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Wallis white Teslin synthetic paper ewagira laminated ID, membership ne RFID card production mu 0.178mm ne 0.254mm gauges, nga zirina okugezesa okukuba ebitabo, okusala ku mutindo, samples n'okugabira B2B mu bungi.
ebikozesebwa ku kaadi
WALLIS
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| Ekika ky’okukuba ebitabo: | |
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Wallis 0.178mm ne 0.254mm white Teslin synthetic paper eweebwa ku ndagamuntu eziriko laminated, kaadi z’obwammemba, ebiwandiiko ebikakasa okuyingira, kaadi z’ebisumuluzo bya wooteeri, RFID kaadi, badge z’emikolo ne pulogulaamu endala eza kaadi ezikubiddwa. Microporous substrate ekkiriza yinki, toner, adhesive ne laminate mu structure yaayo, okuyamba abakola card okutuuka ku print ewangaala n’okunyweza layer bonding.
Gaagi ebbiri zikwatagana n’ensengeka za substrate eza bulijjo eza 7 mil ne 10 mil. Obugumu bulina okulondebwa ng’ekitundu ku kuzimba kaadi okujjuvu okusinga okusinziira ku kika kya kaadi kyokka. Okukuba ku ludda olumu oba zombi, Firimu ya overlay obuwanvu, RFID inlay, magnetic stripe, adhesive, lamination pressure n’obuwanvu bwa finished-card byonna birina okuteekebwa mu specification.
Wallis ewagira abaguzi ba B2B n’empapula za sampuli, okusala ku mutindo, okugezesa okukuba ebitabo, okwekenneenya lamination, okwekenneenya ensengeka ya kaadi n’okupakinga ebweru w’eggwanga. Abaguzi balina okukakasa grade ya Teslin entuufu, eyagikola, okugumiikiriza obuwanvu, embeera y’okungulu n’ebiwandiiko ebikwata ku kugoberera nga tebannakkiriza kukola mu bungi.
| Ekika ky’Ebintu | White microporous synthetic-paper substrate ku kaadi ezikubiddwa ne laminated |
| Enkola z’Obugumu | 0.178mm / 178μm / 7 mil ne 0.254mm / 254μm / 10 mil |
| Enkola z’okukuba ebitabo | Okukuba ebitabo mu ngeri ya offset, silk-screen ne digital; enkola endala zeetaaga okugezesebwa mu ddaala n’ebyuma |
| Okusaba Kaadi | ID, obwammemba, obwesigwa, ekisumuluzo kya wooteeri, okutuuka, omukolo, ebyobulamu ne kaadi RFID ezirondeddwa |
| Enkola z’okugabira abantu ebintu | Ebipande ebisaliddwa ku mutindo oba ku mutindo, okupakinga okw’omunda okukuumibwa, bbaasa ne paleedi ezifulumizibwa ebweru w’eggwanga |
| Empeereza ya B2B | Sampuli, ebisaanyizo by’okukuba ebitabo, okugezesa lamination, RFID okwekenneenya enzimba, okuteekateeka QC n’okugaba mu bungi |
Saba Teslin Card Substrate Samples
Teslin substrate ye microporous, polyolefin-based synthetic material erimu ekitundu ekinene eky’ekijjuza ekitali kiramu n’obunene bw’empewo ey’omunda. Okwawukanako n’ekipande kya pulasitiika ekinene, ensengekera yaakyo ey’obutuli enyiga yinki, toner, ebisiiga ne laminate esaanuuse, ne kikola enkolagana z’ebyuma ezikwatagana munda mu substrate.
Yinki ne toner bisobola okuyingira mu ngulu okusinga okusigala nga layeri y’okungulu eggyibwawo yokka. Mu kiseera ky’okukola laminate, laminate oba adhesive ekwatagana ekulukuta mu pores, eyamba okukuuma ebiwandiiko ebikubiddwa, ebifaananyi, QR codes ne barcodes okuva ku abrasion oba okugezaako okwawula layers.
Ensengekera eno enyigirizibwa esobola okuziyiza emisono gya magineeti, antenna, chips n’ebintu ebirala ebiteekeddwamu. Kino tekimalawo bwetaavu bwa yinginiya w’okuyingiza: obuwanvu bw’ekitundu, dizayini y’ebituli, okugabanya puleesa n’okugezesa okuddiŋŋana-flex bisigala nga byetaagisa.
Obukuumi bwa kaadi businziira ku dizayini enzijuvu, omuli ebifaananyi ebifugibwa, data ekyukakyuka, ebifaananyi bya holographic, UV yinki, Firimu ya overlay s, chips, magnetic stripes n’enkola y’okufulumya. Standard white substrate tesaana kwogerwako nga erimu watermarks oba covert features okuggyako nga grade entuufu erina features ezo ezimbiddwamu.
Ekintu ekyeru ekiyitibwa Microporous Card Substrate
Olupapula olusobola okukubibwa mu kyapa era nga lukwatagana ne Lamination
Obugumu bwombi busobola okukubibwa ku ludda olumu oba zombi. Okulonda okutuufu kwesigamye ku kyetaagisa eky’omugabo gwa substrate ku buwanvu bwa kaadi bwonna awamu, okukaluba, okusiba, okusiba, lamination stack ne firimu eziriwo Firimu ya overlay -so si kyokka oba omulimu gw’ebifaananyi gwa ludda lumu oba lwa ludda lubiri.
| Ensonga y’okulonda | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Omugabo gwa Substrate | Okuwaayo okutono ku buwanvu bwa kaadi bwonna awamu; ereka ekifo ekisingawo ku Firimu ya overlay s oba layers ez'okwongerako | Okugatta kwa waggulu ku buwanvu bwonna n’okusiba |
| Okukyukakyuka mu mbeera | Okukyukakyuka ennyo nga tonnaba kukola lamination | Ebisingawo substantial feel nga tonnaba lamination |
| Enkozesa ya Pulojekiti eya bulijjo | Kaadi eziriko laminated eziriko emisingi emigonvu, badge, tags n’ebizimbe nga tukozesa Firimu ya overlay s enzito | Cores ezizitowa, enhanced cushioning n’ensengekera nga tukozesa ebigonvu Firimu ya overlay s |
| RFID / Enzimba ya Chip | Omugaso nga inlay ne Firimu ya overlay s zimala dda obuwanvu obunene | Ayinza okuwa cushioning okusingawo, naye total stack ne pressure birina okuddamu okubalirirwa |
| Enkola y’Okukkiriza | Kuba, laminate, condition n’okupima sampuli eziwedde | Kuba, laminate, condition n’okupima sampuli eziwedde |
7 Mil ne 10 Mil Obugumu Obulonda
ID card eriko laminated nkola ya substrate, print, Firimu ya overlay s, adhesive n’ebitundu by’ebyuma eby’okwesalirawo. Obugumu obuwedde bulina okubalirirwa okuva ku mugogo gwonna ne bukakasibwa nga kaadi emaze okunnyogoga n’okugitereeza. Obugumu
| bw’ekitundu kya kaadi | n’okulowooza ku nkola |
|---|---|
| Teslin Omusingi gw'okukuba ebitabo | Kozesa 0.178mm oba 0.254mm okusinziira ku stack ekkiriziddwa era nga kyetaagisa cushioning |
| Emmanju n'Emabega Firimu y'okubikka | Firimu y'okubikka gauge, adhesive ne surface finish bye bisalawo obukuumi n'okuwulira kaadi esembayo |
| Yinki / Toner Ekubiddwa | Okubikka ebikalu ebizito kuyinza okukosa obunnyogovu, okuzibikira, lamination ne dimensional balance |
| RFID Inlay oba Chip | Mulimu antenna, chip bump, adhesive ne layers zonna ezirimu ebituli oba spacer |
| Omuguwa gwa Magineeti / Hologram | Kakasa stripe recess, Firimu ya overlay okukwatagana ne post-lamination encoding oba okwekebejja |
| Kaadi Emaliriziddwa | Pima obuwanvu, obupapajjo, ebipimo n’enkola oluvannyuma lw’okunyogoza n’okulongoosa |
ID, Access ne Membership Cards
Enteekateeka za Laminated Card eziwedde
Ebika bya Teslin eby’enjawulo bitereezeddwa ku nkola ez’enjawulo ez’okukuba ebitabo. Abaguzi tebalina kulowooza nti ekipande kimu ekyeru kijja kuvaamu ekivaamu kye kimu ku byuma ebitambuza ebbugumu erya offset, dye inkjet, pigment inkjet, laser, Indigo, screen oba thermal-transfer. Okubeera n’ebisaanyizo by’ekigero ekituufu, enkola ya printer ne yinki yeetaagibwa.
| Enkola y’okukuba ebitabo | B2B Ekyetaagisa Okukakasa |
|---|---|
| Okukuba ebitabo mu Offset | Okuteeka yinki, density, okutega, okukala, pawuda level, okuziyiza n’okuziyiza lamination |
| Okukuba ebitabo mu Silika | Obugumu bwa yinki, okukwatagana kw’ekizimbulukusa, okuwona, okukyukakyuka n’okukwatagana kwa layeri |
| Okukuba ebitabo mu ngeri ya Digital Laser | Ebbugumu lya fiyuza, okunyweza toner, okutambuza empapula, okufuga okutambula (static control) n’ebisaanyizo by’ebyuma |
| Okukuba ebitabo mu Yinki | Kozesa ekigero ekikwatagana ne yinki; okugezesa dayi oba yinki ya langi, obudde bw’okukala, okuziyiza amazzi n’engeri langi |
| HP Indigo / Ekitongole ky'amawulire ekya Digital | Kakasa omutindo ogulina ebisaanyizo, ekyetaagisa kya primer, ebbugumu ly’omufaliso n’okusiba oluvannyuma lw’okukuba |
| Ekyuma ekikuba ebitabo obutereevu okutuuka ku kaadi | Mu budde obutuufu akuba kaadi etaliiko kintu kyonna ewedde okusinga okukuba olupapula lwa Teslin oluyitiridde; okugezesa oluvannyuma lw’okusiba kaadi n’okukuba ebikonde byokka |
Okukuba ebitabo ku njuyi bbiri kufugibwa enkola y’okukuba ebitabo, grade, bbalansi y’obunnyogovu, okubikka ebifaananyi by’ebifaananyi n’okuwandiisa —so si kukozesa bintu bya mm 0.254 byokka. Dizayini ya bbalansi mu maaso n’emabega nayo esobola okuyamba okukendeeza ku curl oluvannyuma lw’okukuba ebitabo n’okugikuba lamination.
Ebifaananyi ebinywevu bitera okukubibwa ku mpapula za substrate nga tebannaba kukola lamination. Amannya agakyukakyuka, ebifaananyi, ennamba oba bbaakoodi biyinza okugattibwako mu kiseera ky’okukuba empapula oba oluvannyuma ku kaadi ewedde, okusinziira ku nkola y’emirimu gy’okufulumya.
Okugezesa okukuba ebitabo mu Offset, Screen ne Digital
Teslin substrate esobola okubeera platen-laminated oba roll-laminated ne firimu ezikwatagana. Okukwatagana okw’amaanyi kubaawo nga laminate oba adhesive ekulukuta mu nsengekera ya microporous. Ensengeka ezisembayo zirina okuteekebwawo n'ekigero kya substrate kyennyini, Firimu ya overlay , yinki, press ne card stack.
| Okufuga Lamination | Enkola Esemba |
|---|---|
| Embeera y’Obunnyogovu | Condition substrate n’empapula ezikubiddwa nga tonnaba kukola lamination; ebintu ebikalu ennyo oba ebinnyogovu ennyo bisobola okukendeeza ku mutindo |
| Ebbugumu | Teeka okusinziira ku mugabi wa laminate n’ebbugumu lya substrate erikakasibwa; tewesigama ku bbugumu lyokka ery’okulaga ekyuma |
| Puleesa n’Obudde | Waayo okukulukuta okumala mu butuli nga tomenya chips, okukyusakyusa artwork oba okukola squeeze-out esukkiridde |
| Okunyogoza | Onnyogoze wansi wa puleesa efugibwa okulongoosa obupapajjo n’okutebenkera kw’ebipimo |
| Amaanyi g’okusekula | Gezesa laminate ewedde oluvannyuma lw’okugirongoosa n’okugiteeka mu butonde |
| Okusiba ku mbiriizi | Ebizimbe bya Teslin laminate ebikwatagana bitera okusalibwa mu ngeri ya die-cut oluvannyuma lw’okugikolako nga tewali nsalo ya njawulo essiddwako ssimu; kakasa ne firimu erongooseddwa |
Ebipimo by’okutandika ebifulumiziddwa biyinza okuyamba mu kugezesa, naye okutambuza ebbugumu okwennyini kwawukana okusinziira ku pulati, ekyuma ekikuba, obuwanvu bw’omutambi, Firimu ya overlay kemiko n’okubikka ebikubiddwa. Wandiika ebbugumu lya substrate erikkiriziddwa, puleesa, okubeera, okunyogoza n’okusumulula-film ensengeka okusobola okuddamu okufulumya.
Obunnyogovu obusibiddwa, ebbugumu eritali limala, laminate etakwatagana, yinki enzito oba okunyogoga obubi bisobola okuleeta ebiwujjo, okufuuka ffeeza, enfuufu oba okuzingulula. Kebera sheet ne kaadi ezikubiddwa ebikonde byombi oluvannyuma lw’okuzirongoosa.
Teslin substrate esobola okuwagira dizayini y'ebiwandiiko ebiraga layeri, naye ebikozesebwa mu by'okwerinda bitondebwawo pulogulaamu y'ebiwandiiko enzijuvu. Ebintu eby’obusuubuzi ebya mutindo tebiriimu bintu bya gavumenti ebikusike oba eby’okunoonyereza ku misango.
| Ebintu Ebikwata ku Byokwerinda | Ekyetaagisa mu Kugatta |
|---|---|
| Okukuba ebitabo mu Microtext ne Fine-Line | Ebifaananyi eby’obulungi obw’amaanyi, okukuba ebifaananyi ebifugibwa ku pulati oba digito n’okusoma oluvannyuma lw’okusiba |
| UV -Yinki Eyaka | Ebisaanyizo by’omugabi wa yinki, okufuga ekitangaala eky’emabega n’okukebera oluvannyuma lw’okugikolako lamination |
| Holographic Firimu y'okubikka | Ewandiisiddwa Firimu ya overlay , okukwatagana kwa laminate, okutegeera kw'amaaso n'enneeyisa y'okukyusakyusa |
| QR Code ne Barcode | Enjawulo y’okukuba ebitabo, obutuufu bw’ebipimo, okusoma kwa sikaani n’obukuumi bw’okunyiga |
| Custom Security-Eddaala lya Substrate | Program-specific embedded markers zeetaaga olukusa olukuumibwa obukuumi era tezenkanankana na standard white sheet |
Obukuumi bwa Layered n'Obukuumi bwa Laminate
Teslin substrate esobola oku cushion n’okukuuma RFID inlay, naye okulonda 0.254mm mu kifo kya 0.178mm tekifuula card esaanira ebyuma eby’omulembe mu ngeri ey’otoma. Enzirukanya y’okuyingiza, chip, antenna, adhesives, Firimu ya overlay ne lamination zirina okukolebwa nga ensengekera emu.
| Smart card Ensonga | Yeetaagibwa Okukakasa |
|---|---|
| Chip ne Frequency nga zikola | Kakasa chip model, frequency, protocol, memory n'enkola y'omusomi |
| Geometry ya Antenna | Kuuma ebilondoola bya antenna mu kiseera ky’okukola lamination, punching n’okumaliriza card-edge |
| Inlay Obugumu | Bala chip bump, antenna, carrier ne adhesive munda mu total card stack |
| Engabanya ya Puleesa | Kozesa emitto n’ebituli ebituufu okwewala okwonooneka kwa chip oba antenna |
| Okugezesa emirimu | Gezesa omutindo gw’okusoma/okuwandiika nga tonnaba kukola lamination, oluvannyuma lw’okusiba, oluvannyuma lw’okukuba ebikonde n’oluvannyuma lw’okufukamira |
| Okusemba | Okussa essira ku Pulojekiti |
|---|---|
| Endagamuntu z’ekitongole | Omutindo gw’ebifaananyi, data ekyukakyuka, barcode, Firimu ya overlay okuwangaala n’okukozesa badge buli lunaku |
| Kaadi z’abayizi n’abasomesa | Okukuba ebitabo mu bungi obw’amaanyi, okulongoosa omuntu, omulimu gwa magineeti oba RFID n’okufukamira okumala ebbanga eddene |
| Kaadi z’obwammemba n’obwesigwa | Langi ya brand, okusoma barcode oba QR, okuwangaala kwa waleti n’okukola empapula ezitasaasaanya ssente nnyingi |
| Kaadi z'ebisumuluzo bya wooteeri | Magnetic-stripe oba RFID okukwatagana, okugezesa kkufulu n'obulamu bw'obuweereza obumpi okutuuka ku bwa wakati |
| Ebyobulamu n’endagamuntu z’abalwadde | Okusoma, okuyonja okulaga, okusika bbaakoodi n’okufulumya okufugibwa |
| Badge z'emikolo n'abagenyi | Okukuba ebitabo mu ngeri ya digito mu bbanga ettono, ebifo, emiguwa, QR codes n’okulongoosa amangu |
| Enkola | ekifo eky’okulondoola omutindo |
|---|---|
| Okusala Guillotine | Squareness, printed registration, embeera ya blade n’okunyigirizibwa kwa stack |
| Okukuba Kaadi / Okusala Die | Ebipimo bya kaadi, radius y’enkoona, empenda ennyonjo ate nga tewali kwawula laminate |
| Okukuba Ebituli n’Ebituli | Ekifo, ebanga ku mbiriizi, omugugu gw’omuguwa n’okuziyiza enjatika |
| Embossing oba Foil Stamping | Ensengeka ya kaadi ewedde, ebbugumu, puleesa, okunywerera kwa foyiro n’okusoma |
| Thermal / Okuddamu okukyusa Okwefuula | Entambula ya printer, okutambuza ribbon, amaanyi ag’okungulu, okukyusakyusa ebbugumu n’okuwangaala kw’ebifaananyi |
| Enkodi ya Magineeti / RFID Enkodi | Encoding yield, okukwatagana kw'omusomi n'omulimu ogw'oluvannyuma lw'okunyigirizibwa |
| g’ebintu | Amaanyi | Ebikulu ebirina okulowoozebwako |
|---|---|---|
| Ekintu ekiyitibwa Teslin Substrate | Okunyiga ebiwandiiko kwa waggulu, okukwatagana kwa laminate okw’amaanyi, okukyukakyuka n’okusiba emitto ku byuma eby’amasannyalaze | Ebiseera ebisinga ekozesebwa nga omusingi ogukubiddwa munda mu kizimbe kya laminate okusinga nga kaadi emaliriziddwa eraga |
| PVC | Enkola ya kaadi etandikiddwawo, okugabira okugazi n’enkola ezimanyiddwa ez’okukola omuntu | Enkula y’obutonde ey’enjawulo, okugumira ebbugumu okutono n’okuddamu okukola okutono mu butale bungi |
| PETG | Obugumu, obutangaavu n’okukozesa kaadi za layeri nnyingi ez’amaanyi | Enkola y’okunyweza yinki n’okukola lamination yawukana ku porous Teslin substrate |
| Ekirungo kya Polycarbonate | Obuwangaazi obw’amaanyi, okugumira ebbugumu n’obusobozi bwa laser-personalization mu ddaala eryetongodde | Ebikozesebwa n’ebikozesebwa ebisingako; ekozesebwa okusaba ebiwandiiko ebiwangaala |
| Okukebera Ekintu | Okulondoola okusemba |
|---|---|
| Endagamuntu y’Ebintu | Omukozi, grade, koodi y’obuwanvu, batch ne satifikeeti reference |
| Obugumu n’obunene | Gaagi eya wakati, okugumiikiriza, obuwanvu bw’ekipande, obugazi, squareness n’obutuufu bw’okusala |
| Endabika | Enjeru, ekisiikirize, amabala amaddugavu, obucaafu, enviiri, ebiwujjo n’okwonooneka kw’empenda |
| Obupapajjo n’Obunnyogovu | Curl, bow, embeera y’okutereka n’okutebenkeza obunnyogovu nga tonnaba kukuba kukuba na kugikuba lamination |
| Ebisaanyizo by’okukuba ebitabo | Densite, okunywerera, okukala, langi, ebikwata ku kifaananyi, okusoma kwa bbaakoodi n’okuziyiza |
| Okugezesebwa kwa Lamination | Amaanyi g’okusekula, ebiwujjo, enfuufu, okwawula ku mbiriizi, okuzingulula n’obugumu obuwedde |
| Okugezesebwa kwa Kaadi Okumaliriziddwa | Ebipimo, flexing, abrasion, personalization, amaanyi ga slot, encoding n'omusomi omulimu |
| Okupakinga n’okulondoola | Omutwalo ogukuumibwa, okubala, akabonero ka bbaasa, ensengeka ya paleedi, ennamba ya looti ne lipoota y’okukebera |
Teslin substrate enyigirizibwa era erina okukuumibwa okuva ku bbugumu, UV ekitangaala, obucaafu, obutakwatagana mu bunnyogovu ne puleesa y’omutambi esukkiridde. Okutereka obulungi kiyamba okukuuma langi, obupapajjo, omulimu gw’okukuba ebitabo n’amaanyi ga lamination.
Ebintu ebibikkiddwa bitereke mu kifo ekiyonjo ewala okuva ku mukka ogwokya n’obucaafu obuva mu nnyumba.
Kuuma empapula okuva ku kitangaala ekitereevu UV n'ebbugumu erisukka ekkomo ly'okutereka erikkirizibwa.
Ebipande ebisaliddwa bikuume nga bipapajjo ku kifo ekigumu era ekiwaniriddwa.
Toteeka migugu mizito oba paleedi ezisimbiddwa emirundi ebiri ku bbaasa ezisaliddwako ebipande.
Weewale okusiba ennyo ebisiba ebiyinza okunyigiriza empenda oba okussaako akabonero ku mugogo gw’empapula.
Ebipapula ebitonotono bikuume nga bizzeemu okuzingibwa okuziyiza enfuufu, okukyusa langi n’enkyukakyuka mu bunnyogovu.
Empapula z’embeera mu kisenge ky’okufulumya nga tezinnaba kukuba oba lamination ng’embeera za sitoowa zaawukana.
Wallis ewagira abakola kaadi n’abagaba ebintu n’okunoonya ensibuko ya substrate, okusala empapula ku mutindo, okupakinga okukuumibwa n’okugabira ebikozesebwa mu kaadi mu ngeri ekwatagana. Buli order erina okuyungibwa ku sampuli ekkiriziddwa n’ebiwandiiko ebikwata ku ddaala, obuwanvu, enkola y’okukuba ebitabo, ensengeka ya lamination n’ebyetaago bya kaadi ewedde.
Ebikozesebwa mu kaadi Okukola n'okutunda ebweru w'eggwanga
Ebipima kaadi bibiri ebya mutindo: 0.178mm ne 0.254mm eby’okulondako ku nsengeka za kaadi ez’enjawulo eziriko laminated.
Obuwagizi bw’enkola y’okukuba ebitabo: Okugezesa okukuba ebitabo mu ngeri ya offset, silk-screen ne digital kuyinza okukwasaganyizibwa nga tebannaba kukkirizibwa mu bungi.
Enkulaakulana etunuulidde lamination: Substrate, Firimu ya overlay , adhesive, ebbugumu n’obuwanvu bwa kaadi bisobola okwekenneenya ng’enkola emu.
RFID obumanyirivu bwa kaadi: Inlay obuwanvu, cushioning, okukuuma chip n'okugezesebwa kw'omusomi bisobola okuteekebwa mu kukakasa sampuli.
Okusala n’okupakinga ku mutindo: Enkola ya sheet, okukuuma stack, cartons ne pallets zisobola okukolebwa okusinziira ku byetaago by’okufulumya n’okutunda ebweru w’eggwanga.
Empeereza ya B2B obutereevu mu kkolero: Esaanira amakolero ga kaadi, abakuba ebitabo, abakyusa, RFID kkampuni, abayingiza n’abasaasaanya.
Okusaba kaadi, obulamu bw’obuweereza obusuubirwa n’akatale k’ekifo w’ogenda.
Obugumu obwetaagisa: 0.178mm / 7 mil oba 0.254mm / 10 mil.
Obuwanvu bwa sheet, obugazi, okugumiikiriza, squareness n’obungi.
Enkola y’okukuba ebitabo, model ya printer, yinki oba toner n’ebifaananyi eby’oludda olumu oba ebiri.
Firimu y'okubikka ebikozesebwa, obuwanvu, okumaliriza, okusiiga n’ebyuma ebikola lamination.
Target ebipimo bya kaadi ewedde, obuwanvu ne radius y’enkoona.
RFID chip, antenna, inlay, magnetic stripe, hologram oba ekitundu ekirala.
Okukuba ebitabo mu by’okwerinda, bbaakoodi, QR code n’ebyetaago by’okukola omuntu.
Satifikeeti ezeetaagisa, okulondoola ebintu ne lipoota y’okukebera.
Omuwendo gw’okugezesa, okuteebereza buli mwaka, omwalo gw’ogenda n’enteekateeka y’okutuusa ebintu.
Teesa ku Pulojekiti Yo eya Teslin Card
Substrate ya mm 0.178 eri mil 7, ate substrate ya mm 0.254 eri mil 10. Ekigero ekinene kiyamba nnyo ku buwanvu bwa kaadi bwonna awamu n’okusiba emitto, naye byombi byetaaga okugezesebwa mu nsengeka ya laminate enzijuvu.
Yee. Okukuba ebitabo ku ludda olumu oba lubiri kisinziira ku ddaala lya substrate, enkola y’okukuba ebitabo, enkola ya yinki, bbalansi y’ebifaananyi n’okuwandiisa —so si ku buwanvu bwa lupapula lwokka.
Tewali kulonda kwa bonna. Bala substrate, mu maaso n’emabega Firimu ya overlay s, adhesive, printing ne optional inlay, olwo laminate n’okupima conditioned finished card.
Substrate ekoleddwa mu polyolefin egumira amazzi, naye okuwangaala kw’okukuba ebitabo kisinziira ku yinki entuufu, grade ne lamination. Kaadi ewedde erina okukeberebwa okulaba oba temuli mazzi, bunnyogovu n’okuyonja.
Kozesa grade ya Teslin ekwatagana ne yinki era ogezese yinki ya langi oba langi entongole. Standard grades ne coated inkjet grades zisobola okweyisa mu ngeri ey’enjawulo mu kiseera eky’obukalu, langi n’okugumira amazzi.
Grade ezisaanira zisobola okukubibwa layisi, naye ebbugumu lya fiyuza, okutambuza empapula, okunywerera kwa toner n’ebisaanyizo bya printa birina okukeberebwa. Tokozesa bintu ebitakkirizibwa kukola byuma.
Ebisinga obungi ebikuba ebitabo obutereevu ku kaadi bikoleddwa ku kaadi eziwedde okutaliiko kintu kyonna, so si mpapula za substrate ezitambula. Sooka okukuba ku lupapula era okole laminate, ebikonde kaadi, n’oluvannyuma ogezese okulongoosa mu ngeri ey’obuntu ku bifo ebiwedde.
Laminates ez’ebbugumu eziwera ne firimu ezisiiga ziyinza okukola, naye okukwatagana kisinziira ku bbugumu ly’okukola, okutambula, obuwanvu n’obwetaavu bwa kaadi ewedde. Kiriza omugatte gwennyini ogwa substrate-ne-film nga oyita mu kukebera ebikuta.
Ebizimbe bya Teslin ebikoleddwa obulungi bisobola okusalibwa okutuuka ku kifaananyi ekiwedde awatali nsalosalo ya njawulo esibiddwa kubanga laminate esiba mu matrix ey’obutuli. Kino kikakasizza ne laminate erongooseddwa n’enkola.
Ebiyinza okuvaako mulimu obunnyogovu obuyitiridde, ebbugumu eritali limala, empewo esibiddwa, yinki enzito, laminate etakwatagana oba puleesa etali nnungi. Condition the sheets era okakasa ebbugumu lyennyini erya substrate.
Yee. Cushioning yaayo esobola okuyamba okukuuma ebyuma, naye chip, antenna, inlay thickness, adhesive, pressure n’omutindo gw’okusoma oguwedde birina okukakasibwa.
Si mu ngeri ya otomatiki. Substrate enzito eyinza okuwa cushioning okusingawo, naye era ekyusa obuwanvu bwa kaadi bwonna awamu n’ensaasaanya ya puleesa. Ensengeka ya inlay enzijuvu y’esalawo omulimu.
Standard white substrate egaba emigaso mu print ne lamination naye tesaana kwogerwako nga erimu obubonero obw’obukuumi obw’ekyama. Ebintu eby’omutindo gw’obukuumi ebikwata ku pulogulaamu (program-specific security-grade material) kintu kya njawulo ekifugibwa.
Yee. Holographic Firimu ya overlay s, UV inks, microtext n'ebintu ebirala bisobola okugattibwa okuyita mu nkola ez'enjawulo ez'okukuba ebitabo n'okusiba. Okulabika kwazo n’okuwangaala kwazo birina okugezesebwa oluvannyuma lw’okubifulumya.
Enkola y’obutonde bw’ensi esinziira ku bikozesebwa ebisookerwako, okuzimba kaadi, obulamu bw’obuweereza, okukola, entambula n’amakubo agaliwo ag’okusuula. Weewale okwewozaako okw’obusukkulumu obugazi nga tolina kwekenneenya kwa bulamu okunnyonnyoddwa.
Okuddamu okukola ebintu kisinziira ku kukungaanya mu kitundu n’ensengeka ya kaadi enzijuvu. Laminates, yinki, magnetic stripes, chips ne antennas bisobola okwetaagisa okwawulwa oba okusuulibwa mu ngeri ey’ekikugu.
Kuuma ebipande nga bibikkiddwa, nga bipapajjo, nga bikalu era nga bikuumibwa UV ekitangaala, ebbugumu, omukka, enfuufu ne puleesa y’omutambi esukkiridde. Ziteeke mu mbeera nga tonnaba kukuba oba lamination.
Okusala ku custom kuyinza okuteesebwako okusinziira ku nteekateeka y’okukuba ebitabo, lamination plate, card imposition, okugumiikiriza, obungi n’ebyetaago by’okupakinga.
Yee. Kuba, laminate, cool, condition, punch and personalize sample cards nga okozesa ebyuma ebigendereddwamu okufulumya nga tonnakkiriza kintu ekyo.
MOQ esinziira ku ddaala, obuwanvu, sayizi y’olupapula, okusala ku mutindo, ebisaanyizo by’okukuba ebitabo, okupakinga n’okuteebereza buli mwaka.
Waayo obuwanvu, obunene bw’olupapula, enkola y’okukuba ebitabo, Firimu ya overlay , ebyuma ebikola lamination, obuwanvu bwa kaadi obuwedde, RFID oba ebyetaago by’emiguwa, obungi, ekifo w’ogenda n’enteekateeka y’okutuusa.
Tuukirira Wallis Plastic ku 0.178mm ne 0.254mm enjeru Teslin synthetic paper ku laminated ID, obwammemba, ekisumuluzo kya wooteeri, omukolo ne RFID kaadi pulojekiti. Ttiimu yaffe ewagira okulonda obuwanvu, okusala ku mutindo, okugezesa okukuba ebitabo n’okuzikola lamination, okwekenneenya ensengeka ya kaadi, ebiragiro ebikwata ku mutindo n’okugabira B2B obutereevu mu kkolero.
Teslin kabonero ka busuubuzi akawandiisiddwa aka PP G Industries Ohio, Inc. Kakasa ekigero ekituufu ekiweereddwa, ensibuko n'ebiwandiiko ku buli order.
