0.178mm & 0.254mm White Teslin ID Card Substrate hmanga siam a ni

0.178mm leh 0.254mm White Teslin ID Card Substrate hmanga siam a ni

Wallis 0.178mm leh 0.254mm white Teslin synthetic paper hi laminated ID card, membership card, access credentials, hotel key card, RFID card, event badge leh printed card program dangte tan supply a ni. Microporous substrate hian a structure-ah ink, toner, adhesive leh laminate te a pawm a, hei hian card siamtute chu print nghet tak leh layer bonding nghet tak neih theihna turin a pui a ni.

Gauge pahnih hi common 7 mil leh 10 mil substrate format nen a inmil a ni. Card chi hrang hrang chauh ni lovin card siam zawh takah hian thickness hi thlan tur a ni. A sir khatah emaw, a sir lehlamah emaw printing, overlay thickness, RFID inlay, magnetic stripe, adhesive, lamination pressure leh finished-card thickness te chu specification-ah hian a tel vek tur a ni.

Wallis hian B2B lei duhte chu sample sheet, custom cutting, printing trial, lamination evaluation, card-structure review leh export packing hmangin a thlawp a ni. Buyers te chuan mass production an pawm hmain Teslin grade dik tak, siamtu, thickness tolerance, surface condition leh compliance documents te chu an confirm hmasa tur a ni.

Product chi hrang hrang	Printed leh laminated card siamna tur microporous synthetic-paper substrate dum a ni
Thickness duhthlan tur a awm	0.178mm / 178μm / 7 mil leh 0.254mm / 254μm / 10 mil a ni
Printing tih dan tur	Offset, silk-screen leh digital printing te a ni a; process dang tih belh tur chuan grade leh equipment test a ngai a ni
Card Dilna te	ID, membership, loyalty, hotel key, access, event, healthcare leh RFID card thlan bik te a awm bawk
Supply duhthlan tur hrang hrang	Standard emaw custom-cut sheet, inner packing humhalh, carton leh export pallet te a awm bawk
B2B Services te a ni	Sample, print qualification, lamination trial, RFID structure enfiah, QC planning leh bulk supply te a awm bawk

Teslin Card Substrate Sample te dil theih a ni

Teslin Synthetic Paper Chu Eng Nge Ni?

Teslin substrate hi microporous, polyolefin-based synthetic material a ni a, inorganic filler leh internal air volume tam tak a awm a ni. Dense plastic sheet ang lo takin a porous structure hian ink, toner, adhesive leh molten laminate te a absorb a, substrate chhungah interlocking mechanical bonds a siam a ni.

Printing leh Bonding atana hman tur Microporous Structure a ni

Ink leh toner te hi removable surface layer ang chauha awm lovin surface chhungah a lut thei a ni. Lamination lai hian compatible laminate emaw adhesive emaw chu pores chhungah a luang lut a, hei hian printed text, thlalak, QR code leh barcode te chu abrasion emaw layer separation tum emaw atanga venhimna kawngah a pui thin.

Embedded Components te tan Flexible Cushioning a awm bawk

Compressible structure hian magnetic stripe, antenna, chip leh embedded element dangte a cushion thei a ni. Hei hian inlay engineering a ngai tawh lo: component thickness, cavity design, pressure distribution leh repeated-flex testing te hi a pawimawh hle.

Teslin hi Substrate a ni a, Security System kimchang tak a ni lo

Card security hi full design-ah a innghat a, controlled artwork, variable data, holographic features, UV ink, overlays, chips, magnetic stripes leh issuance procedures te a innghat a ni. Standard white substrate hi watermark emaw covert feature emaw nei anga sawi tur a ni lo va, grade dik takah chuan chutiang features chu built in a awm loh chuan.

0.178mm leh 0.254mm Teslin Substrate a ni

Thickness pahnih hi a sir khatah emaw, a sir lehlamah emaw print theih a ni. Duhthlanna dik tak chu total card thickness, stiffness, cushioning, lamination stack leh overlay film awm zawng zawnga substrate contribution mamawh danah a innghat a ni—artwork chu single-sided emaw double-sided emaw chauh ni lovin.

A thlan theihna Factor	0.178mm / 7 mil	0.254mm / 10 mil
Substrate thawhhlawkzia	Card thickness zawng zawngah contribution a hniam zawk; overlay emaw additional layer emaw dahna tur hmun tam zawk a hnutchhiah	Total thickness leh cushioning-a thawhhlawk zawk
Flexibility a awm thei	Lamination hmain a flexible zawk	Lamination hmain substantial zawk feel
Project hman dan tlangpui	Thin-core laminated card, badge, tag leh structure te chu overlay thick zawk hmanga siam a ni	Core rit zawk, cushioning tihchangtlun leh thinner overlay hmanga structure siam
RFID / Chip siam dan tur	Inlay leh overlay te hian thickness nasa tak an ei tawhna hmunah a tangkai	Cushioning tam zawk a pe thei a, mahse total stack leh pressure hi chhut nawn leh a ngai thung
Approval dan tur a ni	Sample siam zawh tawhte chu print, laminate, condition leh teh theih a ni	Sample siam zawh tawhte chu print, laminate, condition leh teh theih a ni

7 Mil leh 10 Mil Thickness duhthlan tur a awm

Card Thickness kimchang chu ruahman rawh

Laminated ID card chu substrate, print, overlay, adhesive leh optional electronic components hmanga siam a ni. Thickness zawh tawh chu stack pumpui atanga chhut tur a ni a, card a lum leh condition hnuah verified tur a ni.

Card Component	Thickness leh Process ngaihtuah tur
Teslin Print Core a ni	Approved stack leh cushioning mamawh angin 0.178mm emaw 0.254mm emaw hmang ang che
Hma lam leh Hnung lam Overlay	Overlay gauge, adhesive leh surface finish te hian venhimna leh final card feel a hril
Printed Ink / Toner hmanga siam a ni	Solid coverage rit tak hian moisture, blocking, lamination leh dimensional balance te a nghawng thei a ni
RFID Inlay emaw Chip emaw hmanga siam a ni	Antenna, chip bump, adhesive leh cavity emaw spacer layer eng pawh dah tel bawk ang che
Magnetic Stripe / Hologram hmanga siam a ni	Stripe recess, overlay inmil leh post-lamination encoding emaw inspection emaw tihchian
Card tihfel tawh	Cooling leh conditioning hnuah thickness, flatness, dimensions leh functionality te teh thin ang che

Printing nena inmil leh Grade thlan dan

Teslin grade hrang hrang hi printing system hrang hrang atan optimized a ni. Buyers te chuan white sheet pakhat hian offset, dye inkjet, pigment inkjet, laser, Indigo, screen emaw thermal-transfer equipment-ah result inang a pe ang tih an ngaihtuah tur a ni lo. Grade dik tak, printer leh ink system dik tak nei tur a ni.

Printing Process	B2B Validation neih a ngai
Offset hmanga Printing a ni	Ink setting, density, trapping, drying, powder level, blocking leh lamination lamination te a awm thei
Silk-Screen hmanga tihchhuah a ni	Ink thickness, solvent nena inmil, cure, flexibility leh layer bonding te a awm bawk
Digital Laser hmanga tihchhuah a ni	Fuser temperature, toner adhesion, sheet transport, static control leh hmanrua qualification te a awm bawk
Inkjet hmanga Printing tih a ni	Inkjet nena inmil grade hmang la; test dye emaw pigment ink emaw, a vawt hun, tui invenna leh a rawng profile te
HP Indigo / Digital Press hmanga tihchhuah a ni	Qualified grade, primer mamawh, blanket temperature leh post-print lamination te chu nemnghet rawh
Direct-to-Card Printer hmanga siam a ni	A tlangpuiin Teslin sheet loose tak aiin card blank siam zawh tawh a print thin; card lamination leh punching hnuah chauh test tur a ni

Thickness pahnih hian Double-Sided Printing a Support thei

Double-sided printing hi printing process, grade, moisture balance, artwork coverage leh registration hmanga control a ni—0.254mm material hmang mai mai a ni lo. Front-and-back design balanced hian printing leh lamination hnua curl tihziaawmna kawngah pawh a pui thei bawk.

Final Card Personalization hmain Substrate kha Print hmasa phawt ang che

Fixed graphics hi lamination hmain substrate sheet-ah an print tlangpui. Sheet printing lai emaw, a hnu lama card siam zawh tawhah emaw hming danglam, thlalak, number emaw barcode emaw dah belh theih a ni a, chu chu issuance workflow a zirin a ni.

Offset, Screen leh Digital Printing hmanga enchhin a ni

Thermal leh Roll Lamination kalpui dan tur

Teslin substrate hi platen-laminated emaw roll-laminated emaw pawh nise, film inmil tak tak hmanga siam theih a ni. Bonding chak tak hi laminate emaw adhesive emaw microporous structure chhunga a luang lut hian a awm thin. Setting hnuhnung ber chu substrate grade tak tak, overlay, ink, press leh card stack hmanga siam tur a ni.

Lamination Control	tih dan tur ruahmanna siam
Moisture Condition a awm dan	Lamination hmain substrate leh printed sheet te chu condition hmasa phawt ang che; material a vawt lutuk emaw, a hnim lutuk emaw chuan quality a ti tlahniam thei
Lum leh vawt tehna	Laminate supplier leh substrate temperature finfiah angin set; machine display temperature chauh ring suh
Pressure leh Hun	Chips tihchhiat loh, artwork tihdanglam emaw, squeeze-out tam lutuk siam emaw ngai lovin pores chhungah flow tling tak pe rawh
Cooling a ni	Controlled pressure hnuaiah cool la, flatness leh dimensional stability a ti tha zawk
Peel chakna	Laminate siam zawh tawh chu conditioning leh environment exposure hnuah test rawh
Edge Sealing a ni	Compatible Teslin laminate structures chu lamination hnuah die-cut theih a ni fo a, sealed border hran nei lovin; film thlan nen confirm rawh

Generic Lamination Recipe hi Copy suh

Published starting parameters hian trial-ah a pui thei a, mahse actual heat transfer hi plate, press, stack height, overlay chemistry leh printed coverage hrang hrangah a inang lo. Substrate temperature, pressure, dwell, cooling leh release-film configuration pawm tawhte chu repeat production atan record rawh.

Bubbles, Silvering leh Curl te endik rawh

Trapped moisture, heat tling lo, laminate inmil lo, ink rit emaw cooling tha lo emaw hian bubble, silvering, haze emaw curl emaw a siam thei. Conditioning hnuah sheet leh punched card pahnih chu enfiah vek tur a ni.

Security Feature te inzawmkhawmna

Teslin substrate hian layered credential design a support thei a, mahse security features chu document program kimchang takin a siam a ni. Standard commercial material-ah hian sorkar-grade covert emaw forensic element emaw a awm lo.

Security Feature	Integration neih a ngai
Microtext leh Fine-Line Printing te a ni	High-resolution artwork, controlled plate emaw digital imaging leh post-lamination chhiar theihna
UV-Fluorescent Ink hmanga siam a ni	Ink supplier qualification, background fluorescence control leh lamination hnua enfiah
Holographic Overlay a ni	Registered overlay, laminate nena inmil, optical clarity leh tamper behavior te a awm bawk
QR Code leh Barcode hmanga siam a ni	Print contrast, dimensional accuracy, scanner chhiar awlsam leh abrasion laka invenna a ni
Custom Security-Grade Substrate hmanga siam a ni	Program-specific embedded marker te hian authorized secure supply chain a mamawh a, standard white sheet nen a inang lo

Layered Security leh Laminate hmanga venhimna a ni

RFID, NFC leh Smart Card siam dan tur

Teslin substrate hian RFID inlay chu a cushion thei a, a venghim thei bawk a, mahse 0.178mm aiah 0.254mm thlan chuan card chu electronics hmasawn tak tak atan a tha thei lo. Inlay, chip, antenna, adhesives, overlay leh lamination cycle te hi structure pakhat anga design tur a ni.

Smart Card Factor	a ngai a, chu chu Validation a ni
Chip leh Frequency a ni	Chip model, frequency, protocol, memory leh reader system te chu nemnghet rawh
Antenna Geometry hmanga thil tih a ni	Lamination, punching leh card-edge finishing neih laiin antenna traces te venhim
Inlay Thickness a ni	Card stack zawng zawng chhungah chip bump, antenna, carrier leh adhesive te chu chhut rawh
Pressure Insem darh dan	Chip emaw antenna emaw tihchhiat loh nan cushioning leh cavities tha tak hmang rawh
Functional Testing tih a ni	Lamination hmain, lamination hnuah, punching hnuah leh flexing hnuah read/write performance test rawh

ID Card leh Credential dilna

dilna	atana rawtna Project Focus
Corporate ID Card te pawh a awm bawk	Thlalak quality, variable data, barcode, overlay durability leh nitin badge hman dan te
Zirlai leh Faculty Card te	Volume sang tak printing, personalization, magnetic emaw RFID emaw hmanga hnathawh leh hun rei tak chhunga flexing te pawh a awm thei
Membership leh Loyalty Card te a awm bawk	Brand rawng, barcode emaw QR chhiar theihna, wallet chhe thei lo leh sheet siamna man tlawm zawka siam theih a ni
Hotel Key Card te pawh a awm bawk	Magnetic-stripe emaw RFID emaw nena inmil, lock testing leh service life tawi atanga rei lo te thlenga hman theih a ni
Hriselna leh Damlo ID te	Legibility, cleaning exposure, barcode scanning leh controlled issuance te a awm bawk
Event leh Visitor Badge te a awm bawk	Hun rei lote chhunga digital printing, slot, lanyard, QR code leh rang taka personalization te a awm bawk

Finishing, Punching leh Card Personalization

kalpui dan	Quality Control Point a ni
Guillotine hmanga tihtlak	Squareness, printed registration, blade condition leh stack compression te a awm bawk
Card Punching / Die Cutting a ni	Card dimension, corner radius, a sir fai leh laminate separation awm lo
Slot leh Hole Punching te pawh a awm	Position, edge distance, lanyard load leh crack resistance te a awm bawk
Embossing emaw Foil Stamping emaw hmanga tih a ni	Finished-card structure, lumna, pressure, foil adhesion leh chhiar awlsamna te a awm bawk
Thermal / Retransfer tih hi mimal taka siam a ni	Printer transport, ribbon transfer, surface energy, heat distortion leh image durability te a awm bawk
Magnetic Encoding / RFID Encoding hmanga siam a ni	Encoding yield, reader nena inmil leh post-stress function te a ni

Teslin vs. PVC, PETG leh Polycarbonate Card hmanrua

Material	chakna	ngaihtuah tur pawimawh
Teslin Substrate hmanga siam a ni	Print absorption sang tak, laminate bonding chak tak, electronics tan flexibility leh cushioning a awm bawk	A tlangpuiin exposed finished card ang ni lovin laminate structure chhunga printed core atan hman a ni
PVC hmanga siam a ni	Card kalphung din tawh, supply zau tak leh personalization method hriat lar tak tak te	Environment profile hrang hrang, heat resistance hniam zawk leh market tam takah recycling tlem zawk
PETG	Toughness, clarity leh multilayer card application chak tak a ni	Ink adhesion leh lamination recipe hi porous Teslin substrate nen a danglam a
Polycarbonate hmanga siam a ni	Durability sang tak, heat resistance leh laser-personalization theihna te chu dedicated grade-ah te a awm thei	Material leh production man sang zawk; long-life credentials dilna atana hman thin

Bulk Teslin Sheet Order

enfiahna atana Quality Control Item	Control tura rawtna siam
Thil awmzia (Material Identity) a ni	A siamtu, grade, thickness code, batch leh certificate reference te a ni
Thickness leh Size te pawh a awm	Average gauge, tolerance, sheet sei zawng, zau zawng, squareness leh cutting accuracy te a ni
Landan	Whiteness, shade, black spots, contamination, wrinkles, dents leh edge chhiatna te a awm
Flatness leh Moisture a awm	Print leh lamination hmain curl, bow, storage condition leh moisture balance te
Print thiamna nei tur	Density, adhesion, drying, color, image detail, barcode chhiar awlsam leh blocking te a awm bawk
Lamination Trial neih a ni	Peel chakna, bubble, haze, edge separation, curl leh finished thickness te a awm bawk
Card Test zawh tawh	Dimension, flexing, abrasion, personalization, slot chakna, encoding leh reader function te a awm bawk
Packing leh Traceability te pawh a awm bawk	Stack humhalh, count, carton label, pallet configuration, lot number leh inspection report te a awm bawk

Storage leh Handling mamawh te

Teslin substrate hi compressible a nih avangin lumna, UV light, pollution, moisture imbalance leh stack pressure tam lutuk atanga venhim tur a ni. Storage dik tak hian color, flatness, print performance leh lamination strength te a vawng reng thei a ni.

• Thil khuh chu kangmei chhuak leh in chhunga bawlhhlawh awm lohna hmunah hmun fai takah dah rawh.

• Sheet te chu direct UV light leh temperature approved storage limit aia sang atanga venhim tur a ni.

• Cut sheet te chu solid, supported surface ah flat takin dah tur a ni.

• Cut-sheet carton-ah hian load rit emaw, double-stacked pallet emaw dah suh.

• Edges compress thei emaw sheet stack mark thei tur strapping tight lutuk kha pumpelh rawh.

• Partial pack te chu leivut, rawng danglam leh tuihna inthlak danglam loh nan rerapped reng tur a ni.

• Warehouse dinhmun a inang lo chuan print emaw lamination emaw siam hmain production room-a condition sheet-te chu dah hmasa phawt ang che.

Wallis Production leh B2B Supply te tanpuina a ni

Wallis hian card siamtu leh material distributor te chu substrate sourcing, custom sheet cutting, protected packing leh coordinated card-material supply te hmangin a pui thin. Order tin hi sample pawm tawh leh grade, thickness, printing process, lamination structure leh finished-card mamawh te huam vek tur written specification nen link tur a ni.

Card Material Processing leh Export Supply te pawh a awm bawk

Engvangin nge White Teslin Card Substrate atan Wallis hi kan thlan?

• Standard card gauge pahnih: laminated card structure hrang hrang atan 0.178mm leh 0.254mm options a awm.

• Printing-process support: Offset, silk-screen leh digital printing trial te hi bulk approval hmain coordinate theih a ni.

• Lamination-focused development: Substrate, overlay, adhesive, temperature leh card thickness te hi system pakhat angin enfiah theih a ni.

• RFID card experience: Sample validation-ah hian inlay thickness, cushioning, chip protection leh reader test te pawh telh theih a ni.

• Custom cutting leh packing: Sheet format, stack venhimna, carton leh pallet te hi production leh export mamawh ang zela siam theih a ni.

• Factory-direct B2B service: Card factory, printer, converter, RFID company, importer leh distributor tan a tha hle.

Fast B2B Quotation neih theihna tura Information mamawh

• Card dilna, service life beisei leh destination market.

• A thuk zawng mamawh: 0.178mm / 7 mil emaw 0.254mm / 10 mil emaw a ni.

• Sheet sei zawng, zau zawng, tolerance, squareness leh quantity te.

• Printing process, printer model, ink emaw toner emaw leh a sir khat emaw, a sir hnih emaw hmanga siam artwork.

• Overlay material, thickness, finish, adhesive leh lamination hmanrua te a awm bawk.

• Target card siam zawh tawh dimension, thickness leh corner radius te.

• RFID chip, antenna, inlay, magnetic stripe, hologram emaw component dang emaw hmanga siam a ni.

• Security printing, barcode, QR code leh personalization mamawh a ni.

• Certificate mamawh, material traceability leh inspection report te a awm bawk.

• Trial quantity, kum tin forecast, destination port leh delivery schedule te a ni.

I Teslin Card Project chungchang sawipui rawh

Zawhna Zawh fo thin

0.178mm leh 0.254mm Teslin hi eng nge an danglamna?

0.178mm substrate hi 7 mil a ni a, 0.254mm substrate hi 10 mil a ni thung. Grade thicker zawk hian total card thickness leh cushioning-ah a thawhhlawk zawk a, mahse an pahnih hian laminate structure kimchang takah test a ngai a ni.

Thickness pahnih hi a sir hnih ah print theih a ni em?

Awle. Single- emaw double-sided emaw printing hi substrate grade, printing process, ink system, artwork balance leh registration-ah a innghat a—sheet thickness-ah chauh a innghat lo.

Standard laminated ID card atan chuan eng thickness nge tha zawk?

Khawvel pum huap duhthlan tur a awm lo. Substrate, hmalam leh hnunglam overlay, adhesive, printing leh optional inlay te chu chhut la, chutah chuan laminate la, conditioned finished card chu teh rawh.

Teslin paper hi tui tlakchhamna a ni em?

Polyolefin-based substrate hian tui a do thei a, mahse print durability chu ink, grade leh lamination dik takah a innghat thung. Card siam zawh tawh chu tui, humidity leh cleaning exposure te test tur a ni.

Teslin hi inkjet printer pangngai hmangin print theih a ni em?

Inkjet nena inmil Teslin grade hmangin dye emaw pigment ink bik chu test rawh. Standard grade leh coated inkjet grade te hian dry time, color leh water resistance ah te an che danglam thei a ni.

Teslin hi laser printer hmanga print theih a ni em?

Grade tlingte chu laser hmanga print theih a ni a, mahse fuser temperature, sheet transport, toner adhesion leh printer qualification te enfiah a ngai a ni. Thil hmanrua atana phalna pek loh thil hmang suh.

Direct-to-card printer hian Teslin sheet loose tak tak a print thei em?

Direct-to-card printer tam zawk hi chu blank card siam zawh tawh tan siam a ni a, loose substrate sheet atan siam a ni lo. Sheet chu print leh laminate hmasa la, card te chu punch la, chutah chuan blank siam zawh tawhah personalization test rawh.

Eng laminate film nge Teslin nen hian an thawk dun?

Thermal laminate leh adhesive film tam tak chuan hna a thawk thei a, mahse a inmil theihna chu activation temperature, flow, thickness leh finished-card mamawhnaah a innghat a ni. Peel test hmangin substrate-leh-film combination dik tak chu pawm rawh.

Teslin hian edge seal a mamawh em?

Teslin structure laminated dik tak chu sealed border hran nei lovin a finished shape-ah cut theih a ni fo thin a, a chhan chu laminate chu porous matrix-ah a inzawm tlat a ni. Hei hi laminate thlan leh process hmangin nemnghet rawh.

Engvangin nge lamination lai hian bubble a lo awm?

A chhan awm thei chu tui tam lutuk, lumna tlem, boruak tang, ink rit, laminate inmil lo emaw pressure tling lo emaw a ni. Sheets te chu condition la, substrate temperature tak tak chu verify rawh.

Teslin hi RFID leh NFC card atan hman theih a ni em?

Awle. A cushioning hian electronics venhimna kawngah a pui thei a, mahse chip, antenna, inlay thickness, adhesive, pressure leh finished read performance te hi validate a ngai a ni.

0.254mm Teslin hian automatic in RFID chip a support tha zawk em?

Automatic takin a ni lo. Substrate thick zawk hian cushioning tam zawk a pe thei a, mahse total card thickness leh pressure distribution a tidanglam bawk. Inlay structure kimchang hian performance a tichiang a ni.

Standard Teslin hian security features a nei em?

Standard white substrate hian print leh lamination hlawkna a pe a, mahse covert security marker awmna anga sawi tur a ni lo. Program-specific security-grade material hi controlled product hran a ni.

Hologram leh UV ink te hi dah belh theih a ni em?

Awle. Holographic overlay, UV ink, microtext leh feature dangte chu printing leh lamination process hrang hrang hmangin a inzawm khawm thei a ni. An hmuh theih dan leh an chhe thei lo chu siam chhuah hnuah test a ngai a ni.

PVC aiin Teslin hian boruak a tichhe zawk em?

Environment performance hi raw materials, card siam dan, service life, siam dan, transport leh paihna kawng awmsaah a innghat a ni. Life-cycle assessment mumal tak awm lovin broad superiority claim chu pumpelh rawh.

Teslin hi recycle theih a ni em?

Recycling hi local collection leh card structure kimchang takah a innghat a ni. Laminate, ink, magnetic stripe, chip leh antenna te hi specialist separation emaw disposal emaw a ngai thei.

Teslin sheet te hi engtin nge dah tur?

Sheet te chu khuh, flat, dry leh UV light, heat, fumes, dust leh stack pressure tam lutuk lakah venhim tur a ni. Print emaw lamination emaw hmain condition hmasa phawt ang che.

Wallis hian custom sheet size a pe thei ang em?

Custom cutting hi printing layout, lamination plate, card imposition, tolerance, quantity leh packing mamawh dan azirin sawiho theih a ni.

Bulk order hmain sample test theih a ni em?

Awle. Material approve hmain sample card siamna hmanrua ruahman hmangin print, laminate, cool, condition, punch leh personalize rawh.

Eng thilin nge order quantity tlem ber chu a ruat?

MOQ hi grade, thickness, sheet size, custom cutting, printing qualification, packing leh kum tin forecast-ah a innghat a ni.

Quotation dik tak siam tur chuan eng information nge mamawh?

Thickness, sheet size, printing process, overlay, lamination hmanrua, finished card thickness, RFID emaw stripe mamawh, quantity, destination leh delivery schedule te pe rawh.

White Teslin ID Card Substrate Sample dil tur a ni

Laminated ID, membership, hotel key, event leh RFID card project hrang hrang atan 0.178mm leh 0.254mm white Teslin synthetic paper atan Wallis Plastic biak theih a ni. Kan team hian thickness thlan, custom cutting, printing leh lamination trial, card-structure review, quality specification leh factory-direct B2B supply te kan thlawp a ni.

Teslin hi PPG Industries Ohio, Inc. registered trademark a ni a, order tin atana supply grade, source leh documentation dik tak chu nemnghet rawh.

Sample leh Factory Quote dil theih a ni