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Wallis fitaa Teslin synthetic krataa boa laminated ID, asɔremma ne RFID card production wɔ 0.178mm ne 0.254mm gauges, ne tintim sɔhwɛ, amanne twa, nhwɛsode ne bulk B2B supply.
kaad ho nsɛm
WALLIS na ɔkyerɛwee
| Nneɛma a wɔde yɛe: | |
|---|---|
| Ne kɛse: | |
| Nea wɔde tintim nhoma: | |
| Dodow: | |
Wɔde Wallis 0.178mm ne 0.254mm fitaa Teslin synthetic krataa ma ma laminated ID cards, membership cards, access credentials, hotel key cards, RFID cards, event badges ne card nhyehyɛe afoforo a wɔatintim. Microporous substrate no gye ink, toner, adhesive ne laminate kɔ ne nhyehyɛe mu, boa card manufacturers ma wonya tintim a ɛyɛ den ne layer bonding a emu yɛ den.
Gauges mmienu no ne 7 mil ne 10 mil substrate formats a wɔtaa de di dwuma no hyia. Ɛsɛ sɛ wɔpaw ne kɛse sɛ kaad a wɔasisi no nyinaa fã sen sɛ wɔbɛfa kaad no su nkutoo so. Ɛsɛ sɛ wɔde tintim wɔ ɔfã biako anaa abien no nyinaa, overlay thickness, RFID inlay, magnetic stripe, adhesive, lamination pressure ne finished-card thickness nyinaa ka nkyerɛkyerɛmu no ho.
Wallis boa B2B adetɔfoɔ denam nhwɛsoɔ nkrataa, amanne kwan so twa, tintim sɔhwɛ, lamination nhwehwɛmu, card-nhyehyɛeɛ nhwehwɛmu ne export packing. Ɛsɛ sɛ adetɔfo si Teslin grade pɔtee, nea ɔyɛe, ne kɛse a wotumi gyina ano, ɔfasu tebea ne nkrataa a ɛkyerɛ sɛnea wodi so no so dua ansa na wɔapene so sɛ wɔbɛyɛ no pii.
| Aguade a Wɔde Yɛ Adwuma | White microporous synthetic-paper substrate ma nkrataa a wɔatintim ne laminated |
| Thickness Nneɛma a Wɔpaw | 0.178mm / 178μm / 7 mil ne 0.254mm / 254μm / 10 mil |
| Akwan a Wɔfa so tintim nhoma | Offset, silk-screen ne dijitaal tintim; akwan foforo a wɔfa so yɛ no hwehwɛ sɛ wɔsɔ abasobɔde ne nnwinnade hwɛ |
| Kaad a Wɔde Di Dwuma | ID, asɔremma, nokwaredi, ahɔhodan safe, kwan a wɔfa so kɔ hɔ, adeyɛ, akwahosan ho nhyehyɛe ne RFID nkrataa a wɔapaw |
| Nneɛma a Wɔde Ma a Wobɛpaw | Standard anaa custom-cut nkratafa, ahobammɔ mu packing, cartons ne export pallets |
| B2B Nnwuma a Wɔyɛ | Nhwɛsoɔ, tintim ahwehwɛdeɛ, lamination sɔhwɛ, RFID nhyehyɛeɛ nhwehwɛmu, QC nhyehyɛeɛ ne dodoɔ a wɔde ma |
Bisa Teslin Kaad Substrate Nhwɛsode
Teslin substrate yɛ microporous, polyolefin-based synthetic ade a ɛwɔ inorganic filler ne emu mframa dodow a ɛkɔ soro. Nea ɛnte sɛ plastic krataa a ɛyɛ den no, ne porous nhyehyɛe no twetwe inks, toners, adhesives ne molten laminate, na ɛma mfiri a ɛka bom yɛ nkitahodi wɔ substrate no mu.
Ink ne toner betumi akɔ soro sen sɛ ɛbɛtra hɔ sɛ ade a ɛwɔ soro a wotumi yi fi hɔ nkutoo. Wɔ lamination bere mu no, laminate anaa adhesive a ɛne no hyia sen kɔ pores no mu, boa ma wɔbɔ nsɛm a wɔatintim, mfonini, QR code ne barcodes ho ban fi abrasion anaasɛ mmɔden a wɔbɔ sɛ wɔbɛtetew layer mu no ho.
Compressible structure no betumi cushion magnetic stripes, antennas, chips ne nneɛma afoforo a wɔde ahyɛ mu. Eyi mma ɛho nhia sɛ wɔyɛ inlay engineering: component thickness, cavity design, pressure distribution ne repeated-flex testing da so ara ho hia.
Kaad ahobammɔ gyina sɛnea wɔayɛ no nyinaa so, a adwinni a wɔahyɛ so, data a ɛsakra, holographic nneɛma, UV inks, overlays, chips, magnetic stripes ne akwan a wɔfa so de ma ka ho. Ɛnsɛ sɛ wɔka standard white substrate ho asɛm sɛ ɛwɔ nsu agyiraehyɛde anaa sum ase nneɛma gye sɛ grade pɔtee no wɔ saa nneɛma no a wɔde ahyɛ mu.
White Microporous Kaad Substrate a Wɔde Di Dwuma
Krataa a Wotumi tintim na Ɛyɛ Lamination-Friendly
Wobetumi atintim ne kɛse abien no nyinaa wɔ ɔfã biako anaa abien no nyinaa. Paw a ɛteɛ no gyina substrate mmoa a wɔhwehwɛ wɔ kaad no nyinaa mu duru, ne stiffness, cushioning, lamination stack ne overlay films a ɛwɔ hɔ so —ɛnyɛ sɛ ebia adwinni no yɛ ɔfã biako anaa afã abien kɛkɛ.
| Nneɛma a wɔpaw | 0.178mm / 7 mil | 0.254mm / 10 mil |
|---|---|---|
| Substrate Ntoboa a Wɔde Ma | Mmoa a ɛba fam wɔ kaad no mu duru nyinaa mu; gyaw baabi pii ma nkataso anaasɛ nneɛma foforo a wɔde kata so | Mmoa a ɛkorɔn ma total thickness ne cushioning |
| Nsakrae a ɛyɛ mmerɛw | Ɛyɛ mmerɛw kɛse ansa na wɔayɛ lamination | More substantial te nka ansa na lamination |
| Dwumadie a Wɔtaa De Di Dwuma | Thin-core laminated cards, badges, tags ne structures a wɔde nneɛma a wɔde kata so a ɛyɛ den di dwuma | Cores a emu yɛ duru, cushioning a wɔama anya nkɔso ne structures a wɔde lightner overlays di dwuma |
| RFID / Chip Nhyehyɛe | Mfaso wɔ baabi a inlay ne overlays dedaw di kɛse kɛse | Ebia ɛbɛma wɔanya cushioning pii, nanso ɛsɛ sɛ wɔsan bu total stack ne pressure ho akontaa |
| Ɔkwan a Wɔfa so Pene So | Print, laminate, condition na susuw nhwɛsode a wɔawie | Print, laminate, condition na susuw nhwɛsode a wɔawie |
7 Mil ne 10 Mil Thickness Options
ID kaad a wɔayɛ no laminated yɛ nhyehyɛe a wɔde substrate, print, overlays, adhesive ne ɛlɛtrɔnik nneɛma a wobetumi apaw. Ɛsɛ sɛ wobu ne kɛse a wɔawie no fi stack no nyinaa mu na wɔhwɛ sɛ ɛyɛ nokware bere a kaad no ayɛ nwini na wɔayɛ no yiye awie no.
| Card Component | Thickness ne Adeyɛ ho Nsusuwii |
|---|---|
| Teslin Nkyerɛwee a Wɔde Di Dwuma | Fa 0.178mm anaa 0.254mm di dwuma sɛnea stack a wɔapene so ne cushioning a ɛho hia |
| Anim ne Akyi Nkataso | Overlay gauge, adhesive ne surface finish kyerɛ ahobammɔ ne awiei card te nka |
| Ink / Toner a Wɔatintim | Heavy solid coverage betumi aka nsuo, blocking, lamination ne dimensional kari pɛ |
| RFID Inlay anaa Chip a wɔde hyɛ mu | Fa antenna, chip bump, adhesive ne cavity anaa spacer layers biara ka ho |
| Magnetic Ntrɛwmu / Hologram | Si stripe recess, overlay compatibility ne post-lamination encoding anaa nhwehwɛmu so dua |
| Kaad a Wɔawie | Sua ne kɛse, ne petee, ne nsusuwii ne ne dwumadi bere a woayɛ onwini na woayɛ no yiye akyi |
ID, Access ne Membership Cards a Wɔde Di Dwuma
Laminated Card Dwumadi Ahorow a Wɔawie
Wɔayɛ Teslin abasobɔde ahorow no yiye ama nhoma tintim nhyehyɛe ahorow. Ɛnsɛ sɛ adetɔfo susuw sɛ krataa fitaa biako bɛma aba koro no ara wɔ offset, dye inkjet, pigment inkjet, laser, Indigo, screen anaa thermal-transfer mfiri so. Ɛsɛ sɛ obi fata wɔ grade pɔtee, printa ne ink nhyehyɛe no ho.
| Ntintim Dwumadi | B2B Validation Ahwehwɛde |
|---|---|
| Offset Nkyerɛwee | Ink nhyehyɛe, density, afiri, drying, powder level, blocking ne lamination resistance |
| Silk-Screen a Wɔde tintim nhoma | Ink thickness, solvent compatibility, ayaresa, nsakrae ne layer bonding |
| Digitals Laser Nkyerɛwee | Fuser hyew, toner adhesion, krataa akwantu, static control ne nnwinnade a ɛfata |
| Inkjet a Wɔde tintim nhoma | Fa grade a ɛne inkjet hyia di dwuma; sɔhwɛ dye anaa pigment ink, bere a ɛyow, nsu a ɛko tia ne kɔla profile |
| HP Indigo / Digitals Nsɛmma Nhoma Tintimbea | Si so dua sɛ fata grade, primer ahwehwɛde, blanket hyew ne post-print lamination |
| Print-to-Kard Printer a Wɔde Kɔ Kaad So Tẽẽ | Mpɛn pii no, ɔtintim kaad a ɛnyɛ hwee a wɔawie sen sɛ obetintim Teslin krataa a ɛho ayɛ hare; sɔhwɛ akyi nkutoo wɔ card lamination ne punching |
Wɔnam tintim kwan, grade, nsu a ɛkari pɛ, adwinni a wɔde kata so ne dinkyerɛw so na ɛhwɛ tintim a ɛwɔ afã abien so —ɛnyɛ 0.254mm nneɛma a wɔde di dwuma ara kwa. Anim ne akyi nhyehyɛe a ɛkari pɛ nso betumi aboa ma wɔatew curl so bere a wɔatintim ne lamination awie no.
Wɔtaa tintim mfonini ahorow a ɛyɛ pintinn wɔ substrate nkrataa so ansa na wɔayɛ lamination. Wobetumi de edin a ɛsakra, mfonini, nɔma anaa barcode aka ho bere a wɔretintim krataa anaa akyiri yi wɔ kaad a wɔawie no so, a egyina sɛnea wɔde ma no so.
Offset, Screen ne Digital Printing Sɔhwɛ ahorow
Teslin substrate betumi ayɛ platen-laminated anaasɛ roll-laminated ne films a ɛne no hyia. Nkitahodi a emu yɛ den ba bere a laminate anaa adhesive sen kɔ microporous nhyehyɛe no mu no. Ɛsɛ sɛ wɔde nhyehyɛe a etwa to no si hɔ ne substrate grade ankasa, overlay, ink, press ne card stack.
| Lamination Control | Adeyɛ a Wɔkamfo Kyerɛ |
|---|---|
| Nsuo Tebea a Ɛwɔ Hɔ | Condition substrate ne nkratafa a wɔatintim ansa na wɔayɛ lamination; nneɛma a ɛyɛ nwunu dodo anaasɛ ɛyɛ nwini dodo betumi atew ne su so |
| Ahoɔhyeɛ | Set sɛnea laminate a ɔde ma no ne substrate hyew a wɔagye atom; mfa wo ho nto mfiri a wɔde kyerɛ no hyew nkutoo so |
| Nhyɛso ne Bere | Ma nsu a ɛdɔɔso nkɔ pores no mu a wunbubu chips, kyinkyim adwinni anaasɛ ɛnyɛ squeeze-out dodo |
| Onwini a wɔde ma | Fa no nwini wɔ nhyɛso a wɔahyɛ so ase na ama ayɛ petee na ama ne kɛse ayɛ den |
| Peel Ahoɔden | Sɔ laminate a wɔawie no hwɛ bere a wɔayɛ no yiye ne nneɛma a atwa yɛn ho ahyia no akyi |
| Edge Sealing a Wɔde Nsɔano | Mpɛn pii no wobetumi atwa Teslin laminate nhyehyɛe a ɛne no hyia no die-cut wɔ lamination akyi a wonni ɔhye a wɔatoto mu a ɛyɛ soronko; fa sini a woapaw no si so dua |
Ebia mfiase parameters a wɔatintim no bɛboa wɔ sɔhwɛ ahorow mu, nanso ɔhyew a wɔde kɔ baabi foforo ankasa gu ahorow wɔ mprɛte, press, stack sorokɔ, overlay chemistry ne printed coverage so. Kyerɛw substrate hyew a wɔapene so, nhyɛso, tra, onwini ne release-film nhyehyɛe ma san yɛ.
Nsuo a ɛkyere, ɔhyew a ɛnnɔɔso, laminate a ɛne ne ho nhyia, ink a emu yɛ duru anaasɛ onwini a ɛnyɛ papa betumi ama ahurututu, dwetɛ ayɛ, ahum anaasɛ ayɛ kurukuruwa. Hwɛ krataa no ne kaad a wɔabɔ no akuturuku no nyinaa mu bere a woayɛ no yiye awie no.
Teslin substrate betumi aboa layered credential design, nanso ahobanbɔ nneɛma no nam document program a edi mũ no so na ɛyɛ. Nneɛma a wɔde di gua a wɔahyɛ da ayɛ no nni sum ase anaasɛ asɛnnibea nneɛma a aban de di dwuma no ara kwa.
| Ahobammɔ Feature | Nkabom Ahwehwɛde |
|---|---|
| Microtext ne Fine-Line Nkyerɛwee | Adwini a ɛwɔ nsusuwii a ɛkorɔn, mprɛte anaa dijitaal mfonini a wɔahyɛ so ne akenkan a wɔkenkan wɔ lamination akyi |
| UV-Fluorescent Ink a Ɛyɛ Fɛ | Ink supplier ahwehwɛde, akyi fluorescence control ne nhwehwɛmu akyi lamination |
| Holographic a Wɔde Kata So | Registered overlay, laminate a ɛne ne ho hyia, optical pefeeyɛ ne tamper suban |
| QR Kood ne Barcode a Wɔde Di Dwuma | Print nsonsonoe, dimensional pɛpɛɛpɛ, scanner akenkan ne abrasion ahobammɔ |
| Amanneɛbɔ Ahobammɔ-Grade Substrate | Program-specific embedded markers hwehwɛ sɛ wɔde nneɛma a wɔde ma a ahobammɔ wom a wɔama ho kwan na ɛne krataa fitaa a wɔahyɛ da ayɛ no nsɛ |
Layered Ahobammɔ ne Laminate Ahobammɔ
Teslin substrate betumi ayɛ cushion na abɔ RFID inlay ho ban, nanso sɛ wopaw 0.254mm sen sɛ wobɛpaw 0.178mm a, ɛnyɛ nea ɛbɛma kaad afata ama ɛlɛtrɔnik mfiri a ɛkɔ anim no ara kwa. Ɛsɛ sɛ wɔyɛ inlay, chip, antenna, adhesives, overlay ne lamination cycle no sɛ nhyehyɛe biako.
| Smart Card Factor | a Ɛho Hia sɛ Wɔde Di Dwuma |
|---|---|
| Chip ne Frequency a wɔde yɛ adwuma | Si chip model, frequency, protocol, memory ne akenkanfo nhyehyɛe no so dua |
| Antenna Geometry a Wɔde Di Dwuma | Bɔ antenna traces ho ban bere a woreyɛ lamination, punching ne card-edge finishing |
| Inlay a Ɛyɛ Den | Bu chip bump, antenna, carrier ne adhesive ho akontaa wɔ card stack no nyinaa mu |
| Nhyɛso a Wɔkyekyɛ | Fa cushioning ne cavities a ɛfata di dwuma na amma chip anaa antenna ansɛe |
| Dwumadi mu Sɔhwɛ | Sɔ akenkan/kyerɛw adwumayɛ hwɛ ansa na wɔayɛ lamination, wɔ lamination akyi, punching akyi ne flexing akyi |
| Akwankyerɛ | a Wɔkamfo Kyerɛ Dwumadie no Adwene |
|---|---|
| Adwumakuw no ID Kaad a Wɔde Di Dwuma | Mfonini no su, data a ɛsakra, barcode, overlay durability ne da biara da badge a wɔde di dwuma |
| Asuafoɔ ne Faculty Kaad | High-volume tintim, personalization, magnetic anaa RFID adwuma ne bere tenten flexing |
| Asɔremma ne Nokwaredi Krataa | Brand kɔla, barcode anaa QR akenkan, sika kotoku a ɛtra hɔ kyɛ ne krataa a wɔyɛ a ɛho ka sua |
| Ahɔhodan mu Safoa Kaad | Magnetic-stripe anaa RFID a ɛne ne ho hyia, lock sɔhwɛ ne ɔsom nkwa nna tiaa kosi mfinimfini |
| Akwahosan ne Ayarefo ID ahorow | Akenkan, ahotew a ɛda adi, barcode scanning ne controlled issue |
| Adeyɛ ne Nsrahwɛfo Badges | Digitals tintim bere tiaa mu, slots, lanyards, QR codes ne personalization ntɛmntɛm |
| Adeyɛ | Adesua Pae a Wɔde Di Dwuma |
|---|---|
| Guillotine a Wɔde Twitwa Nneɛma | Squareness, nkyerɛwee a wɔatintim, blade tebea ne stack compression |
| Kaad Punching / Die Twitwa | Kaad nsusuwii, ntwea so radius, anoano a ɛho tew na laminate mpaapaemu biara nni hɔ |
| Slot ne Tokuru a Wɔbɔ | Gyinabea, anoano kwan, hama adesoa ne mpaapaemu a ɛko tia |
| Embossing anaa Foil Stamping a wɔde hyɛ mu | Finished-card nhyehyɛe, ɔhyew, nhyɛso, foil adhesion ne akenkan |
| Ɔhyew / Retransfer Personalization | Printer akwantu, ribbon transfer, soro ahoɔden, ɔhyew a wɔkyinkyim ne mfonini a ɛtra hɔ kyɛ |
| Magnetic Encoding / RFID Nsɛm a Wɔde Di Dwuma | Encoding yield, akenkanfoɔ a ɛne ne ho hyia ne post-stress dwumadie |
| Nneɛma | Ahoɔden | Nneɛma Titiriw a Ɛsɛ sɛ Wosusuw Ho |
|---|---|---|
| Teslin Nneɛma a Wɔde Yɛ Adwuma | High print absorption, ahoɔden laminate bonding, flexibility ne cushioning ma ɛlɛtrɔnik mfiri | Wɔtaa de di dwuma sɛ ade a wɔatintim wɔ laminate dan mu sen sɛ wɔde bɛyɛ kaad a wɔawie a ɛda adi |
| PVC a wɔde yɛ adwuma | Wɔde kaad nhyehyɛe a wɔde asi hɔ, nneɛma a ɛtrɛw ne akwan a wɔfa so yɛ ankorankoro a wonim no yiye | Nneɛma a atwa yɛn ho ahyia ho nsɛm a ɛsono, ɔhyew a ɛko tia a ɛba fam ne nneɛma a wɔsan de di dwuma kakraa bi wɔ gua pii so |
| PETG | Toughness, pefeeyɛ ne ahoɔden multilayer card applications | Ink adhesion ne lamination aduannoa yɛ soronko wɔ porous Teslin substrate ho |
| Polycarbonate a wɔde yɛ nneɛma | High durability, ɔhyew a ɛko tia ne laser-personalization tumi wɔ ahofama grades | Nneɛma ne nneɛma a wɔyɛ ho ka a ɛkɔ soro; wɔde di dwuma de hwehwɛ sɛ wonya adansedi krataa a ɛtra hɔ kyɛ |
| Nhwehwɛmu Ade | a wɔkamfo kyerɛ sɛ wɔhwɛ so |
|---|---|
| Nneɛma a Wɔde Yɛ Nnipa | Ɔyɛfoɔ, grade, thickness code, batch ne adansedie krataa reference |
| Ne Kɛse ne Ne Kɛse | Sɛ wɔkyekyem pɛpɛɛpɛ a, gauge, tolerance, krataa tenten, ne tɛtrɛtɛ, squareness ne cutting pɛpɛɛpɛ |
| Mmaeɛ | Fitaa, sunsuma, nsensanee tuntum, efĩ, nwi, nsensanee ne anoano a ɛsɛe |
| Flatness ne Nsuo a Ɛwɔ Hɔ | Curl, bow, storage tebea ne moisture kari pɛ ansa na woatintim na lamination |
| Print Ho Ahwehwɛde | Density, adhesion, drying, kɔla, mfonini no mu nsɛm, barcode akenkan ne blocking |
| Lamination Sɔhwɛ a Wɔde Di Dwuma | Peel ahoɔden, bubbles, haze, edge mpaapaemu, curl ne wie thickness |
| Kaad Sɔhwɛ a Wɔawie | Nsusuwii, flexing, abrasion, personalization, slot ahoɔden, encoding ne akenkanfo dwumadi |
| Nneɛma a wɔde kyekyere nneɛma ne nea wotumi di akyi | Wɔabɔ ho ban stack, count, carton label, pallet nhyehyɛe, lot nɔma ne nhwehwɛmu amanneɛbɔ |
Teslin substrate yɛ compressible na ɛsɛ sɛ wɔbɔ ho ban fi ɔhyew, UV hann, efĩ, nsu a ɛnkari pɛ ne stack nhyɛso a ɛboro so ho. Nneɛma a wɔkora so yiye boa ma kɔla, ɛyɛ tratraa, tintim adwumayɛ ne lamination ahoɔden kɔ so tra hɔ.
Fa nneɛma a wɔakata so sie baabi a ɛhɔ tew a wusiw a ɛhyew ne efĩ a ɛwɔ dan mu ntumi nkɔ hɔ.
Bɔ nkrataa ho ban fi UV hann tẽẽ ne ɔhyew a ɛboro anohyeto a wɔapene so sɛ wɔmfa nsie no ho.
Ma nkratafa a wɔatwitwa no nyɛ petee wɔ baabi a ɛyɛ den a wɔde gyina so.
Mfa nnesoa a emu yɛ duru anaa pallet a wɔaboaboa ano mprenu nhyɛ nnaka a wɔatwitwa so.
Kwati sɛ wobɛkyekyere nhama a ɛyɛ den dodo a ebetumi amia anoano anaasɛ ahyɛ krataa a wɔaboaboa ano no agyirae.
Fa nneɛma a wɔde ahyɛ mu no fã bi san kyekyere na amma mfutuma, kɔla a ɛbɛsakra ne nsuo a ɛbɛsesa no ano.
Tebea nkrataa a ɛwɔ dan a wɔyɛ nneɛma mu ansa na wɔatintim anaasɛ wɔabɔ no lamination bere a ɛsono adekoradan tebea no.
Wallis boa wɔn a wɔyɛ kaad ne wɔn a wɔkyekyɛ nneɛma denam substrate sourcing, custom sheet cutting, protected packing ne coordinated card-material supply so. Ɛsɛ sɛ wɔde ahyɛde biara bata nhwɛsode a wɔapene so ne nkyerɛkyerɛmu a wɔakyerɛw a ɛfa grade, thickness, printing process, lamination structure ne finished-card ahwehwɛde ahorow ho.
Kaad Nneɛma a Wɔde Di Dwuma ne Nneɛma a Wɔde Kɔ Amannɔne
Abien standard card gauges: 0.178mm ne 0.254mm options ma ahorow ahorow laminated kaad nhyehyɛe.
Printing-process support: Wobetumi ayɛ offset, silk-screen ne digital printing sɔhwɛ ahorow ho nhyehyɛe ansa na wɔapene so kɛse.
Lamination-focused nkɔso: Wobetumi ahwɛ substrate, overlay, adhesive, ɔhyew ne card thickness sɛ nhyehyɛe biako.
RFID kaad osuahu: Wobetumi de inlay thickness, cushioning, chip ahobammɔ ne akenkanfo sɔhwɛ ahorow aka nhwɛsode validation ho.
Amanneɛbɔ twa ne packing: Sheet format, stack ahobammɔ, cartons ne pallets betumi ayɛ nea ɛfata production ne export ahiade.
Factory-direct B2B service: Ɛfata ma card adwumayɛbea, printa, converters, RFID nnwumakuw, importers ne distributors.
Card application, hwɛ kwan sɛ ɔsom nkwa ne destination gua.
Nea wɔhwehwɛ sɛ ɛyɛ kɛse: 0.178mm / 7 mil anaa 0.254mm / 10 mil.
Krataa tenten, ne tɛtrɛtɛ, abodwokyɛre, ahinanan ne dodow.
Printing process, printer model, ink anaa toner ne adwini a ɛwɔ ɔfã biako anaa abien.
Overlay nneɛma, thickness, wie, adhesive ne lamination mfiri.
Target wie card dimensions, thickness ne ntwea so radius.
RFID chip, antenna, inlay, magnetic stripe, hologram anaa ade foforo.
Ahobammɔ tintim, barcode, QR code ne ankorankoro ahwehwɛde ahorow.
Adansedi nkrataa a wɔhwehwɛ, nneɛma a wɔhwehwɛ ne nhwehwɛmu amanneɛbɔ.
Sɔhwɛ dodow, afe afe nkɔmhyɛ, hyɛn gyinabea a wɔde kɔ ne nhyehyɛe a wɔde bɛkɔ.
Ka Wo Teslin Kaad Dwumadie no ho asɛm
0.178mm substrate no yɛ 7 mil, bere a 0.254mm substrate no yɛ 10 mil. Grade a ɛyɛ den no boa kɛse ma kaad no mu duru nyinaa ne cushioning, nanso abien no nyinaa hwehwɛ sɛ wɔsɔ hwɛ wɔ laminate nhyehyɛe a edi mũ no mu.
Aane. Nhoma tintim a ɛwɔ ɔfã biako anaa abien no gyina substrate grade, tintim kwan, ink nhyehyɛe, adwinni a ɛkari pɛ ne dinkyerɛw so —ɛnyɛ krataa no kɛse kɛkɛ.
Amansan nyinaa nni hɔ a wobetumi apaw. Bu substrate, anim ne akyi overlays, adhesive, printing ne optional inlay, afei laminate na susuw conditioned wie card.
Substrate a egyina polyolefin so no gyina nsu ano, nanso tintim a ɛtra hɔ kyɛ no gyina ink, grade ne lamination pɔtee so. Ɛsɛ sɛ wɔsɔ kaad a wɔawie no hwɛ sɛ ebia nsu, nwini ne ahotew a ɛwɔ mu anaa.
Fa Teslin grade a ɛne inkjet hyia di dwuma na sɔ dye anaa pigment ink pɔtee no hwɛ. Standard grades ne coated inkjet grades betumi ayɛ wɔn ade wɔ ɔkwan soronko so wɔ ɔpɛ bere, kɔla ne nsu a ɛko tia mu.
Wobetumi de laser atintim grades a ɛfata, nanso ɛsɛ sɛ wɔhwɛ fuser temperature, sheet transport, toner adhesion ne printer qualification. Mfa nneɛma a wɔmpene so sɛ wɔmfa nyɛ mfiri no nni dwuma.
Wɔayɛ mfiri a wɔde tintim nhoma tẽẽ dodow no ara ama kaad a ɛnyɛ hwee a wɔawie, na ɛnyɛ substrate nkratafa a ɛyɛ hare. Di kan tintim krataa no na fa laminate, bɔ kaad no, na afei sɔ personalization hwɛ wɔ blanks a wɔawie no so.
Ebia thermal laminates ne adhesive films pii bɛyɛ adwuma, nanso sɛnea ɛne ne ho hyia no gyina activation temperature, flow, thickness ne finished-card ahwehwɛde ahorow so. Pene substrate-ne-film a wɔaka abom pɛpɛɛpɛ no so denam peel sɔhwɛ ahorow so.
Mpɛn pii no wobetumi atwitwa Teslin adan a wɔabɔ no yiye no ma ayɛ nea wɔawie a wonni ɔhye a wɔatoto mu a ɛyɛ soronko efisɛ laminate no kyekyere wɔ porous matrix no mu. Si eyi so dua ne laminate a woapaw ne ɔkwan a wɔfa so yɛ no.
Nea ebetumi de aba ne nsu a ɛboro so, ɔhyew a ɛnnɔɔso, mframa a ɛkyere, ink a emu yɛ duru, laminate a ɛne ne ho nhyia anaasɛ nhyɛso a ɛnsɛ. Condition nkrataa no na hwɛ sɛ substrate hyew ankasa.
Aane. Ne cushioning betumi aboa ma wɔabɔ ɛlɛtrɔnik mfiri ho ban, nanso ɛsɛ sɛ wogye chip, antenna, inlay thickness, adhesive, pressure ne akenkan adwumayɛ a wɔawie no tom.
Ɛnyɛ nea ɛba ara kwa. Ebia substrate a ɛyɛ den bɛma cushioning pii, nanso ɛsan sesa total card thickness ne pressure distribution. Inlay nhyehyɛe a edi mũ no na ɛkyerɛ adwumayɛ.
Standard white substrate ma print ne lamination mfaso nanso ɛnsɛ sɛ wɔka ho asɛm sɛ ɛwɔ sum ase ahobammɔ agyiraehyɛde ahorow. Program-specific security-grade nneɛma yɛ ade a ɛyɛ soronko a wɔahyɛ so.
Aane. Wobetumi de holographic overlays, UV inks, microtext ne nneɛma afoforo abom denam tintim ne lamination akwan horow a ɛsono emu biara so. Ɛsɛ sɛ wɔsɔ sɛnea wotumi hu ne sɛnea ɛtra hɔ kyɛ hwɛ bere a wɔayɛ awie no.
Nneɛma a atwa yɛn ho ahyia no adwumayɛ gyina nneɛma a wɔde yɛ adwuma, kaad adansi, dwumadie nkwa nna, nneɛma a wɔyɛ, akwantuo ne akwan a ɛwɔ hɔ a wɔfa so tow gu so. Kwati sɛ wobɛka sɛ obi korɔn sen biara a ɛtrɛw a wonni asetra mu nhwehwɛmu a wɔakyerɛkyerɛ mu.
Nneɛma a wɔsan de di dwuma no gyina mpɔtam hɔ nneɛma a wɔboaboa ano ne kaad nhyehyɛe a edi mũ so. Laminates, inks, magnetic stripes, chips ne antennas betumi ahwehwɛ sɛ wɔtetew mu anaasɛ wɔtow gu titiriw.
Fa nkratafa no kata so, ɛnyɛ petee, ɛnyɛ nwunu na bɔ ho ban fi UV hann, ɔhyew, wusiw, mfutuma ne stack nhyɛso a ɛboro so ho. Condition wɔn ansa na woatintim anaa lamination.
Amanneɛbɔ twa betumi asusuw sɛnea tintim nhyehyɛe, lamination mprɛte, kaad a wɔde hyɛ, abodwokyɛre, dodow ne packing ahwehwɛde ahorow.
Aane. Print, laminate, cool, condition, punch na personalize sample cards denam mfiri a wɔahyɛ da ayɛ no so ansa na woapene ade no so.
MOQ gyina grade, thickness, krataa kɛse, amanne kwan so twa, tintim a ɛfata, packing ne afe afe nkɔmhyɛ so.
Fa ne kɛse, krataa kɛse, tintim kwan, overlay, lamination mfiri, wie card thickness, RFID anaa stripe ahwehwɛde, dodow, baabi a wɔrekɔ ne delivery nhyehyɛe ma.
Di Wallis Plastic nkitaho ma 0.178mm ne 0.254mm fitaa Teslin synthetic krataa ma laminated ID, asɔremma, ahɔhodan safe, adeyɛ ne RFID kaad nnwuma. Yɛn kuw no boa thickness paw, amanne twa, tintim ne lamination sɔhwɛ, card-nhyehyɛe nhwehwɛmu, quality specifications ne factory-direct B2B supply.
Teslin yɛ PPG Industries Ohio, Inc. aguadi agyiraehyɛde a wɔakyerɛw din Si so dua sɛ grade pɔtee a wɔde ama, fibea ne nkrataa a wɔde ama wɔ krataa biara a wɔkra ho.
