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Inlay/ Prelam tih a ni
Wallis chuan a rawn ti a
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Wallis dual-frequency RFID TK4100 + F08 inlay prelam sheet hi hybrid access, employee ID, campus, membership, hotel leh multi-system smart card siamtute tan semi-finished functional core a ni. Card layout pakhatah independent LF 125kHz TK4100 credential leh independent HF 13.56MHz F08 credential te a dah khawm a , card siam zawh tawh chu reader infrastructure inmil pahnih nen a inzawm thei a ni.
LF leh HF circuit te hi a hranin a awm reng a: frequency tin hian chip, antenna emaw coil emaw, protocol behavior leh reader compatibility te an nei vek a. Mass production rintlak tur chuan tooling leh bulk lamination hmain chip reference, reader model, antenna position, sheet layout, finished card structure leh target read performance te hi confirm hmasak phawt tur a ni.
| Parameter | Reference Specification leh B2B Confirmation Point te a awm bawk |
|---|---|
| Product chi hrang hrang | Dual-frequency RFID inlay prelam sheet hmangin a hnu lama overlay lamination, printing, punching leh card personalization te hman theih a ni. |
| Standard Combination a ni | A rilru a buai em em a, a rilru a hah em em bawk a. LF 125kHz TK4100 + HF 13.56MHz F08. Chip siamtu dik tak, memory configuration, UID format leh reader/system mamawh dik tak chu purchase specification-ah confirm rawh. |
| Layout awm thei te | 2×5 (A4), 3×7, 3×8 leh sheet matrices dangte pawh a duh angin siam theih a ni. Final sheet dimension, card pitch, margin, registration mark leh punching direction te chu approved drawing zawm tur a ni. |
| Thuhmahruai Prelam Thickness | Tuna LF + HF structure hman mek atan chuan 0.55–0.60mm vel a ni. Thickness leh tolerance tak tak chu chip package, antenna siam dan, substrate leh final card stack-ah a innghat a ni. |
| Base Material a ni | PVC chu standard option atan hman a ni a; card substrate dangte chu lamination structure leh project mamawh angin endik theih a ni. |
| LF Antenna hmanga siam a ni | A tlangpuiin wound copper coil chu 125kHz chip leh reader environment thlan bik atana siam a ni. |
| HF Antenna hmanga siam a ni | Etched emaw embedded antenna design chu 13.56MHz chip thlan bik, card stack leh reader environment atan tuned a ni. |
| Pawnlang | Blank prelaminated functional core, printable core sheet leh/ emaw transparent overlays nena inzawm tura ruahman a ni. |
| Customization hmanga siam a ni | Chip combination, antenna geometry, layout, thickness, sheet size, registration marks, material structure, packaging leh labeling te a awm bawk. |
| Sample pawmpuina pek a ni | Mass production hmain engineering sample leh Golden Sample neih hmasak phawt a tha. Project pakhatah availability, quantity leh freight te chu confirm a ni. |
LF 125kHz TK4100 Inlay siam dan tur
HF 13.56MHz F08 Inlay siam dan tur
Dual-frequency RFID prelam chu laminated intermediate sheet a ni a, card position tinah independent contactless circuit pahnih a awm a ni. TK4100 circuit hi 125kHz proximity-reader application nena inmil tur atan hman a ni a, F08 circuit hi 13.56MHz reader system inmil atan hman a ni thung.
Card body pakhata circuit pahnih inzawmkhawm hi organization pakhatin HF application hran a dah belh laiin legacy LF access system a vawn reng a ngai a nih chuan a tangkai hle. Protocol pahnih emaw database emaw chu a inzawm khawm lo. Card petu chuan credential tinte chu a inmil system-ah a enroll tur a ni a, a enkawl tur a ni.
TK4100 hi 125kHz proximity reader inmil tur tan read-only identification credential atan thlan a ni tlangpui. A tlangpuiin system-in application data dahkhawm ai chuan fixed identification number a chhiar hian hman a ni. Bit format dik tak, facility-code handling leh reader compatibility te chu access-control integrator hmangin a dik tih finfiah tur a ni.
F08 hi system inmil takah 13.56MHz contactless memory credential atan hman a ni tlangpui. Buyer chuan F08 version dik tak, memory organization, keys, UID handling, sector data leh personalization method te chu a confirm tur a ni. 13.56MHz operating frequency chauh hian smartphone, NFC application, MIFARE-branded system emaw ISO/IEC 14443 reader zawng zawng nen a inmil thei lo.
Smart-card terminology-ah chuan dual frequency tih hian a tlangpuiin contactless radio system pahnih LF + HF tihna a ni. Dual interface tih hian contact chip plus contactless interface a kawk tlangpui. Procurement error awm lo turin drawing, quotation leh system documentation-ah term dik hmang rawh.
| Item | TK4100 Side | F08 Side |
|---|---|---|
| Zinzia | 125kHz LF a ni | 13.56MHz HF a ni |
| Role pangngai (Typical Role) a ni | Access emaw attendance reader nena inmil tur fixed-ID proximity credential. | HF card application nena inmil tur memory credential chhiar/ziak. |
| Chhiartute hriat tur pawimawh | Reader brand/model, data format supported, card number beisei leh target read distance te a ni. | Reader brand/model, protocol, memory/key mamawh, UID policy leh transaction workflow beisei ang te. |
| Mimal nihna (personalization) a ni | A tlangpuiin factory-a programmed identifier hmanga siam a ni a; system hian number format bik a mamawh em tih finfiah. | Sector programming, key, data file emaw issuer-side enrollment emaw a ngai thei. |
| Security Positioning chungchang a ni | Basic read-only LF credential pawmtu project tan a tha. | Suitability chu chip dik tak leh security policy ah a innghat. Project thar emaw, high-security project emaw chuan secure chip platform pawm tawh a tarlang tur a ni. |
| Phone nena inmil theihna | Standard smartphone-ah chuan a tlangpuiin 125kHz proximity credentials an chhiar ngai lo. | Smartphone nena inmil nia ngaih suh; chip dik tak, protocol leh target phone operating system dik tak finfiah. |
Card te tak te pakhat chhunga antenna pahnih dah hian resonance, read distance, lamination behavior leh punching clearance te a nghawng thei a ni. Chuvangin antenna geometry hi validation awm lovin independent inlay pahnih inzawmkhawm ai chuan integrated card structure pakhat anga design tur a ni.
LF coil leh HF antenna te hi duh loh coupling tih tlem nan leh card edge, contact module, magnetic stripe, signature panel, hole emaw special die-cut features te tan clear zone dah tur a ni. Design hi finished-card stack tak tak hmanga test tur a ni a, a chhan chu printed layer, overlay leh a bula conductive elements te hian RF performance a nghawng thei a ni.
Chip package awmna hmunah hian local cavities, cushioning layer emaw controlled material build-up emaw a ngai thei. Chip-area design tha lo hian bumps, trapped air, print distortion, delamination emaw punching damage a thlen thei. Drawing pawm tawh chuan chip coordinate leh permitted local thickness a tarlang tur a ni.
Desktop reader pakhata card chhiar thiam chuan wall-a dah access reader, hotel lock, turnstile emaw handheld terminal emaw-ah a thawk dan a danglam thei. Sample card te hi deployment-a tel reader model zawng zawngah test vek tur a ni a, multiple orientation atang leh final lamination hnuah pawh test tur a ni.
HF Reader hman dan tur
RFID hman dan entirnan
Prelam layout chu customer printing plate, laminator, collation method, punching tool leh finished-card orientation te nen a inmil tur a ni. Layout hming 3×8 ang chi hi production tihchhuah nan a tawk lo; dimensioned drawing a ngai a ni.
| Drawing Item | Information nemnghet tur |
|---|---|
| Sheet Format a ni | Sheet zau zawng leh sei zawng zawng, matrix, card pitch, edge margin leh feed lam hawi zawng zawng. |
| Card awmna tur hmun | Card outline siam zawh tawh, corner radius, punching centerline leh hmalam/ hnunglam orientation te. |
| LF Circuit ah a awm a | Coil dimension, turn, chip awmna, lead routing leh no-cut area venhimna te a awm bawk. |
| HF Circuit ah a awm a | Antenna outline, bridge/chip awmna, tuning target leh no-cut area venhim a ni. |
| Inziahluh theih a ni | Optical mark, punching mark, print registration mark leh X/Y displacement phalsak te a awm bawk. |
| Features dangte pawh a awm | Contact-module cavity, magnetic stripe zone, signature panel, thlalakna hmun, slot hole emaw custom shape emaw a awm thei. |
| Card Stack a ni | Printable core, prelam, overlay, adhesives, target thickness zawng zawng leh layer sequence te pawh a awm bawk. |
Hybrid RFID Card Structure siam zawh tawh a ni
Dual-Frequency Inlay Layout hmanga siam a ni
LF leh HF chip reference mamawh, reader model, card-number format, programming mamawh leh acceptance distance te pe rawh. Frequency chauh atanga chip approve loh tur.
Sheet size, matrix, card pitch, antenna outline, chip coordinate, registration mark, punching direction leh full layer stack te chu nemnghet rawh.
Test bare prelam sheet leh card zawh tawh te. Chip function, antenna response, surface flatness, lamination compatibility, hmuh theih dan leh reader performance te enfiah thin ang che.
Temperature, pressure, dwell time, heating rate leh cooling condition te chu substrate leh overlay thlan chhuah hmangin siam tur a ni. Heat emaw pressure tam lutuk hian antenna a ti che thei a, chip area a tichhe thei a, RF tuning a tidanglam thei bawk.
Golden Sample signed chuan a hnua batch inspection atan card hmel, a dimension, electronic behavior leh reader performance pawm theih tur a tarlang tur a ni.
Prelam production, card lamination leh final delivery hmanga chip leh antenna atanga traceability vawng reng turin lot identification leh agreed sampling plan hmang.
| Inspection | Eng nge enfiah tur | Recommended Stage |
|---|---|---|
| Chip Identity a ni | LF/HF chip reference dik tak, UID emaw serial data, lot traceability leh chip chhiatna hmuh theih. | Incoming components leh prelam zawh tawh te. |
| Antenna Integrity a ni | Continuity, bonding point, coil lead condition leh antenna chhiatna te a awm bawk. | Prelamination hma leh neih hnuah. |
| RF Chhanna | LF leh HF te hi independent takin an thawk a, target reader compatibility, orientation leh read-distance window te an ni. | Bare prelam leh card zawh tawh. |
| Cross-Interaction neih a ni | Reader pakhat activate hian circuit pahnihnaah pawm theih loh thil a siam lo tih nemnghet rawh. | Engineering sample leh Golden Sample lak a ni bawk. |
| Layout Registration neih a ni | Chip leh antenna awmna chu X/Y coordinate, punching line leh no-cut zone te nen a inmil lo. | Production lot zawng zawngah. |
| Mechanical Quality tha tak a ni | Sheet dimension, thickness, flatness, bubbles, contamination, local chip bump leh surface chhiatna te a awm thei. | Prelam release endik a ni. |
| Lamination Result a ni | Peel resistance, warpage, card thickness, edge quality leh chip-area appearance te a awm bawk. | Finished-card hmanga tihdik a ni. |
| Mimal nihna (personalization) a ni | LF number dik taka lak, HF memory/key kalpui dan leh database enrollment dik tak. | Issuer emaw system-integrator emaw tihdikna. |
TK4100 + F08 combination hi a tha ber a, chutah chuan reader environment awmsa pahnih chu physical credential pakhatah support a ngai a, system pahnih hi chip thlan bikte nen verified a ni.
Legacy LF access point hrang hranga hman hnathawk leh contractor card leh HF application hran.
Campus, club emaw property-management card hmanga credential system inmil pahnih inzawmkhawm.
Time-attendance leh building-access project hrang hrangah LF leh HF identifier hranpa mamawh a ni.
Migration project-ah hian pawl pakhatin 125kHz reader atanga 13.56MHz infrastructure-ah a inthlak a ni.
OEM smart-card production-ah hian card factory-in print, lamination leh punching process kimchang a control a ni.
Hotel lock, transport, payment, sorkar credentials emaw controlled system dang emaw tan chuan compatibility leh security approval chu system neitu hnen atanga lak a ngai a ni. Frequency match ringawt pawh a tawk lo.
| Project Need | Possible Direction | Pawimawh tak Qualification |
|---|---|---|
| LF Identification bulpui ber | TK4100 emaw, read-only LF credential pawm tawh dang emaw a ni thei. | Reader data format leh card-number mamawh te chu nemnghet rawh. |
| Thuziak theih LF Credential | Writable LF chip inmil tak chu evaluate theih a ni. | Programming hmanrua, memory, password/security leh legal system phalna te chu nemnghet rawh. |
| Legacy HF Memory Card hmanga siam a ni | F08 emaw system-in a pawmpui 13.56MHz memory chip dang emaw a ni thei. | Key, UID awm dan, memory map leh reader firmware te chu nemnghet rawh. |
| Security-Sensitive HF Project thar siam a ni | System neituin a pawmpui, tunlai secure chip platform kha tarlang rawh. | Antenna design hmain cryptography, key management, lifecycle leh certification mamawh turte sawifiah. |
| Phone-Tap hmanga tihchhuah a ni | Smartphone nena inzawmna atana siam NFC Forum nena inmil chip thlang rawh. | Target iOS leh Android device-ah test a ni a; F08 inmilna anga ngaih suh. |
| Longer-Range Tracking a ni | UHF combination hi hybrid structure danglam tak angin engineer theih a ni. | Region, reader, antenna orientation leh finished-card RF testing neih a ngai a ni. |
RFID prelam sheet te hi bending, electrostatic discharge, pressure point, humidity sang, contamination leh uncontrolled heat atanga venhim tur a ni. Packaging specification te chu sheet size, chip profile, shipment method leh lot traceability mamawh nen a inmil tur a ni.
Surface scratching leh particle transfer tihziaawmna turin interleaving thianghlim emaw protective film emaw hmang rawh.
Sheet te chu flat takin dah la, handling laiin a hmun pum pui chu support rawh.
Production lot hrang hrang siam a, chip combination, layout, quantity leh inspection status te hriat chian.
Storage leh workshop dinhmun a inang lo hle laiin lamination hmain material chu production environment-ah equilibrate turin phalsak rawh.
Wallis hian card factory, RFID solution provider leh material distributor te chu project-based chip matching, custom antenna engineering, sheet-layout development leh card-material integration hmangin a pui a ni. A tum ber chu prelam structure supply a ni a, chu chu buyer’s actual reader leh lamination environment-ah validate theih a ni.
Engineering lam hawi specification: chip, antenna, reader, layout leh card stack te chu enfiah ho a ni.
Custom layout support: matrices, dimensions, registration marks leh chip coordinate te hian buyer tooling a zawm thei.
Material integration: card structure kimchang tak atan printable sheet leh overlay matching chungchang sawiho theih a ni.
Sample-led qualification: engineering sample leh Golden Sample pawmpuina hian mass-production risk a ti tlem.
B2B documentation: drawing, product specification, lot identification leh inspection mamawh te chu purchase order nen a inmil thei.
| Thu hriat ngai | Entirna emaw, hrilhfiahna emaw |
|---|---|
| LF Chip leh Reader a ni | TK4100 emaw, a dang emaw; chhiartute brand/model; output/card-number format mamawh a ni. |
| HF Chip leh Reader a ni | F08 version dik tak emaw, a dang emaw; chhiartute brand/model; protocol, key, memory leh UID mamawh te a ni. |
| Target Performance tih hi a ni | Frequency tin tan read distance tlem ber/ tam ber, orientation leh test setup te. |
| Sheet Drawing a ni | A pum puia size, layout, card pitch, punching mark, feed direction leh card orientation te a ni. |
| Card Stack tih zawh tawh | Core sheet, overlay, adhesive, printed layer leh target zawng zawng thickness te a awm bawk. |
| Card Feat dangte pawh a awm | Magnetic stripe, contact chip, signature panel, slot, transparent area emaw special shape emaw a awm thei. |
| Order chungchang hriat tur | Sample zat, forecast volume, packaging, destination leh documentation mamawh te. |
Semi-finished card core a ni a, card position tinah 125kHz TK4100 circuit leh 13.56MHz F08 circuit hran a awm a ni. A hnuah sheet chu printable layer leh overlay hmangin an inzawm khawm a, laminated leh punched in card siam zawh tawhah an siam a ni.
No. Independent chip an ni a, antenna structure hrang hrang, frequency leh data behavior hrang hrang nei an ni. LF leh HF credential te hi a hranin enroll leh enkawl a ni.
TK4100 hi a tlangpuiin read-only LF identification credential atan thlan a ni. Writable LF function a mamawh hunah quotation hmain reader, programming equipment leh approved alternative chip te kha tarlang hmasa phawt ang che.
F08 leh MIFARE Classic te hi legacy 13.56MHz application environment inangah hman theih a ni a, mahse branded chip inang anga present tur a ni lo. Chip siamtu dik tak, protocol awm dan, memory, keys, UID mamawh leh reader compatibility dik tak chu finfiah rawh.
No. 13.56MHz-a hnathawh hian chip chu NFC phone zawng zawng nen a thawk dun thei vek lo. Smartphone nena inmil theihna chu chip leh protocol dik takah, phone hardware, operating system leh application-ah a innghat a ni.
Hotel lock siamtu emaw system integrator emaw chuan chip, protocol, UID/key behavior leh reader compatibility mamawh a nemnghet hnuah chauh ngaihtuah theih a ni. Hotel system hi frequency chauh atanga inthlak danglam theih a ni lo.
Chutiang chuan ngai suh. Payment leh high-security credential project-ah chuan system-in a pawmpui chip, cryptography, certification, personalization control leh complete-card testing te a ngai a ni. Chip platform him zawk a ngai mai thei.
Awle. Sheet dimension, card matrix, antenna geometry, chip coordinate, registration mark, thickness leh card orientation te chu technical drawing pawm tawh atang hian siam theih a ni.
Tuna he LF + HF prelam reference range hi 0.55–0.60mm vel a ni. Thickness leh tolerance tak tak chu electronic components, antenna siam dan, substrate leh final card stack mamawh danah a innghat a ni.
Target reader tinah frequency pahnih hi independent takin test la, chutah chuan printing, lamination, punching leh personalization hnuah repeat leh rawh. Card thickness, warpage, chip-area flatness, peeling leh antenna awmna te pawh enfiah bawk ang che.
Project hi prelam-only supply angin emaw, printable core sheet leh overlay te pawh telna coordinated card-material structure angin sawiho theih a ni. Bulk production hmain layer zawng zawng hi qualified vek tur a ni.
Chip reference dik tak, reader model, protocol leh data mamawh, layout drawing, antenna/chip coordinate, thickness leh dimensional tolerances, RF pawm dan tur, packaging, inspection plan leh pawm tawh Golden Sample te dah tel a ni.
