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Inlay/ Prelam tih a ni
Wallis chuan a rawn ti a
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Wallis 13.56MHz HF RFID PVC prelam inlay sheet te hi contactless smart card, ID card, access card, hotel key card, membership card, transport card leh NFC hmang thei card program te tan functional core atan engineer a ni. Sheet tin hian controlled PVC structure chhungah HF chip leh antenna thlan bikte chu a inzawm khawm a, final card-body lamination, printing, punching leh personalization atan a inpeih reng a ni.
B2B project te hi chip model, protocol, memory, antenna geometry, sheet size, card layout, inlay thickness, chip position, material, final card siam dan leh packaging te hmangin a siam theih a ni. Standard layout reference-ah hian 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 leh 4 × 10 te a awm a, lamination plate leh punching hmanrua bik atan custom multi-card layout a awm bawk.
Chip chhungkua chu universal compatibility claim pakhat hnuaiah group-ah dah tur a ni lo. MIFARE Classic, MIFARE Ultralight, NTAG leh MIFARE DESFire products te hi ISO/IEC 14443 Type A environment-ah an thawk a, ICODE product te erawh chu ISO/IEC 15693 hmanga siam a ni tlangpui a, antenna tuning leh bulk production hmain chip, reader, application software leh security mamawh dik tak chu finfiah hmasak tur a ni.
| Product chi hrang hrang | Plastic-card siamna atana hman tur 13.56MHz HF RFID contactless prelaminated inlay sheet a ni |
| Zinzia | 13.56MHz HF a ni a; protocol leh air interface te hi chip thlan danah a innghat a ni |
| Standard Layout hrang hrang a awm | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 leh custom layout te a awm bawk |
| Tuna Page Thickness Reference hman mek | HF structure thlan bikte tan 0.45 ± 0.02mm vel; chip, antenna, material leh final card stack hmangin confirm rawh |
| Base Materials te pawh a awm | PVC dum emaw, a langtlang emaw; PETG leh polycarbonate nena inmil project hrang hrangah process validation hranpa neih theih a ni |
| Antenna duhthlan tur a awm | Embedded copper wire, etched aluminum leh project hrang hranga antenna siamna te a awm bawk |
| B2B Services te a ni | Chip sourcing, antenna design, RF tuning, layout engineering, sample, lamination trial, electrical test, QC report leh export supply te a awm bawk |
HF RFID Inlay Sample leh Quote dil rawh
Prelam inlay chu intermediate card siamna sheet a ni a, chutah chuan RFID chip, chip-to-antenna connection leh plastic layer chhunga tuned antenna structure te a awm a ni. A tlangpuiin printable card siam zawh tawh a ni lo. Card siamtute chuan prelam hi printed core sheet leh transparent overlay te nen an inzawm khawm a, chutah chuan card siam zawh tawhte chu laminate, cool, punch leh personalize-in an siam a ni.
Antenna hian reader field atanga energy a dawng a, reader leh embedded chip inkarah data a transfer thin. RF performance hi antenna geometry, conductor resistance, chip capacitance, resonance, card materials, a bula metal, final card thickness leh reader field chakna ah a innghat a ni.
Printed PVC core sheets, transparent overlays, adhesives, magnetic stripes, signature panels leh protective finishes te hian prelam chhehvel hi thickness a belhchhah a ni. Target finished card thickness chu prelam gauge atang chauh ni lovin full stack atanga ruahman tur a ni.
Chip chhungkua, antenna size, conductor, card material emaw card environment thlak danglam hian resonance a thlak danglam thei a, read performance a tidanglam thei bawk. Chip pakhat atana design pawm tawh chu RF tehna tel lo chuan chip dang atan automatic-in hman nawn leh tur a ni lo.
HF Chip leh Antenna Structure te embedded a ni
Lamination atan hian Multi-Card Sheet Layout a awm bawk
Chip hi reader protocol, memory mamawh, security level, transaction speed, lifecycle, certification leh software ecosystem atanga thlan tur a ni. Brand hming MIFARE, NTAG leh ICODE te hi interchangeable generic term ni lovin product family an ni.
| Chip Chhungkaw / Option | Protocol Positioning | Typical Project Fit | Pawimawh B2B Note |
|---|---|---|---|
| Fudan F08 / Legacy 1K Option nena inmil | ISO/IEC 14443 Type A nena inmil system atana dil tlangpui; part number dik tak chu a dik tih finfiah a ngai | Legacy access, membership leh installed-reader thlak danglamna tur project hrang hrang | Manufacturer, memory, UID, authentication, reader nena inmil leh legal brand description te nemnghet rawh |
| A rilru a buai em em a, a rilru a hah em em bawk a. 1K / 4K | ISO/IEC 14443-3 A chi A, 106kbit/s a ni | Transport, ticketing, access leh gaming infrastructure awmsa te | Legacy product chhungkua; installed system-in a mamawhna hmunah chauh hmang la, design thar siamna atana tunlai secure alternative evaluate rawh |
| MIFARE Ultralight EV1 hmanga siam a ni | ISO/IEC 14443 Type A awmna hmun a ni | Ticket hman tlem, event, loyalty leh contactless program awlsam tak tak te | Memory, password leh originality features te chu application threat model nen match rawh |
| NTAG 213 / 215 / 216 ah a tarlang bawk | NFC Forum Type 2 Tag leh ISO/IEC 14443 Type A | NFC business card, authentication link, mobile engagement leh connected products te a awm bawk | User memory hi model hrang hrangah a danglam a; NDEF size, password leh originality mamawh te confirm |
| MIFARE DESFire EV3 a ni | ISO/IEC 14443 Type A parts 1–4 te chu higher-layer secure application te nen | Secure access, transport, campus, identity, loyalty leh multi-application card te a awm bawk | Key management, application personalization leh reader/software integration te a ngai a ni |
| ICODE SLIX2 / ISO 15693 Chhungkaw pakhat | ISO/IEC 15693, NFC Forum Type 5 awmna tur a ni | Vicinity-card, library, asset, identification leh longer-coupling-distance project te a ni | ISO/IEC 14443 Type A reader nena inthlak danglam theih a ni lo; reader protocol leh antenna size te chu nemnghet rawh |
Contactless standard tam tak chu 13.56MHz-ah a thawk a ni. Reader hian ISO/IEC 14443 Type A, Type B, ISO/IEC 15693, NFC Forum tag type emaw proprietary application layer emaw a support thei a ni. Frequency chauh hi compatibility pawm turin a tawk lo.
Banking, payment, sorkar identity leh regulated transit project-ah te hian certified chips, secure key injection, audited manufacturing, scheme approval leh application testing te a ngai thei a ni. Generic HF inlay chu qualification mamawh nei lovin payment-ready anga market tur a ni lo.
| Parameter | awm thei Direction | Production Control |
|---|---|---|
| 2 × 5 Layout a ni | A4-type prototype leh card volume tlem zawk siam chhuah a ni | Sheet dimension dik tak, card pitch leh registration marks te chu nemnghet rawh |
| 3 × 7 / 3 × 8 a ni | Industrial smart-card sheet layout hman tlanglawn tak tak te | Lamination plate, punching tool, printed core leh collation direction te chu inmil tir rawh |
| 4 × 8 / 4 × 10 / 5 × 5 a ni | Output sang zawk layout leh customer bik hmanrua te | Antenna kianga awm leh sheet deformation inkara RF inzawmna control |
| Custom Layout a ni | Custom card dimension, key fob, mini card emaw punching format bik emaw a awm thei | CAD drawing, finished-product outline, chip awmna, antenna zone leh cutting clearance te pek |
| Prelam Thickness a ni | Tuna page reference hi 0.45 ± 0.02mm vel a ni a; custom structures a awm bawk | Average, point variation, chip-bump zone leh final-card stack chhiar dan te chu nemnghet rawh |
| Bungrua | PVC dum, PVC langtlang leh project-specific PETG emaw PC nena inmil structure te | Shrinkage, bonding, heat, RF tuning leh finished-card durability te tihdik |
CR80/ID-1 card hman tlanglawn tak chu a tlangpuiin 0.76mm vel a design a ni a, mahse a tolerance dik tak chu card leh equipment specification-ah a innghat thung. Printed core, hmalam leh hnunglam overlay, adhesives leh local chip thickness te chu chhutnaah hian a tel tur a ni.
Sheet hi average gauge tolerance chhungah a awm thei a, chip zone erawh chu locally thicker a ni thei thung. Cavity design, cushioning, press pressure leh layer thlan te hian hmuh theiha bumps, weak bonding leh chip chhiatna te a veng tur a ni.
| Antenna Factor- | in Card a nghawng dan | Validation mamawh |
|---|---|---|
| Coil Geometry a ni | Inductance, coupling area leh cutting clearance awmsa te a control thin | Chip capacitance, card dimension, reader leh target environment te a inmil thei ang |
| Copper Wire Antenna hmanga siam a ni | Embedded coil design leh flexible geometry te a support bawk | Wire diameter, embedding thuk zawng, crossover, bond joint leh continuity te a awm bawk |
| Etched Aluminium Antenna hmanga siam a ni | Volume sang tak patterned antenna siamchhuahna a support | Trace zau zawng, a resistance, corrosion laka invenna, chip attachment leh lamination behavior te a awm bawk |
| Chip capacitance a awm thei | Antenna/chip circuit resonance a thlak danglam thin | Chip family emaw package emaw thlak dawnin retune thin ang che |
| Card Stack a ni | Plastic, ink, foil, metalized graphics leh overlays te hian coupling a thlak danglam thei a, antenna pawh a detune thei bawk | Card zawh tawh chu test la, bare prelam chauh ni lovin |
| Environment hmang rawh | Metal surface, phone, wallet, a bul hnaia card leh liquid te hian performance a nghawng thei a ni | Reader tum, mounting condition leh user handling te endik rawh |
Read distance hi chip, antenna area, quality factor, reader power, reader antenna, protocol, card orientation, final card stack leh environment ah a innghat a ni. Quotation-ah hian universal number pakhat hmang lovin test reader leh pass/fail distance tarlan tur a ni.
Multi-card sheet-a antenna siam tur hian cutting line, registration hole leh a kianga awmna hmun atanga hla tawk a mamawh a ni. Sheet-level RF test hian card punch hmaa antenna inkara coupling awm dan tur a ngaihtuah tur a ni.
| Layer | hnathawh dan | Key Control |
|---|---|---|
| Hma lam Overlay a ni | Printed graphics a humhim a, gloss, matte, frosted emaw security finish emaw a pe bawk | Thickness, bonding, abrasion leh personalization nena inmil |
| Hma lam Printed Core a awm | Fixed graphics, text, logo leh security printing te a keng tel bawk | Print registration, ink cure, shrinkage leh RF-safe metallic effects te a awm bawk |
| HF Prelam Inlay a ni | Chip, antenna, electrical joint leh supporting plastic layer te a awm a ni | RF tuning, chip awmna, thickness, alignment, bond leh electrical yield te a awm thei |
| Back Printed Core a ni | Front layer a balance a, reverse-side artwork a keng tel bawk | Gauge balance, magnetic-stripe awmna leh print coverage te a awm bawk |
| Back Overlay a ni | Artwork a humhim a, stripe, signature panel emaw security feature emaw a keng tel thei bawk | Bonding, flatness, encoding leh final surface te a awm bawk |
Antenna bula metalized foil lian tak tak, conductive ink emaw metallic layer te hian coupling emaw shift tuning emaw a ti tlem thei. RF test-ah hian final decorative materials te pawh telh la, a tulna hmunah clear zone vawng reng rawh.
Front leh back layer gauge, material direction leh print coverage te chu a theihna hmunah a inthlau tur a ni. Asymmetrical stack hian a lum leh a lum hnuah card curl a siam thei.
Stack pawm tawh chu nemnghet rawh: Overlay, printed core, inlay, adhesive, stripe leh security layer zawng zawng record vek rawh.
Sheet zawng zawng condition: Production environment-ah materials stabilize la, a fai, flat leh dry-ah dah rawh.
Orientation finfiah: Sheet lam hawi, card pitch, chip awmna, antenna awmna, artwork leh punching mark te inmil tir rawh.
Lamination cycle siam rawh: Material stack dik tak atan heat, pressure, dwell, plate finish, release sheet leh cooling siam rawh.
Chip zone humhim: Local pressure control la, IC chhehvela hard particle, plate defect emaw material flow tam lutuk emaw pumpelh rawh.
Controlled pressure hnuaia cool: Cool hian flatness, layer adhesion, chip stress leh dimensional stability te a nghawng a ni.
Punch hmaa test: Sheet-level electrical function, a lan dan, a thickness, bonding leh registration te enfiah thin ang che.
Card siam zawh tawh test: Punch, personalize leh RF performance, dimension, bending leh application compatibility te verify.
| Lamination Risk | A chhan awm thei | siamthatna kawng |
|---|---|---|
| Chip a chhiat phah | Khua lum lutuk, local pressure, electrostatic chhiatna emaw chip connection chak lo emaw | Chip package limit, process pressure, ESD control leh connection quality te enfiah leh rawh |
| Antenna Circuit chu hawng rawh | Conductor chhe, joint tha lo, cutting chhiatna emaw stretch lutuk emaw | Continuity, conductor kalna tur, punching clearance leh mechanical stress te enfiah thin ang che |
| Read Range chak lo tak a ni | Detuning, conductor hloh, reader inmil lo, metalized artwork emaw card-stack thlak emaw | Card siam zawh tawh leh target reader hmangin resonance teh la, retune rawh |
| Chip Bump hmuh tur a awm | Compensation tling lo, module thickness tam lutuk emaw pressure inang lo emaw | Local cavities, layer gauges, cushioning leh pressing condition te tihchangtlun |
| Delamination tih a ni | Contamination, thil inmil lo, lumna hniam emaw, lumna tha lo emaw | Material inmilna, thianghlimna, cycle leh peel performance te thlirletna |
| Sheet emaw Card emaw Warpage emaw a awm thei | Stack inthlau lutuk, a lum lutuk, pressure inang lo emaw, rang taka control loh cooling emaw | Layer te balance la, heating, plate flatness leh cooling te optimize rawh |
| enfiahna Item | B2B Control tura rawtna siam |
|---|---|
| Chip Identity a ni | A siamtu, part number dik tak, memory, UID option, protocol leh lot traceability te enfiah rawh |
| Electric hmanga hnathawh dan | Inspection plan angin card position tinah chip UID, memory emaw defined command set emaw chhiar thin ang che |
| Antenna chhunzawm zelna | Open circuit, short, joint chak lo, conductor chhiatna leh crossover chhia te hriatchhuah |
| Resonance / RF hnathawh dan | Test hmanrua leh fixture ruat sa hmangin agreed RF parameter emaw functional read distance emaw teh rawh |
| Chip leh Antenna awmna hmun | CAD, card outline, punch clearance leh a kianga antenna te nen position enfiah rawh |
| Sheet Dimension hrang hrang | A sei zawng, a zau zawng, a squareness, card pitch, registration holes leh edge quality te a awm bawk |
| Thickness leh Flatness a ni | Average thickness, local chip-zone thickness, curl, bow leh point-to-point danglamna |
| Visual Inspection neih a ni | Contamination, bubble, wrinkles, black spot, conductor exposure, scratch leh layer defect te a awm bawk |
| Card Test zawh tawh | RF function, dimension, thickness, bending, torsion, heat, humidity, peel leh reader nena inmil |
| Traceability a awm bawk | Chip lot, antenna lot, PVC lot, siam ni, layout, test program, sheet number leh packing record te a awm bawk |
Full inspection hian position tinah electrical read testing a kawk thei a, dimensional, peel leh destructive test te erawh sample lak a ni tlangpui thung. Purchase specification-ah hian test items, fixture, acceptance criteria, sampling plan leh report te tarlan tur a ni.
Prelam hian electrical testing a paltlang thei a, heat, pressure, punching emaw personalization nasa lutuk hnuah pawh a la fail thei tho. B2B qualification-ah hian incoming-inlay leh finished-card performance pahnih a tel tur a ni.
| hman | Chip / Protocol Direction | dan Critical Validation |
|---|---|---|
| Hnathawktu leh Access Card te | Legacy Type A, MIFARE Plus emaw DESFire emaw chu installed access system angin a awm thei | Reader compatibility, key management, enrollment leh nitin bending te pawh a awm thei |
| Hotel Key Card te pawh a awm bawk | Hotel-lock platform-a chip mamawh a ni | Lock encoder, guest-management system, card thickness leh humidity exposure te a awm bawk |
| Transport leh Campus Card te a awm bawk | System architecture mamawhna hmunah DESFire ang chi multi-application chip him | Transaction speed, security, reader estate, personalization leh lifecycle te a ni |
| Membership leh Loyalty Card te a awm bawk | Program design angin memory chip, NTAG emaw secure application chip emaw type rawh | Reader emaw phone emaw nena inmil, database, privacy leh hman nawn leh theihna |
| NFC Business leh Marketing Card te a awm bawk | NTAG emaw NFC Forum nena inmil chip dang emaw | NDEF theihna, phone nena inmil, URL venhimna leh scan position |
| Library, Asset leh Vicinity Card te a awm bawk | ISO/IEC 15693 / ICODE ang chi solution hmanga siam a ni | Reader protocol, antenna size, target range, anti-collision leh EAS mamawh te a ni |
| Secure Identity leh Pawisa pekna tur Project hrang hrang | Certified secure chip leh application architecture pawm tawh | Certification, key injection, audited supply chain leh scheme bik pawmpuina pek a ni |
Smart Card Programme atana HF RFID Inlay hman dan tur
| Data / Security Item | B2B mamawh a ni |
|---|---|
| UID a ni | UID sei zawng, fixed emaw random ID awm dan, database format leh reader support te chu nemnghet rawh |
| Memory Encoding a ni | Data structure, sector/file/pages, NDEF record, lock bit leh verification te sawifiah |
| Authentication Keys te chu a awm | Key ownership, injection process, transport venhimna, diversification leh audit trail te sawifiah |
| Password / Access siam dan tur ruahmanna siam | Password, access bits, counters, originality checks leh lock-state testing te chu a support na hmunah te tarlang rawh |
| Variable Data tihchhuah a ni | Printed number, barcode emaw QR code emaw chu controlled reconciliation hmangin chip data nen link rawh |
| Card hnawl tawhte | Live key, identifier emaw encoded data emaw awmna card te chu segregate, count leh him taka tihchhiat |
Mipui chhiar theih identifier atanga chauh access phalna system chu copy emaw emulation emaw a hlauhawm thei hle. Security-sensitive project-te chuan cryptographic authentication dik tak support thei chip leh backend architecture an hmang tur a ni.
Secure chip supply hian application setup emaw key management emaw a huam lo. Key siamtu, dahkhawm, load leh verify tu te, audited secure-personalization environment a ngai em tih te sawifiah rawh.
Hybrid smart card hian HF hi LF, UHF, contact chip emaw HF application dang emaw nen a thlunzawm thei a ni. Heng structure te hian hmun tam zawk, antenna uluk taka then hran, local thickness control dang leh lamination leh testing program bik a mamawh a ni.
| Hybrid Structure | hman dan Case | Engineering lama harsatna awm thei |
|---|---|---|
| LF + HF a ni | Legacy proximity access atanga HF smart-card system-a inthlak danglamna | Antenna space, inpawh tawnna, card thickness leh dual-reader testing te a awm bawk |
| HF + UHF tih a ni | Short-range identity bakah hla zawka tracking a awm bawk | Antenna system hrang hrang, material effect leh UHF sensitivity te chu taksa emaw metal emaw bulah a awm |
| HF Chip pahnih | Application hrang hrang emaw independent issuer domain emaw a awm thei | Reader thlan dan, antenna coupling, data neih dan leh card-layout tihkhawtlai te a awm bawk |
| Contact + Contact nei lo | Dual-interface hmanga identity him, telecom emaw pawisa pekna architecture emaw a awm thei | Module cavity, antenna connection, lamination, certification leh personalization te a awm bawk |
Standard single-frequency HF prelam chu LF emaw UHF emaw automatic-a support anga sawi tur a ni lo. Multi-frequency structure te hian anmahni drawing, chip list, RF test, thickness specification leh price te an mamawh a ni.
Prelam sheet te chu ni êng direct leh lumna hmun hla takah sealed, clean leh dry packaging-ah flat takin dah rawh.
Bending, scratch leh chip-zone pressure awm loh nan rigid board, interleaving leh protected carton hmang rawh.
Electrostatic discharge chak tak pumpelh la, a tulna hmunah ESD handling control dik tak hmang rawh.
Sheet stack-ah hian load rit tak tak, inang lo tak tak dah suh la, pallet overhang pawh phal suh.
Warehouse leh production condition a inang lo chuan processing hmain lamination room chhunga material condition hmasa phawt ang che.
Pack tinte chu chip model, antenna design, layout, thickness, batch leh inspection status hmangin hriat theih.
First-in, first-out inventory hmang la, rei tak dah emaw, phurh chhuah emaw a nih hnuah material test leh rawh.
HF RFID Prelam Sheets te tan Flat Packing humhalh a ni
Prelam rintlak siamna atan hian controlled antenna embedding emaw etching emaw, chip attachment, sheet registration, plastic lamination, electrical testing, dimensional inspection, clean handling leh batch traceability te a ngai a ni. Controlled change remtih a nih loh chuan repeat order atan chip, antenna drawing leh RF test method pawm tawh chu fixed reng tur a ni.
RFID Inlay Project leh Technical Team te an ni
Prelam Inlay siamchhuahna hnatlang neih a ni
Antenna leh Inlay Process Control a ni
Electric leh Dimensional Inspection neih a ni
Application hmanga chip thlan dan: Legacy access, NFC, secure multi-application leh ISO 15693 project te chu protocol leh security mamawh angin a thliar hrang thei a ni.
Custom antenna engineering: Coil geometry, conductor, chip capacitance, card outline leh target reader te hi enfiah dun theih a ni.
Flexible sheet layouts: Standard multi-card arrangement leh customer-specific card pitch te a awm bawk.
Card-material inzawmkhawm: PVC prelam hi printed core, overlay, magnetic stripe leh finished-card structure te nen a inzawm theih a ni.
Qualification support: Sample, lamination trial, RF test, thickness check leh finished-card verification te hian project risk a ti tlem a ni.
Factory-direct B2B supply: Smart-card factory, printer, converter, system integrator, issuer, importer leh distributor te tan a tha hle.
Application, reader brand/model, protocol leh software platform install tawh te a ni.
Chip siamtu dik tak leh part number, memory, UID leh security mamawh dik tak.
Sheet layout, total dimension, card pitch, registration mark leh quantity te a awm bawk.
Card size, antenna clear zone, chip awmna leh punching drawing te a awm bawk.
Prelam material, rawng, nominal thickness leh tolerance te a ni.
Antenna technology hmanga siam, target resonance emaw functional read-range test emaw a ni thei.
Final card stack, printed core, overlay, metallic printing, stripe emaw signature panel emaw a awm thei.
Lamination press, lumna, pressure, dwell, cooling leh plate dimension te a awm a.
Electrical test, RF test, dimensional inspection leh pawm dan tur te a awm bawk.
Encoding, key injection, UID list, variable data emaw database inrem dan emaw a ni.
Prototype quantity, kum tin forecast, repeat-order schedule leh change-control mamawh te a ni.
Packing, inspection document, destination port leh delivery date dil te a awm bawk.
I HF RFID Inlay Project chungchang sawiho rawh
Card siamna core sheet a ni a, plastic layer chhungah 13.56MHz chip leh antenna a awm a ni. Printed core leh overlay hmanga laminated a ni a, contactless card siam zawh tawh a ni.
No. Prelam chu intermediate functional layer a ni. Card siam zawh tawhte chu printing, overlay, lamination, cooling, punching leh optional personalization emaw encoding emaw tih belh a ngai a ni.
Project-ah hian ISO/IEC 14443 Type A, Type B, ISO/IEC 15693 emaw NFC Forum nena inmil chip hman theih a ni. Protocol dik tak chu IC leh reader system thlan danah a innghat a ni.
No. Product family hrang hrang, protocol, memory, command, security leh application hrang hrang nei an ni. Order hmain chip leh reader dik tak kha confirm hmasa phawt ang che.
Chutiang legacy 1K-compatible option chu sawiho theih a ni. Chip mamawh dik tak leh reader sample pe rawh, a chhan chu manufacturer, UID, memory leh authentication compatibility te hi finfiah a ngai a ni.
Installed legacy system tan a pawimawh reng a, mahse tunlai secure project-te chuan system architecture angin tuna alternative awm mek MIFARE DESFire emaw MIFARE Plus emaw te chu an evaluate tur a ni.
NTAG 213, 215 emaw 216 leh NFC Forum nena inmil chip dangte hi duhthlan tur tlanglawn tak a ni. NEF memory mamawh, phone compatibility leh security features atang hian model chu thlang rawh.
MIFARE DESFire ang chi multi-application chip him tak chu a dik mai thei a, mahse reader support, key management, certification, application file leh software te chu a dik tih finfiah a ngai a ni.
ISO/IEC 15693 hi ISO/IEC 14443 hmanga siam proximity-card system aiin reader, antenna size leh target coupling distance a danglamna vicinity-card application atan hman a ni.
A duhthlan tur tlanglawn tak chu 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 leh 4 × 10 te a ni a, a lei duhtu lamination leh punching drawing atang hian custom layout siam theih a ni.
Tuna product page hian HF structure thlan bikte tan 0.45 ± 0.02mm vel a reference a ni. Final thickness hi chip, antenna, material, card stack leh local chip-zone mamawh danah a innghat a ni.
Awle. Target finished-card thickness, overlay leh printed-core gauges, chip package leh lamination process te pe la, chutiang chuan stack kimchang chu chhut theih a ni.
Awle. Antenna geometry hi chip capacitance, card size, reader, target performance, chip position leh cutting clearances vel a siam theih a ni.
Embedded copper-wire leh etched-aluminum option te pawh sawi theih a ni. Construction tha ber chu volume, resistance, thickness, bonding, card design leh RF target ah a innghat a ni.
Universal range a awm lo. Chip, antenna, reader, card stack, orientation leh environment ah a innghat. Test reader leh functional distance tlem ber siam rawh.
RF test zawhah hman theih a ni. Antenna bula metallic foil lian tak tak emaw conductive ink emaw chuan contactless interface chu a detune emaw shield emaw thei.
Material structure dang pawh enfiah theih a ni a, mahse shrinkage, bonding, lamination temperature, RF tuning leh finished-card durability te chu a hranin validate a ngai a ni.
Prelam hi a tlangpuiin blank functional core angin supply a ni. Printing hi core sheet hrang hrangah hman a ni tlangpui a, mahse project-specific construction erawh sawiho theih a ni.
Structure tin atan hian universal setting engmah tihchhuah tur a ni lo. PVC, overlay, ink, chip leh antenna siam dan dik tak vel temperature, pressure, dwell leh cooling te siam chhuah.
Chip packaging inmil, controlled local thickness, plate fai, balanced pressure, heat cycle pawm tawh leh lamination hma leh hnua electrical testing hmang rawh.
Electrical test kimchang pawh tarlan theih a ni. Purchase agreement-ah hian position tinah eng command nge check tih leh eng destructive emaw dimensional test nge sampling hman tih te a tarlang tur a ni.
UID chhiar, memory encoding, NDEF ziah emaw application personalization emaw sawiho theih a ni. Secure-key services atan hian controlled specification hran a ngai a ni.
Hybrid design hi product hrang hrang angin siam theih a ni. Antenna layout bik, thickness planning, reader test leh pricing te an mamawh a ni.
Awle. A duh ber chu prelam test a, card stack kimchang laminate a, punch card leh RF, mechanical leh personalization performance verify a ni.
MOQ hi chip awm dan, custom antenna tooling, layout, material, thickness, test program, encoding leh approved standard design hman theih leh theih lohah a innghat a ni.
Chip, reader, protocol, layout, sheet size, card drawing, thickness, antenna target, final card stack, test, quantity, packing leh destination dik tak pe rawh.
Wallis Plastic hi biak theih a ni a, 13.56MHz HF RFID PVC prelam inlay sheets customized hmangin access, ID, hotel, membership, transport, NFC leh smart-card siamna atana hman theih a ni. Kan team hian chip thlan, antenna design, sheet layout, RF tuning, lamination trial, electrical testing, encoding, quality specification leh factory-direct B2B supply te kan support a ni.
