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Pampiri ea maiketsetso ea Wallis e tšoeu ea Teslin e tšehetsa tlhahiso ea laminated ID, litho le RFID tlhahiso ea likarete ka li-gauge tsa 0.178mm le 0.254mm, ka liteko tsa khatiso, ho itšeha ka tloaelo, lisampole le phepelo e ngata ea B2B.
thepa ea karete
WALLIS
| Boitsebiso: | |
|---|---|
| Botenya: | |
| Mofuta oa Khatiso: | |
| Bongata: | |
Pampiri ea maiketsetso ea Wallis 0.178mm le 0.254mm e tšoeu ea Teslin e fanoa bakeng sa likarete tsa ID tsa laminated, likarete tsa botho, lintlha tsa ho kena, likarete tsa linotlolo tsa hotele, RFID likarete, libeche tsa liketsahalo le mananeo a mang a hatisitsoeng. The substrate microporous e amohela enke, toner, sekhomaretsi le laminate ka sebopeho sa eona, ho thusa baetsi ba likarete ho fumana khatiso e tšoarellang le maqhama a matla a lera.
Li-gauge tse peli li lumellana le lifomate tse tloaelehileng tsa 7 mil le 10 mil substrate. Botenya bo lokela ho khethoa e le karolo ea kaho e felletseng ea karete ho fapana le mofuta oa karete feela. Ho hatisa ka mahlakoreng a le mong kapa ka bobeli, botenya ba Filimi ea overlay , RFID inlay, khoele ea makenete, sekhomaretsi, khatello ea lamination le botenya ba karete e felileng li tlameha ho kenyeletsoa ka botlalo.
Wallis e tšehetsa bareki ba B2B ka lisampole tsa maqephe, ho itšeha ka tloaelo, liteko tsa khatiso, tlhahlobo ea lamination, tlhahlobo ea sebopeho sa likarete le ho paka kantle ho naha. Bareki ba lokela ho netefatsa boemo bo nepahetseng ba Teslin, moetsi, mamello ea botenya, boemo ba bokaholimo le litokomane tsa ho lumellana pele ba fana ka tumello ea tlhahiso ea bongata.
| Mofuta oa Sehlahisoa | White microporous synthetic-pampiri substrate bakeng sa likarete tse hatisitsoeng le laminated |
| Dikgetho tsa botenya | 0.178mm / 178μm / 7 mil le 0.254mm / 254μm / 10 mil |
| Mekhoa ea ho Hatisa | Offset, silika-screen le khatiso ea digital; lits'ebetso tse eketsehileng li hloka tlhahlobo ea sehlopha le lisebelisoa |
| Lisebelisoa tsa karete | ID, botho, botšepehi, senotlolo sa hotele, phihlello, ketsahalo, tlhokomelo ea bophelo le likarete tse khethiloeng tsa RFID |
| Khetho ea ho Fana | Lishiti tse tloaelehileng kapa tse sehiloeng ka mokhoa o ikhethileng, liphutheloana tse sirelelitsoeng tsa kahare, mabokose le liphalete tsa kantle ho naha |
| Litšebeletso tsa B2B | Mehlala, mangolo a mangolo a khatiso, liteko tsa lamination, RFID tlhahlobo ea sebopeho, moralo oa QC le phepelo e ngata |
Kopa Mehlala ea Substrate Card ea Teslin
Teslin substrate ke microporous, polyolefin-based synthetic material e nang le karolo e phahameng ea inorganic filler le moea o ka hare oa moea. Ho fapana le lakane e teteaneng ea polasetiki, sebopeho sa eona sa porous se monya enke, lithane, likhomaretsi le laminate e entsoeng ka ho qhibilihisoa, ho theha maqhama a hokahaneng ka har'a substrate.
Enke le toner li ka phunyeletsa ka holim'a metsi ho e-na le ho lula feela e le lera le ka tlosoang. Nakong ea lamination, laminate e lumellanang kapa sekhomaretsi se phalla ka har'a li-pores, se thusa ho sireletsa mongolo o hatisitsoeng, lifoto, likhoutu tsa QR le li-barcode ho tsoa ho abrasion kapa ho leka karohano ea lera.
Mohaho o hatellehang o ka koala likhoele tsa makenete, li-antenna, li-chips le lintho tse ling tse kentsoeng. Sena ha se felise tlhokahalo ea boenjiniere ba inlay: botenya ba likarolo, moralo oa sekoti, kabo ea khatello le tlhahlobo e pheta-phetoang e ntse e le bohlokoa.
Tšireletseho ea karete e ipapisitse le moralo o felletseng, ho kenyeletsoa mesebetsi ea bonono e laoloang, data e feto-fetohang, likarolo tsa holographic, li-inks tsa UV , Filimi ea overlay s, chips, likhoele tsa makenete le mekhoa ea ho fana. Substrate e tšoeu e tloaelehileng ha ea lokela ho hlalosoa e na le li-watermark kapa likarolo tse patiloeng ntle le haeba kereiti e nepahetseng e na le likarolo tseo.
Substrate e tšoeu ea Microporous Card
Leqephe le ka hatisoang le le bonolo ho Lamination
Botenya ka bobeli bo ka hatisoa ka lehlakoreng le le leng kapa ka bobeli. Khetho e nepahetseng e itšetlehile ka tlatsetso e hlokahalang ea substrate ho kakaretso ea karete ea botenya, ho satalla, cushioning, lamination stack le lifilimi tse fumanehang Filimi ea overlay -eseng feela hore na litšoantšo li na le lehlakore le le leng kapa la mahlakore a mabeli.
| Ntho ea Khetho | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Substrate Contribution | Tlatsetso e tlase ho boima ba karete kaofela; e siea sebaka se eketsehileng bakeng sa Filimi ea overlay s kapa likarolo tse ling | Tlatsetso e phahameng ho botenya bohle le cushioning |
| Ho tenyetseha | Ho feta tenyetseha pele lamination | Boikutlo bo bongata pele ho lamination |
| Tšebeliso e Tloaelehileng ea Morero | Likarete tsa laminated tse tšesaane, libeche, li-tag le meaho e sebelisang matla a Filimi ea overlay s | Li-cores tse boima, cushion e ntlafalitsoeng le meaho e sebelisang masesaane Filimi ea overlay s |
| RFID / Sebopeho sa Chip | E thusa moo inlay le Filimi ea overlay s li se li ntse li sebelisa botenya bo bongata | E ka fana ka cushion e eketsehileng, empa palo eohle le khatello li tlameha ho baloa hape |
| Mokhoa oa tumello | Hatisa, laminate, boemo 'me u lekanye lisampole tse phethiloeng | Hatisa, laminate, boemo 'me u lekanye lisampole tse phethiloeng |
7 Mil le 10 Mil Thickness Options
Karete ea ID ea laminated ke sistimi ea substrate, print, Filimi ea overlay s, sekhomaretsi le likarolo tsa boikhethelo tsa elektroniki. Botenya bo phethiloeng bo lokela ho baloa ho tloha ho stack eohle le ho netefatsoa ka mor'a hore karete e pholile le ho tsitsa. Botenya
| ba Karolo ea Karete | le Tlhokomelo ea Ts'ebetso |
|---|---|
| Teslin Print Core | Sebelisa 0.178mm kapa 0.254mm ho latela stack e amohetsoeng le cushioning e hlokahalang |
| Pele le Ka morao Filimi ea overlay | Filimi ea overlay gauge, sekhomaretsi le pheletso ea bokaholimo li bonts'a tšireletso le maikutlo a ho qetela a karete |
| Enke e hatisitsoeng / Toner | Sekoaelo se matla se ka ama mongobo, ho thibela, lamination le dimensional balance |
| RFID Inlay kapa Chip | Kenyelletsa antenna, chip bump, sekhomaretsi le likarolo life kapa life tsa mokoti kapa spacer |
| Mothapo oa Magnetic / Hologram | Netefatsa nako ea phomolo, Filimi ea overlay e tsamaellana le khouto ea kamora ho lamination kapa tlhahlobo |
| Karete e phethiloeng | Lekanya botenya, ho bata, litekanyo le ts'ebetso ka mor'a ho pholisa le ho lokisa |
ID, Likarete tsa Phihlello le Botho
Mananeo a Karete a Laminated a felile
Limaraka tse fapaneng tsa Teslin li ntlafalitsoe bakeng sa litsamaiso tse fapaneng tsa khatiso. Bareki ha baa lokela ho nahana hore lakane e le 'ngoe e tšoeu e tla hlahisa sephetho se tšoanang ho offset, dae inkjet, pigment inkjet, laser, Indigo, skrine kapa thepa ea ho fetisa mocheso. Ho hlokahala hore ho be le kereiti e nepahetseng, printa le sistimi ea enke. Tlhokahalo ea netefatso ea
| Ts'ebetso ea Khatiso | ea B2B |
|---|---|
| Khatiso ea Offset | Ho beha enke, ho teteana, ho tšoasa, ho omisa, boemo ba phofo, ho thibela le ho hanyetsa lamination |
| Khatiso ea Silk-Screen | Botenya ba enke, ho tsamaellana le solvent, pheko, ho feto-fetoha ha maemo le bonding ba layer |
| Khatiso ea Laser ea Digital | Mocheso oa fuser, ho khomarela toner, lipalangoang tsa maqephe, taolo e tsitsitseng le qualification ea lisebelisoa |
| Khatiso ea Inkjet | Sebelisa kereiti e lumellanang le enke; dae ea teko kapa enke ea pigment, nako e omileng, ho hanyetsa metsi le profil ea mebala |
| HP Indigo / Digital Press | Netefatsa kereiti e tšoanelehang, tlhokahalo ea pele, mocheso oa kobo le lamination ka mor'a khatiso |
| Printer e tobileng ho ea Karete | Ka tloaelo o hatisa karete e phethiloeng e se nang letho ho e-na le leqephe le hlephileng la Teslin; teko feela ka mor'a karete lamination le punching |
Ho hatisa ka mahlakoreng a mabeli ho laoloa ke mokhoa oa khatiso, kereiti, tekanyo ea mongobo, tšireletso ea litšoantšo le ngoliso-eseng feela ka ho sebelisa thepa ea 0.254mm. Moralo o leka-lekaneng ka pele le morao o ka boela oa thusa ho fokotsa curl ka mor'a ho hatisa le ho lamination.
Litšoantšo tse tsitsitseng li atisa ho hatisoa maqepheng a substrate pele ho lamination. Mabitso a feto-fetohang, linepe, linomoro kapa libarcode li ka eketsoa nakong ea khatiso ea maqephe kapa hamorao kareteng e phethiloeng, ho ipapisitse le phallo ea mosebetsi ea phano.
Liteko tsa Offset, Screen le Digital Printing
Teslin substrate e ka ba platen-laminated kapa roll-laminated ka lifilimi tse lumellanang. Kamano e matla e etsahala ha laminate kapa sekhomaretsi se phalla ka har'a sebopeho sa microporous. Litlhophiso tsa ho qetela li tlameha ho thehoa ka kereiti ea 'nete ea substrate, Filimi ea overlay , inki, tobetsa le stack ea karete.
| Lamination Control | kgothaletswa Tloaelo |
|---|---|
| Boemo ba mongobo | Boemo substrate le maqephe a hatisitsoeng pele lamination; thepa e ommeng haholo kapa e mongobo haholo e ka fokotsa boleng |
| Mocheso | Beha ho ea ka mofani oa laminate le mocheso o tiisitsoeng oa substrate; u se ke ua itšetleha feela ka mocheso oa pontšo ea mochine |
| Khatello le Nako | Fana ka phallo e lekaneng ka har'a li-pores ntle le ho pshatla li-chips, ho khopamisa litšoantšo kapa ho etsa ho pepeseha ho feteletseng |
| Ho phodisa | Pholisa tlas'a khatello e laolehileng ho ntlafatsa flatness le dimensional botsitso |
| Matla a Peel | Lekola laminate e phethiloeng ka mor'a hore boemo bo be teng le ho pepeseha tikolohong |
| Ho tiisoa ha Edge | Mehaho e lumellanang ea Teslin laminate hangata e ka shoa ka mor'a lamination ntle le moeli o tiisitsoeng o arohaneng; netefatsa ka filimi e khethiloeng |
Mekhahlelo ea ho qala e hatisitsoeng e ka 'na ea thusa litekong, empa mocheso oa sebele o fapana ho ea ka poleiti, khatiso, bophahamo ba stack, Filimi ea overlay khemistri le khaso e hatisitsoeng. Rekota mocheso o amohelehang oa substrate, khatello, ho lula, ho pholisa le ho lokolla-filimi tlhophiso bakeng sa tlhahiso e pheta-phetoang.
Mongobo o ts'oaretsoeng, mocheso o sa lekaneng, laminate e sa lumellaneng, enke e boima kapa pholiso e mpe e ka baka lipudula, silevera, haze kapa curl. Hlahloba ka bobeli lakane le likarete tse phuntsoeng ka mor'a hore boemo bo be teng.
Teslin substrate e ka ts'ehetsa moralo o hlophisitsoeng oa bopaki, empa likarolo tsa ts'ireletso li entsoe ke lenaneo le felletseng la litokomane. Lisebelisuoa tse tloaelehileng tsa khoebo ha li na lintho tse patehileng tsa boemo ba 'muso kapa tsa forensic.
| Sebopeho sa Tšireletso | Tlhokahalo ea ho Kopanya |
|---|---|
| Microtext le Fine-line Printing | Mesebetsi ea bonono e nang le liqeto tse phahameng, poleiti e laoloang kapa litšoantšo tsa digital le ho nepahala ka morao ho lamination |
| UV -Enke ea Fluorescent | Tlhokomelo ea mofani oa enke, taolo ea mokokotlo oa fluorescence le tlhahlobo kamora ho lamination |
| Holographic Filimi ea overlay | E ngolisitsoe Filimi ea overlay , ho lumellana ha laminate, ho hlaka ha pono le boitšoaro ba ho senya |
| QR Code le Barcode | Phapang ea khatiso, ho nepahala ha dimensional, ho bala ha scanner le tšireletso ea abrasion |
| Custom Security-Grade Substrate | Matshwao a kenyeleditsweng ka lenaneo le itseng a hloka phepelo e sireleditsweng e dumelletsweng mme ha e lekane le leqephe le tshweu le tlwaelehileng. |
Tšireletso ea Layered le Tšireletso ea Laminate
Teslin substrate e ka sireletsa le ho sireletsa RFID inlay, empa ho khetha 0.254mm sebakeng sa 0.178mm ha e etse karete e loketseng lisebelisoa tsa elektroniki tse tsoetseng pele. Potoloho ea inlay, chip, antenna, adhesives, Filimi ea overlay le lamination cycle e tlameha ho raloa joalo ka sebopeho se le seng.
| Karete e bohlale | Netefatso e Hlokehang |
|---|---|
| Chip le Frequency | Netefatsa mohlala oa chip, frequency, protocol, memori le sistimi ea ho bala |
| Antenna Geometry | Sireletsa mesaletsa ea li-antenna nakong ea ho lamination, ho phunya le ho qetela ka karete |
| Inlay Botenya | Bala chip bump, antenna, carrier le sekhomaretsi ka har'a kakaretso ea karete |
| Kabo ea Khatello | Sebelisa cushion le likheo tse loketseng ho qoba tšenyo ea chip kapa antenna |
| Tlhahlobo ea Ts'ebetso | Lekola ts'ebetso ea ho bala / ho ngola pele ho lamination, ka mor'a ho lamination, ka mor'a ho otla le ka mor'a ho fetoha |
| Kopo ea Likopo tse Kopo | e khothalelitsoeng Morero |
|---|---|
| Likarete tsa ID tsa Khamphani | Boleng ba foto, data e feto-fetohang, barcode, Filimi ea overlay ho tšoarella ha nako le tšebeliso ea libeche tsa letsatsi le letsatsi |
| Likarete tsa Baithuti le Ba Faculty | Khatiso e phahameng haholo, ho iketsetsa motho, makenete kapa RFID ts'ebetso le ho feto-fetoha ha nako e telele |
| Likarete tsa Botho le Botšepehi | Mmala oa brand, barcode kapa QR e baloang, ho tšoarella ha sepache le tlhahiso ea lipampiri tse baballang chelete e ngata |
| Likarete tsa Key Hotel | Tšebelisano-'moho kapa RFID , tlhahlobo ea linotlolo le bophelo ba ts'ebeletso bo khuts'oane ho isa bohareng |
| Li-ID tsa tlhokomelo ea bophelo le mokuli | Ho lumeloa, ho hloekisoa ho pepeseha, ho hlahloba barcode le tlhahiso e laoloang |
| Libeche tsa Ketsahalo le Baeti | Khatiso ea nakoana ea dijithale, li-slots, lanyards, likhoutu tsa QR le ho iketsetsa motho ka potlako |
| Process | Control Point |
|---|---|
| Ho khaola Guillotine | Squareness, ngoliso e hatisitsoeng, boemo ba blade le compression ea stack |
| Ho phunya ka karete / Ho Seha ka Lefu | Litekanyo tsa karete, radius ea sekhutlo, litšepe tse hloekileng ebile ha ho na karohano ea laminate |
| Ho phunya sekotjana le lesoba | Boemo, sebaka sa moeli, mojaro oa lanyard le ho hanyetsa mapetso |
| Embossing kapa Foil Stamping | Sebopeho sa karete e phethiloeng, mocheso, khatello, ho khomarela ka foil le ho ba bonolo |
| Thermal / Retransfer Personalization | Lipalangoang tsa khatiso, phetisetso ea lente, matla a holim'a metsi, ho sotha mocheso le ho tšoarella ha setšoantšo |
| Khouto ea Magnetic / RFID Khouto | Phano ea khouto, tšebelisano ea 'mali le ts'ebetso ea kamora khatello ea maikutlo |
| Material | Strengths | Lintlha Tse ka Sehloohong |
|---|---|---|
| Teslin Substrate | Monyetla o phahameng oa khatiso, bonding bo matla ba laminate, ho feto-fetoha ha maemo le cushioning bakeng sa lisebelisoa tsa elektroniki | Hangata e sebelisoa e le motheo o hatisitsoeng ka har'a mohaho oa laminate ho e-na le ho ba karete e phethiloeng e senotsoeng |
| PVC | Ts'ebetso ea likarete tse thehiloeng, phepelo e pharaletseng le mekhoa e tloaelehileng ea motho ka mong | Boemo bo fapaneng ba tikoloho, ho hanyetsa mocheso o tlase le ho sebelisoa hape ho fokolang limmarakeng tse ngata |
| PETG | Matla, ho hlaka le lisebelisoa tse matla tsa likarete tsa multilayer | Recipe ea ho khomarela enke le lamination e fapane le karolo e nyenyane ea Teslin |
| Polycarbonate | Ho tšoarella ho phahameng, ho hanyetsa mocheso le bokhoni ba laser-personalization ka limaraka tse inehetseng | Litšenyehelo tse phahameng tsa thepa le tlhahiso; se sebedisoang bakeng sa ho batla mangolo a bophelo bo bolelele |
| Inspection Ntho | e khothalelitsoeng Taolo |
|---|---|
| Boitsebiso ba Lintho | Moetsi, kereiti, khoutu ea botenya, beche le referense ea setifikeiti |
| Botenya le Boholo | Karolelano ea gauge, mamello, bolelele ba lakane, bophara, lisekoere le ho nepahala ha seha |
| Ponahalo | Bosoeu, moriti, matheba a matšo, tšilafalo, masoebe, maqeba le tšenyo e ka thōko |
| Bophahamo le Mongobo | Curl, seqha, boemo ba polokelo le tekanyo ea mongobo pele ho khatiso le lamination |
| Print Qualification | Botenya, ho khomarela, ho omisa, 'mala, lintlha tsa setšoantšo, ho baloa ha barcode le ho thibela |
| Teko ea Lamination | Matla a peel, li-bubble, haze, karohano ea moeli, curl le botenya bo felileng |
| Tlhahlobo ea Karete e Feletseng | Litekanyo, ho feto-fetoha ha maemo, abrasion, motho ka mong, matla a slot, khouto le ts'ebetso ea ho bala |
| Ho paka le Traceability | Lipalo tse sirelelitsoeng, palo, lebokose la lebokose, tlhophiso ea pallet, nomoro ea lotho le tlaleho ea tlhahlobo |
Teslin substrate e hatelloa 'me e lokela ho sireletsoa mochesong, UV leseli, tšilafalo, ho se leka-lekane ha mongobo le khatello e feteletseng ea stack. Ho boloka ka nepo ho thusa ho boloka 'mala, ho bata, ho sebetsa ha khatiso le matla a lamination.
Boloka lintho tse koahetsoeng sebakeng se hloekileng hole le mosi o tukang le lintho tse silafatsang ka tlung.
Sireletsa maqephe ho khanya e tobileng UV le thempereichara ka holimo ho moeli o lumelletsoeng oa polokelo.
Boloka maqephe a sehiloeng a bataletse sebakeng se tiileng, se tšehelitsoeng.
Se ke oa beha mejaro e boima kapa liphalete tse phuthetsoeng habeli holim'a mabokose a lipampiri tse sehiloeng.
Qoba likhoele tse thata haholo tse ka hatellang mahlakoreng kapa tsa tšoaea stack ea lakane.
Boloka liphutheloana tse sa fellang li phuthetsoe bocha ho thibela lerōle, ho fifala le ho fetoha ha mongobo.
Lipampiri tsa boemo ka kamoreng ea tlhahiso pele ho khatiso kapa lamination ha maemo a polokelo a fapana.
Wallis e ts'ehetsa bahlahisi ba likarete le barekisi ba thepa ka ho fumana li-substrate sourcing, ho itšeha maqephe a tloaelo, ho paka ho sirelelitsoeng le phepelo e hokahaneng ea lisebelisoa tsa likarete. Odara e 'ngoe le e' ngoe e lokela ho amahanngoa le sampole e amohetsoeng le litlhaloso tse ngotsoeng tse koahelang kereiti, botenya, mokhoa oa khatiso, sebopeho sa lamination le litlhoko tsa karete e felileng.
Lisebelisoa tsa likarete Phepelo ea Ts'ebetso le ho Romela kantle
Li-gauge tse peli tse tloaelehileng tsa likarete: likhetho tsa 0.178mm le 0.254mm bakeng sa meaho e fapaneng ea likarete tsa laminated.
Tšehetso ea ts'ebetso ea ho hatisa: Liteko tsa Offset, silika-screen le khatiso ea digital li ka hokahanngoa pele ho tumello ea bongata.
Nts'etsopele e shebaneng le Lamination: Substrate, Filimi ea overlay , sekhomaretsi, mocheso le botenya ba karete bo ka hlahlojoa e le sistimi e le 'ngoe.
RFID boiphihlelo ba karete: Inlay botenya, cushioning, ts'ireletso ea chip le liteko tsa ho bala li ka kenyelletsoa ho netefatso ea sampole.
Ho itšeha le ho paka ka tloaelo: Sebopeho sa Sheet, tšireletso ea stack, mabokose le lipalete li ka etsoa ho latela litlhoko tsa tlhahiso le kantle ho naha.
Tšebeletso ea B2B e tobileng fekthering: E loketse lifeme tsa likarete, liprinta, li-converter, RFID lik'hamphani, bareki ba tsoang kantle ho naha le barekisi.
Kopo ea karete, bophelo bo lebelletsoeng ba ts'ebeletso le 'maraka oa moo o eang teng.
Hlokahala botenya: 0.178mm / 7 mil kapa 0.254mm / 10 mil.
Bolelele ba leqephe, bophara, mamello, lisekoere le bongata.
Mokhoa oa ho hatisa, mofuta oa printa, enke kapa toner le litšoantšo tse mahlakoreng a le mong kapa a mabeli.
Filimi ea overlay thepa, botenya, qetellong, sekhomaretsi le lisebelisoa tsa ho lamination.
Reka litekanyo tsa karete e felileng, botenya le radius ea sekhutlo.
RFID chip, antenna, inlay, khoele ea makenete, hologram kapa karolo e 'ngoe.
Khatiso ea ts'ireletso, barcode, khoutu ea QR le litlhoko tsa motho ka mong.
Lisetifikeiti tse hlokahalang, ho lateloa ha thepa le tlaleho ea tlhahlobo.
Bongata ba teko, ponelopele ea selemo, boema-kepe le kemiso ea thomello.
Buisanang ka Morero oa Karete ea hau ea Teslin
The substrate 0.178mm ke 7 mil, ha 0.254mm substrate ke 10 mil. Mokhahlelo o motenya o kenya letsoho ho feta botenya ba karete le ho ts'oara, empa ka bobeli li hloka tlhahlobo ka sebopeho se felletseng sa laminate.
Ee. Ho hatisa ka mahlakoreng a le mong kapa a mabeli ho itšetlehile ka sehlopha sa substrate, mokhoa oa khatiso, tsamaiso ea enke, tekanyo ea litšoantšo le ngoliso-eseng feela ka botenya ba lakane.
Ha ho khetho e akaretsang. Bala substrate, ka pele le ka morao Filimi ea overlay s, sekhomaretsi, khatiso le inlay boikhethelo, ebe laminate le lekanya conditioned phethiloe karete.
Substrate e thehiloeng ho polyolefin e hanela metsi, empa ho tšoarella ha khatiso ho itšetlehile ka enke e nepahetseng, kereiti le lamination. Karete e phethiloeng e lokela ho lekoa bakeng sa ho pepeseha ha metsi, mongobo le ho hloekisa.
Sebelisa kereiti ea Teslin e tsamaellanang le enke 'me u leke dae e itseng kapa enke ea pigment. Limaraka tse tloaelehileng le limaraka tsa inkjet tse koahetsoeng li ka itšoara ka tsela e fapaneng nakong e omileng, mebala le ho hanyetsa metsi.
Limaraka tse loketseng li ka hatisoa ka laser, empa mocheso oa fuser, lipalangoang tsa maqephe, ho khomarela toner le mangolo a khatiso a tlameha ho hlahlojoa. U se ke ua sebelisa thepa e sa lumelloang bakeng sa thepa.
Boholo ba lihatisi tse tobileng ho karete li etselitsoe likarete tse se nang letho, eseng lishiti tse hlephileng tsa substrate. Hatisa le ho laminate laminate pele, otla likarete, 'me u leke motho ka mong likheong tse felileng.
Li-laminates tse ngata tsa mocheso le lifilimi tse khomarelang li ka sebetsa, empa ho lumellana ho itšetlehile ka mocheso oa ts'ebetso, phallo, botenya le litlhoko tsa karete e phethiloeng. Amohela motsoako o nepahetseng oa substrate-le-filimi ka liteko tsa peel.
Mehaho ea Teslin e entsoeng ka laminated ka mokhoa o nepahetseng hangata e ka khaoloa ho ea sebopeho se phethiloeng ntle le moeli o tiisitsoeng o arohaneng hobane litlamo tsa laminate ka har'a matrix a porous. Netefatsa sena ka laminate e khethiloeng le ts'ebetso.
Lisosa tse ka 'nang tsa e-ba teng li kenyelletsa mongobo o feteletseng, mocheso o sa lekaneng, moea o qabeletsoeng, enke e boima, laminate e sa lumellaneng kapa khatello e sa lekaneng. Beha maqephe 'me u netefatse mocheso oa' nete oa substrate.
Ee. Cushioning ea eona e ka thusa ho sireletsa lisebelisoa tsa elektroniki, empa chip, antenna, botenya ba inlay, sekhomaretsi, khatello le ts'ebetso e felileng ea ho bala e tlameha ho netefatsoa.
Eseng ka bo eona. Substrate e teteaneng e ka fana ka cushioning e eketsehileng, empa e boetse e fetola botenya ba karete eohle le kabo ea khatello. Sebopeho se feletseng sa inlay se etsa qeto ea ts'ebetso.
Substrate e tšoeu e tloaelehileng e fana ka melemo ea khatiso le lamination empa ha ea lokela ho hlalosoa e na le matšoao a tšireletso a patiloeng. Boitsebiso bo khethehileng ba lenaneo la tšireletso ke sehlahisoa se laoloang se arohaneng.
Ee. Holographic Filimi ea overlay s, UV li-inks, microtext le likarolo tse ling li ka kopanngoa ka mekhoa e fapaneng ea khatiso le lamination. Ponahalo le ho tšoarella ha tsona li tlameha ho lekoa ka mor'a tlhahiso.
Ts'ebetso ea tikoloho e ipapisitse le thepa e tala, kaho ea likarete, bophelo ba ts'ebeletso, tlhahiso, lipalangoang le litsela tse fumanehang tsa ho lahla. Qoba tseko e pharalletseng ea bophahamo ntle le tlhahlobo e hlalositsoeng ea potoloho ea bophelo.
Ho sebelisoa hape ho ipapisitse le pokello ea lehae le sebopeho se felletseng sa karete. Li-laminate, li-inks, likhoele tsa makenete, li-chips le li-antenna li ka hloka karohano ea litsebi kapa ho lahla.
Boloka maqephe a koahetsoe, a bataletse, a omme 'me a sirelelitsoe ho UV khanya, mocheso, mosi, lerōle le khatello e feteletseng ea qubu. Li behelle pele ho khatiso kapa lamination.
Ho itšeha ka tloaelo ho ka buisanoa ho latela moralo oa khatiso, poleiti ea lamination, ho beha karete, mamello, bongata le litlhoko tsa ho paka.
Ee. Hatisa, laminate, pholile, boemo, phunya 'me u etse motho ka mong likarete tsa sampuli u sebelisa thepa e reriloeng ea tlhahiso pele u amohela thepa.
MOQ e ipapisitse le kereiti, botenya, boholo ba lakane, ho itšeha tloaelo, mangolo a khatiso, ho paka le ponelopele ea selemo.
Fana ka botenya, boholo ba lakane, mokhoa oa khatiso, Filimi ea overlay , lisebelisoa tsa lamination, botenya ba karete e felileng, RFID kapa litlhoko tsa mela, bongata, sebaka sa ho fihla le kemiso ea ho fana.
Ikopanye le Wallis Plastic bakeng sa pampiri ea maiketsetso ea 0.178mm le 0.254mm e tšoeu ea Teslin bakeng sa ID ea laminated, litho, senotlolo sa hotele, ketsahalo le mesebetsi ea likarete tsa RFID . Sehlopha sa rona se ts'ehetsa khetho ea botenya, ho itšeha ka tloaelo, liteko tsa khatiso le lamination, tlhahlobo ea sebopeho sa karete, litlhaloso tsa boleng le phepelo ea B2B e tobileng fekthering.
Teslin ke lets'oao la khoebo le ngolisitsoeng la PP G Industries Ohio, Inc. Netefatsa boemo bo fanoeng, mohloli le litokomane bakeng sa odara ka 'ngoe.
