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silicone hmanga siam a ni
Wallis chuan a rawn ti a
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Wallis high-temperature silicone press pad for card lamination hi industrial plastic card laminating hmanrua atana siam, hman nawn theih press consumable a ni. PVC , PETG leh PC card structure te hot-press lamination neih laiin pressure distribution uniform zawk a support rualin stack leh platen tenau danglamna te compensate turin a pui bawk.
siam a ni a 3mm, 5mm, 8mm leh 10mm thickness-a , a dimension pawh a duh angin a awm a, silicone pad hi lamination plate hrang hrang, card-sheet format leh production equipment hrang hrang nen a inmil thei a ni. Custom thickness, density, shape leh surface mamawh te pawh OEM leh ODM project atan pawh enfiah theih a ni.
A hmanna tlangpui chu bank card, ID card, membership card, magnetic stripe card, RFID leh contactless card, smart card, multi-layer plastic card leh Overlay film -film lamination te a ni.
Professional B2B thlan nan chuan lei duhtute chuan laminator model, press-plate dimension, card material, stack thickness, hot-press temperature, pressure, dwell time, cooling method leh surface finish mamawh te an pe tur a ni . Heng parameter te hi a thickness chauh atanga press pad thlan ai chuan a tangkai zawk.
| Specification / Attribute | Typical / Thil awm thei te |
|---|---|
| Pad Material a ni | Silicone lumna do thei lo |
| Operating Temperature a ni | Card-lamination lumna atana duan a ni a; Pad thlan tawh atan continuous leh peak temperature dik tak chu tarlan leh confirm tur a ni |
| Thickness duhthlan tur a awm | 3mm / 5mm / 8mm / 10mm a ni a; custom thickness dil theih a ni |
| Pad Dimension hrang hrang | Lamination plate leh machine dimension nena inmil tura siam a ni |
| Pressure Insem darh dan | Press area hman theih zawng zawngah pressure distribution inang tlang zawka support turin duan a ni |
| Pawnlang | Silicone contact surface chu a hrual a; application thlan bik atan surface finish leh release mamawhna confirm |
| Hardness / Density a ni | Customized theih a ni a; exact Shore hardness emaw density emaw chu technical specification-ah finfiah tur a ni |
| A chhe thei lo | Temperature, pressure, tihfai leh dahna hmun remchang hnuaia hman nawn theih; actual replacement interval hi a kalphung a innghat a ni |
| Shape / Edge hmanga enkawl dan | Rectangular, plate-fitting emaw custom-cut emaw ang chi a ni |
| Dilna hrang hrang | PVC , PETG leh PC card lamination, Overlay film lamination, RFID leh smart-card siamchhuah te a ni |
| Standard MOQ a ni | Tuna Wallis product information atanga a lan danin sheet 100 a ni |
| Lead Time a ni | Tuna product information angin order confirm a nih atanga ni 7–15 chhungin |
| Packaging siam a ni | Carton box ah hian venhimna wrapping a awm bawk |
| OEM / ODM , a man pawh a to hle. | Custom size, thickness, density, shape leh machine-fit mamawh te chu enfiah theih a ni |
Engineering hriat tur pawimawh: tuna Wallis page hian fixed maximum temperature, Shore A hardness, compression set, compression recovery, thickness tolerance, flatness tolerance emaw guaranteed cycle count emaw a tichhuak lo. Heng parameters mamawh lei duhtute chuan silicone pad dang atanga value lak ai chuan model-specific technical data an dil tur a ni.
Silicone press pad hi hot-press card lamination stack chhunga hman thin compliant layer a ni. Press assembly chhungah a thu a, thickness variation tenau te compensate turin a pui a, card-sheet area a mechanical load transfer even zawk a support bawk.
Compliant silicone layer hian card stack, plate condition leh local thickness-a danglamna tenau te chu a khum thei a ni. Hei hi multi-layer card structure emaw, RFID inlays, chips emaw local thickness variation dang awmna sheet emaw laminating-naah a pawimawh hle.
Pad hi heating, pressing leh cooling process repeated chhungah a thawk a ni. Chuvangin a thickness, hardness leh thermal behavior te hi independent taka thlan ai chuan complete lamination recipe nen a inmil tur a ni.
Cushioning layer hian press components inkara hard localized contact a tihziaawm thei a, polished lamination plate leh card sheet te chu concentrated loading atanga venhimna kawngah a pui thei bawk. Faina hi a pawimawh hle a, a chhan chu leivut emaw embedded particle emaw hian laminated surface-ah chhiatna a la transfer thei tho a ni.
Cushioning dik taka thlan chuan press chu hman theih card-sheet area zawng zawngah force inang tlang zawka a hman theih nan a pui thei a, lamination laiin layer contact inmil zawk a support thei bawk.
Plastic-card stack-ah hian printed layer, Overlay film s, inlays emaw local structure-ah pawh danglamna tenau te a awm thei. Pad tling tak chuan chutiang danglamna thenkhat chu rigid steel plate hmanga direct-a transfer ai chuan a absorb thei a ni.
Controlled pad specification hmanga documented temperature, pressure leh cycle recipe hman hian batch hrang hrang inkara process repeatability a ti tha thei a ni.
Press pad chauh hian bubble-free, warp-free leh delamination-free card a guarantee thei lo. Ink drying, moisture, trapped air, material compatibility, plate parallelism, heating uniformity, pressure, dwell time leh cooling condition te hian final result a nghawng bawk.
Tunah hian Wallis hian 3mm, 5mm, 8mm leh 10mm thickness option a pe chhuak mek a ni. Pad thick zawk chu automatic in a tha zawk lo. Thickness hian stack san zawng, compression behavior leh potentially lamination assembly thermal response a tidanglam thin.
Laminator-in cassette space a neih tlem emaw, cushioning thickness hniam zawk a mamawhna hmunah emaw 3mm pad hi evaluate theih a ni. Final suitability chu hardness, compression leh machine settings ah a innghat.
5mm construction hian machine emaw card stack emaw tan option dang a pe a, compliant thickness dang mamawh a ni. Production hman hmain lamination recipe awmsa nen test hmasak phawt tur a ni.
8mm pad hian physical cushion depth tam zawk a pe thei a, mahse a lei duhte chuan press clearance, heat-transfer response leh compressed stack height te an verify tur a ni.
Machine clearance, pressure behavior leh heating profile te confirm hnuah chauh 10mm pad thlan tur a ni. Thickness emaw softness emaw lutuk hian lamination condition ruahman chu a tidanglam thei a ni.
Non-standard thickness hi laminator bik leh card-stack design hrang hrang tan enfiah theih a ni. Customized replacement dil hunah pad sample awmsa, technical drawing emaw machine information emaw thawn tur a ni.
Engineering specification atan chuan 'High temperature resistant' hi a tawk lo. Buyers te chuan normal hot-press temperature, maximum temperature, dwell time leh shift khata cycle awm zat te an pe tur a ni a, chutiang chuan silicone construction thlan chu enfiah theih a ni.
Hardness hian press load hnuaia silicone pad a deform awlsam dan a nghawng a ni. Tunah hian Wallis hian hardness emaw density emaw chu customizable tiin a list a, mahse he product atan hian fixed Shore A value a publish lo. I process hmanga control a nih chuan technical inquiry-ah hian hardness mamawh chu telh bawk ang che.
Reusable press pad chu compression nawn leh hnuah a recover tawk tur a ni. High-cycle production kalpui mek lei duhtute chuan a tulna hmunah construction thlan bik atana compression-set emaw recovery information hman tur dil tur a ni.
Pad thickness danglamna hian lamination plate lian takah local pressure a nghawng thei a ni. Precision production atan chuan purchase specification-ah thickness tolerance pawmtlak, flatness leh cut-size tolerance te tarlang rawh.
Silicone press pad hi multi-layer PVC card sheet hot-press lamination-ah hman theih a ni a, chutah chuan printed core layer leh PVC Overlay film s te pawh a tel.
PETG card structure-ah pawh silicone cushion layer remchang tak hman theih a ni bawk. Heating leh cooling recipe chu PETG material nen a inmil tur a ni a, card siam zawh vek tur a ni.
PC card siam nan hian a tlangpuiin controlled heat, pressure leh cooling a ngai thin. Silicone pad thlan tawh chu i machine-in a hman PC lamination cycle atan a temperature theihna tak tak chu a dik tih finfiah rawh.
RFID leh contactless card sheet-ah hian antenna, chip emaw local thickness danglamna emaw a awm thei. Cushioning layer tha tak chuan controlled press contact vawng reng chungin variation tenau te a awm theih nan a pui thei bawk.
Press pads hi downstream punching, personalization leh finishing hmaa bank, membership leh magnetic-stripe card sheet siamna atana hman lamination stack-ah hian a tel thei a ni.
Silicone cushioning hian Overlay film -film lamination a support thei bawk. Buyers te chuan pad hian an specific stack-a steel plate, release layer emaw component dang emaw direct-a a contact em tih an nemnghet tur a ni.
He page hian Wallis silicone press pads 3mm, 5mm, 8mm leh 10mm thicknesses a awm te a tarlang a ni. Project specification-in Wallis-a separate wool-silicone product page-a tarlan wool-felt construction awm lo silicone-based pad a mamawh hunah he product entity hi hmang ang che.
Wallis hian silicone-fiberglass card lamination cushion product a hranpaa thinner a pe bawk. Buyers te chuan product pahnih hi inang vek anga ngaih ai chuan thickness, reinforcement, hardness, thermal response leh compression characteristic te hi an khaikhin tur a ni.
Wool-silicone pads hian felt-based cushioning structure silicone nena inzawm a hmang a. An thermal leh compression response hi silicone-only emaw fiberglass-reinforced pad nen a danglam thei.
Selection method rintlak ber chu candidate pads te chu production-a hman thin laminator, steel plate, card material, Overlay film , temperature, pressure leh cooling recipe ang chiah hmanga test hi a ni.
Lamination-plate hman theih sei leh zau zawng thawn la, pad drawing awmsa pe rawh. Positioning holes, cut-outs emaw special machine features atana allowances te chu chiang taka tarlan tur a ni.
3mm, 5mm, 8mm, 10mm thlang la, approved pad awmsa thickness pe rawh.
Operating temperature pangngai, temperature sang ber leh lum ber sawi rawh
