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Wallis finman Teslin sintetiki papier bɛ ID lamininen, tɔndenw ani RFID karti dilanni dɛmɛ 0,178mm ani 0,254mm jateminɛnanw na, ni sɛbɛnni kɔrɔbɔliw ye, ni tigɛcogo ladamulen ye, misaliw ani B2B caman dilancogo.
karti kɔnɔfɛnw
WALLIS ye baara kɛ
| Fɛn min bɛ kɛ: | |
|---|---|
| A bonya: | |
| Sɛbɛn suguya: | |
| A hakɛ: . | |
Wallis 0,178mm ani 0,254mm Teslin sintetiki papiye finman bɛ dilan ka ɲɛsin ID karti lamininenw ma, tɔndenw ka kartiw, donsɛbɛnw, lotɛli kilisi kartiw, RFID kartiw, ko kɛlenw badgew ani karti sɛbɛnnen porogaramu wɛrɛw. Substrat microporose bɛ sɔn encre, toner, adhesive ani laminate ma a jɔcogo la, o bɛ karti dilannikɛlaw dɛmɛ u ka se ka sɛbɛnni kuntaalajan sɔrɔ ani ka layɛrɛ sirili barikama sɔrɔ.
O jatebla fla bɛ Bɛn ni 7 mil ni 10 mil substrat cogoyaw ye minnu bɛ Kɛ ɲɔgɔn fɛ. Janya ka kan ka sugandi ka kɛ karti jɔli dafalen dɔ ye sanni ka kɛ karti suguya dɔrɔn fɛ. Sɛbɛnni kɛli fan kelen walima fan fila bɛɛ la, a dacogo janya, a RFID doncogo, a magɛnni, a nɔrɔlen, a lamini tansiyɔn ani a ka karti dafalen janya, olu bɛɛ ka kan ka don o fɛn ɲɛfɔlen kɔnɔ.
Wallis bɛ B2B sannikɛlaw dɛmɛ ni misali sɛbɛnw ye, ni tigɛcogo ye min bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye, ka sɛbɛnni kɛcogo kɔrɔbɔ, ka lamini jateminɛ, ka karti-jɔcogo lajɛ ani ka fɛnw bila jamana kɔkan. Sannikɛlaw ka kan ka Teslin hakɛ tigitigi, a dilabaga, a bonya muɲuni, a sanfɛla cogoya ani a labatoli sɛbɛnw dafa sani u ka sɔn jama dilanni ma.
| Fɛn dilannen suguya | Sintetiki-papier substrat finman min bɛ kɛ ni karti sɛbɛnnenw ni lamininenw ye |
| Sugandili minnu bɛ kɛ ni thickness ye | 0,178mm / 178μm / 7 mil ani 0,254mm / 254μm / 10 mil |
| Sɛbɛnni kɛcogo minnu bɛ kɛ | Offset, silk-screen ani sɛbɛnni nizɛri; taabolo wɛrɛw bɛ kɛ ni kalasi ni minɛnw sɛgɛsɛgɛli ye |
| Kartiw ka baarakɛminɛnw | ID, tɔndenw, kantigiya, lotɛli kilisi, sɔrɔli, ko kɛlen, kɛnɛyako ani RFID karti sugandilenw |
| Sugandili minnu bɛ kɛ ka fɛnw dilan | Sɛbɛn minnu tigɛra ka kɛɲɛ ni sariya ye walima minnu tigɛra ka kɛɲɛ ni mɔgɔw sago ye, kɔnɔna pake lakananenw, kartɔnw ani palɛti minnu bɛ taa jamana wɛrɛw la |
| B2B Baarakɛlaw | Misaliw, sɛbɛnni setigiya, lamini kɔrɔbɔli, RFID jɔcogo lajɛ, QC bolodacogo ani caman dilancogo |
Aw ye Teslin Karti Substrat Samples ɲini
Teslin substrat ye fɛn dilannen ye min bɛ kɛ ni mikroporow ye, min sinsinnen bɛ poliyolefini kan, min kɔnɔ, fasa inorganique hakɛ ka ca ani kɔnɔna fiɲɛ hakɛ. A tɛ i n’a fɔ plastiki sɔgɔlen, a porose jɔcogo bɛ enki, ton, nɔrɔlanw ani laminati wulilenw minɛ, ka masinw ka jɛɲɔgɔnyaw da ɲɔgɔn kan substrat kɔnɔ.
Enki ni tonso bɛ se ka don yɔrɔ la sanni u ka to yɔrɔ la dɔrɔn i n’a fɔ yɔrɔ min bɛ se ka bɔ. Lamini kɛtuma na, laminati walima nɛgɛ min bɛ bɛn o ma, o bɛ woyo ka don porozew kɔnɔ, o bɛ dɛmɛ don ka sɛbɛnni sɛbɛnnenw, fotow, QR kodew ani barɔdiw lakana ka bɔ sɔgɔsɔgɔninjɛ walima layɛrɛw farali ɲinini na.
O jɔcogo min bɛ se ka digi, o bɛ se ka magɛnni sɛrɛkiliw, antɛniw, puwɛntiw ani fɛn wɛrɛw minnu bɛ don a kɔnɔ, olu cushion. O tɛ mago bɔ inlay engineering na: components (fɛnw) janya, cavity design, pressure distribution ani repeated-flex testing (sɛgɛsɛgɛli segin-segin-flexion) tora.
Karti lakanani bɛ bɔ a dilanni dafalen na, i n’a fɔ seko ni dɔnko baara minnu bɛ kɔrɔsi, kunnafonidilanw caman bɛrɛbɛrɛ, olografu kɛcogo, UV enki, overlays, chips, magnetic stripes ani bɔli kɛcogo. Substrat blanc standard man kan ka fɔ ko ji taamasiɲɛw walima fɛn dogolenw bɛ a kɔnɔ fo ni o fɛnw donna a kɔnɔ.
Substrat de carte microporouse blanche
Sɛbɛn min bɛ se ka sɛbɛn ani min bɛ se ka lamination kɛ
O janya fila bɛɛ bɛ se ka sɛbɛn fan kelen walima fan fila bɛɛ la. Sugandili ɲuman bɛ bɔ substrat dɛmɛni wajibiyalen na karti janya bɛɛ lajɛlen na, a gɛlɛyali, a sɔgɔli, lamination stack ani overlay films sɔrɔlenw na—a tɛ kɛ dɔrɔn ni seko ni dɔnko baara ye fan kelen ye walima fan fila.
| Sugandili Factor | 0,178mm / 7 mil | 0,254mm / 10 mil |
|---|---|---|
| Substrat ka dɛmɛ | Dɔgɔya dɛmɛni kariti bɛɛ lajɛlen janya la; bɛ yɔrɔ caman to dabɔli walima layɛrɛ wɛrɛw kama | Dɛmɛba ka bon ka ɲɛsin total thickness ni cushioning ma |
| Fɛn min bɛ se ka fɛn caman sɛgɛsɛgɛ | A ka ca a la ka se ka lamination kɛ | A ka ca a la, a bɛ dusukunnataw sɔrɔ ka kɔn lamination ɲɛ |
| Porozɛ baarakɛcogo min bɛ kɛ tuma caman na | Karti lamininenw, badgew, tags ani structures minnu bɛ kɛ ni finimugu finmanw ye | Cores girinmanw, cushioning enhanced ani structures ni overlays finmanw ye |
| RFID / Puce (puce) jɔcogo | Nafa bɛ a la yɔrɔ minnu na inlay ni overlays bɛ fɛn caman dun kaban | A bɛ se ka cushioning caman di, nka total stack ni pressure ka kan ka jate kokura |
| Sɔn-ni-sɔn gafenin Fɛɛrɛ | Sɛbɛnni kɛ, ka lamina, ka u cogoya ani ka u suman misali dafalenw na | Sɛbɛnni kɛ, ka lamina, ka u cogoya ani ka u suman misali dafalenw na |
7 Mil ani 10 Mil Janya Sugandili
ID karti lamininen ye substrat, imprimerie, overlays, adhesive ani optionnel électronique yɔrɔw sigicogo ye. A janya dafalen ka kan ka jate ka bɔ kulu bɛɛ la, ka sɛgɛsɛgɛli kɛ karti nɛnɛlen kɔfɛ ani ka a labɛn.
| Karti yɔrɔ | janya ani a kɛcogo jateminɛ |
|---|---|
| Teslin ka sɛbɛnnikɛlan | Aw bɛ 0,178mm walima 0,254mm kɛ ka kɛɲɛ ni stack dafalen ye ani cushioning wajibiyalen ye |
| Fɛn min bɛ ɲɛfɛ ani kɔfɛ | Overlay gauge, adhesive ani surface finish bɛ lakanani ni karti laban dusukunnata dantigɛ |
| Encre / Toner sɛbɛnnen | Datugulan gɛlɛn gɛlɛn bɛ se ka nɔ bila ji la, balili la, lamini na ani balansi hakɛ la |
| RFID Inlay walima Chip | Aw bɛ antɛni, puce bump, adhesive ani cavity walima spacer layers fɛn o fɛn kɛ a la |
| Bandi Magnétique / Hologramme (Hologramme) ye | Aw bɛ stripe recess, overlay compatibility ani post-lamination encoding walima sɛgɛsɛgɛli dafa |
| Karti dafalen | Aw bɛ a janya, a flakɛ, a bonya ani a baarakɛcogo suman nɛnɛ ni a labɛnni kɔfɛ |
ID, Access ani Membership Kartiw
Porogaramuw ka karti lamininenw dafara
Teslin ka kalasi suguya wɛrɛw bɛ labɛn ka ɲɛ sɛbɛnnikɛlan suguya wɛrɛw kama. Sannikɛlaw man kan k’a miiri ko sɛbɛn finman kelen bɛna o nɔ kelen bɔ offset, dye inkjet, pigment inkjet, laser, Indigo, screen walima thermal-transfer minɛnw kan. Kalanso tigitigi, sɛbɛnnikɛlan ani tintiri sitɛmu ka setigiya de wajibiyalen don.
| Sɛbɛnni taabolo | B2B tiɲɛni wajibiyalen |
|---|---|
| Offset sɛbɛnni | Enki sigili, a density, trapping, drying, powder level, blocking ani lamination resistance |
| Siliki-Ekran sɛbɛnni | Enki janya, furajiw bɛnkan, furakɛli, sɛgɛsɛgɛli ani layɛrɛ sirili |
| Laser numérique ka sɛbɛnni | Fuser funteni, toner adhesion, sheet transport, static control ani minɛnw ka setigiya |
| Inkjet Imprimerie (Enkjet Imprimerie) ka baara | Aw bɛ baara kɛ ni grade ye min bɛ se ka kɛ ni tintiri ye; kalali walima pigment ink sɛgɛsɛgɛli, jalen waati, ji kunbɛncogo ani kulɛri cogoya |
| HP Indigo / Nizɛri ka kunnafonidilan | Aw bɛ kalasi setigi, primer wajibiyalen, blanket funteni ani sɛbɛnni kɔfɛ lamination dafa |
| Imprimante min bɛ taa ni karti ye | A ka c’a la, a bɛ karti lankolon dafalen dɔ sɛbɛn sanni ka Teslin sɛbɛnfura lafiyalen dɔ bɔ; sɛgɛsɛgɛli kɛ dɔrɔn karti laminini ni punching kɔfɛ |
Sɛbɛnni min bɛ kɛ fan fila fɛ, o bɛ kɔlɔsi ni sɛbɛnni kɛcogo ye, a hakɛ, a ji hakɛ, a ka seko ni dɔnko baara datugucogo ani a sɛbɛnni—a tɛ kɛ dɔrɔn ni 0,254mm fɛn ye. Fɛn min bɛ kɛ ɲɛfɛ ni kɔfɛ, o fana bɛ se ka dɛmɛ don ka dɔ bɔ kurukuruni na sɛbɛnni ni lamini kɔfɛ.
Ja jɔlenw bɛ sɛbɛn tuma caman na substrat sɛbɛnw kan sani u ka lamini. Tɔgɔ caman, fotow, nimɔrɔw walima barɔdiw bɛ se ka fara ɲɔgɔn kan sɛbɛnw bɔli senfɛ walima kɔfɛ karti dafalen kan, ka kɛɲɛ ni bɔli baara kɛcogo ye.
Offset, Screen ani Digital Printing Kɔrɔbɔliw
Teslin substrat bɛ se ka kɛ platen-laminated walima roll-laminated ni filimuw ye minnu bɛ bɛn ɲɔgɔn ma. Jɛɲɔgɔnya barikama bɛ kɛ ni lamina walima nɔrɔlen bɛ woyo ka don mikroporozɛni na. Labɛn labanw ka kan ka sigi sen kan ni substrat grade yɛrɛ ye, overlay, ink, presse ani card stack.
| Lamination Control (Lamination Control) | kɛcogo min bɛ fɔ |
|---|---|
| Ji cogoya | Aw bɛ substrat ni sɛbɛnfura sɛbɛnnenw cogoya sani aw ka lamini kɛ; fɛn min jalen don kojugu walima min ɲiginnen don kojugu, o bɛ se ka dɔ bɔ jogo la |
| Goniyahakɛ | Aw bɛ a sigi ka kɛɲɛ ni lamini feerela ye ani substrat funteni sɛgɛsɛgɛlen; aw kana aw jigi da masin jiracogo funteni dɔrɔn kan |
| Degun ni Waati | Aw bɛ ji caman di ka don ɲɛgɛnw kɔnɔ k’a sɔrɔ aw ma sɔgɔsɔgɔninjɛw mugumugu, ka seko ni dɔnko baara tiɲɛ walima ka sɔgɔsɔgɔ kojugu kɛ |
| Nɛnɛ bɛ kɛ | Aw bɛ nɛnɛ ni degun kɔrɔsilen ye walasa ka flakɛli ni a hakɛ sabatili ɲɛ |
| Peel Fanga | Aw bɛ laminati dafalen kɔrɔbɔ a kɛlen kɔ ka a labɛn ani ka a bila sigida la |
| Edge Sealing (dakunw sigicogo). | Teslin laminiw jɔcogo minnu bɛ bɛn ɲɔgɔn ma, olu bɛ se ka tigɛ tuma caman na lamini kɔfɛ ni dankan sirilen tɛ u ni ɲɔgɔn cɛ; a jira ni filimu sugandilen ye |
Daminɛ paramɛtiri minnu bɔra kɛnɛ kan, olu bɛ se ka dɛmɛ don kɔrɔbɔliw la, nka funteni jiginni yɛrɛ bɛ danfara ka kɛɲɛ ni plati, presse, stack janya, overlay chimie ani printed coverage ye. Aw bɛ substrat funteni, tansiyɔn, sigiyɔrɔ, nɛnɛ ani bɔli-filimu cogoya dafalen sɛbɛn walasa ka segin a dilanni kan.
Ji min sirilen don, funteni bɛrɛbɛrɛ, lamini min tɛ bɛn, enki gɛlɛn walima nɛnɛ jugu bɛ se ka kɛ sababu ye ka bugunw, warijɛ, sisi walima kurukuruw lawuli. Aw bɛ sɛbɛnfura ni karti punched fila bɛɛ lajɛ conditionnement kɔfɛ.
Teslin substrate bɛ se ka dɛmɛ don layered credential design la, nka lakana fɛɛrɛw bɛ dabɔ sɛbɛnw porogaramu dafalen fɛ. Jagokɛminɛnw minnu bɛ kɛ ka kɛɲɛ ni sariya ye, olu tɛ sɔrɔ a yɛrɛma, gofɛrɛnaman ka fɛn dogolenw walima kiritigɛlaw ka fɛnw.
| Lakanali fɛnw | doncogo wajibiyalen |
|---|---|
| Microtexte ani sɛbɛnni min bɛ kɛ ni layini ɲumanw ye | Seko ni dɔnko baara minnu ka bon kosɛbɛ, plati walima ja numérique contrôlé ani lamination kɔfɛ kalan |
| Encre UV-Fluorescent ye | Enki feerela ka setigiya, kɔkanna fluorescence control ani sɛgɛsɛgɛli lamini kɔfɛ |
| Holographie (Olographie) Dabɔcogo | Overlay sɛbɛnnen, laminate bɛnkan, ɲɛnayeli jɛlen ani tamper kɛcogo |
| QR Code ani Barcode | Sɛbɛnni danfara, hakɛw tiɲɛni, skanɛrɛ kalanni ani sɔgɔli lakanani |
| Substrate Lakanali-Grade ladamulen | Porogaramu kɛrɛnkɛrɛnnenw taamasiyɛn minnu bɛ don a kɔnɔ, olu bɛ fɛnw dilancogo lakananen dɔ de wajibiya min yamaruyara, wa u tɛ bɛn sɛbɛn finman jɔnjɔn ma |
Lakanali layɛrɛw ni Laminatiw lakanani
Teslin substrat bɛ se ka RFID inlay dɔ cushion ani k’a lakana, nka ni i ye 0,254mm sugandi 0,178mm nɔ na, o tɛ kɛ sababu ye ka karti kɛ a yɛrɛma ka bɛn ɛntɛrinɛti kɔrɔlenw ma. Inlay, chip, antenne, adhesives, overlay ani lamination cycle ka kan ka dilan i n’a fɔ fɛn kelen.
| Smart Card Factor | ka kan ka sɛgɛsɛgɛli kɛ |
|---|---|
| Puce ani Frequency (Fɛrɛnkan) | Puce modɛli, frequency, protocol, memory ani reader system dafa |
| Antenna Geométrie (Jɛkulu min bɛ wele ko Geométrie). | Aw bɛ antɛni taamasiyɛnw lakana lamini, punch ani karti-da finini waati |
| Inlay (Inlay) ka bonya | Jatebɔ kɛ puce bump, antenne, carrier ani adhesive kan karti bɛɛ lajɛlen kɔnɔ |
| Degun (Degun) Jatebɔ | Aw bɛ baara kɛ ni sɔgɔsɔgɔninjɛ ni kɔnɔnatumuw ye minnu bɛnnen don walasa ka aw tanga puwɛnti walima antɛni tiɲɛni ma |
| Baarakɛcogo Kɔrɔbɔli | Kalan/sɛbɛnni kɛcogo kɔrɔbɔ sani lamini ka kɛ, lamini kɔfɛ, punch kɔfɛ ani flexion kɔfɛ |
| Application | Recommended Porozɛ sinsinnan |
|---|---|
| Jɛkulu ka ID Kartiw | Fotow ka ɲi, kunnafoniw bɛrɛbɛrɛ, barɔdi, u dacogo muɲuni ani don o don badge baara |
| Kalandenw ni Karamɔgɔya ka kartiw | Sɛbɛnni hakɛ caman, mɔgɔya, magɛnni walima RFID baarakɛcogo ani flexing kuntaalajan |
| Mɔgɔya ni kantigiya kartiw | Marka kulɛri, barɔdi walima QR kalanni, portefeuille muɲuni ani sɛbɛnw dilanni musaka ka dɔgɔ |
| Hotel Key Kartiw | Magnetic-stripe walima RFID bɛnkan, lock sɛgɛsɛgɛli ani baarakɛ waati surun fo cɛmancɛ |
| Kɛnɛyako ni Banabagatɔw ka IDw | Kalanjɛ, saniya jiracogo, barɔdi sɛgɛsɛgɛli ani bɔli kɔlɔsili |
| Ko kɛlenw ni taamakɛlaw ka badgew | Nizɛri sɛbɛnni kunkurunnin, slots, lanyards, QR codes ani personalisation teliya |
| Process | jogoɲumanya kɔlɔsili yɔrɔ |
|---|---|
| Gilotini Tigɛcogo | Kɛrɛnkɛrɛnnenya, sɛbɛnni sɛbɛnnen, blade cogoya ani stack compression |
| Karti Punching / Die Tigɛ | Karti hakɛw, nkɔni janya, a dakunw saniyalen don ani laminati farali tɛ yen |
| Slot ani Hole Punching (Slot ni Dingɛ Punching). | A jɔyɔrɔ, a dawolo janya, a sirili doni ani a karicogo |
| Embossing walima Foil Stamping (Embossing walima Foil Stamping). | Finished-card structure, funteni, degun, papiye nɔrɔli ani kalanni |
| Thermal / Retransfert Mɔgɔya | Imprimante tacogo, bandi jiginni, dugukolo sanfɛla fanga, funteni tiɲɛni ani ja muɲuli |
| Kode magnétique / Kode RFID | Encoding yield, kalanden ka bɛnkan ani degun kɔfɛ baarakɛcogo |
| Fɛnw | fanga Jateminɛ | jɔnjɔnw |
|---|---|---|
| Teslin ka substrat (Teslin substrat) ye | Print absorption ka bon, laminate bonding barikama, flexibilité ani cushioning for electronics | A ka c’a la, a bɛ kɛ i n’a fɔ kɔnɔbara sɛbɛnnen lamininen kɔnɔ sanni ka kɛ karti dafalen ye min bɛ kɛnɛ kan |
| PVC ye | Karti taabolo sigilen, a dicogo caman ani mɔgɔya kɛcogo dɔntaw | Lamini cogoya tɛ kelen ye, funteni kunbɛncogo dɔgɔyali ani fɛnw lasegincogo danma sugu caman na |
| PETG ye | Toughness, clarity ani barikama multilayer karti baarakɛcogo | Encre nɔrɔli ni lamination furakɛcogo tɛ kelen ye ni porous Teslin substrate ye |
| Polikarbonati (Polikarbonati) ye | Muɲuli ka bon, funteni kɛlɛli ani laser-personnalisation se ka kɛ kalasi kɛrɛnkɛrɛnnenw na | Fɛnw ni u dilanni musaka ka bon; bɛ kɛ ka seereyaw ɲini minnu bɛ ɲɛnamaya jan kɛ |
| Sɛgɛsɛgɛli fɛn | Kɔlɔsili ladilikan |
|---|---|
| Materiel Identité (Dɔnniya min bɛ sɔrɔ fɛnw na). | A dilabaga, a ka kalasi, a bonya kode, a batch ani a ka seereyaw ɲɛfɔli |
| A bonya ni a bonya | Jateminɛ kɛcogo cɛmancɛ, muɲuli, sɛbɛn janya, a bonya, a kɛrɛ ani a tigɛcogo ɲuman |
| Yecogo | Fɛnɲɛnɛma, biɲɛ, nɛrɛmuguma, nɔgɔ, kurukuru, sɔgɔsɔgɔninjɛ ani dawolo tiɲɛni |
| Flatness ani Moisture (Flatness ani Moisture) ye | Kuru, bow, maracogo ani ji balansi sani ka sɛbɛnni kɛ ani ka lamination kɛ |
| Print Setigiya | Density, adhesion, drying, color, image detail, barcode kalanni ani a balili |
| Lamination Kɔrɔbɔli | Peel fanga, bulonw, haze, dakunw farali, kurulen ani finimugu janya |
| Karti sɛgɛsɛgɛli dafalen | Dimensions, flexing, abrasion, personalisation, slot fanga, kodɔn ani kalanbaga baarakɛcogo |
| Packing ani Traceability (Baarakɛcogo) ani Traceability (Traceability). | Stack lakananen, jate, kartɔn taamasiyɛn, palɛti labɛncogo, lot nimɔrɔ ani sɛgɛsɛgɛli rapɔɔri |
Teslin substrat bɛ se ka degun, wa a ka kan ka tanga funteni ma, UV yeelen ma, nɔgɔ ma, ji balanbaliya ma ani stack tansiyɔn tɛmɛnen ma. Fɛn maracogo ɲuman bɛ dɛmɛ ka kulɛri, flakɛ, sɛbɛnni kɛcogo ani lamini fanga mara.
Aw bɛ fɛn datugulenw mara yɔrɔ saniyalen na, yɔrɔ min ka jan jeni sisi ni so kɔnɔ nɔgɔw la.
Aw bɛ sɛbɛnw tanga UV yeelen tilennen ma ani funteni minnu ka ca ni u maracogo dan ye min dagalen don.
Aw bɛ sɛbɛn tigɛlenw to u ka kɛ fla ye yɔrɔ gɛlɛn na, min bɛ dɛmɛ.
Aw kana doni girinmanw walima palɛti fila bila kartɔn tigɛlenw kan.
Aw bɛ aw yɛrɛ tanga sirili sirilenw ma kojugu minnu bɛ se ka dakunw digidigi walima ka taamasiyɛn kɛ sɛbɛnfura kulu kan.
Aw bɛ pake yɔrɔ dɔw siri kokura walasa ka buguri, u ɲɛci ani ji caman cili bali.
Condition sheets minnu bɛ production so kɔnɔ sani u ka sɛbɛnni kɛ walima ka lamination kɛ ni depo cogoyaw tɛ kelen ye.
Wallis bɛ karti dilannikɛlaw ni fɛnw tila-tilabagaw dɛmɛ ni substrat sourcing ye, ka sɛbɛnw tigɛ ka kɛɲɛ ni mɔgɔw sago ye, ka pake lakananenw ani ka karti-fɛnw dilancogo jɛlen. Koman kelen-kelen bɛɛ ka kan ka siri misali dɔ la min dabɔra ani kunnafoni sɛbɛnnen dɔ min bɛ kuma hakɛ, a bonya, a sɛbɛnni kɛcogo, a laminicogo ani a ka karti dafalen wajibiyalenw kan.
Karti fɛnw baaracogo ani u bɔli jamana wɛrɛw la
Karti jateminɛlan jɔnjɔn fila: 0,178mm ani 0,254mm suganditaw karti lamininenw jɔcogo danfaralenw na.
Sɛbɛnni-taamasenɲɛ dɛmɛni: Offset, silk-screen ani digital printing kɔrɔbɔliw bɛ se ka labɛn ka sɔrɔ ka sɔn caman ma.
Lamini sinsinni yiriwali : Substrat, overlay, adhesive, temperature ani card thickness bɛ se ka lajɛ i n’a fɔ sigida kelen.
RFID karti dɔnniya : Inlay thickness, cushioning, chip protection ani reader tests bɛ se ka don sample validation kɔnɔ.
Tigɛ ni pake kɛcogo ladamu: Sɛbɛn cogoya, kulu lakanani, kartɔnw ni palɛtiw bɛ se ka kɛ ka kɛɲɛ ni fɛn dilanni ni jago magow ye.
Factory-direct B2B service: A bɛnnen don karti iziniw ma, sɛbɛnnikɛlanw, fɛn caman tigɛlikɛlaw, RFID sosiyetew, fɛnw donbagaw ani u tilabagaw.
Karti ɲinini, baarakɛwaati makɔnɔnen ani taayɔrɔ sugu.
A janya wajibiyalen don: 0,178mm / 7 mil walima 0,254mm / 10 mil.
Sɛbɛn janya, a bonya, a muɲuli, a kɛnɛ ani a hakɛ.
Sɛbɛnni kɛcogo, sɛbɛnnikɛlan modɛli, enki walima toner ani ja min bɛ kɛ fan kelen walima fan fila fɛ.
Overlay material, thickness, finish, nɔrɔli ani lamini minɛnw.
Laɲini dafalen karti hakɛw, a bonya ani a nkɔni radiyali.
RFID puce, antenne, inlay, magnétique stripe, ologramu walima fɛn wɛrɛ.
Lakanali sɛbɛnni, barɔdi, QR code ani mɔgɔ yɛrɛ ka baarakɛcogo wajibiyalenw.
Sɛbɛn minnu wajibiyalen don, fɛnw nɔfɛtaama ani sɛgɛsɛgɛli rapɔɔri.
Kɔrɔbɔli hakɛ, san o san jateminɛ, taayɔrɔ kurunbonkarila ani jiginni waatibolodalen.
Baro kɛ Aw ka Teslin Karti Porozɛ kan
0,178mm substrat ye 7 mil ye, 0,254mm substrat ye 10 mil ye. Grade min ka bon, o bɛ dɛmɛba don karti bɛɛ lajɛlen janya la ani cushioning, nka u fila bɛɛ bɛ sɛgɛsɛgɛli de wajibiya laminate jɔcogo dafalen na.
Awɔ. Sɛbɛnni kɛli fan kelen walima fan fila fɛ, o bɛ bɔ substrat hakɛ la, sɛbɛnni kɛcogo la, enki kɛcogo la, seko ni dɔnko baara balansi la ani a sɛbɛnni na—a tɛ bɔ sɛbɛnfura janya dɔrɔn na.
Sugandili si tɛ yen min bɛ kɛ diɲɛ bɛɛ kɔnɔ. Jatebɔ kɛ substrat, ɲɛfɛla ni kɔfɛla datugulanw, nɔrɔlan, sɛbɛnnikɛlan ani inlay optionnel, o kɔ aw bɛ lamina ani ka karti fini conditionné suman.
Poliyolefini basigilen substrat bɛ ji kɛlɛ, nka sɛbɛnni muɲuli bɛ bɔ tintin tigitigi la, a hakɛ ani a lamini na. Karti dafalen ka kan ka sɛgɛsɛgɛ ni ji, nɛnɛ ani saniya bɛ a la.
Aw bɛ baara kɛ ni Teslin grade ye min bɛ se ka kɛ ni tintiri ye ani ka kalali walima tintiri ɲɛgɛn kɛrɛnkɛrɛnnen sɛgɛsɛgɛ. Grade standard ani grade coté inkjet bɛ se ka kɛ cogo wɛrɛ la jalen waati, kulɛri ani ji kunbɛnni na.
Kalanso bɛnnenw bɛ se ka sɛbɛn ni laser ye, nka fuser funteni, sɛbɛnw tacogo, toner nɔrɔli ani sɛbɛnnikɛlan ka setigiya ka kan ka lajɛ. Aw kana baara kɛ ni fɛnw ye minnu ma sɔn ka kɛ minɛnw ye.
Imprimante minnu bɛ taa karti la, olu fanba dabɔra karti lankolon dafalenw kama, u ma dabɔ substrat sɛbɛn lafiyalenw kama. Aw bɛ sɛbɛnfura sɛbɛn ani ka a lamini fɔlɔ, ka kartiw sɔgɔ, ka tila ka mɔgɔya kɛcogo kɔrɔbɔ yɔrɔ jɛlenw kan.
Laminati funteni caman ni filimu nɔrɔlenw bɛ se ka baara kɛ, nka bɛnkan bɛ bɔ baarakɛcogo funteni na, jibɔ, a janya ani karti dafalen wajibiyalenw na. Aw bɛ sɔn substrat ni filimu faralen ɲɔgɔn kan tigitigi ma ni peel tests ye.
Teslin jɔcogo minnu lamininen don ka ɲɛ, olu bɛ se ka tigɛ tuma caman na ka se u cogo dafalen ma k’a sɔrɔ dankan datugulen tɛ kelen ye barisa lamini bɛ siri porose matirili la. Aw bɛ o dafa ni lamini ni taabolo sugandilen ye.
A sababu minnu bɛ se ka kɛ, olu ye ji tɛmɛnen ye, funteni bɛrɛbɛrɛ, fiɲɛ min bɛ minɛ, enki gɛlɛn, laminati min tɛ bɛn walima degun bɛrɛbɛrɛ. Aw bɛ sɛbɛnw labɛn ani ka substrat funteni yɛrɛ sɛgɛsɛgɛ.
Awɔ. A ka cushioning bɛ se ka dɛmɛ don ka ɛntɛrinɛti lakana, nka puce, antenne, inlay thickness, adhesive, pressure ani finished read performance ka kan ka tiɲɛ.
A tɛ kɛ a yɛrɛma. Substrat min ka bon, o bɛ se ka cushioning caman di, nka a bɛ karti girinya bɛɛ lajɛlen ni degun tilatilali fana Changer. Inlay structure dafalen de bɛ baarakɛcogo dantigɛ.
Standard white substrate bɛ sɛbɛnni ni lamination nafa di nka a man kan ka fɔ ko lakana taamasiɲɛ dogolenw bɛ a kɔnɔ. Porogaramu kɛrɛnkɛrɛnnen lakanani-dafalen-minɛn ye fɛn ye min bɛ kɔlɔsi a danma.
Awɔ. Holographie overlays, UV inks, microtext ani fɛn wɛrɛw bɛ se ka fara ɲɔgɔn kan sɛbɛnni ni lamination kɛcogo danfaralenw fɛ. U yecogo n’u muɲuli ka kan ka kɔrɔbɔ u dilanni kɔfɛ.
Lamini baarakɛcogo bɛ bɔ fɛnɲɛnamafagalanw na, karti jɔli, baarakɛ waati, fɛn dilanni, bolifɛnw ani fɛnw filicogo minnu bɛ sɔrɔ. Aw ye aw yɛrɛ tanga sanfɛla fɔli ma min ka bon ni ɲɛnamaya kɛcogo jateminɛ ɲɛfɔlen tɛ.
Segin-ka-bɔnye bɛ bɔ sigida lajɛw la ani karti jɔcogo dafalen na. Laminatiw, tintinw, magɛnni sɛrɛkiliw, puwɛntiw ani antɛniw bɛ se ka kɛ sababu ye ka u faranfasi kɛrɛnkɛrɛnnenya la walima ka u fili.
Aw bɛ sɛbɛnw datugu, ka u kɛ fla ye, ka u ja ani ka u tanga UV yeelen ma, funteni, sisi, buguri ani stack degun kojugu ma. Aw bɛ u labɛn sani aw ka sɛbɛnni kɛ walima ka u lamini.
Ladamu tigɛcogo bɛ se ka baro kɛ ka kɛɲɛ ni sɛbɛnni kɛcogo ye, lamini plati, karti bilali, muɲuli, hakɛ ani pake wajibiyalenw.
Awɔ. Aw bɛ misali kartiw sɛbɛn, k’u lamini, k’u nɛnɛ, k’u cogoya, k’u punch ani k’u kɛ i yɛrɛ ta ye ni baarakɛminɛnw ye minnu laɲininen don ka sɔrɔ ka sɔn o fɛn ma.
MOQ bɛ bɔ kalasi, a bonya, a sɛbɛn hakɛ, a tigɛcogo ladamulen, a sɛbɛnni seko, a pakew ani a san o san fɔcogo.
Aw bɛ a janya, a sɛbɛnfura hakɛ, a sɛbɛnni kɛcogo, a dacogo, a lamini minɛnw, a janya dafalen, RFID walima a sɛrɛkili wajibiyalenw, a hakɛ, a taayɔrɔ ani a lase waati di.
Aw bɛ se ka kuma Wallis Plastic fɛ walasa ka Teslin sintetiki papiye finman 0,178mm ani 0,254mm sɔrɔ ID lamininen, tɔndenw, lotɛli kilisi, ko kɛlenw ani RFID karti porozɛw kama. An ka jɛkulu bɛ dɛmɛ don ka ɲɛsin janya sugandili ma, ka tigɛ ka kɛɲɛ ni mɔgɔw sago ye, ka sɛbɛnni kɛ ani ka lamini kɛ, ka karti-jɔcogo lajɛ, ka jogo ɲɛfɔ ani ka B2B dilan ka ɲɛsin izini ma.
Teslin ye PPG Industries Ohio, Inc. ka jagokɛyɔrɔ taamasiyɛn sɛbɛnnen ye, a’ ye a jira ko a bɛ se ka kɛ cogo min na, a bɛ se ka kɛ cogo min na, a bɛ se ka kɛ ko a bɛ se ka kɛ, a bɛ se ka kɛ ko a bɛ se ka kɛ, a bɛ se ka kɛ, a bɛ se ka kɛ, a bɛ se ka kɛ, a bɛ se ka kɛ, a bɛ se ka kɛ, a bɛ se ka kɛ.
