Inlay / prelam
Wallis chuan a rawn ti a
| 2*5: | |
|---|---|
| 3*8: | |
| 3*7: | |
| Customizable: | |
| Chip: | |
| A awm theihna: | |
| A tam zawng: | |
Custom 125kHz leh 13.56MHz RFID PVC Prelam inlay Sheet te a awm a
Wallis hian access- control card, employee ID, hotel key card, membership card, campus card, transport credential leh system-migration atan 125kHz LF HF {[ RFID LF + HF PVC prelam inlay sheet a supply a ni project hrang hrang a awm. Sheet tin hian chip thlan bik, tuned antenna leh plastic support layer te a integrate a, final card lamination, printing, punching leh personalization atan a inpeih reng a ni.
Standard layout reference-ah hian 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 leh 4 × 10 te a tel a, a lei duhtu lamination plate, printing sheet leh punching tools te tan custom sheet size, card pitch, chip position, antenna geometries, material structure leh thickness te siam theih a ni.
Frequency chauh hian compatibility a finfiah lo. TK4100, EM4200 leh ATA5577-type low-frequency product te hian read-only emaw read/write behavior, coding leh configuration option hrang hrang an nei a. HF chip te hian ISO /IEC 14443 Type A, ISO /IEC 14443 Type B, ISO /IEC 15693 emaw NFC Forum specification te an hmang thei ang. Antenna design leh mass production hmain reader dik tak, chip model, protocol, memory, security leh application software dik tak chu a dik tih finfiah a ngai a ni.
| Product chi hrang hrang | LF , HF emaw, plastic-card siamna atana hman tur dual-frequency RFID prelaminated inlay sheet emaw a ni thei |
| Frequency duhthlan tur a awm | 125kHz LF , 13.56MHz HF , LF + HF hybrid leh project-a innghat multi-technology structure hrang hrangte |
| Standard Layout hrang hrang a awm | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 leh custom card layout te a awm bawk |
| LF prelam Thickness chungchang sawina | LF structure thlan bikte tan 0.50–0.60mm vel; thickness dik tak chu chip, antenna, material leh final card stack ah a innghat |
| Material duhthlan tur | White emaw transparent emaw PVC ; PETG leh polycarbonate nena inmil structure te chu qualification hran neia siam a ni |
| Antenna duhthlan tur a awm | Copper-wire LF / HF coil embedded, etched aluminum HF antenna leh custom dual-antenna design te a awm bawk |
| B2B Support a ni | Chip thlan, antenna engineering, CAD layout, sample, lamination trial, RF test, encoding, QC report leh export supply te a awm bawk |
RFID prelam Sample leh Quote dil rawh
RFID prelam inlay chu contactless plastic card siamna atana hman thin internal functional sheet a ni. Antenna, integrated circuit leh electrical connection te chu plastic layer inkarah embedded a ni a, chu chu a lei tuin printed core sheet leh transparent Overlay film s a dah hmain a ni. Stack zawh tawh chu laminated, cooled, punched leh personalized niin card siam zawh tawhah siam a ni.
Prelam hian a tlangpuiin customer artwork a keng lo. Printing hi front leh back core sheet hrang hrangah hman a ni a, chip leh antenna venhimna atan a pui a, chutih rualin controlled color, Overlay film leh security-feature production a phalsak bawk.
Dual-frequency card ah hian LF leh HF circuit hrang hrang a awm a. Chip pahnih hi protocol pakhatah a chang lo. Frequency tin hi design, tuned, read leh—support a nih chuan—reader interface dik tak hmanga ziah tur a ni.
Printed layer, metalized graphics, magnetic stripes, adhesives, card thickness, a bula metal leh reader geometry te hian RF performance a tidanglam thei a ni. Chuvangin qualification-ah hian bare prelam chauh ni lovin, fully laminated leh punched card a tel tur a ni.
125kHz LF Chip leh Coil siam dan
Industrial Lamination atana hman tur Multi-Card Sheet hmanga siam a ni
| Inlay Type | Construction | B2B hman dan tlangpui |
|---|---|---|
| 125kHz LF prelam | LF chip pakhat leh tuned low-frequency copper coil pakhat | Legacy proximity access, parking, membership leh identification system te a awm bawk |
| 13.56MHz HF prelam | Application atan HF chip pakhat leh ISO / NFC -compatible antenna pakhat thlan a ni | Secure access, transport, campus, hotel, NFC leh multi-application card te a awm bawk |
| LF + HF Frequency pahnih nei prelam | Card body pakhat chhungah coil hrang hrang neiin LF leh HF chip hrang hrang siam rawh | Legacy 125kHz reader atanga tunlai HF smart-card infrastructure lama inthlak danglamna |
| LF + UHF emaw HF + UHF | Structure pakhatah chip tam tak leh frequency-specific antenna awm | Access plus hla zawka tlan theihna tur lirthei, asset emaw personnel emaw tracking |
| Contact + Contact nei lo Hybrid | RFID prelam bakah hian milled contact-module cavity emaw dual-interface architecture emaw a awm bawk | Qualification hnuah identity, telecom, banking emaw regulated credential project emaw secure |
Organization te chuan infrastructure tihchangtlun laiin LF reader hlui leh HF reader thar zawkte nena thawk ho thei credential pakhat an pe thei a ni. Access-control database hian technology pahnih atanga identifier emaw application emaw te chu map leh a la enkawl reng tur a ni.
Chip pahnihna dah belh hian local thickness, antenna congestion, material flow leh test complexity a tipung a ni. Single-frequency design chu layout thar, lamination trial leh RF qualification tel lo chuan dual frequency-ah thlak loh tur a ni.
I installed reader-a hnathawk tur card atang hian inlay chu thlang rawh. Interface pakhat chauh mamawh hunah single-frequency inlay hi a tha zawk tlangpui; dual-frequency design hi LF reader awm tawh leh HF infrastructure tharin physical credential inang an hriat a ngai a nih chuan a tangkai ber a ni.
| Project dinhmun | rawtna Inlay | Buyer chuan a nemnghet tur a ni |
|---|---|---|
| 125kHz access system awmsa | LF -chip leh code format inmil chiah prelam chauh | Reader output, modulation, bit sei zawng, facility code leh card numbering te a awm bawk |
| Secure access thar emaw campus system thar emaw a awm bawk | HF -secure IC pawm tawh hmanga prelam chauh | Reader protocol, cryptographic application, key enkawl dan leh nunphung |
| LF atanga HF thlenga phased migration. | LF + HF vawi hnih nei prelam | Reader population pahnih, antenna design hrang hrang leh identifier mapping te |
| NFC website emaw digital business card emaw a ni thei | HF / NFC prelam chu NDEF-capable chip tling tak nen | Phone inzawmkhawm theihna, payload theihna, URL venhimna leh scan position te |
| Legacy LF chu secure HF identity nen a inzawm a ni | Dual-frequency prelam chu LF chip thlan bik leh secure HF chip hmanga siam a ni | Chip sourcing, firmware, user enrollment, antenna clearance leh interface tin testing te a awm bawk |
Dual-frequency prelam ah hian a tlangpuiin independent chip pahnih leh independently tuned antenna circuit pahnih a awm thin . Identity pahnih hi issuer-in access-control database-ah a inzawm thei a, mahse frequency pahnihna chuan insecure legacy application chu automatic-in a upgrade lo.
| LF Chip duhthlan tur | Chhiar / ziak Positioning | Hman dan tlangpui | B2B Buying Note |
|---|---|---|---|
| TK4100-Type a ni | Common legacy chhiar theih chauh proximity configuration; supplier dik tak leh encoding dik tak chu a dik tih finfiah a ngai | Access-control leh identification system bulpui ber berte | Reader sample leh output format mamawh pe rawh; 'TK4100' product zawng zawng hi a inang vek ang tih ring suh |
| EM4200 a ni | Factory-a programmed low-frequency chhiar theih chauh hriat theihna IC | Access control, bawlhhlawh sawngbawl dan leh hriat theihna tur format thlan bikte | Code sei zawng, modulation, mask option leh reader compatibility te chu production hmain confirm hmasa phawt ang che |
| ATA5577 / T5577-A chi hrang hrang | Programmable LF read/write transponder hmanga modulation leh coding siam theih a ni | Configurable identification, migration, testing leh legacy format inmil te a awm bawk | Configuration block, data format, password, lock bits leh programming verification te sawifiah rawh |
| EM4305 / R/W dang LF | Application-specific format hrang hranga chhiar/ziak LF option awm thei | Access, industrial identification leh programmable credentials te a awm bawk | IC status dik tak, memory, protection leh programmer support te chu confirm rawh |
EM4200-type credentials hian a tlangpuiin factory-programmed identifier a thawn chhuak a, ATA5577-type devices erawh chu programmer inmil takin a configure thei a, a ziak thei bawk. Quotation-ah hian buyer-in fixed number, customer encoding emaw programmable blank emaw a mamawh leh mamawh loh a tarlang tur a ni.
Heng standard te hi rannung hriat theihna data structure leh air-interface format te nen a inzawm a ni. TK4100, EM4200 emaw T5577 access card zawng zawngah blanket claim angin hman tur a ni lo. Chip dik tak, configuration leh reader system dik tak chu confirm rawh.
| HF Chip Chhungkaw | Protocol Direction | Application thlan dan tlangpui | Note |
|---|---|---|---|
| MIFARE Classic / A inmil thei Legacy 1K | ISO /IEC 14443 Type A legacy ecosystem a ni | Access, ticketing leh closed-loop system hlui zawk dah a ni | Infrastructure awmsa mamawhna hmunah hman; system thar siamna atana tunlai secure alternatives te evaluate |
| MIFARE Ultralight a ni | ISO /IEC 14443 A awmna hmun chi hrang hrang | Ticket hman tlem, event leh contactless program awlsam tak tak te | Memory, originality, password leh lifecycle mamawh te chu nemnghet rawh |
| NTAG 213 / 215 / 216 ah a tarlang bawk | NFC Forum Type 2 Tag leh ISO /IEC 14443 Type A | NFC business card, mobile link, authentication leh digital engagement te a awm bawk | NDEF memory, URL sei zawng, password leh originality mamawh dan hmangin thlang rawh |
| MIFARE DESFire EV3 a ni | ISO /IEC 14443 Type A chu layer sang zawk application him tak nen | Secure access, campus, transport, identity leh multi-application card te a awm bawk | Application design, key management, personalization leh reader/software integration te a ngai a ni |
| ICODE / ISO 15693 Chhungkaw | ISO /IEC 15693 leh NFC Forum Type 5 awmna hmun | Library, asset, vicinity-card leh hla zawka coupling-distance hmanna tur a ni | Reader protocol leh antenna size hi ISO /IEC 14443 Type A system nen a danglam a |
Reader hian 13.56MHz-ah hna a thawk thei a, standard emaw command thlan bik chauh a la support thei bawk. Type A, Type B, ISO 15693 emaw NFC Forum support bakah chip model dik tak leh application software te chu tarlang rawh.
DESFire-class chip supply hian a takin secure credential a siam lo. Key, application, access rights, diversification, issuer procedure leh backend authentication te hi a hranpaa engineer a ngai a ni.
LF Proximity Inlay Thil duhthlan tur
Custom Chip leh Antenna te inzawmkhawmna
| Engineering Factor | Dual-Frequency hman a ngai |
|---|---|
| Antenna inthen darh a ni | Physical overlap, pressure concentration leh tum loh taka coupling tih tlem nan LF leh HF coil te chu dah la |
| Chip awmna hmun | Chip pahnih hi punching line, slot, contact-module cavities leh high-pressure zone atanga hla takah dah tur a ni |
| Local Thickness a ni | IC pahnih, coil crossover leh connection point te chu hmuh theiha bump siam lovin compensate rawh |
| LF Tuning a ni | LF coil leh chip capacitance chu reader frequency, coding leh target read performance nen inmil rawh |
| HF Tuning tih a ni | HF antenna chu final chip, card stack, printed layer leh intended reader hmangin tune rawh |
| System Mapping siam a ni | LF identifier leh HF UID/application chu cardholder record pakhat nena an inzawmna sawifiah rawh |
| End-User hmanga finfiahna | Legacy leh reader model thar mamawh apiangah card siam zawh tawh ang chiah chu test rawh |
Dual-frequency reader chuan LF format thlan leh HF protocol thlan chauh a support thei. Reader brand, model, firmware leh expected output te supply la, chutiang chuan card chu system tak tak nen test theih a ni.
LF leh HF read distance hi a inang lo va, reader power, antenna geometry, card orientation, coding, final card stack leh environment-ah a innghat a ni. Interface tin atan pass/fail distance hrang hrang leh test fixture hrang hrang hmang rawh.
LF -to- HF migration atan chuan inlay hi rollout-a element pakhat chauh a ni. Buyers te chuan bulk order tooling, encoding emaw recurring emaw an tih hmain reader compatibility matrix leh identifier migration plan an pawm hmasa tur a ni.
| Validation Stage | mamawh Buyer Input | Pass Criteria a ni |
|---|---|---|
| LF chhiartute audit | Reader model, firmware, modulation leh card-number output te a awm bawk | LF chip thlan chu hriatchhuah a ni a, a tum identifier chu a rawn pe kir leh thin |
| HF chhiartute audit | Protocol, reader software, authentication method leh IC thlan chhuah te a ni | HF interface chuan application transaction tarlan chu a ti zo ta a ni |
| Dual-ID inzawmkhawmna a ni | LF ID, HF UID/application account, enrollment record te a ni | Interface pahnih hian authorized cardholder hnenah inhnaih lovin an resolve vek a ni |
| Prototype card hmanga enchhin a ni | Printing tak tak, Overlay film s, foil leh lamination cycle te | Interface pahnih hian finished leh punched sample inangah hna an thawk a ni |
| Field pilot control theih a ni | Reader site hlui leh thar, user group leh help-desk kalphung | Ruahman lawk loha access failure awm lo; card chhia leh bo tawhte chu tihtawp theih a ni |
| Mass-production hmanga sign off a ni | Golden sample, chip lots, programming file leh RF enfiahna fixture te a awm bawk | Dual-interface yield, traceability leh change-control record pawm a ni |
Security pawimawhna hmunah chuan mipui chhiar theih LF number emaw HF UID emaw chauh ring suh. HF application hian access system tak takin a mamawh authorization leh cryptographic methods a hmang tur a ni.
| Parameter | Reference Size / Supply Option | B2B Control Point |
|---|---|---|
| 2 × 5 a ni | A4 size tehna: 210 × 297mm a ni | Card pitch, edge margin, antenna orientation leh registration holes te chu nemnghet rawh |
| 3 × 7 a ni | 295 × 460mm vel a ni | Printed core, lamination plate leh punching tool te chu a inmil tur a ni |
| 3 × 8 a ni | 295 × 485mm vel a ni | Artwork registration leh card number pek dan tur sawifiah rawh |
| 4 × 8 / 5 × 5 / 4 × 10 a ni | Industrial layout-a output sang zawk siam a ni | Control sheet flatness, antenna inkar leh electrical test theihna te |
| Custom Layout a ni | Custom card, key fob, mini card leh proprietary tools te a awm bawk | CAD, outline siam zawh tawh, cutting clearance leh chip/antenna coordinate te pe rawh |
| LF Thickness chungchang sawina | LF siamna thlan bikte tan 0.50–0.60mm vel; approved drawing hmangin nemnghet rawh | Average, local chip-zone gauge leh finished-card calculation te chu nemnghet rawh |
| Dual-Frequency a ni a, a thuk ber | Project-specific leh a tlangpuiin chip pahnih leh antenna system pahnih in a nghawng thin | Thickness map, card flatness leh local pressure compensation te pawm |
CR80/ID-1 card hman tlanglawn tak chu nominal thickness 0.76mm vel vel a design a ni a, mahse a tawp ber result chu printed core, Overlay film s, adhesive flow, chip zone leh lamination compression-ah a innghat a ni. Conditioned finished card chu teh rawh.
'3 × 8' hian sheet dimension, registration mark leh card pitch zawng zawng a sawifiah lo. Antenna siam hmain final drawing hi sign tur a ni a, a chhan chu punching leh chip position error hian electrical yield a tichhe thei a ni.
Custom Sheet Layout leh Registration neih dan tur
HF Chip leh Antenna Layout duhthlan tur
| Layer | hnathawh dan | Key Control |
|---|---|---|
| Hma lam Overlay film | Print a venghim a, gloss, matte, frosted emaw security finish emaw a pe bawk | Gauge, bonding, abrasion leh personalization te a inmil thei |
| Hma lam Printed Core a awm | Graphics, text, logo leh security print te a keng tel bawk | Registration, ink cure, shrinkage leh metallic-print clear zone te a awm bawk |
| RFID Prelam Inlay | Chip pakhat emaw a aia tam emaw, antenna leh electrical connection te a awm | RF tuning, chip awmna, thickness, electrical yield leh alignment te a awm bawk |
| Back Printed Core a ni | Hma lam a balance a, reverse-side artwork a keng tel bawk | Layer balance, stripe awmna leh print coverage te a awm bawk |
| Hnunglam Overlay film | Card a humhim a, magnetic stripe emaw signature panel emaw a awm thei bawk | Bonding, flatness, encoding leh final surface te a awm bawk |
HF antenna bula metallic area lian tak takte chuan coupling emaw shift resonance emaw a tihtlem thei. Card RF test hnuhnung berah hian metalized print, holographic foil leh magnetic component zawng zawng telh vek tur a ni.
Front leh back gauge inang chiah chiah, controlled material direction leh balanced print coverage te hian curl a ti tlem thei a ni. Dual-frequency structure-ah hian ngaihven belh a ngai a, a chhan chu chip leh antenna awmna hmun hi a asymmetrical thei a ni.
Stack drawing pawm rawh: Overlay film , printed core, inlay, adhesive, stripe leh security layer zawng zawng record rawh.
Materials te chu condition: Sheet te chu production environment thianghlim takah stabilize la, leivut leh tui lakah venhim rawh.
Orientation finfiah: Card pitch, chip awmna, antenna zone, artwork leh punching mark te inmil tir.
Heat cycle siam: A sakna dik tak atan temperature, pressure, dwell, release material leh cooling te siam rawh.
Chip zone humhim: Chip pahnih chungah hard particle, local pressure tam lutuk leh plate defect awm loh tur.
Controlled pressure hnuaia cool: Cool hian flatness, chip stress, bonding leh RF consistency a nghawng a ni.
Laminated sheet test: Punch hmain a thickness, position, appearance leh RF interface pahnih te enfiah hmasa phawt ang che.
Card siam zawh tawhte chu finfiah rawh: Punch, personalize, encode leh test tum system-a LF leh HF performance te.
| Common Risk | A chhan awm thei | Corrective Direction |
|---|---|---|
| Chip a chhiat phah | Heat lutuk, pressure, ESD emaw chip connection chak lo emaw | Chip limit, process pressure, ESD control leh connection quality te enfiah leh rawh |
| Coil hawng rawh | Conductor chhe, joint tha lo, cutting chhiatna emaw material movement tam lutuk emaw | Continuity, conductor kalna tur, joint chakna leh punch clearance te enfiah thin ang che |
| LF emaw HF Range chak lo emaw | Detuning, reader inmil lo, card-stack thlak emaw metallic interference emaw a awm thei | Card leh target reader zawh tawh hmangin interface tinte chu retune leh test rawh |
| Chip Bump hmuh tur a awm | Gauge compensation tling lo emaw local thickness tam lutuk emaw | Cavities, layer gauges, cushioning leh pressure distribution te tihchangtlun |
| Delamination tih a ni | Contamination, thil inmil lo, lumna hniam emaw, lumna tha lo emaw | Material inmil dan, tihfai dan, heat cycle leh peel chakna te enfiah leh rawh |
| Card Warpage a awm | Stack inthlau lutuk, a lum lutuk, pressure inang lo emaw, a lum chak lutuk emaw | Layer te balance la, heating, plate flatness leh cooling te optimize rawh |
| enfiahna Item | B2B Control tura rawtna siam |
|---|---|
| Chip Identity a ni | A siamtu, part number dik tak, frequency, protocol, memory leh lot traceability te enfiah rawh |
| LF Hnathawh dan Test | ID emaw programmed block emaw defined chu agreed LF reader leh output format hmangin chhiar rawh |
| HF Hnathawh dan Test | UID leh command, memory emaw application thlan bikte chu HF chip dik tak angin chhiar rawh |
| Antenna chhunzawm zelna | Coil pahnih tan open circuit, short, joint chak lo leh conductor defect te hriatchhuah |
| RF hnathawh dan | LF leh HF test fixture hrang hrang, reader model, orientation leh pass distance hrang hrang hmang rawh |
| Chip leh Antenna awmna hmun | CAD, card outline, punching clearance, slot leh module cavities te enfiah rawh |
| Sheet Dimension hrang hrang | A sei zawng, a zau zawng, a squareness, card pitch, registration holes leh edge quality te a awm bawk |
| Thickness leh Flatness a ni | Average thickness, local chip zone, bow, curl leh point-to-point danglamna |
| Card Test zawh tawh | LF / HF hnathawh dan, dimension, bending, torsion, heat, humidity, peel leh reader nena inmil |
| Traceability a awm bawk | Chip lots, antenna design, PVC lot, sheet number, test program, inspection result leh packing record te a awm bawk |
Card position tinah full electrical reading tih theih a ni a, destructive peel, bending leh cross-section test-ah erawh chuan sampling hman a ni tlangpui thung. Purchase specification-ah hian command, reader, fixture, limit leh report te a awm tur a ni.
Card LF pass mahse HF —a nih loh leh HF pass mahse LF —chu conforming dual-frequency card a ni lo. Acceptance criteria chuan technology pahnih hi finished card position inangah pass vek a ngai tur a ni.
Prelam pakhatin incoming inspection a paltlang a, mahse card siam zawh tawh a chhiat chuan chip/protocol chungchanga harsatna awmte chu antenna tuning, mechanical damage leh reader configuration atanga thliar hran tur a ni. LF leh HF chu chhiartu tha hriat lar tak tak leh reference card pawm tawh hmangin independent takin test rawh.
| Symptom | Likely Area | Engineering Check hmasa ber a ni |
|---|---|---|
| 125kHz reader hian card a hre lo | LF data format dik lo, modulation emaw programming dik lo | Chip option, raw output leh reader decoding te chu approved reference nen khaikhin rawh |
| 13.56MHz reader hian card a hre lo | HF protocol emaw application emaw a inmil lo | ISO /IEC 14443 / 15693 support, command leh secure-key setup te chu finfiah rawh |
| LF a pass a mahse HF chu lamination hnuah a fail | HF antenna detuning emaw chip stress emaw a awm thei | HF resonance, chip bond, foil awmna leh laminated card stack te enfiah rawh |
| HF a pass a mahse LF chu lamination hnuah a fail | LF coil chhia emaw LF tuning dik lo emaw | Coil continuity, chip link, frequency setting leh local press stress te enfiah thin ang che |
| Frequency pahnih hian read range an nei tha lo hle | Reader setup, geometry, metallic material emaw process emaw tihchhiat a ni | Reader fixture pahnih, card orientation leh printed/metalized layer te chu enfiah leh rawh |
| Card bulge emaw curl emaw chips vel a awm | Local thickness inang lo emaw, sak dan inthlau lo emaw | Chip-area gauge, cavity compensation, cooling leh layer symmetry te teh rawh |
| Punch hnua chhiar chhunzawm zel | Antenna die-cut boundary hnaih lutuk | Card pitch, punch registration, wire clearance leh mechanical fatigue te enfiah thin ang che |
| Identifier te hi hnathawk account nen a inmil lo | Enrollment emaw data reconciliation emaw tihsual a awm | LF -to- HF mapping leh printed number chu database pawm tawh nen enfiah rawh |
Dual-frequency order tan chuan card position inang chuan frequency tan acceptance limit a tlin a ngai a pahnih ; interface pakhat chauh a pass result chu pass kimchang a ni lo.
| dilna Dilna | atana rawtna Technology Direction | Critical Validation |
|---|---|---|
| Legacy Access Control a ni | 125kHz read-only emaw programmable LF chip installed reader mamawh a ni | Reader format, ID output, card orientation leh access database te a awm bawk |
| Access-System hmanga inthlak danglamna | LF + secure HF frequency pahnih neia hriat theihna | Reader population pahnih, identity mapping, key management leh rollout plan te pawh a awm bawk |
| Hotel Key Card te pawh a awm bawk | Hotel-lock platform-in a tarlan chip; mixed lock a awm chuan dual technology a hmang thin | Encoder, lock firmware, card thickness, humidity leh hman nawn fo te |
| Hnathawktu leh Campus ID te | HF secure application emaw LF + HF emaw chu migration laiin | Kawngkhar luhna, attendance, pawisa pek, printing leh lifecycle |
| NFC Member nihna leh Marketing | NTAG emaw NFC Forum nena inmil HF chip dang emaw | Phone nena inmil, NDEF data, URL venhimna leh antenna awmna |
| Transport leh Secure Multi-Application te a awm bawk | HF chip him tak leh system architecture certified | Transaction performance, cryptography, key injection leh scheme pawmpui te a ni |
| Data Item | mamawh sawifiahna |
|---|---|
| LF Hriat theihna | Factory code, programmed format, facility code, card number leh output order te tihfel a ni |
| HF UID / CSN hmanga tih a ni | UID sei zawng, fixed emaw random emaw awm dan, database format leh reader interpretation |
| HF Hriatrengna / Application | NDEF, sector, page, file, access rights, counter leh lock state te a ni |
| Key leh Password te pawh a awm | Ownership, generation, injection, diversification, transport leh audit trail te a ni |
| Dual-ID Mapping hmanga siam a ni | LF number, HF UID/application leh printed card number inzawmna |
| Inremna siam | Interface pahnih a card record duplicate, missing, reject leh tihchhiat te |
Public identifier te hi copy emaw emulate emaw theih a ni. Security-sensitive system-te chuan number hmuh theih emaw chhiar theih emaw chauh rinchhan lovin cryptographic authentication, backend control leh issuer procedure dik tak an hmang tur a ni.
HF chip him tak chuan controlled application siam leh key loading a ngai a ni. Production hmaa secure environment, data exchange, verification, rejected-card handling leh audit mamawh turte sawifiah.
Requirement review: Reader, chip, protocol, card layout, card stack leh test limit te chu nemnghet rawh.
Engineering drawing: Sheet size, card pitch, chip awmna, antenna kalna tur leh cutting clearance te pawm.
Prototype inlay: Electrical, RF, thickness leh lamination trial atan engineering batch te tak te siam.
Finished-card test: System mamawh zawng zawngah card print, laminate, punch, encode leh test theih a ni.
Golden sample pawmpuina: Card pawm tawh, data structure, reader test leh visual standard-ah sign rawh.
Bulk production: Chip lot, antenna process, dimension, electrical testing leh traceability te control theih a ni.
Control thlak danglam: Chip source, package, antenna, PVC , adhesive, layout emaw test hmanrua emaw thlak hmain phalna la hmasa phawt ang che.
Stock sample chuan hnathawh dan tlangpui a tarlang. Custom prototype hian a lei tuin a mamawh chip, antenna, layout, card stack, reader leh lamination hmanrua dik tak a finfiah thin.
In-stock standard design hian sample order tenau te chu a support thei a ni. Custom chip, dual-frequency layout, antenna tooling, secure encoding leh nonstandard sheet dimension te hian a tlangpuiin production MOQ a mamawh a ni.
Stable RFID prelam siamna atan hian controlled chip sourcing, antenna siam, chip-to-coil connection, plastic collation, lamination, electrical testing, dimensional inspection leh lot traceability te a ngai a ni. Repeat order-ah chuan documented change pawm a nih loh chuan chip pawm tawh, antenna drawing, material stack leh test method hman tur a ni.
RFID Project leh Technical lama puihna
LF , HF leh Hybrid Inlay te hnathawhna hmun a ni
Sheet te chu sealed, clean leh dry packaging ah flat takin dah la, khaw lum leh ni êng direct atanga hlaah dah rawh.
Antenna leh chip zone venhim nan rigid board, interleaving leh reinforced carton hmang thin ang che.
Pallet load inang lo, bending, sharp impact leh stack pressure tam lutuk te chu pumpelh tur a ni.
Exposed production process leh testing atan ESD handling control dik tak hmang rawh.
Warehouse leh production condition a inang lo chuan lamination room-a condition sheet siam thin.
Pack tin chu chip combination, antenna design, layout, thickness, quantity leh batch hmangin label rawh.
Hun rei tak dah emaw, transport exposure pangngai lo emaw hnuah first-in, first-out inventory leh retest material hmang thin ang che.

International B2B Order te tan Flat Packing humhalh a ni
LF , HF leh hybrid capability: Single-frequency leh dual-frequency project te hi reader ecosystem tak tak atang hian siam theih a ni.
Chip-specific engineering: Read-only, programmable, NFC leh secure HF option te hi protocol leh application hmangin a inthen a.
Custom antenna leh layout: Sheet size, card pitch, chip awmna, coil geometry leh punching clearance te chu customized theih a ni.
Finished-card qualification: Sample te chu print, laminated, punch, encode leh target reader-ah test theih a ni.
Documented quality control: Electrical, RF, dimensional, visual leh traceability mamawh te chu specification-ah hian ziah theih a ni.
Factory-direct B2B supply: Card factory, access integrator, hotel-system supplier, issuer, importer leh distributor te tan a tha hle.
Application leh configuration mamawh: LF , HF emaw LF + HF dual frequency emaw.
Reader brand, model, firmware, protocol leh output format mamawh te.
LF leh HF chip siamtu dik tak, part number, memory leh security mamawh.
Sheet layout, dimension, card pitch, registration mark leh quantity te a awm bawk.
Card size, finished thickness, chip awmna hmun, slot, hole leh punching drawing te a awm bawk.
prelam thil, rawng, thickness leh tolerance.
LF leh HF read-range test mamawh leh target orientation te.
Final card stack, Overlay film s, printed core, metallic ink, magnetic stripe leh security features te a awm bawk.
Lamination press, temperature, pressure, dwell, cooling leh plate dimension te a awm bawk.
Encoding, UID/ID list, key injection, data mapping leh inremna siam ngai te.
Prototype quantity, kum tin forecast, MOQ target leh delivery schedule te a ni.
Packing, inspection document, destination port leh compliance document mamawh te a awm bawk.
I LF leh HF Inlay Project chungchang sawiho rawh
Intermediate card sheet a ni a RFID chip leh antenna PVC layer chhungah a awm a ni. Card siamtute chuan final lamination leh punching hmain printed core leh Overlay film s te an dah tel thin.
Awle. Dual-frequency prelam ah hian card body pakhatah LF leh HF chip leh antenna hrang hrang a awm a. Interface pahnih hi independent tuning leh testing a ngai a ni.
Infrastructure migration neih laiin credential pakhat chu legacy 125kHz reader leh 13.56MHz smart-card reader thar zawkte nena hnathawh theihna a siamsak a ni.
A tlangpuiin circuit hrang hrang an ni. An identifier te hi customer database ah link theih a ni a, mahse reader hrang hrang nen independent takin an inbiak thin.
TK4100-type, EM4200, ATA5577/T5577-type leh LF option dangte pawh sawi theih a ni. Read-only emaw read/write behavior, encoding leh reader format te chu nemnghet rawh.
EM4200 hi factory-a programmed low-frequency read-only identification IC anga dah a ni. Code option mamawh leh reader compatibility te chu a tarlang tur a ni.
ATA5577/T5577-type device te hi configure theih read/write LF transponder an ni. Programming format, password, lock bits leh verification te chu a chiang tur a ni.
No. Compatibility hi chip leh configuration dik takah a innghat. Heng standard te hi access-control LF chip tinah blanket claim angin hman tur a ni lo.
Option hrang hrangah hian legacy Type A chips, MIFARE Ultralight, NTAG, MIFARE DESFire leh ISO 15693/ICODE chhungkua te a awm a, a awm leh awm loh leh a hman dan tur a zirin a ni.
No. Chhiartute hian standard, command leh application bikte chu an thlawp a ni. Type A, Type B, ISO 15693 emaw NFC Forum support leh IC dik tak chu nemnghet rawh.
NTAG 213, 215 emaw 216 leh NFC Forum compatible chip dangte hi duhthlan tur tlanglawn tak a ni. NDEF memory, phone compatibility leh security mamawh hrang hrang hmangin thlang rawh.
MIFARE DESFire ang chi platform him tak chu a remchang mai thei a, mahse reader, keys, applications, backend leh personalization process te hi engineered a ngai a ni.
Layout hman tlanglawn tak tak chu 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 leh 4 × 10 te a ni a, a lei duhtu CAD drawing atang hian custom layout siam theih a ni.
Prelam construction thlan bik LF te hi 0.50–0.60mm vel a ni thei. Ordered chip, coil, PVC structure leh finished card te thickness leh tolerance tak tak chu nemnghet rawh.
Chip pahnih leh antenna system pahnih a awm avangin thickness emaw local compensation emaw a mamawh zawk thei. Thickness map kimchang chu pawm tur a ni.
Awle. Coil geometry hi chip, card size, reader, target range, chip awmna leh cutting clearance vel a siam theih a ni.
Range hi frequency, chip, antenna, reader, card stack, orientation leh environment ah a innghat a ni. LF leh HF test reader hrang hrang leh pass distance hrang hrangte sawifiah rawh.
Test zawhah ngaihtuah theih a ni. Metalized area lian tak takte hian HF antenna a nghawng thei a, finished-card RF qualification-ah pawh telh tur a ni.
Alternative structure siam theih a ni a, mahse bonding, heat, shrinkage, RF tuning, chip stress leh final-card durability te hi a hranin validate a ngai a ni.
A tlangpuiin blank functional sheet an ni. Customer graphics hi card kimchang laminated hmain core sheet hrang hrangah print a ni tlangpui.
Universal setting a awm lo. Heat, pressure, dwell leh cooling te hi PVC , chip package, antenna, printed core leh Overlay film s dik tak atan siam chhuah a ngai a ni.
Controlled local thickness, plate thianghlim, balanced pressure, chip package inmil, heat cycle pawm tawh leh lamination hma leh hnua electrical testing hmang thin ang che.
Ni e, electrical testing kimchang chu a chiang thei. Dual-frequency product tan chuan LF leh HF interface pahnih hian accepted position tinah an pass tur a ni.
LF programming, HF memory ziah, NDEF data leh application personalization te sawiho theih a ni. Secure keys atan hian controlled process hran a ngai a ni.
Awle. Qualification tha ber chuan chip dik tak, antenna, card stack, lamination press, punching tool leh target reader te a hmang thin.
MOQ hi chip awm zat, single emaw dual frequency emaw, antenna tooling, layout, material, encoding, test mamawh leh standard design awm leh awm lohah a innghat a ni.
LF leh HF chip, reader, protocol, layout, card drawing, thickness, card stack, test limit, encoding, quantity, packing leh destination dik tak pe rawh.
No. 125kHz-only reader chuan HF -only card nen a inbiak theih loh. Dual-frequency inlay hian reader hrang hrang pahnih chu anmahni LF leh HF chip hrang hrang hmangin an inbiak theih a, reader tinte protocol angin.
Standard LF + HF smart-card inlays hian frequency pahnih tan hian antenna circuit hrang hrang, independent taka tuned an hmang a. Structure siam zawh tawh chuan antenna clearance a humhim tur a ni a, RF test hrang hrang a paltlang tur a ni.
No. Hengte hi nominal frequency hrang hrang an ni a, animal-identification specification ISO 11784/11785 ang chi te hi 125kHz access-card chip-ah chuan automatic-in a hman theih loh. Reader leh transponder configuration tak tak chu confirm rawh.
Issuer chuan LF card number chu a access-control system-a HF chip emaw secured application account emaw-ah a map a. Hei hi enrollment leh database task hranpa a ni a; RFID circuit pahnih hian record an insem nghal vek lo.
Prelam-ah chuan chip leh antenna chu card siamna atan plastic layer-ah dah a ni. Dry inlay chu chip-and-antenna assembly a ni a, chu chu prelaminated card core siam zawh tawh ang chiah khan a la chantir lo.
Test reader, encoding format, functional read distance, allowed defect rate, inspection sampling leh LF leh HF tana report te chu a hranin tarlang rawh. Interface pahnih hian dual-frequency card position pawm apiang chu an pass vek tur a ni.
125kHz LF , 13.56MHz HF leh LF + HF dual-frequency RFID PVC prelam inlay sheet siam duh tan Wallis Plastic zawhfiah theih a ni. Kan team hian chip thlan dan, antenna leh layout design, card-stack planning, lamination trial, LF / HF testing, encoding, quality specification leh factory-direct B2B supply te kan thlawp a ni.
Sample leh Factory Quote dil theih a ni
Kan hnen atangin I Project tan tir rawh