pad ya silicone
Wallis
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Mpo na basali ya bakarte ya plastiki mpe baye bapesaka lamination, pad ya presse ya qualité ya likolo ekoki kosala bokeseni kati na sortie constante mpe ba défauts mbala na mbala. Our Wool Silicone Press Pads , engineered by Wallis, epesaka résistance ya chaleur ya kozala na confiance, distribution uniforme ya pression, mpe durability ya tango molayi — perfect mpo na ba processus ya lamination ya carte PVC, PETG, to PC. Fourni yango directement usine, ba pads oyo epesaka valeur excellent, taille personnalisable, mpe performance stable mpo na ba courses ya production ya volume ya moke mpe ya munene.
| Spécification / Attribut | Standard / Option personnalisée |
|---|---|
| Matériel ya Pad | Silicone + base ya felt ya laine oyo ekoki kozala na molunge te |
| Résistance na molunge | Ebongi mpo na molunge ya lamination ya carte typique (PVC, PETG, PC) — kino ~180 °C |
| Options ya épaisseur | 3 mm, 5 mm, 8 mm, 10 mm (to personnalisé na commande moko) |
| Taille / Dimensions ya Pad | Ekokani na ba taille ya plaque ya lamination to personnalisé — OEM/ODM esungami |
| Bopanzani ya pression | Uniforme na likolo ya pad — minimiser ba défauts ya lamination |
| Contact ya Surface | Surface ya silicone lisse, non abrasif na ba superpositions ya carte |
| Bowumeli / Bomoi ya bomoi | Durabilité ya cycle ya likolo na se ya usage correct mpe entretien |
| Bord / Lolenge ya kosala | Pad rectangulaire to forme personnalisée mpo na ko correspondre na plaque, coupe personnalisée ezali |
| Quantité ya commande / MOQ | Flexible — ebongi mpo na ba commandes ya batch ya moke to ya masse |
| Personnalisation & OEM / ODM | Taille personnalisée, épaisseur, densité mpe forme — adapté na équipement na yo ya lamination |
Ezali kosala ete pression mpe molunge ezala ndenge moko na likoló ya karte mpo na kokitisa mbeba lokola adhésion inégale, bulles, to kobalusama.
Résistance ya chaleur ya silicone esalaka que ba pads ebongi na ba cycles ya lamination ya température makasi, epesaka fonctionnement ya sécurité, ya kozala na confiance.
Construction ya silicone + laine ekoki ko supporter ba cycles ya production ebele, ko réduire fréquence ya remplacement ya pad pe ko kitisa ba coûts ya exploitation.
Compatible na PVC, PETG, matériaux ya carte PC na ba films ya superposition ndenge na ndenge, ko soutenir ba types ya carte ebele na installation moko.
Lisungi ya OEM/ODM epesaka nzela na boyokani malamu na bamasini ya lamination ya bonene mpe ba configurations ndenge na ndenge.
Processus ya lamination stable ekitisaka ba rejets mpe retravail, ematisaka rendement mpe débit ya production globale.
Lamination ya ba cartes ya PVC, PETG, PC — y compris ba cartes d’identité, ba cartes bancaires, ba cartes ya membre, ba cartes intelligentes.
Lamination ya film ya superposition — ko appliquer ba films ya protection, ba couvertures, to ba couches revêtues UV.
Production ya carte multi-couche — ebongi mpo na ba structures ya carte complexes oyo esengeli na ba cycles ya lamination stable, oyo ezongaka mbala na mbala.
Remplacement ya ba pads oyo elati — mise à niveau ba lignes na yo ya lamination oyo ezali mpo na kobongisa rendement mpe qualité ya carte.
Ba commandes ya carte personnalisée — pona ba lots oyo esengaka ba pads ya taille non standard to ba conditions spéciales ya lamination.
Ezala ozali kosala izini ya volume mingi to magazini ya moke ya lamination, ba tampons na biso ya presse ya laine-silicone epesaka performance ya kozala na confiance mpo na ko correspondre na ba besoins na yo.



Pad esalemi na silicone oyo ekoki kozala na molunge te oyo ekangami na base ya felt ya laine — kosangisaka stabilité thermique na amortissement.
Iyo. Tosungaka ba dimensions ya pad personnalisé, épaisseur, mpe densité mpo na kokokana na ba plaques ya lamination ndenge na ndenge mpe masengi ya machine.
Pad ezali conçu pona ba températures typiques ya lamination ya PVC, PETG, na PC — atako tolerance ya exact etali ba paramètres ya lamination na yo.
Na bosaleli mpe bobateli malamu, pad ekoki kotelemela ba cycles mingi ya lamination — kopesa bomoi molai ya mosala.
Oui — esalaka malamu mpo na lamination ya film ya superposition mpe ezali compatible na ba matériaux ya carte ebele.
Bandá Projet na Yo elongo na Biso