I-Wallis embozwe ngentambo enomugqa kazibuthe ihlanganisa ukubopha okuqinile kwe-lamination, ukuvikelwa kwekhadi okucacile kanye nokusebenza kwedatha ye-HiCo noma ye-LoCo ebhange, ihhotela, ukufinyelela, i-ID kanye nokukhiqizwa kwamakhadi obulungu.
I-WLS-Oeralay enomugqa onguMag
WALLIS
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I-Wallis embozwe imbondela enomugqa kazibuthe iwumsebenzi osebenzayo wekhadi-lamination ohlanganisa imbondela ebonisa ngale, i-bonding, kanye nomugqa ozibuthe ohlanganisiwe eshidini elilodwa elilungele ukukhiqizwa. Ingenziwa i-laminated kanye namashidi ekhadi-core ephrintiwe ngaphambi kokuba amakhadi aqediwe abethelwe futhi afakwe ikhodi.
Itholakala ngezinketho zemigqa kazibuthe ye-HiCo ne-LoCo , imbondela yakhelwe abakhiqizi bamakhadi abangochwepheshe abakhiqiza amakhadi okhiye behhotela, amakhadi okufinyelela, amakhadi obulungu, amakhadi okwethembeka, amakhadi esisebenzi, amakhadi okuthutha, amakhadi asebhange, amakhadi omazisi, namanye amakhadi epulasitiki afundeka ngomshini.
Izinketho zokukhiqiza ngokwezifiso: i-PVC, i-PET, i-PETG noma i-PC substrate; 0.04mm-0.15mm ubukhulu; A4, A3, ishidi noma ifomethi eyenziwe ngokwezifiso; umugqa we-HiCo noma we-LoCo; ngokwezifiso umbala womugqa, ububanzi, isikhundla, isiqondiso, enamathela kanye nokupakishwa.
| Igama Lomkhiqizo | Ifilimu eyimbondela embozwe ngomugqa ozibuthe ohlanganisiwe |
| Izinto Ezitholakalayo | I-PVC, i-PET, i-PETG, i-PC, noma izinto ezihambisana nekhadi ezenziwe ngezifiso |
| Ubukhulu bembondela | 0.04mm–0.15mm; izinketho ezivamile zihlanganisa 0.05mm, 0.08mm, kanye 0.10mm |
| Usayizi Weshidi | I-A4, A3, ubukhulu beshidi obungokwezifiso, noma ifomethi eqondene nephrojekthi |
| I-Magnetic Stripe Type | I-HiCo noma i-LoCo |
| Izinketho zokuphoqelela | 300 Oe LoCo; 2750 Oe noma 4000 Oe HiCo; eminye imininingwane engaphansi kokuqinisekiswa kwephrojekthi |
| Umbala Omthende | Umbala omnyama noma owenziwe ngendlela oyifisayo ungaphansi kwebanga lomugqa ozibuthe kanye nezidingo zokuhleleka |
| Ububanzi Bomthende | Ububanzi obujwayelekile noma obenziwe ngezifiso ngokuya ngomklamo wekhadi kanye nezidingo zomfundi |
| Isikhundla Somthende | Ibanga elenziwe ngendlela oyifisayo ukusuka eshidini noma onqenqemeni lwekhadi eliqediwe, ngokuya ngomdwebo ogunyaziwe |
| Ukugqoka | I-Lamination bonding coating ohlangothini olukhethiwe lokuxhumana nekhadi |
| I-Surface Qeda | Okucwebezelayo okubonisa ngale, okumatte, okuyisithwathwa, noma okuphothulwe ngokwezifiso |
| Izicelo Eziyinhloko | Amakhadi ehhotela, amakhadi okufinyelela, amakhadi asebhange, amakhadi obulungu, amakhadi okwethembeka, amakhadi okuthutha, amakhadi abasebenzi, amakhadi omazisi, namakhadi ahlakaniphile |
| Ukwenza ngokwezifiso kwe-OEM | Impahla, ukujiya, ubukhulu, ibanga lomugqa, ububanzi, indawo, umbala, ukunamathela, ingaphezulu, ukupakisha, nokulebula |
Wonke amapharamitha wobuchwepheshe kufanele aqinisekiswe ngokucaciswa okugunyaziwe, umdwebo wesakhiwo somugqa ozibuthe, kanye nesampula yokukhiqiza. Ukusebenza kwekhadi eliqediwe kuncike esakhiweni sekhadi eliphelele, ibanga lomugqa, isifaki khodi, isifundi, uyinki, okokusebenza kokucwenga, nezimo zokucubungula.
Imbondela embozwe ngomugqa kazibuthe iyishidi lembondela lekhadi elibonisa ngale eselivele liqukethe umugqa wedatha uzibuthe kanye nendawo yokubopha i-lamination. Ngesikhathi sokukhiqizwa kwekhadi, izinto ezisetshenziswayo zipakishwa ngomongo wekhadi eliphrintiwe nezinye izendlalelo ezisebenzayo, zifakwe ngaphansi kokushisa okulawulwayo nokucindezela, bese zishaywa emakhadini kazibuthe aphelile.
Ukuhlanganisa umugqa kazibuthe kwimbondela kungasusa inqubo ehlukile yohlelo lokusebenza. Lokhu kusiza abakhiqizi bamakhadi ukuba benze lula ukulungiselela ungqimba, bathuthukise ukuhambisana kwendawo yomugqa, banciphise izinyathelo zokubamba, futhi bakhe indawo evikelayo yekhadi eliqediwe emjikelezweni ofanayo wokucwala.
Umugqa kazibuthe uqukethe izinhlayiya ezikwazi ukudonsa uzibuthe ezingafakwa ikhodi ngedatha efundeka ngomshini. Izishumeki zikazibuthe ezihambisanayo zenza iphethini yokushintsha kazibuthe kumugqa, futhi abafundi bekhadi baguqulela lezo zinguquko zibe ulwazi lwedijithali olusetshenziswa ukufinyelela okuhambisanayo, ukuhlonza, ubulungu, ukungenisa izihambi, inkokhelo, noma isistimu yezokuthutha.
Umugqa ngokwawo uyindlela yokuqopha idatha. Ukuvikeleka kwesistimu kuncike ohlelweni oluphelele lwekhadi, okuhlanganisa ifomethi yedatha, ukuqinisekiswa kwe-backend, ukulungiselelwa komfundi, imithetho yokufinyelela, ubuchwepheshe be-chip, izici zokuphepha ezibonakalayo, nezinqubo zokuphatha izifakazelo.
Ibhakhodi kanye nekhadi le-Magnetic Stripe
Amakhadi Angenalutho Alungele Ukuphrinta Nombhalo Wekhodi
I-LoCo isho ukuphoqelelwa okuphansi. Ukucaciswa okujwayelekile kwe-LoCo cishe kungama-300 Oe. Idinga indawo kazibuthe ephansi yombhalo wekhodi futhi ingafanelekela amakhadi okhiye behhotela, amakhadi okufinyelela esikhashana, amakhadi omcimbi, amakhadi okuphromotha, nezinye izinhlelo zokusebenza lapho amakhadi evame ukukhishwa khona noma abhalwe kabusha.
Ngenxa yokuthi idatha ye-LoCo ingathinteka kalula izinkundla eziqinile zamagnetic zangaphandle, abathengi kufanele bahlole indawo yesevisi ehlosiwe, impilo yekhadi, okokusebenza kombhalo wekhodi, kanye nesistimu yokufunda ngaphambi kokuyikhetha.
I-HiCo isho ukuphoqelela okuphezulu. Imininingwane ejwayelekile yephrojekthi ingafaka i-2750 Oe noma i-4000 Oe. Imigqa ye-HiCo inikeza ukumelana okukhulu nokucinywa kazibuthe ngengozi futhi ngokuvamile ibhekwa njengamakhadi aphathwa njalo noma anesevisi ende njengamakhadi okufinyelela abasebenzi, amakhadi okuthutha, amakhadi obulungu, amakhadi omazisi, namakhadi ezezimali.
Khetha i-LoCo lapho ubhala kabusha kalula kanye nokusebenzisa umjikelezo omfushane obiza kancane kuyizidingo eziyinhloko. Khetha i-HiCo lapho ukumelana okuthuthukisiwe ekusuleni ngengozi nokugcinwa kwedatha okude ngaphansi kokuphathwa njalo kubaluleke kakhulu.
Ukukhetha kokugcina kufanele futhi kufane nesishumeki sekhasimende, umfundi, ifomethi yedatha, izinga lomugqa ozibuthe, ukumiswa kwethrekhi, indawo yesevisi, kanye nenqubo yokufaneleka yekhadi eliphelile.
Umugqa kazibuthe unikezwa njengengxenye yongqimba oluyimbondela, okunciphisa isidingo sokusebenzisa umugqa ohlukile ngemva kokuphrinta noma ukucwenga. Lokhu kungenza kube lula ukulungiselela izinto kanye nokuhlelwa kokukhiqiza.
Uhlangothi oluboshwe luklanyelwe ukuhlangana nezinto ezihambisanayo eziphrintiwe zekhadi-core ngesikhathi sokushisa okushisayo. Ukukhetha okulungile kokunamathela kungasiza ekunciphiseni amabhamuza, ukuphakamisa unqenqema, ukunamathela okubuthakathaka, nokuhlukaniswa kwe-interlayer.
Ukuma kwe-stripe kungenziwa ngokomdwebo wobuchwepheshe ogunyaziwe, okusiza ukugcina ukuhleleka okuphindaphindekayo ngemva kokucwenga kweshidi nokubhobozwa kwekhadi.
Imbondela ebonisa ngale ivikela izithombe eziphrintiwe, umbhalo, amabhakhodi, amalogo, izithombe, nedatha eguquguqukayo kusukela ekuhuzukeni okujwayelekile, umswakama, ukungcola, nokubamba okuphindaphindiwe.
Impahla, ukujiya, ubukhulu beshidi, ibanga lomugqa, indawo yomugqa, ububanzi bomugqa, ukuphela kwendawo, ukunamathela, ukupakisha, kanye nokulebula kungenziwa ngendlela oyifisayo emigqeni yokukhiqiza amakhadi ehlukene.
Ngokuhlanganisa imbondela evikelayo kanye nomugqa kazibuthe kube okokusebenza okukodwa, abakhiqizi bangase banciphise imisebenzi ehlukene yokudlulisa imigqa, isikhathi sokuphatha, umsebenzi wokuqondanisa, kanye nempahla yesiteji sokukhiqiza.
Izixazululo Zekhadi Le-Magnetic Stripe ne-Chip
Imbondela Magnetic for Card Lamination
Imbondela ye-PVC isetshenziswa kabanzi kumakhadi epulasitiki avamile ngoba inikeza ibhalansi engokoqobo yokusebenza kwe-lamination, ukuguquguquka, ukuhambisana nokuphrinta, ikhwalithi yendawo, kanye nezindleko.
Amamaki e-PET kanye ne-PETG angahlolwa ukuze kutholwe izakhiwo zamakhadi ezidinga amandla aphezulu emishini, ukumelana namakhemikhali, ukuqina kohlangothi, noma ukuhambisana nama-core card womndeni we-PET.
Imbondela ye-Polycarbonate ingacatshangelwa ukwakhiwa kwamakhadi ahlala isikhathi eside, imibhalo kamazisi evikelekile, kanye nezinhlelo zokusebenza ezidinga i-lamination ehambisana ne-PC noma izinto zokwenza ngelaser. Isakhiwo sesendlalelo esiphelele kufanele siqinisekiswe ngaphambi kokukhiqizwa.
Phrinta amakhadi-core sheet usebenzisa uyinki ogunyaziwe, indlela yokuphrinta, inqubo yokomisa, namamaki okubhalisa. Qinisekisa ukuthi isistimu ye-inki iyahambisana ne-coating ekhethiwe.
Khomba uhlangothi olunamekwe, uhlangothi olunomugqa kazibuthe, isiqondiso somugqa, nomumo wembondela ongaphezulu noma ongezansi ngaphambi kokuhlanganisa izendlalelo zekhadi.
Beka imbondela yangaphambili, izendlalelo eziyinhloko eziphrintiwe, i-inlay noma umongo osebenzayo, kanye nembondela yangemuva kazibuthe ngokulandelana okugunyaziwe. Izinhlangothi zokubopha kufanele zibhekane nezindawo ezihlosiwe zekhadi-core.
Sebenzisa izinga lokushisa elifanelekile, ingcindezi, isikhathi sokushisisa, isikhathi sokupholisa, ipuleti lokukhulula, nendlela yokupakisha esungulwe ngesikhathi sokuhlolwa kwesampula. Iresiphi ye-lamination yendawo yonke akufanele icatshangwe ngayo yonke inhlanganisela yezinto ezibonakalayo.
Gcoba ishidi elaminate emakhadini aqediwe bese uhlola ubukhulu bekhadi, ukuma komugqa, ikhwalithi ephezulu, ukucaba, ukubopha komphetho, nokubukeka okubonakalayo.
Faka ikhodi umugqa usebenzisa isifaki khodi esihlosiwe sokukhiqiza, bese uqinisekisa ukusebenza kokufunda, ulandelele idatha, ukuvumelana kwesignali, isiqondiso sokuswayipha, izinga lephutha, nokuhambisana nabafundi bekhadi eliqondiwe.
Ukumbondelana komugqa kazibuthe we-LoCo kuvame ukuhlolwa kumakhadi egumbi lezivakashi ngenxa yokuthi izifakazo zivame ukubhalwa kabusha futhi ziphinde zikhishwe phakathi nomjikelezo wesevisi yekhadi.
Imigqa kazibuthe ye-HiCo ingasekela amakhadi okufinyelela asetshenziswa njalo, amabheji ezisebenzi, amakhadi ekhampasi, imininingwane yesikhungo, namakhadi okuhlonza adinga ukumelana okuthuthukisiwe ekusulweni ngengozi.
Ukumbondelana kwemigqa kamagnetic kungasetshenziselwa amakhadi ejimu, amakhadi eqembu, amakhadi okwethembeka okudayisa, amakhadi omtapo wolwazi, amakhadi okuzijabulisa, nezinhlelo zokuhlonza amakhasimende.
Amakhadi azibuthe angakwazi ukusekela ukuqoqwa kwemali yokugibela, amathikithi, ukuhlonza abagibeli, ukufinyelela endaweni yokupaka, nezinye izinhlelo zokusebenza zokuhamba uma kuqhathaniswa nengqalasizinda yokufunda ekhethiwe.
Izinto ezisetshenziswayo zomugqa kazibuthe we-HiCo zingahlolelwa izakhiwo zamakhadi wezezimali ezidinga idatha kazibuthe efundeka ngomshini. Amakhadi aqediwe kufanele aqinisekiswe ngokumelene nezimfuneko ezisebenzayo zomthengi zobuchwepheshe, ukuphepha, inethiwekhi yokukhokha, nokulawula.
Ukusebenza komugqa kazibuthe kungahlanganiswa nama-chips othintana naye, ama-inlay e-RFID angathinteki noma e-NFC, amabhakhodi aphrintiwe, amakhodi e-QR, amaphaneli esiginesha, nezici zokuphepha ezibonakalayo ukuze kusekelwe ifa nezinhlelo ezintsha zokufunda ngaphakathi kwekhadi elilodwa.
Amakhadi Magnetic enziwe ngokwezifiso
Amakhadi Obulungu Nobuqotho
Amakhadi e-Hybrid Magnetic kanye ne-Smart
Indawo yomugqa kazibuthe kufanele ichazwe ngokuhlobene nekhadi eliqediwe, hhayi kuphela ishidi lembondela elingasikiwe. Umphakeli udinga umdwebo onobukhulu obonisa ukuma kweshidi, ukwakheka kwekhadi, izimpawu zokusika, isiqondiso somugqa, ibanga ukusuka onqenqemeni lwekhadi eliqediwe, ububanzi bemigqa, nokubekezelela.
Usayizi wekhadi eliqediwe kanye nokuma kwekhadi.
Inani lamakhadi ahlelwe eshidini ngalinye eliphrintiwe.
Ububanzi bomugqa we-magnetic kanye nombala.
Ibanga ukusuka onqenqemeni lomugqa ukuya onqenqemeni lwekhadi eliqediwe.
Isiqondiso somthende kanye nesiqondiso sokuswayipha.
Ukucaciswa kokuphoqelelwa kwe-HiCo noma kwe-LoCo.
Kudingeka ukubekezelelana kwesikhundla nokusika.
Noma iyiphi iphaneli yesiginesha, i-chip, ibhakhodi, noma indawo ephrintiwe eduze komugqa.
Ukukhiqizwa okuthembekile kwamakhadi kazibuthe kudinga ukuhlolwa kwakho kokubili imbondela ebonisa ngale kanye nomugqa osebenzayo. I-Wallis ingaxhumanisa izidingo zokuhlola eziqondene nephrojekthi ngokuya ngebanga lezinto ezibonakalayo, ukwakheka kwekhadi, umthamo we-oda, kanye nenqubo yokwamukela ikhasimende.
Ukuqinisekiswa kwe-Material kanye ne-coating-grade.
Ukuhlolwa kobukhulu nobukhulu beshidi.
Ukubonisa ngale, inkungu, isicwebezelisi, nokuhlolwa kokuhlanzeka kwendawo.
Ukufana kwe-coating kanye nokuhlonza uhlangothi olunamekwe.
Ukuhlola uthuli, ukuklwebheka, ukushwabana, imbobo, nokulimala komphetho.
Ukuhlolwa kwe-trial lamination, flatness, nokuhlola amandla e-peel.
Ukuqinisekiswa kwebanga le-HiCo noma le-LoCo.
Ububanzi bomthende, indawo, isiqondiso, nokuvumelana okubonakalayo.
Ukunamathela komugqa kanye nokumelana nokuxebuka ngesikhathi sokucubungula.
Ukonakala kwendawo, ukungcoliswa, ukuphuka, noma imiphetho engajwayelekile.
Ukufaka ikhodi nokufunda kusetshenziswa okokusebenza okuhambisanayo.
Ukuswayipha kwekhadi eliqedile, ithrekhi, nokuhlola ukuhambisana komfundi.
Lapho kusebenza khona i-ISO, ikhasimende, ibhange, ezokuthutha, impatho, uhulumeni, noma imfuneko yokulawula ukufinyelela, ukuvumelana kufanele kuhlolwe ekhadini elifakwe ikhodi eliqediwe kusetshenziswa indlela yokuhlola efanele. Ukunikezwa kwembondela engahluziwe iyodwa akuqinisekisi ukuthobela ikhadi eliqediwe.
Imbondela yamagnetic kufanele ihlolwe ngomongo wangempela ophrintiwe womthengi, impahla yekhadi lomzimba, umshini wokugcwalisa i-lamination, i-encoder, isifundi, isakhiwo sokusika, nomklamo wamakhadi aphelile ngaphambi kokukhiqizwa ngobuningi.
Gunyaza okokusebenza, ukujiya, ibanga lomugqa, ububanzi, umbala, nomdwebo wendawo.
Hlola ukuhambisana kokugqoka noyinki wangempela ophrintiwe.
Qinisekisa izinga lokushisa le-lamination, ingcindezi, isikhathi, nomjikelezo wokupholisa.
Hlola ukuqondanisa kwemigqa ngemva kokucwenga nokushaya.
Faka ikhodi wonke amathrekhi adingekayo usebenzisa isifaki khodi sokukhiqiza.
Funda amakhadi anezindawo ezihlosiwe zokufunda.
Linganisa ukunamathela, ukuhuzuka, ukugoba, ukucaba, ukuguga, nokusebenza kokuphatha.
Sayina isampula egunyaziwe noma ukucaciswa kobuchwepheshe ngaphambi kokukhiqizwa kwenqwaba.
Thumela okokusebenza kwakho kwembondela, ukujiya, isakhiwo seshidi, ukuphoqa kwemigqa, ububanzi, indawo, umbala, uhlelo lokusebenza lwekhadi, imodeli yesishumeki, isistimu yokufunda, inani elilinganiselwe, nendawo yokulethwa.
Thola Isincomo SobuchwephesheImbondela yemigqa kazibuthe kufanele ivikelwe kumswakama, uthuli, ukuhuzuka kwendawo, ukugoba, ukulimala konqenqema, kanye nokuchayeka kazibuthe okungalawuleki phakathi nokugcinwa nokuthutha. Ukupakisha okuthekelisa kungenziwa ngendlela oyifisayo ngokuya ngosayizi weshidi, inani le-oda, indawo oya kuyo, kanye nezidingo zokuphatha.
Hlanza ifilimu yangaphakathi yokuvikela noma ukugoqa kwe-PE.
Iphepha le-kraft elimelana nomswakama noma amaphakheji okuvikela avaliwe.
Ikhathoni, ibhokisi eliqinisiwe, ikesi lepulangwe, noma ukupakisha okuthekelisa okunephalethi.
Ukuvikelwa kwekhona nokonqenqema ukuze kuncishiswe ukuwohloka kweshidi.
Inombolo yelothi, ibanga lempahla, amalebula anohlangothi olunamekwe kanye namalebula okuqondisa kwemigqa.
Amalebula enziwe ngokwezifiso, izinhlu zokupakisha, nezimpawu zokuthumela.
Ukupakisha Okuthekelisa Okuvikelekile
I-Palletized International Shipping
I-Wallis inikezela ngezinto zamakhadi kubakhiqizi bamakhadi, izinkampani zokuphrinta, izimboni zamakhadi ahlakaniphile, iziguquli, abasabalalisi, namakhasimende e-OEM. Sisekela amaphrojekthi embondela womugqa ozibuthe enziwe ngokwezifiso kusukela ekubuyekezweni kwezicaciso namasampuli ngokukhiqizwa kwenqwaba nokulethwa kwamanye amazwe.
Isipiliyoni seminyaka engaphezu kwe-15 kumashidi epulasitiki nezinto zamakhadi.
Izikhungo zokukhiqiza eziningi kanye namandla okukhiqiza akhuphukayo.
I-PVC, i-PET, i-PETG, i-PC, imbondela emboziwe, ishidi eliwumongo, nokunikezwa kwekhadi-inlay.
Ukwenza ngokwezifiso umugqa we-HiCo kanye ne-LoCo uzibuthe.
Ukujiya okwenziwe ngendlela oyifisayo, ubukhulu, indawo yomugqa, ingaphezulu, nokunamathiswa.
Isampula kanye nokwesekwa kwe-oda lomshayeli ukuze kuqinisekiswe i-lamination kanye nombhalo wekhodi.
Ukupakishwa ngendlela oyifisayo, amalebula, izimpawu zokuthumela, kanye nemibhalo yokuthekelisa.
Wallis Exhibition
Global B2B Amakhasimende
I-Wallis Factory
Thumela u-Wallis impahla yakho, ukujiya, usayizi weshidi, ukuphoqelelwa kwemigqa, ububanzi bomugqa, indawo yomugqa, ukusetshenziswa kwekhadi, isishumeki sekhodi, umfundi, ivolumu yonyaka, nezidingo zesampula.
Cela Intengo namasampuliIsetshenziswa njengesendlalelo sangaphandle esivikelayo kanye nesendlalelo sedatha kazibuthe emakhadini epulasitiki alaminated. Imbondela ivikela ulwazi lwekhadi eliphrintiwe kuyilapho umugqa ohlanganisiwe usekela umbhalo wekhodi kazibuthe ohambisanayo nokufunda.
Imigqa ye-LoCo idinga inkambu kazibuthe ephansi yombhalo wekhodi futhi ivamise ukusetshenziselwa umjikelezo omfushane noma amakhadi aphinde abhalwe kabusha. Imigqa ye-HiCo idinga inkambu yombhalo wekhodi eqinile futhi inikeze ukumelana okukhulu nokusulwa kukazibuthe ngengozi.
Yebo. U-Wallis angaxoxa ngezinketho ezingu-300 ze-Oe LoCo nezingu-2750 Oe noma ezingu-4000 ze-Oe HiCo. Ukutholakala kokugcina nokufaneleka kuncike kokubalulekile, umphakeli wemigqa, umbala, ububanzi, indawo, ubuningi, kanye nezidingo zephrojekthi.
Yebo. Ububanzi bomugqa, indawo, isiqondiso, umbala, ukuphoqelela, kanye nebanga ukusuka onqenqemeni lwekhadi eliqediwe kungenziwa ngendlela oyifisayo ngokomdwebo wobuchwepheshe ovunyelwe.
Yebo. I-Wallis ingahlinzeka nge-A4, A3, nobukhulu beshidi obungokwezifiso. Isakhiwo kufanele sifaniswe nefomethi yokuphrinta yomthengi, ukubekwa kwekhadi, ipuleti lokunamathisela, kanye nenqubo yokubhoboza.
Izinketho zezinto ezitholakalayo zingabandakanya i-PVC, i-PET, i-PETG, ne-polycarbonate. Izinto ezilungile zincike kumongo wekhadi, indlela yokuphrinta, izinga lokushisa le-lamination, impilo yekhadi edingekayo, kanye nenqubo yokwenza kube ngokwakho.
Yebo, lapho ukumbozwa kwembondela, uyinki ophrintiwe, i-card-core material, kanye nenqubo yokuhlobisa kuhambisana. Uhlangothi olunamekiwe kufanele lubhekane nongqimba oluhlosiwe oluphrintiwe noma oluwumgogodla, futhi amasampula kufanele ahlolwe ngaphambi kokukhiqiza ngobuningi.
Cha. Umugqa kazibuthe ngokuyinhloko uwumthombo wedatha ofundeka ngomshini. Ukuvikeleka kuncike kudatha efakwe ikhodi, isistimu ye-backend, izilawuli zokufunda, inqubo yokuphatha ukuqinisekisa, kanye nanoma iyiphi i-chip eyengeziwe, izici zokuphepha eziphrintiwe, noma ezenziwe nge-laser.
Yebo. Imbondela yamagnetic ingaba yingxenye yekhadi elihlanganisiwe eliqukethe i-chip yokuxhumana, i-RFID noma i-NFC inlay, ibhakhodi, ikhodi ye-QR, iphaneli yesiginesha, noma omunye umsebenzi wekhadi. Isakhiwo sesendlalelo esiphelele kufanele sihlolelwe ukubopha, ukucaba, ukujiya kwekhadi, nokusebenza kombhalo wekhodi.
Lesi sici siklanyelwe ukusetshenziswa ngesikhathi sokukhiqiza amakhadi, ngaphambi kokukhishwa kwe-lamination kanye nokushaya. Ukuyengeza ekhadini eselivele liqediwe ngokuvamile akulingani nokukhiqiza ikhadi elizibuthe elakhiwe kahle futhi kungase kuthinte ukushuba kwekhadi, ubukhulu, ukucaba, nokuhambisana komfundi.
Yebo. Ukuhlolwa kwesampula kunconywa kakhulu ukuze kuqinisekiswe ukuhambisana kwe-coating, ukuma komugqa, ukubopha i-lamination, ukunemba kokushaya, ukubhala ngekhodi, ukufundwa kwethrekhi, ukubukeka kwendawo, nokusebenza kwekhadi eliphelile.
Sicela unikeze okubalulekile kwembondela, ugqinsi, usayizi weshidi, ukucaciswa kwe-HiCo noma i-LoCo, ukuphoqelelwa, ububanzi bomugqa, umbala womugqa, umdwebo wokuma komugqa, imfuneko yokumboza, ukusetshenziswa kwekhadi, indlela yokuphrinta, inani elilinganiselwe, ukupakisha, nendawo okuyiwa kuyo.
Gcina amashidi evaliwe emaphaketheni awo asekuqaleni endaweni ehlanzekile, eyomile, nelawulwa izinga lokushisa. Zivikele emazibukweni, othulini, ekugobeni, ekuklwebheni, ezindaweni ezinamandla kazibuthe, elangeni eliqondile, nasekushiseni okungalawuleki.
Qala Iphrojekthi Yakho nathi