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Wallis wayt Teslin sintetik pepa de sɔpɔt laminated ID, mɛmbaship ɛn RFID kad prodakshɔn insay 0.178mm ɛn 0.254mm gej, wit print trayal, kɔstɔm kɔt, sampul ɛn bɔlk B2B saplai.
kad matirial
WALLIS
| Di tin we dɛn yuz: | |
|---|---|
| Tik: | |
| Di kayn we aw dɛn print: Di say | |
| Kwantiti: | |
Wallis 0.178mm ɛn 0.254mm wayt Teslin sintetik pepa dɛn de saplae fɔ laminated ID kad, mɛmbaship kad, akses kredibiliti, ɔtel ki kad, RFID kad, ivin badge ɛn ɔda print kad program dɛn. Di maykroporous sabstret de aksept ink, toner, adhesive ɛn laminate insay in strɔkchɔ, we de ɛp di wan dɛn we de mek kad fɔ ajɔst di print we go de te ɛn strɔng layt bonding.
Di tu gej dεm kכrεspכnd to kכmכn 7 mil εn 10 mil sabstεrayt fכmat dεm. Tiknes fɔ pik as pat pan di kɔmplit kad kɔnstrɔkshɔn pas bay kad tayp nɔmɔ. Printin na wan ɔ ɔl tu say, ɔvlay tik, RFID inlay, magnɛtik strɛp, adhesive, lamination prɛshɔn ɛn finish-kad tik ɔl fɔ de insay di spesifikeshɔn.
Wallis de sɔpɔt B2B bayer dɛn wit sampul shit, kɔstɔm kɔt, printin trayal, lamination ɛvalueshɔn, kad-strɔkchɔ rivyu ɛn ɛkspɔt pak. Di wan dɛn we de bay fɔ kɔnfɔm di ɛksaktɔl Teslin gred, di wan we mek am, di tiknɛs tolɛreshɔn, di sɔfa kɔndishɔn ɛn di kɔmplians dɔkyumɛnt dɛn bifo dɛn gri fɔ mek dɛn prodyuz bɔku bɔku wan.
| Tayp fɔ Prodakt | Wait maykroporous sintetik-pepa sabstret fɔ print ɛn laminated kad dɛn |
| Tiknɛs Opshɔn dɛn | 0,178mm / 178μm / 7 mil ɛn 0,254mm / 254μm / 10 mil |
| Di We Aw Dɛn De Print | Ɔfset, silk-skrin ɛn dijital printin; ɔda prɔses dɛn nid fɔ tɛst gred ɛn ikwipmɛnt |
| Kad Aplikeshɔn dɛn | ID, mɛmbaship, lɔyalti, ɔtel ki, akses, ivin, wɛlbɔdi biznɛs ɛn sɔm RFID kad dɛn we dɛn dɔn pik |
| Di Opshɔn dɛn fɔ Saplae | Standart ɔ kɔstɔm-kat shit, protɛkt insay pak, katɔn ɛn ɛkspɔt palet |
| B2B Savis dɛn | Sampul, print kwalifayeshɔn, lamineshɔn trayal, RFID strɔkchɔ rivyu, QC planin ɛn bɔlk saplai |
Rikwest Teslin Kad Sabstret Sampul dɛn
Teslin sabstεrayt na maykroporous, polyolefin-bεys sεntetik mεtirial we gεt hכy prכpכshכn fכ inכrganik fil εn intanal εya vכlyum. difrεnt lεk dense plastic shit, in porous strכkchכ de abzכp ink, tכna, adhesive εn mכlt laminate, we de mek intalכk mεkanikal bכnd dεm insay di sabstεrayt.
Ink ɛn toner kin go insay di say we di wata de pas fɔ de nɔmɔ as layt we dɛn kin pul. We dɛn de lamin, kɔmpitabl laminat ɔ adhesive de flɔ insay di pores, we de ɛp fɔ protɛkt print tɛks, foto, QR kɔd ɛn barɔd frɔm abrashɔn ɔ tray fɔ separet layt.
di kכmprεsibl strכkchכ kin kushכn magnεtik strεp dεm, antena dεm, chips dεm εn כda εmbaded εlimεnt dεm. Dis nכ de εliminet di nid fכ inlay εnjinia: kכmכpכnt tik, kaviti disayn, prεshכn distribushכn εn ripit-fleks tεst de stil implεnt.
Kad sikyɔriti dipen pan di ful dizayn, inklud kɔntrol at wok, vayriɔbul data, ɔlografik ficha dɛn, UV ink, ɔvlay, chips, magnɛtik strɛp ɛn isyu prosidur. Dɛn nɔ fɔ tɔk bɔt standad wayt sabstret se i gɛt watamak ɔ kɔvat ficha pas di ɛksaktɔ gred gɛt dɛn ficha dɛn de we dɛn bil insay.
Wait Maykroporous Kad Sabstrat
Shit we yu kin print ɛn we yu kin yuz lamination
Yu kin print ɔl tu di tik dɛn na wan ɔ ɔl tu di say dɛn. Di kɔrɛkt chuk dipen pan di kɔntribyushɔn we dɛn nid fɔ di sabstret fɔ di totɛl kad tik, stiffnɛs, kusɛn, lamineshɔn stak ɛn ɔvlay film dɛn we de—nɔto jɔs if di artwok na singl-sayd ɔ dabl-sayd.
| Seleksi Faktor | 0,178mm / 7 mil | 0,254mm / 10 mil |
|---|---|---|
| Sabstret Kɔntribyushɔn | Lɔwa kɔntribyushɔn to totɛl kad tik; de lεf mכr rum fכ כvlay כ adishכnal layεr dεm | Higher kontribiushɔn to totɛl tik ɛn kusɛn |
| Fɔ ebul fɔ chenj chenj | Mɔ fleksibul bifo lamination | Mɔ substantial fil bifo lamination |
| Kɔmɔn Projɛkt Yuz | Tin-kɔr laminated kad, badge, tag ɛn strɔkchɔ dɛn we de yuz tik ɔvlay | Hevi kor, enhanced cushioning ɛn strɔkchɔ dɛn we de yuz tin ɔvlay |
| RFID / Chip Struktrɔ | Yuzful usay inlay ɛn ɔvlayz dɔn ɔlrɛdi de it bɔku tik | May giv mכr kushכn, bכt tכtal stak εn prεshכn mכst rikalkul |
| Di We aw Dɛn De Aprɔval | Print, laminate, kondishɔn ɛn mɛzhɔ di sampul dɛn we dɔn dɔn | Print, laminate, kondishɔn ɛn mɛzhɔ di sampul dɛn we dɔn dɔn |
7 Mil ɛn 10 Mil Tiknɛs Opshɔn dɛn
Laminated ID kad na wan sistem we gɛt sabstret, print, ɔvlay, adeziv ɛn opshɔnal ilɛktronik kɔmpɔnɛnt dɛn. Dɛn fɔ kɔl di tik we dɛn dɔn dɔn frɔm di wan ol stak ɛn chɛk afta di kad dɔn kol ɛn kɔndishɔn.
| Kad Kɔmpɔnɛnt | Tiknɛs ɛn Prɔses Kɔnsidɛreshɔn |
|---|---|
| Teslin Print Kɔr | Yuz 0.178mm ɔ 0.254mm akɔdin to di stak we dɛn dɔn gri fɔ ɛn di kusɛn we dɛn nid |
| Frɔnt ɛn Bak Ɔvlay | Ovlay gej, adhesive ɛn surface finish de ditarmin protɛkshɔn ɛn fayn kad fil |
| Ink / Toner we dɛn print | Hevi sכlid kכvεreshכn kin afekt mכsichכ, blכk, laminεshכn εn dimεnshכnal bεlε |
| RFID Inlay ɔ Chip | Inklud antena, chip bamp, adeziv ɛn ɛni kaviti ɔ spɛshal layers |
| Magnɛtik Strayp / Ɔlogram | Kɔnfɛm strɛp rɛs, ɔvlay kɔmpatibiliti ɛn post-laminɛshɔn ɛnkɔdin ɔ inspekshɔn |
| Kad we dɛn dɔn dɔn | Mekɔp di tik, flatnɛs, dimɛnshɔn ɛn funkshɔnaliti afta yu dɔn kol ɛn kɔndishɔn |
ID, Akses ɛn Mɛmbaship Kad dɛn
Finish Laminated Kad Program dɛn we dɛn dɔn mek
Difrɛn Teslin gred dɛn de ɔptimayz fɔ difrɛn printin sistem dɛn. Di wan dɛn we de bay nɔ fɔ tink se wan wayt sheet go prodyuz di sem rizɔlt pan ɔfset, day inkjɛt, pigmɛnt inkjɛt, lɛsa, Indigo, skrin ɔ tɛmal-transfa ikwipmɛnt. Kwalifayeshɔn fɔ di ɛksaktɔl gred, printa ɛn ink sistɛm nid fɔ de.
| Printin Proses | B2B Valideshɔn Rikwaymɛnt |
|---|---|
| Ɔfset Printin we yu de print | Ink setin, density, trap, drying, pauda levul, blok en lamination resistance |
| Silk-Skrin we dɛn de print | Ink tiknes, solvent kompitibiliti, kur, fleksibiliti en layt bonding |
| Dijital Laser Printin we dɛn kin yuz | Fuser temperechur, toner adheshon, shit transpɔt, statik kɔntrol ɛn ikwipmɛnt kwalifayeshɔn |
| Inkjet we dɛn de print | Yuz wan gred we kɔmpitabl wit inkjɛt; tɛst day ɔ pigmɛnt ink, dray tɛm, wata rɛsistɛns ɛn kɔlɔ prɔfayl |
| HP Indigo / Dijital Prɛs | Kɔnfɔm di kwalifay gred, prayma rikwaymɛnt, blankit tɛmpracha ɛn post-print lamination |
| Printa we de go na di kad dairekt wan | Nɔmal wan i kin print wan blank kad we dɔn dɔn pas wan lɔs Teslin sheet; test onli afta kad lamination en panch |
Dabl-sayd printin na di printin prɔses, gred, mɔstɔ balans, artwok kɔvarej ɛn rɛjista—nɔto jɔs bay we dɛn yuz 0.254mm matirial. Wan balans frɔnt ɛn bak dizayn kin ɛp bak fɔ ridyus kɔl afta dɛn dɔn print ɛn lamin.
Fiks grafik dɛn kin print pan sabstret shit bifo lamination. Dɛn kin ad difrɛn nem dɛn, foto dɛn, nɔmba dɛn ɔ barɔd dɛn we dɛn de print di shit ɔ leta na di kad we dɛn dɔn dɔn, i go dipen pan di wok we dɛn de gi.
Ɔfset, Skrin ɛn Dijital Printin Trayal
Teslin sabstret kin bi platen-laminated ɔ rol-laminated wit kɔmpitabl film dɛn. Strɔng bonding de apin we laminate ɔ adhesive de flɔ insay di maykroporous strɔkchɔ. Di fainal sɛtin dɛn fɔ establish wit di aktual sabstret gred, ɔvlay, ink, prɛs ɛn kad stak.
| Lamination Control | Rikɔmɛnd Praktis |
|---|---|
| Mɔstɔ Kɔndishɔn | Kondishɔn sabstret ɛn print sheet bifo lamination; matirial we tu dray ɔ tu wet kin ridyus kwaliti |
| Tɛmprɛchɔ | Set akɔdin to di laminate spɔlayt ɛn verified sabstret tɛmpracha; nɔ jɔs abop pan mashin displei tɛmpracha |
| Prɛshɔn ɛn Tɛm | gi inof fכ fכlכ insay di pores dεm we yu nכ kכrכs di chips dεm, disכrt di artwok dεm כ mek yu sכk bכku pasmak |
| Fɔ mek pɔsin kol | Kul ɔnda kɔntrol prɛshɔn fɔ impɔtant flatnɛs ɛn dimɛnshɔnal stebiliti |
| Pɛl Strɔng | Test di finished laminate afta kondishɔn ɛn envayrɔmɛnt ɛksplɔshɔn |
| Edj Silin we dɛn kin yuz | Kכmpatibl Teslin laminat strכkchכ dεm kin כltεm day-kכt afta laminεshכn we nכ gεt sεparat sial bכda; kɔnfɔm wit di fim we yu dɔn pik |
Di statin paramita dɛn we dɛn dɔn pablish kin ɛp wit trayal, bɔt di aktual ɔt transfɔm kin difrɛn bay plet, prɛs, stak ayt, ɔvlay kemistri ɛn print kɔvarej. Rikɔd di aprɔv sabstret tɛmpracha, prɛshɔn, dwɛl, kɔl ɛn rilis-film kɔnfigyushɔn fɔ ripit prodakshɔn.
Mɔstɔ we trɔp, ɔt we nɔ go du, laminat we nɔ kɔmpitabl, ebi ink ɔ we nɔ de kol fayn kin mek bɔbul, silva, haz ɔ kɔl. Inspek ɔl tu di sheet ɛn di panch kad dɛn afta dɛn dɔn kondishɔn.
Teslin sabstret kin sɔpɔt wan layt kredibiliti dizayn, bɔt di sikyɔriti ficha dɛn na di kɔmplit dɔkyumɛnt program de mek dɛn. Standart kɔmɛshɔnal matirial nɔ kin gɛt gɔvmɛnt-grɛd kɔvat ɔ fɔrɛns ɛlimɛnt dɛn ɔtomɛtik wan.
| Sekyuriti Ficha | Integreshɔn Rikwaymɛnt |
|---|---|
| Maykrotɛks ɛn Fayn-Layn Printin | Ay-rɛzolushɔn artwok, kɔntrol plet ɔ dijital imej ɛn post-laminɛshɔn lijibiliti |
| Ink we gɛt UV-Fluorescent | Ink spɔlayt kwalifayeshɔn, bakgrɔn fluorescence kɔntrol ɛn inspekshɔn afta lamination |
| Ɔlografik Ɔvlay | Rejistret ɔvlay, laminat kɔmpatibiliti, optik klia ɛn tamper bihayvya |
| QR Kɔd ɛn Bakɔd | Print kɔntrast, dimɛnshɔnal akkuracy, skan ridabiliti ɛn abrashɔn protɛkshɔn |
| Kastɔm Sikyuriti-Grɛd Sabstret | Program-spɛsifi k ɛmbaded mak dɛn nid fɔ gɛt ɔtorizayt sikyɔriti sapɔt chen ɛn dɛn nɔ ikwal to standad wayt shit |
Layered Sekyuriti ɛn Laminat Protɛkshɔn
Teslin sabstret kin kusɛn ɛn protɛkt wan RFID inlay, bɔt fɔ pik 0.254mm instead ɔf 0.178mm nɔ de mek wan kad ɔtomɛtik wan fayn fɔ advans ilɛktroniks. Di inlay, chip, ɛntena, adeziv, ɔvlay ɛn lamineshɔn saykl fɔ disayn as wan strɔkchɔ.
| Smart Kad Fakta | we nid fɔ validet |
|---|---|
| Chip ɛn Frikyuɛnsi | Kɔnfɛm chip mɔdel, frikshɔn, protɔkɔl, mɛmori ɛn rida sistem |
| Antena Jɔmɛtri | Protekt antena trays durin lamination, panch ɛn kad-ɛj finish |
| Inlay Tiknɛs we pɔsin kin gɛt | Kalkul chip bamp, antena, karia ɛn adeziv insay di totɛl kad stak |
| Prɛshɔn Distribushɔn | Yuz fayn kusɛn ɛn kaviti fɔ avɔyd chip ɔ ɛntena damej |
| Fɔ Tɛst we Dɛn De Du am | Test rid/rayt pefomans bifo lamination, afta lamination, afta panch en afta fleks |
| Aplikeshɔn | Rikɔmɛnd Projɛkt Fɔs |
|---|---|
| Kɔpɔt ID Kad dɛn | Fɔto kwaliti, vayriɔbul data, barɔd, ɔvlay durabiliti ɛn ɛvride badge yus |
| Studɛnt ɛn Fakulti Kad dɛn | Ay-volyum printin, pɔsnalayzeshɔn, magnɛtik ɔ RFID fɛnshɔn ɛn lɔng tɛm fleks |
| Membaship ɛn Loyalti Kad dɛn | Brand kɔlɔ, barɔd ɔ QR ridabiliti, walet durabiliti ɛn kɔst-ɛfishin shit prodakshɔn |
| Hotel Ki Kad dɛn | Magnɛtik-strayp ɔ RFID kɔmpatibiliti, lɔk tɛst ɛn shɔt-to-midul savis layf |
| Ɛlthkɛr ɛn Patient ID dɛn | Lijibiliti, klin ɛksplɔshɔn, barɔd skan ɛn kɔntrol ishu |
| Ivint ɛn Vizita Badge dɛn | Short-run dijital printin, slot, lanyard, QR kod ɛn rapid pɔsnalayzeshɔn |
| Prɔses | Kwaliti Kɔntrol Point |
|---|---|
| Gilɔtin we dɛn de kɔt | Skwea, print rɛjista, bled kɔndishɔn ɛn stak kɔmpreshɔn |
| Kad Panch / Day Kɔt | Kad dimɛnshɔn, kɔna rayus, klin edj ɛn nɔ laminate separeshɔn |
| Slot ɛn Ɔl Panch | Pozishɔn, edj distans, lanyard lod ɛn krak rɛsistɛns |
| Embossing ɔ Fɔyl Stamp | Finished-kad strɔkchɔ, ɔt, prɛshɔn, fɔyl adheshon ɛn legibiliti |
| Thermal / Ritransfεr Pɔsnalayzeshɔn | Printa transpɔt, ribin transfa, sɔfayz ɛnaji, ɔt distɔshɔn ɛn imej durabiliti |
| Magnɛtik Ɛnkɔdin / RFID Ɛnkɔdin | Enkodin yield, rida kompitibiliti ɛn post-strɛs fɛnshɔn |
| Matirial | Strɔng | Ki Kɔnsidɛreshɔn |
|---|---|---|
| Teslin Sabstret we de na di wɔl | High print absorption, strɔng laminate bonding, fleksibiliti ɛn kusɛn fɔ ilɛktroniks | Dɛn kin yuz am as kɔr we dɛn print insay laminat strɔkchɔ pas fɔ yuz am as kad we dɔn dɔn we de na do |
| PVC we dɛn kin yuz | Establish kad prɔses, brayt saplai ɛn famili pɔsnalayzeshɔn mɛtɔd dɛn | Difrɛn envayrɔmɛnt prɔfayl, lɔwa ɔt rɛsistɛns ɛn limited risaykul na bɔku makit dɛn |
| PETG we dɛn kɔl PETG | Tafnɛs, klia ɛn strɔng multilayer kad aplikeshɔn dɛn | Ink adhesion ɛn lamination rɛsipɛkt difrɛn frɔm porous Teslin sabstret |
| Polikabɔnɛt we dɛn kɔl | High durability, heat resistance ɛn laser-personalization kapabiliti insay dediket gred dɛn | Di matirial ɛn prodakshɔn kɔst we ay pasmak; we dɛn kin yuz fɔ aks fɔ lɔng layf kredibiliti |
| Inspekshɔn Aytem | Rikɔmɛnd Kɔntrol |
|---|---|
| Matirial Aydentiti | Manufacturer, gred, tiknɛs kɔd, batch ɛn sɛtifiket rɛfrɛns |
| Tik ɛn Sayz | Avrej gej, tolɛreshɔn, shit lɔng, wit, skwea ɛn kɔt akkuracy |
| Aw a luk | Wait, shed, blak spat, kɔntaminɛshɔn, wrinkles, dent ɛn ed damej |
| Flatnɛs ɛn Mɔstɔ | Kul, bo, stɔrɔj kɔndishɔn ɛn mɔstɔ balans bifo yu print ɛn lamin |
| Kwalifayeshɔn fɔ Print | Densiti, adheshon, drying, kala, imej ditel, barkod ridabiliti en blok |
| Lamineshɔn Trayal | Pil trɛnk, bɔbul, haz, edj separeshɔn, kɔl ɛn finish tik |
| Kad Tɛst we dɛn dɔn dɔn | Dimɛnshɔn, fleks, abrashɔn, pɔsnalayzeshɔn, slot trɛnk, ɛnkɔdin ɛn rida fɛnshɔn |
| Pak ɛn Traceability | Protɛkt stak, kɔnt, katon lɛbl, palet kɔnfigyushɔn, lɔt nɔmba ɛn inspekshɔn ripɔt |
Teslin sabstret na kɔmprɛsibl ɛn i fɔ protɛkt am frɔm ɔt, UV layt, pɔyushɔn, mɔstɔ imbalans ɛn pasmak stak prɛshɔn. Kɔrɛkt stɔrɔj de ɛp fɔ mek di kɔlɔ, flat, print pefɔmɛns ɛn lamination trɛnk.
Stɔr di tin dɛn we yu kɔba na klin say we nɔ gɛt faya we de bɔn ɛn tin dɛn we de pwɛl di os.
Protekt sheet frɔm dairekt UV layt ɛn tɛmpracha we pas di aprɔv stɔrɔj limit.
Kip di sheet dɛn we yu kɔt flat pan say we strɔng ɛn we gɛt sɔpɔt.
Nɔ put ebi lod ɔ palet dɛn we dɛn dɔn stak tu tɛm pan katon dɛn we dɛn kɔt.
Nɔ strɛp tayt pasmak we go ebul fɔ kɔmprɛs di ed dɛn ɔ mak di sheet stak.
Kip pat pan di pak dɛn we dɛn rap bak fɔ mek dɔst, di kɔlɔ nɔ chenj ɛn di mɔstɔ nɔ chenj.
Kɔndishɔn sheet dɛn na di prodakshɔn rum bifo dɛn print ɔ lamin we di westɛm kɔndishɔn difrɛn.
Wallis de sɔpɔt kad manifakta ɛn matirial distribyushɔn wit sabstret sɔs, kɔstɔm shit kɔt, protɛkt pak ɛn kɔdinɛt kad-matirial saplai. Ɛni ɔda fɔ gɛt link to wan aprɔv sampul ɛn rayt spɛsifikɛshɔn we kɔba gred, tiknɛs, printin prɔses, lamination strɔkchɔ ɛn finish-kad rikwaymɛnt.
Kad Matirial Prosesin ɛn Ɛkspɔt Saplai
Tu standad kad gej: 0.178mm ɛn 0.254mm opshɔn fɔ difrɛn laminated kad strɔkchɔ dɛn.
Printing-process support: Dɛn kin kɔdinɛt ɔfset, silk-skrin ɛn dijital printin trayal bifo dɛn gi bɔku aprɔval.
Lamination-focused divεlכpmεnt: Sabstεt, כvlay, adhesive, tεmprachכ εn kad tiknes kin rivyu as wan sistεm.
RFID kad ɛkspiriɛns: Inlay tiknɛs, kusɛn, chip protɛkshɔn ɛn rida tɛst dɛn kin inklud insay sampul validɛshɔn.
Kastom kɔt ɛn pak: Shit fɔmat, stak protɛkshɔn, katon ɛn palet dɛn kin tayla to prodakshɔn ɛn ɛkspɔt nid.
Factory-direct B2B service: I fayn fɔ kad faktri, printa, kɔnvɔta, RFID kɔmni, impɔta ɛn distribyushɔn.
Kad aplikeshɔn, ɛkspɛkt savis layf ɛn dɛstineshɔn makɛt.
Tik we yu nid: 0.178mm / 7 mil ɔ 0.254mm / 10 mil.
Shit lɔng, wit, tolɛreshɔn, skwea ɛn kwantiti.
Printin prɔses, printa mɔdel, ink ɔ toner ɛn wan ɔ tu-sayd at wok.
Ovlay matirial, tik, finish, adhesive ɛn lamination ikwipmɛnt.
Target finish kad dimɛnshɔn, tik ɛn kɔna rayus.
RFID chip, antena, inlay, magnɛtik strɛp, ɔlogram ɔ ɔda kɔmpɔnɛnt.
Sekyuriti printin, barɔd, QR kɔd ɛn pɔsnalayzeshɔn rikwaymɛnt dɛn.
Sɛtifiket dɛn we dɛn nid, matirial traceability ɛn inspekshɔn ripɔt.
Trayal kwantiti, ɛni ia fɔkɔs, dɛstineshɔn pɔt ɛn dilivri schedule.
Di 0.178mm sabstret na 7 mil, we di 0.254mm sabstret na 10 mil. Di tik gred de kɔntribyut mɔ to tɔtal kad tik ɛn kusɛn, bɔt dɛn ɔl tu nid fɔ tɛst insay di kɔmplit laminat strɔkchɔ.
Yɛs. Wan ɔ tu sayd printin dipen pan di sabstret gred, di printin prɔses, ink sistɛm, artwok balans ɛn rɛjista—nɔto jɔs pan di tik we di sheet tik.
No tin nɔ de we ɔlman kin disayd fɔ du. Kalkul di sabstret, frɔnt ɛn bak ɔvlay, adeziv, printin ɛn opshɔnal inlay, dɔn laminate ɛn mɛzhɔ di kɔndishɔn dɔn kad.
Di polyolefin-based substrate de resist wata, bɔt di print durabiliti dipen pan di ekzak ink, gred ɛn lamination. Dɛn fɔ tɛst wan kad we dɔn dɔn fɔ si if i gɛt wata, if i gɛt wata ɛn if i de klin.
Yuz wan Teslin gred we kɔmpitabl wit inkjet ɛn tɛst di patikyula day ɔ pigmɛnt ink. Standart gred ɛn kɔt inkjet gred kin biev difrɛn we pan dray tɛm, kɔlɔ ɛn wata rɛsistɛns.
Dɛn kin print di rayt gred dɛn wit lɛsa, bɔt dɛn fɔ chɛk di fiuza tɛmpracha, shit transpɔt, di tona adheshon ɛn di kwalifayeshɔn fɔ di printa. Nɔ yuz tin dɛn we dɛn nɔ gri fɔ yuz fɔ di ikwipmɛnt.
Bɔku pan di printa dɛn we dɛn kin print dairekt to kad, dɛn mek am fɔ blank kad dɛn we dɔn dɔn, nɔto fɔ sabstret sheet dɛn we nɔ gɛt lɔs. Print ɛn laminate di sheet fɔs, panch di kad dɛn, dɔn tɛst pɔsnalayzeshɔn pan di blank dɛn we dɔn dɔn.
Bɔku tɛmal laminat ɛn adhesive film kin wok, bɔt kɔmpatibiliti dipen pan aktiveshɔn tɛmpracha, flɔ, tik ɛn finish-kad rikwaymɛnt. Apruv di ekzak sabstεrayt-εn-film kכmbaynshכn tru pil tεst.
Bɔku tɛm dɛn kin kɔt di Teslin strɔkchɔ dɛn we dɛn dɔn lamin fayn fayn wan to di shep we dɔn dɔn we nɔ gɛt sɛpret sial bɔda bikɔs di laminate de bon insay di porous matris. Kɔnfɛm dis wit di laminat ɛn di prɔses we yu dɔn pik.
Di tin dɛn we kin mek i apin na we di wata we pasmak, we nɔ gɛt bɛtɛ ɔt, di briz we trɔp, ebi ink, laminat we nɔ kɔmpitabl ɔ we nɔ gɛt bɛtɛ prɛshɔn. Kondishɔn di sheet dɛn ɛn verify di aktual sabstret tɛmpracha.
Yɛs. I kusɛn kin ɛp fɔ protɛkt ilɛktroniks, bɔt chip, ɛntena, inlay tik, adhesive, prɛshɔn ɛn dɔn rid pefɔmɛns fɔ validet.
Nɔto ɔtomɛtik wan. wan tik sabstεrayt kin gi mכr kushכn, bכt i kin chenj bak di tכtal kad tik εn prεshכn distribyushכn. Di komplit inlay strɔkchɔ de disayd di pefɔmɛns.
Standart wayt sabstret de gi print ɛn lamination bɛnifit bɔt dɛn nɔ fɔ diskrayb am se i gɛt kɔvat sikyɔriti mak dɛn. Program-spɛsifi k sikyɔriti-grɛd matirial na wan sɛpret kɔntrol prodak.
Yɛs. Ɔlografik ɔvlay, UV ink, maykrotɛks ɛn ɔda ficha dɛn kin intagret tru sɛpret printin ɛn laminɛshɔn prɔses. Dɛn fɔ tɛst aw dɛn kin si ɛn aw dɛn kin te afta dɛn dɔn mek dɛn.
Envayrɔmɛnt pefɔmɛns dipen pan raw matirial, kad kɔnstrɔkshɔn, savis layf, manufakchurin, transpɔt ɛn di rod dɛn we de fɔ trowe. Avɔyd wan brayt supiriɔriti klem we nɔ gɛt difayn layf-saykl asɛsmɛnt.
Risaykul dipen pan lokal kɔlɛkshɔn ɛn di kɔmplit kad strɔkchɔ. Laminat, ink, magnɛtik strɛp, chips ɛn ɛntena kin nid spɛshal separeshɔn ɔ trowe.
Kip di sheet dɛn kɔba, flat, dray ɛn protɛkt frɔm UV layt, ɔt, fum, dɔst ɛn pasmak stak prɛshɔn. Kɔndishɔn dɛn bifo yu print ɔ lamin.
Kastom kɔt kin tɔk bɔt akɔdin to printin layout, lamination plet, kad impozishɔn, tolɛreshɔn, kwantiti ɛn pak rikwaymɛnt.
Yɛs. Print, laminate, kol, kondishɔn, panch ɛn pɔsnalayz sampul kad dɛn yuz di prodakshɔn ikwipmɛnt we dɛn want bifo yu apruv di matirial.
MOQ dipen pan gred, tiknes, sheet saiz, kɔstɔm kɔt, printin kwalifayeshɔn, pak ɛn ɛni ia fɔkɔs.
Gi tik, sheet saiz, printin prɔses, ɔvlay, laminɛshɔn ikwipmɛnt, finish kad tik, RFID ɔ strɛp rikwaymɛnt, kwantiti, dɛstineshɔn ɛn delivri schedule.
Kɔntakt Wallis Plastik fɔ 0.178mm ɛn 0.254mm wayt Teslin sintetik pepa fɔ laminated ID, mɛmbaship, ɔtel ki, ivin ɛn RFID kad projɛkt dɛn. Wi tim de sɔpɔt tiknɛs sɛlɛkshɔn, kɔstɔm kɔt, printin ɛn laminɛshɔn trayal, kad-strɔkchɔ rivyu, kwaliti spɛsifikɛshɔn ɛn faktri-dayrɛkt B2B saplai.
Teslin na wan rɛjista tredmak fɔ PPG Industries Ohio, Inc. Kɔnfɛm di rayt gred we dɛn gi, sɔs ɛn dɔkyumentri fɔ ɛni ɔda.
