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Wallis ɣi Teslin nuwɔwɔ pepa doa alɔ laminated ID, hamevinyenye kple RFID kaɖi wɔwɔ le 0.178mm kple 0.254mm gauges, kple tata dodokpɔwo, custom lãɖeɖe, kpɔɖeŋuwo kple bulk B2B nana.
kaɖi dzi nyatakakawo
WALLIS ƒe ŋkɔ
| Nusi wotsɔ wɔe: | |
|---|---|
| Titrime: | |
| Agbalẽtata ƒe ƒomevi: | |
| Agbɔsɔsɔ: | |
Wotsɔa Wallis 0.178mm kple 0.254mm Teslin ƒe pepa ɣi ɣi naa ID gbalẽvi siwo wotsɔ laminated, hamevinyenye gbalẽvi, mɔɖeɖe ƒe ɖaseɖigbalẽwo, amedzrodzeƒe ƒe safui gbalẽviwo, RFID gbalẽviwo, wɔnawo ƒe akɔtagbalẽviwo kple kaɖi ƒe ɖoɖo bubu siwo wota. Microporous substrate xɔa ink, toner, adhesive kple laminate ɖe eƒe wɔwɔme me, si kpena ɖe card wɔlawo ŋu be woakpɔ agbalẽtata si nɔa anyi didina kple layer bonding sesẽ.
Gauge eveawo sɔ kple 7 mil kple 10 mil substrate ƒe nɔnɔme siwo bɔ. Ele be woatia titrime be wòanye kaɖi bliboa tutu ƒe akpa aɖe tsɔ wu be woatiae le kaɖi ƒomevi ɖeɖeko nu. Ele be agbalẽtata le axa ɖeka alo evea siaa, nutsyɔnu ƒe titrime, RFID inlay, magnetic stripe, adhesive, lamination pressure kple finished-card ƒe titrime katã nade specification la me.
Wallis doa alɔ B2B nuƒlelawo kple kpɔɖeŋu agbalẽwo, lãɖeɖe ɖe ɖoɖo nu, agbalẽtata dodokpɔwo, lamination ƒe dodokpɔ, kaɖi-ɖoɖo me toto kple nusiwo wotsɔ ɖoa duta ƒe babla. Ele be nuƒlelawo naɖo kpe Teslin ƒe dzeside tututu, ewɔla, eƒe titrime ƒe mɔɖeɖe, anyigba ƒe nɔnɔme kple sedziwɔwɔ ŋuti nuŋlɔɖiwo dzi hafi ada asi ɖe ewɔwɔ le agbɔsɔsɔ gã me dzi.
| Adzɔnu Ƒomevi | White microporous synthetic-paper substrate na agbalẽvi siwo wota kple esiwo wotsɔ lãgbalẽ wɔe |
| Tiatiawɔblɔɖe ƒe Titrime | 0.178mm / 178μm / 7 mil kple 0.254mm / 254μm / 10 mil |
| Agbalẽtata ƒe Mɔnuwo | Offset, seda-screen kple dijitaal agbalẽtata; dɔwɔwɔ bubuwo bia be woado dzeside kple dɔwɔnuwo kpɔ |
| Kpekpeɖeŋugbalẽviwo ƒe Dɔbiagbalẽviwo | ID, hamevinyenye, nuteƒewɔwɔ, amedzrodzeƒe ƒe safui, mɔɖeɖe, wɔna, lãmesẽnyawo gbɔ kpɔkpɔ kple RFID kaɖi tiatia aɖewo |
| Tiatia Siwo Ku Ðe Nuzazãwo Ŋu | Standard alo custom-cut sheets, takpɔkpɔ ememe packing, kakɛwo kple export pallets |
| B2B Dɔwɔƒewo | Kpɔɖeŋuwo, agbalẽtata ƒe dzedze, lamination dodokpɔwo, RFID xɔtuɖoɖowo me toto, QC ɖoɖowɔwɔ kple agbɔsɔsɔme nana |
Bia Teslin Kpekpeɖeŋugbalẽvi ƒe Substrate Kpɔɖeŋuwo
Teslin substrate nye microporous, polyolefin-based synthetic material si me inorganic filler kple ememe ya ƒe agbɔsɔsɔ gbogbo aɖe le. To vovo na plastik-gbadzɛ si le ʋeʋẽm la, eƒe ʋuʋudedi xɔa ink, toner, adhesives kple laminate si wotsɔ ƒo ƒui, si wɔnɛ be mɔ̃ɖaŋununya ƒe kadodo siwo do ƒome kple wo nɔewo le nusi wotsɔ wɔe la me.
Ink kple toner ate ŋu age ɖe eme tsɔ wu be wòanɔ anyi abe anyigba ƒe akpa si woate ŋu aɖe ɖa ene ko. Le lamination me la, laminate alo adhesive si sɔ la sina yia pores la me, si kpena ɖe ame ŋu be woakpɔ nuŋɔŋlɔ siwo wota, fotowo, QR codes kple barcodes ta tso abrasion alo layer mama ƒe agbagbadzedze me.
Nusiwo woate ŋu aƒo ƒu ate ŋu axe mɔ na magnet-ka, antenna, chips kple nu bubu siwo wotsɔ de eme. Esia meɖea inlay engineering ƒe hiahiã ɖa o: akpaa ƒe titrime, do ƒe nɔnɔme, nyaƒoɖeamenu mama kple dodokpɔ si wowɔna enuenu-flex gakpɔtɔ le vevie.
Kaɖi ƒe dedienɔnɔ nɔ te ɖe alesi wowɔe bliboa dzi, si me nutata siwo dzi wokpɔna, nyatakaka siwo trɔna, holographic ƒe nɔnɔmewo, UV inks, overlays, chips, magnetic stripes kple eɖeɖe ƒe ɖoɖowo hã le. Mele be woaɖɔ anyigba ɣi si wozãna ɖaa be tsidzesiwo alo nu ɣaɣlawo le eme o negbe ɖe wotu nɔnɔme mawo ɖe grade si tututu wòle la me hafi.
White Microporous Kpekpeɖeŋugbalẽvi ƒe Substrate
Agbalẽ Si Woate Ŋu Ata Kple Lamination-Xɔlɔ̃wɔwɔ
Woate ŋu ata eƒe titrime eveawo siaa ɖe axa ɖeka alo evea siaa dzi. Tiatia nyuitɔ nɔ te ɖe nusi wobia tso anyigba ƒe akpa si woawɔ le kaɖi ƒe titrime bliboa, eƒe sesẽme, eƒe akɔtaɖonu, lamination stack kple overlay film siwo li dzi—menye ne nutata la nye axa ɖeka alo axa eve ko o.
| Tiatia ƒe Nu | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Substrate ƒe Nudzɔdzɔ | Nudzɔdzɔ si wowɔna le kaɖi ƒe titrime bliboa me dzi ɖe kpɔtɔ; gblẽa teƒe geɖe ɖi na nusiwo woatsɔ atsyɔ nu dzi alo nusiwo woatsɔ atsyɔ nu bubuwo dzi | Kpekpeɖeŋu si lolo wu le eƒe titrime bliboa kple cushioning me |
| Trɔtrɔ ɖe nɔnɔmewo ŋu | Woate ŋu atrɔ ɖe nɔnɔmewo ŋu wu hafi woawɔ lamination | Seselelãme si le vevie wu hafi lamination |
| Dɔwɔɖoɖoa Zazã Si Bɔbɔe | Thin-core laminated cards, badges, tags kple xɔtuɖoɖowo zãa nusiwo wotsɔ tsyɔa nu dzi wu | Nu vevi siwo kpekpe wu, cushioning si wodo ɖe ŋgɔ kple xɔtuɖoɖo siwo zãa nutsyɔnu siwo le tsɛ wu |
| RFID / Chip ƒe Dɔwɔɖoɖo | Viɖe le afisi inlay kple overlays ɖua titrime geɖe xoxo | Ate ŋu ana cushioning geɖe wu, gake ele be woagbugbɔ abu akɔnta le total stack kple pressure ŋu |
| Mɔnu si Woatsɔ Ada Asi Ðo | Ta, laminate, nɔnɔme eye nàdzidze kpɔɖeŋu siwo wowɔ vɔ | Ta, laminate, nɔnɔme eye nàdzidze kpɔɖeŋu siwo wowɔ vɔ |
7 Mil kple 10 Mil Titrime Tiatia
ID gbalẽvi si wotsɔ laminated nye ɖoɖo si me wotsɔa nusiwo wotsɔ wɔa anyigba, agbalẽtata, nusiwo wotsɔ blaa nu, adhesive kple elektrɔnik akpa siwo woate ŋu atia. Ele be woabu akɔnta le eƒe titrime si wowu enu la ŋu tso ƒuƒoƒo bliboa me eye woaɖo kpe edzi ne kaɖia fa eye wòtrɔ asi le eŋu vɔ.
| Card Component ƒe | Titrime kple Dɔwɔwɔ Ŋuti Bubu |
|---|---|
| Teslin ƒe Agbalẽtata ƒe Nu vevi | Zã 0.178mm alo 0.254mm le stack si dzi woda asi ɖo kple cushioning si hiã nu |
| Ŋgɔgbe kple Megbe ƒe Nutsyɔnu | Overlay gauge, adhesive kple anyigbadzi nuwuwu ɖoa ametakpɔkpɔ kple mamlɛtɔ kaɖi ƒe seselelãme |
| Ink / Toner si wota | Nu sesẽ sesẽ ƒe nutsyɔtsyɔ ate ŋu akpɔ ŋusẽ ɖe tsidzadza, mɔxexe, lamination kple didime ƒe dadasɔ dzi |
| RFID Inlay alo Chip | De antenna, chip bump, adhesive kple cavity alo spacer layers ɖesiaɖe eme |
| Magnetic Stripe / Hologram ƒe fli | Kpɔ kpe stripe recess, overlay ƒe ɖekawɔwɔ kple post-lamination encoding alo inspection dzi |
| Kpekpeɖeŋugbalẽvi si Wowu Nu | Dzidze eƒe titrime, eƒe gbadzaƒe, eƒe didime kple eƒe dɔwɔwɔ le fafa kple eƒe nɔnɔmewɔwɔ vɔ megbe |
ID, Mɔɖeɖe kple Hamea Me Tɔ ƒe Kpekpeɖeŋugbalẽviwo
Wowu Laminated Card ƒe Ðoɖowo Nu
Wotrɔ asi le Teslin ƒe dzesi vovovowo ŋu wòsɔ nyuie na agbalẽtata ƒe ɖoɖo vovovowo. Mele be nuƒlelawo nasusui be agbalẽ ɣi ɖeka ana nu ma ke nado tso offset, dye inkjet, pigment inkjet, laser, Indigo, screen alo thermal-transfer dɔwɔnuwo dzi o. Wobia be woadze le dzeside, agbalẽtamɔ̃ kple nuŋlɔtsi ƒe ɖoɖoa tututu ŋu.
| Agbalẽtata ƒe Dɔwɔna | B2B ƒe Dzesidede Nudidi |
|---|---|
| Offset ƒe Agbalẽtata | Ink ɖoɖo, density, trapping, ƒuƒu, powder level, mɔxexe kple lamination tsitretsitsi |
| Seda-Screen Tata | Ink ƒe titrime, solvent ƒe sɔsɔ, dɔyɔyɔ, asitɔtrɔ le nɔnɔmewo ŋu kple layer bonding |
| Digitál Laser Tata | Fuser dzoxɔxɔ, toner adhesion, agbalẽa tsɔtsɔ, static dziɖuɖu kple dɔwɔnuwo ƒe dzedze |
| Inkjet ƒe Agbalẽtata | Zã dzeside si sɔ kple inkjet; dodokpɔ amadede alo amadede ƒe nuŋlɔtsi, ƒuƒuɣi, tsi ƒe tsitretsitsi kple amadede ƒe nɔnɔme |
| HP Indigo / Digitál Nyadzɔdzɔdɔwɔƒe | Ðo kpe dzeside si dze, primer ƒe nudidi, blanket ƒe dzoxɔxɔ kple post-print lamination dzi |
| Agbalẽtamɔ̃ si Wotsɔna Yia Kpekpeɖeŋugbalẽvi Dzi Tsã | Zi geɖe la, etaa agbalẽvi ƒuƒlu si wowu enu tsɔ wu be wòataa Teslin ƒe agbalẽvi si le gbadzaa; dodokpɔ le kaɖi ƒe lamination kple punching megbe ko |
Wokpɔa axa eve ƒe agbalẽtata dzi to agbalẽtata ƒe ɖoɖo, dzeside, tsi ƒe dadasɔ, nutata ƒe nutsyɔtsyɔ kple ŋkɔ ŋɔŋlɔ dzi—menye to 0.254mm nu zazã ko me o. Ŋgɔgbe kple megbe ƒe nɔnɔme si da sɔ hã ate ŋu akpe ɖe eŋu be woaɖe ʋuʋudedi dzi akpɔtɔ le agbalẽtata kple lamination megbe.
Zi geɖe la, wotaa nɔnɔmetata siwo woɖo ɖi ɖe substrate sheets dzi hafi lamination. Woate ŋu atsɔ ŋkɔ siwo trɔna, fotowo, xexlẽdzesiwo alo barcodewo akpe ɖe eŋu le agbalẽwo tata me alo emegbe le agbalẽvi si wowu enu la dzi, le alesi woɖea agbalẽviawo nanae nu.
Offset, Screen kple Digital Printing Dodokpɔwo
Teslin substrate ate ŋu anye platen-laminated alo roll-laminated kple film siwo sɔ. Kadodo sesẽ dzɔna ne laminate alo adhesive sina yi ɖe microporous structure la me. Ele be woaɖo ɖoɖo mamlɛawo kple substrate grade ŋutɔŋutɔ, overlay, ink, press kple card stack.
| Lamination Control | Nuwɔna si Wokafu |
|---|---|
| Tsidzadza ƒe Nɔnɔme | Nɔnɔme substrate kple agbalẽ siwo wota hafi lamination; nusiwo ƒu akpa alo tsi akpa ate ŋu aɖe eƒe nyonyome dzi akpɔtɔ |
| Dzoxɔxɔ | Ðoe ɖe laminate dzrala kple substrate ƒe dzoxɔxɔ si ŋu woɖo kpee nu; mègaɖo ŋu ɖe mɔ̃a ƒe dzoxɔxɔ si woɖena fiana ŋu ko o |
| Nyaƒoɖeamenu Kple Ɣeyiɣi | Na tsi si sɔ yi ɖe ʋuʋudediawo me evɔ màgbã lãgbalẽgolowo, atrɔ asi le nutatawo ŋu alo awɔe be woaƒo wo wòagbɔ eme o |
| Fafa na ame | Fae le nyaƒoɖeamenu si dzi wokpɔ ŋusẽ ɖo me be wòana wòanɔ gbadzaa eye wòana eƒe didime nali ke nyuie wu |
| Peel Ŋusẽ | Do laminate si wowu enu la kpɔ le eƒe nɔnɔme kple nutome ƒe nɔnɔme wɔwɔ vɔ megbe |
| Nutrenu ƒe Nugbɔ | Zi geɖe la, woate ŋu atso Teslin laminate xɔtunu siwo sɔ la le lamination megbe esi wometre liƒo ɖe vovo o; ɖo kpe edzi kple sinima si nètia |
Gɔmedzedze ƒe nɔnɔme siwo wota ate ŋu akpe ɖe dodokpɔwo ŋu, gake dzoxɔxɔ ƒe tsɔtsɔ ŋutɔŋutɔ toa vovo le agbalẽ, agbalẽtamɔ̃, stack ƒe kɔkɔme, overlay chemistry kple printed coverage nu. Ŋlɔ substrate ƒe dzoxɔxɔ, nyaƒoɖeamenu, nɔƒe, fafa kple asiɖeɖe le film ƒe ɖoɖo si dzi woda asi ɖo ŋu hena ewɔwɔ ake.
Tsi si woxe, dzoxɔxɔ si mesɔ gbɔ o, laminate si mewɔ ɖeka o, ink kpekpe alo fafa si mesɔ o ate ŋu ana kuɖɔ, klosalo, afu alo ʋuʋudedi. Lé ŋku ɖe agbalẽa kple agbalẽvi siwo wotsɔ aŋe wɔe siaa ŋu le wo ɖɔɖɔɖo vɔ megbe.
Teslin substrate ateŋu ado alɔ layered credential design, gake dedienɔnɔ ƒe nɔnɔmewo nye esiwo wowɔ to document program bliboa dzi. Asitsatsa ŋuti nyatakaka siwo wozãna ɖaa la metsɔa nya ɣaɣlawo alo ʋɔnudrɔ̃ƒe ƒe nya siwo dziɖuɖua dea dzesii la le wo ɖokui si o.
| Dedienɔnɔ ƒe Nɔnɔmewo | ƒe Ðekawɔwɔ ƒe Nudidi |
|---|---|
| Microtext kple Fine-Line Agbalẽtata | Nutata siwo ƒe lolome deŋgɔ, plate alo digital nɔnɔmetata siwo dzi wokpɔna kple lamination megbe nuxexlẽ |
| UV-Fluorescent Ink si Wotsɔna Klẽnae | Ink nala ƒe dzedze, megbe fluorescence dziɖuɖu kple ŋkuléle ɖe lamination megbe |
| Holographic ƒe Nutsyɔtsyɔ | Woŋlɔ ŋkɔ ɖe nutsyɔtsyɔ, laminate ƒe sɔsɔ, ŋkume kɔ nyuie kple tamper nuwɔna |
| QR Code kple Barcode | Ta ƒe vovototo, didime ƒe nyateƒetoto, scanner xexlẽ kple abrasion takpɔkpɔ |
| Dedienɔnɔ ƒe Dzeside-Grade Substrate si wowɔ ɖe ɖoɖo nu | Dzesi siwo wotsɔ de ɖoɖowɔɖia koŋ me hiã na nuzazãwo ƒe kɔsɔkɔsɔ si ŋu woɖe mɔ ɖo si le dedie eye womesɔ kple agbalẽ ɣi si wozãna ɖaa o |
Layered Dedienɔnɔ kple Laminate Takpɔkpɔ
Teslin substrate ate ŋu axe mɔ na RFID inlay eye wòakpɔ eta, gake ne ètia 0.254mm ɖe 0.178mm teƒe la, menaa kaɖi si sɔ na elektrɔnikmɔ̃ deŋgɔwo le eɖokui si o. Ele be woawɔ inlay, chip, antenna, adhesives, overlay kple lamination ƒe tsatsam abe xɔtuɖoɖo ɖeka ene.
| Smart Card Factor | si hiã be woada asi ɖe edzi |
|---|---|
| Chip kple Frequency | Ðo kpe chip ƒe kpɔɖeŋu, frequency, protocol, ŋkuɖodzinu kple nuxlẽla ƒe ɖoɖo dzi |
| Antenna ƒe Geometry | Takpɔ antenna ƒe dzesiwo le lamination, punching kple card-edge finishing me |
| Inlay ƒe Titrime | Bu akɔnta le chip bump, antenna, carrier kple adhesive le card stack bliboa me |
| Nyaƒoɖeamenu ƒe Mama | Zã cushioning kple do siwo sɔ be nàƒo asa na chip alo antenna ƒe gbegblẽ |
| Dɔwɔwɔ ƒe Dodokpɔ | Do nuxexlẽ/ŋɔŋlɔ ƒe dɔwɔwɔ kpɔ hafi lamination, le lamination megbe, le punching megbe kple le flexing megbe |
| Dɔbiagbalẽvi | si Wokafu be Woalé fɔ Ðe Dɔa Ŋu |
|---|---|
| Dɔwɔƒewo ƒe ID-gbalẽviwo | Foto ƒe nyonyome, nyatakaka siwo trɔna, barcode, overlay ƒe anyinɔnɔ kple gbesiagbe akɔtagbalẽvi zazã |
| Sukuviwo kple Nufialawo ƒe Kpekpeɖeŋugbalẽviwo | Agbalẽtata si ƒe lolome lolo, ame ŋutɔ ƒe tɔtrɔ, magnet alo RFID dɔwɔwɔ kple ɣeyiɣi didi ƒe flexing |
| Hamevinyenye Kple Nuteƒewɔwɔ ƒe Gbalẽviwo | Adzɔnu ƒe amadede, barcode alo QR xexlẽ, gakotoku ƒe anyinɔnɔ kple agbalẽwo wɔwɔ si me ga mele o |
| Amedzrodzeƒea ƒe Safuigbalẽviwo | Magnetic-stripe alo RFID ƒe sɔsɔ, ʋɔtru dodokpɔ kple kpuie va ɖo titina subɔsubɔ agbenɔƒe |
| Lãmesẽnyawo Kple Dɔnɔwo ƒe ID-gbalẽviwo | Nuxexlẽ, dzadzɛnyenye ƒe nukpɔkpɔ, barcode scanning kple eɖeɖe si dzi wokpɔna |
| Nudzɔdzɔ Kple Amedzrowo ƒe Akɔtagbalẽviwo | Digitál agbalẽtata ɣeyiɣi kpui aɖe, slots, lanyards, QR codes kple ame ŋutɔ ƒe tɔtrɔ kabakaba |
| Dɔwɔna | ƒe Nyonyome Dzikpɔƒe |
|---|---|
| Guillotine ƒe Lãɖeɖe | Squareness, agbalẽ si wota, blade ƒe nɔnɔme kple stack compression |
| Card Punching / Ku Lãɖeɖe | Kpekpeɖeŋugbalẽvi ƒe didime, dzogoe ƒe didime, goawo dzadzɛ eye laminate ƒe mama aɖeke meli o |
| Slot kple Dowo ƒe Punching | Teƒe si wòle, nugbɔ ƒe didime, ka ƒe agba kple gbagbã ƒe tsitretsitsi |
| Embossing alo Foil Stamping | Finished-card structure, dzoxɔxɔ, nyaƒoɖeamenu, foil adhesion kple nuxexlẽ |
| Dzoxɔxɔ / Retransfer Ame ŋutɔ ƒe Nɔnɔme | Agbalẽtamɔ̃ ƒe ʋuɖoɖo, ribbon ƒe asitɔtrɔ, anyigba ƒe ŋusẽ, dzoxɔxɔ ƒe tɔtɔ kple nɔnɔmetata ƒe anyinɔnɔ |
| Magnetic Encoding / RFID Nuŋɔŋlɔ | Encoding yield, nuxlẽla ƒe sɔsɔ kple post-stress dɔwɔwɔ |
| ƒe | Ŋusẽwo | Nu vevi siwo ŋu woabu |
|---|---|---|
| Teslin ƒe Anyigbadzinu | Kɔkɔe tata absorption, sesẽ laminate kadodo, asitɔtrɔ kple cushioning na elektrɔnikmɔ̃wo | Zi geɖe la, wozãnɛ abe nu vevi si wota le xɔtunu si wotsɔ laminate wɔe me ene tsɔ wu be woazãe abe agbalẽvi si wowɔ vɔ si woɖe ɖe go ene |
| PVC si wotsɔ wɔa dɔe | Woɖo kaɖi ƒe ɖoɖo, nana si keke ta kple ame ŋutɔ ƒe tɔtrɔmɔnu nyanyɛwo | Nutome ƒe nɔnɔme vovovowo, dzoxɔxɔ ƒe tsitretsitsi si bɔbɔ ɖe anyi kple nusiwo wogbugbɔ zãna si seɖoƒe li na le asi geɖe me |
| PETG | Toughness, eme kɔ kple sesẽ multilayer kaɖi dɔwɔwɔwo | Ink adhesion kple lamination nuɖaɖa to vovo na porous Teslin substrate |
| Polycarbonate si wotsɔ wɔa dɔe | Kɔkɔe, dzoxɔxɔ tsitretsitsi kple laser-ame ŋutɔ ƒe ŋutete le adzɔgbeɖeɖe ƒe dzesiwo | Nusiwo wotsɔ wɔe kple ewɔwɔ ƒe gazazã si lolo wu; wozãna tsɔ biaa ɖaseɖigbalẽ siwo nɔa anyi didi |
| Dzodzro Nu Kafui | Dzikpɔkpɔ |
|---|---|
| Nuwo ƒe Dzesidede Ame | Adzɔnuwɔƒe, dzeside, titrime ƒe kɔda, batch kple ɖaseɖigbalẽ ƒe nufiame |
| Eƒe Titrime Kple Eƒe Agbɔsɔsɔme | Mamã dedie ƒe dzidzenu, mɔɖeɖe ɖe nu ŋu, agbalẽa ƒe didime, kekeme, dzogoe ene me kple lãɖeɖe ƒe nyateƒetoto |
| Dzedzeme | Yevuwɔwɔ, vɔvɔli, teƒe yibɔwo, ɖiƒoƒo, flitete, ʋuʋudedi kple nugbɔ ƒe gbegblẽ |
| Flatness kple Tsidzadza | Curl, bow, nudzraɖoƒe ƒe nɔnɔme kple tsi ƒe dadasɔ hafi tata kple lamination |
| Agbalẽtata ƒe Dzeside | Density, adhesion, drying, amadede, nɔnɔmetata tsitotsito, barcode xexlẽ kple mɔxexe |
| Lamination Dodokpɔ | Peel ŋusẽ, bubbles, haze, nugbɔ mama, curl kple nuwuwu titrime |
| Kpekpeɖeŋugbalẽvi ƒe Dodokpɔ si Wu enu | Dimensions, flexing, abrasion, ame ŋutɔ ƒe nɔnɔme, slot ŋusẽ, encoding kple nuxlẽla ƒe dɔwɔwɔ |
| Nubablɛwo Kple Wo Didi | Takpɔkpɔ stack, xexlẽme, kakɛ ƒe dzeside, pallet ɖoɖo, lot xexlẽdzesi kple ŋkuléle ɖe nyatakaka |
Teslin substrate nye nusi woate ŋu aƒo eye ele be woakpɔ eta tso dzoxɔxɔ, UV kekeli, ɖiƒoƒo, tsi ƒe dadasɔmakpɔmakpɔ kple stack ƒe nyaƒoɖeamenu si gbɔ eme me. Nudzraɖoƒe nyuie kpena ɖe ame ŋu be amadede, gbadzaƒe, agbalẽtata ƒe dɔwɔwɔ kple lamination ƒe ŋusẽ nanɔ anyi.
Dzra nusiwo wotsɔ tsyɔ nu dzi ɖo ɖe teƒe dzadzɛ aɖe si didi tso dzobibi ƒe dzudzɔ kple xɔme ɖiƒoƒo gbɔ.
Takpɔ agbalẽwo ta tso UV keklẽ tẽ kple dzoxɔxɔ si wu seɖoƒe si dzi woda asi ɖo be woadzra wo ɖo la me.
Na agbalẽ siwo wotso la nanɔ gbadzaa le anyigba sesẽ si dzi woate ŋu alé ɖe te.
Mègatsɔ agba kpekpewo alo pallet siwo woƒo ƒu zi eve la da ɖe kakɛ siwo wotso dzi o.
Ƒo asa na kaƒoƒo sesẽ akpa si ate ŋu aƒo goawo alo ade dzesi agbalẽa ƒe ƒuƒoƒoa.
Na woagbugbɔ abla akpa aɖewo be ke, amadede ƒe tɔtrɔ kple tsi ƒe tɔtrɔ nagatrɔ o.
Nɔnɔme ƒe agbalẽvi siwo le xɔ si me wowɔa nu le me hafi woata wo alo abla wo ne nudzraɖoƒe ƒe nɔnɔmewo to vovo.
Wallis doa alɔ kaɖiwɔlawo kple nuwo mamalawo kple substrate sourcing, custom sheet cutting, protected packing kple coordinated card-material supply. Ele be woatsɔ nudɔdɔ ɖesiaɖe asɔ kple kpɔɖeŋu si dzi woda asi ɖo kple nyatakaka si woŋlɔ ɖi si ƒo nu tso grade, titrime, agbalẽtata ƒe ɖoɖo, lamination structure kple finished-card ƒe nudidiwo ŋu.
Kpekpeɖeŋugbalẽviwo ƒe Dɔwɔnawo Kple Wo Ðeɖe Ðe Duta
Eve standard card gauges: 0.178mm kple 0.254mm tiatia na vovovo laminated kaɖi xɔtuɖoɖowo.
Agbalẽtata-dɔwɔwɔ ƒe kpekpeɖeŋu: Woate ŋu awɔ ɖoɖo ɖe offset, silk-screen kple digital agbalẽtata dodokpɔwo ŋu hafi woada asi ɖe edzi le agbɔsɔsɔ gã me.
Lamination-focused development: Woate ŋu ato substrate, overlay, adhesive, dzoxɔxɔ kple card ƒe titrime me abe ɖoɖo ɖeka ene.
RFID kaɖi nuteƒekpɔkpɔ: Woate ŋu ade inlay ƒe titrime, cushioning, chip takpɔkpɔ kple nuxlẽla dodokpɔwo kpɔɖeŋu ƒe kpeɖodzinana me.
Custom lãɖeɖe kple packing: Sheet format, stack takpɔkpɔ, kakɛwo kple pallets ate ŋu atrɔ asi le ewɔwɔ kple dɔdɔ ƒe hiahiãwo.
Factory-direct B2B service: Esɔ na kaɖi dɔwɔƒewo, agbalẽtamɔ̃wo, tɔtrɔlawo, RFID dɔwɔƒewo, nusiwo wotsɔ tso duta vɛ kple mamalawo.
Kpekpeɖeŋugbalẽvi ƒe dɔbiagbalẽvi, subɔsubɔ ƒe agbenɔƒe si wokpɔ mɔ na kple asi si me woayi.
Titrime si hiã: 0.178mm / 7 mil alo 0.254mm / 10 mil.
Agbalẽvi ƒe didime, kekeme, mɔɖeɖe ɖe nu ŋu, eƒe dzogoe ene me kple eƒe agbɔsɔsɔ.
Agbalẽtata ƒe ɖoɖo, agbalẽtamɔ̃ ƒe nɔnɔme, ink alo toner kple akpa ɖeka alo eve ƒe nutata.
Overlay nu, titrime, nuwuwu, adhesive kple lamination dɔwɔnuwo.
Taɖodzinu wu kaɖi ƒe didime, titrime kple dzogoe ƒe didime.
RFID chip, antenna, inlay, magnetic stripe, hologram alo akpa bubu.
Dedienɔnɔ ƒe agbalẽtata, barcode, QR code kple ame ŋutɔ ƒe tɔtrɔ ƒe nudidiwo.
Ðaseɖigbalẽ siwo hiã, nuwo didi kple wo me dzodzro ŋuti nyatakaka.
Dodokpɔ ƒe agbɔsɔsɔme, ƒe sia ƒe ƒe nyagblɔɖi, melidzeƒe si woɖo tae kple ɖoɖowɔɖi si woatsɔ aɖoe.
Dzro Wò Teslin Kpekpeɖeŋugbalẽvi Dɔwɔɖoɖoa Me
0.178mm ƒe anyigba ƒe lolome nye 7 mil, gake 0.254mm ƒe anyigba ƒe didime nye 10 mil. Dzeside si le kpekpem wu kpena ɖe kaɖi ƒe titrime bliboa kple cushioning ŋu geɖe wu, gake wo ame evea siaa hiã dodokpɔ le laminate ƒe wɔwɔme bliboa me.
Ɛ̃. Axa ɖeka alo akpa eve tata nɔ te ɖe nusi wotsɔ wɔe ƒe dzeside, agbalẽtata ƒe ɖoɖo, nuŋlɔtsi ƒe ɖoɖo, nutatawo ƒe dadasɔ kple woƒe ŋkɔ ŋɔŋlɔ dzi—menye ɖe agbalẽa ƒe titrime ko dzi o.
Tiatia aɖeke meli si woawɔ le xexeame katã o. Bu akɔnta le substrate, ŋgɔgbe kple megbe overlays, adhesive, agbalẽtata kple tiatia inlay, emegbe laminate eye nàdzidze conditioned nuwuwu kaɖi.
Substrate si wotu ɖe polyolefin dzi la tsi tre ɖe tsi ŋu, gake agbalẽtata ƒe anyinɔnɔ nɔ te ɖe ink, grade kple lamination tututu dzi. Ele be woado agbalẽvi si wowɔ vɔ la akpɔ be tsi, fafa le eme eye wòle dzadzɛ hã.
Zã Teslin ƒe dzesi si sɔ kple inkjet eye nàdo amadede alo amadede ƒe ink tɔxɛa kpɔ. Standard grades kple coated inkjet grades ateŋu awɔ nu le mɔ vovovowo nu le kuɖiɖiɣi, amadede kple tsi ƒe tsitretsitsi me.
Woate ŋu ata dzesi siwo sɔ la to laser dzi, gake ele be woalé ŋku ɖe fuser ƒe dzoxɔxɔ, agbalẽa ƒe tsɔtsɔ, toner ƒe adhesion kple agbalẽtamɔ̃ ƒe dzedze ŋu. Mègazã nusiwo dzi womeda asi ɖo na dɔwɔnuawo o.
Wotrɔ asi le agbalẽtamɔ̃ siwo wotsɔna ɖoa agbalẽ dzi tẽ ƒe akpa gãtɔ ŋu na kaɖi ƒuƒlu siwo wowɔ vɔ, ke menye na agbalẽvi siwo dzi woŋlɔ nu ɖo siwo me mekɔ o. Ta agbalẽvi la eye nàblae gbã, ƒo agbalẽviawo, eye emegbe nàdo ame ŋutɔ ƒe nɔnɔme kpɔ le teƒe ƒuƒlu siwo nèwu enu la dzi.
Dzoxɔxɔ ƒe laminate geɖewo kple adhesive films ate ŋu awɔ dɔ, gake woƒe sɔsɔ nɔ te ɖe activation temperature, flow, thickness kple finished-card ƒe nudidiwo dzi. Da asi ɖe substrate-and-film ƒe ƒuƒoƒo tututu dzi to peel dodokpɔwo me.
Zi geɖe la, woate ŋu atso Teslin xɔtunu siwo wotsɔ lãgbalẽ wɔe nyuie la ɖe nɔnɔme si wowu enu nu evɔ liƒo si wotu ɖe vovo manɔmee elabena lãgbalẽa blana ɖe ʋuʋudedi si me ʋuʋudedi le la me. Ðo kpe esia dzi kple laminate kple dɔwɔwɔ si nètia.
Nusiwo ate ŋu atsoe dometɔ aɖewoe nye tsi si sɔ gbɔ, dzoxɔxɔ si mesɔ gbɔ o, ya si xe, nuŋlɔtsi kpekpe, laminate si mewɔ ɖeka o alo nyaƒoɖeamenu si mesɔ o. Dzra agbalẽawo ɖo eye nàɖo kpe anyigba ƒe dzoxɔxɔ ŋutɔŋutɔ dzi.
Ɛ̃. Eƒe cushioning ate ŋu akpe ɖe elektrɔnikmɔ̃wo takpɔkpɔ ŋu, gake ele be woaɖo kpe chip, antenna, inlay ƒe titrime, adhesive, pressure kple finished read performance dzi.
Menye le eɖokui si o. Substrate si le kpekpem wu ate ŋu ana cushioning geɖe wu, gake etrɔa card ƒe titrime bliboa kple nyaƒoɖeamenu ƒe mama hã. Inlay ƒe wɔwɔme bliboae ɖoa dɔwɔwɔ.
Standard white substrate naa tata kple lamination viɖewo gake mele be woaɖɔe be dedienɔnɔ ƒe dzesi ɣaɣlawo le eme o. Ðoɖowɔɖi tɔxɛ ƒe dedienɔnɔ ƒe dzesidenu nye nusi dzi wokpɔna le vovo.
Ɛ̃. Woateŋu awɔ holographic overlays, UV inks, microtext kple nɔnɔme bubuwo ɖekae to agbalẽtata kple lamination ƒe mɔnu vovovowo dzi. Ele be woado woƒe dzedzeme kple alesi woanɔ anyi eteƒe nadidi kpɔ le wo wɔwɔ vɔ megbe.
Nutome ƒe dɔwɔwɔ nɔ te ɖe nu xoxowo, kaɖiwo tutu, dɔwɔwɔ ƒe agbenɔƒe, wo wɔwɔ, ʋuɖoɖo kple mɔ siwo li siwo dzi woato atsɔ wo aƒu gbe dzi. Ƒo asa na nya si wogblɔna be yede ŋgɔ wu le mɔ gbadza nu si me womewɔ agbenɔnɔ ƒe ɣeyiɣi ƒe dodokpɔ si woɖe fia o.
Gbugbɔgazã nɔ te ɖe nutoa me nuƒoƒoƒu kple agbalẽvi ƒe ɖoɖo bliboa dzi. Laminates, inks, magnetic stripes, chips kple antennas ateŋu abia be woaɖe wo ɖe vovo alo atsɔ wo aƒu gbe etɔxɛe.
Na agbalẽwo natsyɔ, woanɔ gbadzaa, woaƒu eye woakpɔ wo ta tso UV kekeli, dzoxɔxɔ, dzudzɔ, ke kple stack ƒe nyaƒoɖeamenu si gbɔ eme me. Trɔ asi le wo ŋu hafi nàta wo alo awɔ lamination.
Woate ŋu aƒo nu tso lãɖeɖe si wowɔ ɖe ɖoɖo nu ŋu le agbalẽtata ƒe ɖoɖo, lamination plate, card imposition, mɔɖeɖe ɖe nu ŋu, agbɔsɔsɔme kple packing nudidiwo nu.
Ɛ̃. Ta, laminate, cool, condition, punch eye nàtrɔ asi le kpɔɖeŋugbalẽviwo ŋu to dɔwɔnu siwo woɖo be woawɔ la zazã me hafi ada asi ɖe nusi wotsɔ wɔe dzi.
MOQ nɔ te ɖe grade, titrime, agbalẽ ƒe lolome, custom cutting, agbalẽtata ƒe dzedze, packing kple ƒe sia ƒe ƒe nyagblɔɖi dzi.
Na titrime, agbalẽa ƒe lolome, agbalẽtata ƒe ɖoɖo, nutsyɔnu, lamination dɔwɔnuwo, kaɖi ƒe titrime si wowu enu, RFID alo fli ƒe nudidiwo, agbɔsɔsɔ, teƒe si woayi kple ɖoɖo si woatsɔ aɖoe ɖa.
Te ɖe Wallis Plastic ŋu hena 0.178mm kple 0.254mm ɣi Teslin synthetic paper na laminated ID, hamevinyenye, amedzrodzeƒe safui, wɔna kple RFID kaɖi dɔwo. Míaƒe ƒuƒoƒoa doa alɔ titrime tiatia, dekɔnu lãɖeɖe, agbalẽtata kple lamination dodokpɔwo, kaɖi-ɖoɖo me toto, nyonyome ƒe nɔnɔmewo kple dɔwɔƒe- tẽ B2B nana.
Teslin nye PPG Industries Ohio, Inc. ƒe asitsadzesi si wode agbalẽ me. Ðo kpe dzeside si tututu wotsɔ na, afisi wòtso kple nuŋlɔɖiwo dzi na nudɔdɔ ɖesiaɖe.
