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Wallis -PLA Sheet
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I-WALLIS yekhadi le-PLA eliqhelekileyo le-PLA imathiriyeli yenzelwe abavelisi bamakhadi, abashicileli, abaguquli be-inlay be-RFID, abanikezeli bekhadi lesipho kunye neenkqubo zamakhadi ezigxile ekuzinzeni ezifuna enye indlela esekelwe kwibhayoloji kwiisubstrates zePVC eziqhelekileyo. Ukhetho olukhoyo lubandakanya amaphepha amhlophe, acacileyo, amnyama kunye nombala oqhelekileyo kwiigeyiji ezininzi zee-cores eziprintiweyo, ii-overlays, amakhadi okuthengisa, amakhadi obulungu, amakhadi angundoqo ehotele kunye nolwakhiwo olukhethiweyo lwe-RFID.
Imveliso yekhadi le-PLA isebenzisa inkqubo eyahlukileyo yefestile ukusuka kwi-PVC, i-PETG kunye ne-polycarbonate. I-inki yokuprinta, unyango lomphezulu, ukuqhelaniswa neshiti, ubushushu be-lamination, uxinzelelo, ukupholisa, ukukhetha okuncamathelayo, ukusika ukufa kunye novavanyo olugqityiweyo lwekhadi kufuneka luqinisekiswe njengenkqubo enye. Ulingo lwesampulu luyacetyiswa phambi kokuveliswa kobuninzi, ngakumbi kwi-multilayer, i-RFID, i-magnetic-stripe kunye neeprojekthi zekhadi lenkonzo ende yobomi.
'I-bio-based,' 'biodegradable,' 'icompostable industry' kunye 'recyclable' ichaza iimpawu ezahlukeneyo zokusingqongileyo. Naliphi na ibango kufuneka lingqinelane ngqo nebakala lePLA kunye nokwakhiwa kwekhadi eligqityiweyo. I-chips, i-antennas, ii-inks, ii-overlays, i-adhesives, imigca yamagnetic kunye neengubo zinokutshintsha indlela yokuphela kobomi kwaye inokuthintela ikhadi eligqityiweyo ukuba lifanelekele ibango le-compostability.
| Uhlobo lweMveliso | Iphepha elingundoqo lekhadi le-PLA, ishidi eliprintwayo kunye neprojekti ethe ngqo yezixhobo zokwaleka |
| Ukutyeba okusemgangathweni | 0.08mm, 0.15mm, 0.17mm, 0.20mm kunye 0.35mm; ezinye iigeyiji zixhomekeke kuphononongo lwemveliso |
| Ubungakanani bePhepha eliMgangatho | 300 × 480mm okanye ubungakanani obulungiselelwe ngokweemfuno zokuprinta kunye nekhadi-loyilo |
| Iinketho zoMbala | Umbala omhlophe, ocacileyo, oguquguqukayo, omnyama okanye owenziwe ngokwezifiso ngokuxhomekeke kwi-MOQ kunye nokuqulunqwa |
| Izicelo zeKhadi | Isipho, ubulungu, ukunyaniseka, isiganeko, isitshixo sehotele, ishishini, amakhadi e-RFID entengiso kunye nakhethiweyo |
| Iinkonzo zeB2B | Amaphepha eisampulu, iigeyiji zesiko, izilingo zoshicilelo, uvavanyo lwe-lamination, uphononongo lwesakhiwo sekhadi, iinkcukacha ze-QC kunye nokubonelela ngaphandle |
Cela iiSampulu zePhepha lekhadi le-PLA kunye neQuote
I-Polylactic acid, ebizwa ngokuba yi-PLA, yi-polyester ye-thermoplastic enokuveliswa kwi-feedstocks yezityalo ezivuselelekayo. Ukwenziwa kwamakhadi, i-PLA iguqulwa ibe ngamaphepha acwebileyo anokuthi asebenze njengoluhlu oluphambili oluprintiweyo, umaleko wokuhombisa, umaleko obala okanye oxhasayo kwisakhiwo sekhadi elaminethiweyo.
Imvelaphi ehlaziyiweyo ye-PLA ayiqinisekisi ngokuzenzekelayo ukuqina kwekhadi, ukunamathela kokuprinta okanye ukubumba. Ibakala le-resin, i-crystallinity, izongezo, i-pigment, ukuqhelaniswa nephepha kunye nokwakhiwa kwekhadi kumisela i-mechanical final, i-thermal kunye neempawu zokusingqongileyo.
Iimveliso ezininzi ze-PLA ziyilelwe ukulawulwa komgquba woshishino ngobushushu obulawulwayo, ukufuma kunye nokungena emoyeni. Iphepha lePLA akufuneki lichazwe njengenyamalala ngokukhawuleza kwindawo yokulahla inkunkuma, kumhlaba oqhelekileyo, emilanjeni okanye elwandle. Ikhadi eligqityiweyo kufuneka lihlolwe njengento epheleleyo phambi kokuba kusetyenziswe ilogo yecompostability okanye ibango.
Iphepha le-PLA le-thermoforming jikelele alinako ukubonelela ngokutya, uburhabaxa bomphezulu, ukuprinta okanye ukuziphatha okufunekayo kwimveliso yekhadi. Abathengi kufuneka bacele ukucaciswa kwebakala lekhadi kwaye bavavanye iphepha elichanekileyo ngoomatshini bokushicilela, ii-inki, ii-overlays kunye ne-laminators.
Iphepha lePLA lokuVeliswa kweKhadi eliZinzileyo
| iParameter | Ukucaciswa okuQhelekileyo / iMfuno yeProjekthi |
|---|---|
| Izinto eziphathekayo | I-PLA okanye ukulungiswa komgangatho wekhadi le-PLA; I-resin echanekileyo kunye nephakheji yokongeza kufuneka itshixiwe ngekhowudi yemveliso |
| Ukutyeba | 0.08, 0.15, 0.17, 0.20 kunye ne-0.35mm okanye ngokwezifiso; ukunyamezelana kufuneka kuvunyelwene kwigeyiji nganye |
| Ubungakanani bephepha | I-300 × 480mm okanye ifomathi elungiselelwe ngokwezifiso esekelwe ekubekweni, ibhedi yokucofa kunye nepleyiti yokulala |
| Tensile strength | Ulwalathiso lomatshini ≥25MPa (ixabiso lokubhekisela); qinisekisa indlela yovavanyo ekuvunyelwene ngayo, ulungiselelo kunye nemfuneko yokwalatha-mnqamlezo kumyalelo ngamnye |
| Uburhabaxa boMphezulu | 0.8–3.0μm uluhlu lwereferensi; khetha ngokweemfuno zoshicilelo, i-inki yokubamba kunye ne-lamination |
| Umphezulu Gqiba | Imatte, isemi-matte, ecwebezelayo, ene-corona-treatment okanye igqunywe umphezulu oprintwayo ophantsi kovavanyo lwenkqubo |
| Umbala | Imhlophe, i-transparent, imnyama, iPantone yesiko okanye ibakala eliphantsi kokulawulwa kwe-opacity phantsi koyilo kunye ne-MOQ |
| Ukupakisha | Amaphepha eflethi anefilimu ekhuselayo okanye i-interleaving, ukupakisha-umqobo womswakama, i-carton kunye nokukhusela i-pallet |
Ikhadi lokuchonga eligqityiweyo liqhele ukwakhiwa ukusuka kumaleko amaninzi kuneshiti elinye elishinyeneyo. I-ISO/IEC 7810 ichonga ifomathi yekhadi le-ID-1 eliqhelekileyo malunga ne-85.60 × 53.98mm kunye nobukhulu begama be-0.76mm. Indibaniselwano yomaleko ochanekileyo wePLA kufuneka ithathele ingqalelo ukuprintwa, ukuncamathelisa, ukwaleka, itshiphu okanye ubukhulu be-antenna kunye nokuncipha kwe-post-lamination.
| Umaleko | oqhelekileyo woMsebenzi | we-PLA woqwalaselo lweProjekthi |
|---|---|---|
| Ukwaleka kwangaphambili | Ikhusela ushicilelo kwaye ibonelela ngokugqitywa komphezulu | Qinisekisa ukudibanisa, ukucaca, ukuxhathisa ukukrwempa kunye nokuhambelana nebango lokusingqongileyo |
| IPhepha elinguNdoqo eliprintiweyo | Ithwala imizobo, umbhalo, uyilo lokhuseleko kunye nombala ongasemva | Unyango lomphezulu kunye nenkqubo ye-inki kufuneka iphile ngaphandle kokutshintsha kombala okanye i-delamination |
| Umbindi Wombindi | Yakha ubukhulu, ukukhanya kunye nokugoba kokuqina | Sebenzisa i-balanced orientation kunye nokwakhiwa kwe-symmetrical ukunciphisa i-curl |
| RFID Inlay Layer | Iqulethe itshiphu kunye ne-eriyali yomsebenzi ongaqhagamshelwanga | Iakhawunti yobukhulu be-inlay, ukunamathela kwe-eriyali, i-chip cavity kunye noxinzelelo lwe-lamination |
| Ngasemva Iphepha Eliprintiweyo / Ukwaleka | Ibonelela ngemizobo engasemva kunye nokhuseleko lomphezulu | Ukulinganisa iileya zangaphambili nasemva ukuze ulawule utshintsho lwe-dimensional |
Iileyile zangaphambili nasemva ezingalinganiyo zingenza i-curl emva kokufudumeza kunye nokupholisa. Apho kunokwenzeka, sebenzisa iigeyiji ezihambelanayo, ukugqunywa koshicilelo okufanayo kunye nokwaleka okulinganayo kumacala omabini. Amakhadi agqityiweyo kufuneka ahlolwe emva kokulungiswa kwemeko, kungekhona nje ngokukhawuleza emva kokutshatyalaliswa.
I-inki, into encamathelayo, inlay ye-RFID, umgca wemagnethi kunye nokhuso olukhuselayo zonke zinegalelo kubunzima bokugqibela. Isitaki seshiti esine-0.76mm phambi kokuba i-lamination singavelisi ikhadi eligqibeleleyo elithobelayo emva koxinzelelo kunye nokuncipha.
| Indlela yoShicilelo | oluNgakho ukusetyenziswa | okuFunwayo |
|---|---|---|
| Ushicilelo lwe-Offset | Amaphepha aphezulu anomthamo wenkqubo, iPantone kunye nemvelaphi yokhuseleko | Ukubambelela kwi-ink, ukomisa, ukuvala, ukuxinana kombala kunye nokuchasana kwe-lamination |
| UV Inkjet | Imitsi emifutshane, ukwenziwa komntu, imizobo elandelanayo kunye neprototyping | Amandla angaphezulu, inqanaba lokunyanga, ukuguquguquka, ivumba kunye nokudibanisa okungaphezulu |
| Ushicilelo lweSkrini | I-Opaque emhlophe, isinyithi, umbala webala kunye neengqimba ezisebenzayo | Ubungqingqwa be-inki, ukuhambelana kwe-solvent, ukunyanga kunye ne-lamination bond |
| I-Indigo / Ushicilelo lweDijithali | Idatha eguquguqukayo, ukubaleka okufutshane kunye neenkqubo zekhadi ezenzelwe wena | Ukuhambelana kwe-Primer, ubushushu bengubo, ukunamathela kwi-toner kunye ne-lamination esezantsi |
| Thermal / Retransfer Personalization | Iinombolo zekhadi eligqityiweyo, iifoto, iikhowudi zebhakhowudi kunye neziqinisekiso | Ukubonakaliswa kobushushu, ukuhanjiswa kweribhoni, ukucaba kunye novavanyo lothutho lomshicileli |
Unyango lweCorona lunokonakala ngexesha lokugcinwa. Abathengi abasebenzisa i-inkjet ye-UV, ukuprintwa kwesikrini okanye iingubo ezikhethekileyo kufuneka bavumelane kwinqanaba le-dyne elijoliswe kuyo, indlela yokuvavanya kunye nexesha elide lokugcina ngaphambi kokushicilela.
Ukubambelela kakuhle kokuprintwa kokuqala akuqinisekisi ukumelana nobushushu, uxinzelelo kunye noqhagamshelwano oluncamathelayo. Amaphepha ashicilelweyo kufuneka afakwe elaminethiweyo, apholiswe kwaye ahlolwe ngaphambi kokuba umsebenzi wobugcisa kunye neenkqubo ze-inki zamkelwe.
Iphepha lekhadi lePLA eliprintwayo
Izilingo zokuLamination kunye nokuguqula
I-PLA ithande ukuthamba kubushushu obuphantsi kunePVC, i-PETG okanye izixhobo zekhadi le-polycarbonate. Iresiphi esemgangathweni ye-PVC yokulahla i-recipe inokubangela ukuncipha okugqithisileyo, ukuphawula umphezulu, ukuphazamiseka, ukuvimba okanye umonakalo we-chip. Umjikelo ochanekileyo kufuneka uphuhliswe kunye ne-stack yangempela kunye nezixhobo.
Isimo samaphepha: Gcina kwaye ulungelelanise amaphepha e-PLA, iileya eziprintiweyo kunye nezifakelo phantsi kobushushu obulawulwayo kunye nokufuma.
Qinisekisa ukuqhelaniswa: Gcina umatshini kunye nezalathiso ezinqamlezayo zingaguquguquki kwisitaki ukuze ulawule ukucutheka.
Qala ngomjikelo wobushushu obubambekayo: Sebenzisa uvavanyo lobushushu obusezantsi kunomjikelo wePVC oqhelekileyo kwaye unyuke kuphela emva kokuphonononga amandla ebhondi kunye nemilinganiselo.
Ubushushu bokulinganisela, uxinzelelo kunye nokuhlala: Uxinzelelo olugqithisileyo lunokuphawula umphezulu okanye umonakalo amacandelo e-RFID; ukungonelanga kwamandla kunokubangela i-delamination.
Ukupholisa phantsi koxinzelelo olulawulwayo: Ukupholisa kuchaphazela ukucaba, ukucutha kunye nokuthintela.
Umqathango phambi komlinganiselo: Jonga imilinganiselo, i-curl, ukuncamathela kunye nobukhulu bekhadi emva kwexesha elivunyelweneyo lokubuyisela.
Tshixa iresiphi evunyiweyo: Rekhoda uhlobo lwepleyiti, ukuqhelaniswa nestakhi, iprofayile yobushushu, uxinzelelo, ixesha kunye neemeko zokupholisa.
Eminye imigangatho ye-PLA ehambelanayo inokuthi ibophe nge-thermal, ngelixa ezinye izakhiwo zifuna i-adhesive okanye i-tie layer. Inkqubo ekhethiweyo yokudibanisa kufuneka ihlolwe amandla e-peel, ukuguga, ukuhambelana nokuprintwa kunye nefuthe layo kwibango lokusingqongileyo.
Iglosi, i-matte kunye ne-textured plates ivelisa inkangeleko eyahlukileyo yomphezulu kunye nokuziphatha okukhuphayo. Uvavanyo lokukhutshwa kweefilimu kunye nokugqitywa kwepleyiti yokuncamathela, inkungu, ukuguquguquka kweglosi kunye nokuhanjiswa okungafunekiyo kokuthungwa.
| Converting Step | Key Control |
|---|---|
| Sheet Guillotine Cutting | Iblade ebukhali, isitaki esixhaswayo, ukwakhiwa kobushushu obuphantsi kunye nokuchaneka komda |
| Ukubetha kweKhadi | Ukususwa kwesixhobo, ubushushu, ukuqhelaniswa nekhadi kunye nokungabikho kokuqhekeka kwekona |
| Slot kunye Hole Punching | Ukukhanya komphetho, uvakalelo lwenotshi, indawo yokuma komngxuma kunye nokumelana nomthwalo ojingayo |
| Chip Cavity Milling | Ukusika isantya, ubushushu, ukususwa kothuli, ubunzulu bomgodi kunye nokuncamathelisa |
| Ukuhlolwa komda | Burrs, delamination, cracks, whitening, sharpness and layer registration |
Iphepha lekhadi le-PLA linokuvavanywa kumakhadi angenawo umnxeba, kodwa iphepha liyinxalenye enye yenkqubo. I-eriyali, i-chip, i-inlay substrate, i-adhesive kunye ne-lamination cycle kufuneka zihlale zizinzile ngombane kunye noomatshini kulo lonke ukuveliswa kwekhadi kunye nenkonzo.
| lweMfuneko yekhadi eliSmart | Into yoQinisekiso |
|---|---|
| I-RFID Frequency kunye neChip | Qinisekisa inkqubo yokufunda, usapho lwetshiphu, inkumbulo, iprotocol kunye neemfuno zeekhowudi phambi kokwakha iisampulu |
| Ijometri yeAntenna | Qinisekisa ukuba umphetho wekhadi, indawo yetshiphu kunye noyilo lokusika alonakalisi i-eriyali |
| Inlay Bonding | Jonga ukuhambelana kwe-adhesive, ukumelana nobushushu, i-voids kunye ne-delamination yexesha elide |
| Funda ukusebenza | Vavanya umgama wokufunda, uqhelaniso, uphazamiseko lwesipaki sekhadi kunye nokutshixa/ukuhambelana komfundi |
| Ibango lokusingqongileyo | Musa ukuchaza ikhadi le-elektroniki njengecompostable ngokupheleleyo ngaphandle kokuba into epheleleyo iqinisekisiwe |
| Isicelo | seMveliso yokuJolisa | uvavanyo oluBalulekileyo |
|---|---|---|
| Amakhadi esipho kunye nokunyaniseka | Ushicilelo olukumgangatho ophezulu, ibhakhowudi, umgca wemagnethi okanye iinketho zeRFID | Ukuhambelana komshicileli, ukusetyenziswa kwe-wallet, ukugoba kunye nobomi beprogram obulindelekileyo |
| Amakhadi angundoqo ehotele | Amakhadi eRFID asebenzisa ixesha elifutshane anemizobo enegama kunye nokuhambelana kwenkqubo yokutshixa | Ukuthelekisa i-chip, i-encoding, ukusebenza komfundi, ukufuma kunye nokuphatha ngokuphindaphindiweyo |
| Amakhadi oMnyhadala kunye neeNdwendwe | Ukufikelela ixesha elifutshane, uphawu, slot punching kunye nedatha variable | Umthwalo weLanyard, ukuqina koshicilelo kunye nendlela yokulahla umcimbi |
| Amakhadi obulungu | Amakhadi ashicilelweyo kunye nawenzelwe iiklabhu, iindawo zokuzivocavoca kunye neenkqubo zokuthengisa | Ukulindela ubomi benkonzo, i-abrasion, ukugoba kunye ne-card-printer transport |
| Amakhadi oShishino kunye neNtengiso | Ukugqitywa kokubonwa kwePremium, ukungafihli, umbala okhethekileyo kunye nobuntu obufutshane | Shicilela ukuncamathelisa, ukumelana nokukrweleka, umgangatho womphetho kunye nokugcinwa kucaba |
| RFID Access Cards | Ulwakhiwo lwekhadi olungenanxibelelwano oluhambelanayo kunye ne-lamination yobushushu obuphantsi | Ukusebenza kombane, ukuguquguquka, i-delamination kunye nokuhambelana komfundi |
Isipho, ubulungu kunye namakhadi okuKhuthaza
IiNkqubo zeKhadi le-PLA ezigqityiweyo
| Amandla | oMathiriyeli | . |
|---|---|---|
| I-PLA | Amandla asekelwe kwi-Bio, ibali lokuzinza elahlukileyo kunye ne-industrial-compostability enokubakho kwizakhiwo eziqinisekisiweyo | Ukumelana nobushushu obuphantsi, ubuntununtunu benkqubo, umngcipheko wobuqhophololo kunye neziseko zokuqokelela ezilinganiselweyo |
| I-PVC | Ukusekwa kwenkqubo yekhadi eliphantsi kwexabiso eliphantsi, ukuprintwa okubanzi kunye nolwazi lwe-lamination | I-Fossil-based, i-chlorine-equlethe kunye nokuhlaziywa okulinganiselweyo kwiinkqubo ezininzi zamakhadi |
| I-PETG | I-lamination elungileyo, ukuqina, ukungafihli kunye nokuqhelana nokwenziwa kwamakhadi | Ayinamgquba kwaye ukulahlwa kuxhomekeke kwiinkqubo zasekhaya zokurisayikilisha |
| Polycarbonate | Ukuqina okuphezulu, ukumelana nobushushu kunye nokufaneleka kwe-laser engraving | Iindleko eziphezulu kunye nokuzinza okwahlukileyo / iprofayili yokuphela kobomi |
| Iphinda isetyenziswe iPVC / RPETG | Yehlisa imfuno yeplastiki enyulu ngelixa igcina ukusetyenzwa kwekhadi eliqhelekileyo | Umxholo ohlaziyiweyo, umbala, ukungaguquguquki kunye nokusebenziseka kwakhona kufuna ubungqina |
I-PLA ayisiyiyo ngokuzenzekelayo imathiriyeli efanelekileyo kuzo zonke iziqinisekiso. Ihotele yobomi obufutshane, undwendwe, umcimbi, isipho kunye namakhadi okuthengisa anokuba ngabaviwa abanamandla. Ii-ID zikaRhulumente zexesha elide, amakhadi okuhlawula, iziqinisekiso zobushushu obuphezulu kunye namakhadi afuna i-laser engraving inokufuna i-PETG, i-polycarbonate okanye enye ulwakhiwo oluqinisekisiweyo.
| B2B | Luchanekile uToliko lwe- |
|---|---|
| Isekwe kwi-Bio | Ibhekiselele kumxholo wekhabhoni ohlaziyekayo kwaye kufuneka ixhaswe ngamaxwebhu abonakalayo okanye uvavanyo |
| I-Industrial Compostable | Ifuna isiqinisekiso sokulawulwa kweemeko zokwenziwa komgquba kumasipala okanye kushishino |
| Ikhaya Compostable | Ifuna isatifikethi esahlukileyo somgquba wasekhaya; isiqinisekiso soshishino asanelanga |
| I-Biodegradable | Ayiphelelanga ngaphandle kwendawo yovavanyo, indlela kunye nexesha elimisiweyo |
| Iyarisayikilishwa | Ngobuchule kunokwenzeka kumjelo ozinikeleyo we-PLA, kodwa amakhadi awamkelwanga ngokubanzi kwi-PET eqhelekileyo okanye kwi-mixed-plastic recycling. |
| Gqibezela iBango leKhadi | Itshiphu, i-eriyali, i-inki, i-coating, incamatheliswayo kunye nomgca wemagnethi kufuneka zibandakanywe kuvavanyo. |
Isatifikethi sephepha le-PLA asinakuxhasa ngokuzenzekelayo ibango lekhadi le-RFID, ikhadi lomgca wemagnethi okanye ikhadi eliprintiweyo. Amalungu ombane kunye neentsimbi asenokufuna ukususwa, uhlaziyo lwengcali okanye indlela yokulahlwa eyahlukileyo.
Uninzi lweendawo zokubumba umgquba kwimizi-mveliso awamkeli amakhadi aqinileyo e-bioplastic. Amagama alahliweyo kufuneka abonise eyona nkqubo yokuqokelela kwimarike ekujoliswe kuyo endaweni yepropathi yemathiriyeli yethiyori.
| lweNdawo | UVavanyo |
|---|---|
| Imilinganiselo kunye nokutyeba | Ubude, ububanzi, i-radius yekona, ubukhulu kunye nokunyamezela emva kokulungiswa |
| I-Warpage kunye ne-Flatness | I-curl ekhawulezileyo kunye nedala kwiqondo lokushisa elilawulwayo kunye nokufuma |
| Ukuncamathela kwiLayer | I-Peel, i-edge delamination, ukuguga kobushushu, ukufuma ukuguga kunye nokuguquguquka |
| Ukugoba kunye neTorsion | Ukuphindaphinda ukuguquguquka, ukuxhatshazwa, ukubunjwa kwe-crack kunye nokuguqulwa okusisigxina |
| Ubushushu kunye noZinzo lweDimensional | Ukugcinwa kwiindawo ezifudumeleyo, ukubonakaliswa kobushushu bomshicileli kunye ne-post-lamination shrinkage |
| Shicilela Ukuqina | Hlikihla, ukukrwela, ukudityaniswa kweekhemikhali, ukuvezwa kweUV kunye nokuncamathela okungaphezulu |
| Ukwenziwa Kwekhadi | Ngokuthe ngqo kwikhadi, ukudluliselwa kwakhona, ukudluliselwa kwe-thermal, i-embossing kunye neemvavanyo zokufaka iikhowudi njengoko kusebenza |
| RFID / Umsebenzi weMagnetic | Funda / bhala, ukuhambelana kokutshixa, ingqibelelo ye-eriyali kunye nokufakwa kwekhowudi yomgca emva kwemveliso |
| Ukuhlolwa koMgangatho | weMpahla |
|---|---|
| Iprofayile yokutyeba | I-avareji yegeyiji, i-point-to-point umahluko kunye nokunyamezelana okuninzi |
| Imilinganiselo yePhepha | Ubude, ububanzi, isikwere, umgangatho womphetho kunye nokunyamezela ukusika |
| I-Flatness kunye ne-Curl | Isaphetha samaphepha, ukuphakanyiswa komphetho kunye nesalathiso se-curl emva kokulungiswa |
| Umbala kunye ne-Opacity | L*, a*, b*, mhlophe, ukungafihli, iglosi kunye nomgangatho ovunyiweyo wokubonwayo |
| Umgangatho womphezulu | Uburhabaxa, inqanaba lonyango, imikrwelo, amabala amnyama, iijeli, ungcoliseko kunye nomgangatho wefilimu ekhuselayo |
| Iipropati zoomatshini | Ukuqina, ubude, ukuqina, impembelelo kunye nokuqina ngokweendlela ekuvunyelwene ngazo |
| Uvavanyo lweLamination | Ukudibanisa, ukushwabana, inkungu, ukuvalela, ukuzinza koshicilelo kunye nokukhululwa kwepleyiti |
| Ukulandeleka | IBanga, ibhetshi, umhla we-extrusion, uqhelaniso, umhla wonyango, ingxelo yokuhlolwa kunye nesalathiso sesatifikethi |
Iphepha le-PLA linobuthathaka kubushushu, ukufuma kunye nokugcinwa ixesha elide. Ukugcinwa okungahambi kakuhle kunokutshintsha ukucaba, unyango olungaphezulu, ukuprintwa kunye nokuziphatha kokulala. Iimfuno zokugcina kufuneka kuvunyelwene ngebakala elichanekileyo kunye nendlela yokupakisha.
Gcina amashiti avaliweyo kwindawo yokugcina impahla epholileyo, eyomileyo necocekileyo kude nelanga elithe ngqo kunye nezifudumezi.
Gcina amashiti ethe tyaba kwiipalethi ezixhaswayo kwaye uthintele uxinzelelo olugqithisileyo.
Khusela umphezulu eluthulini, kwi-oyile, kwiminwe, kwimikrwelo nakumanzi.
Izinto zomqathango kwindawo yokuprinta okanye kwigumbi lokuthambisa ngaphambi kokucubungula.
Sebenzisa ukusonga isithintelo sokufuma, ukhuseleko lwekona kunye neebhokisi zokuthumela ngaphandle ezomeleziweyo.
Faka i-inventri yokuqala, eyokuqala kwaye ujonge kwakhona unyango lomphezulu emva kokugcinwa ixesha elide.
Ukugxila kwishishini lekhadi: Ubukhulu bephepha, umphezulu, ukuprinta kunye nesakhiwo somaleko sinokujongwa malunga neemfuno zokwenyani zemveliso yekhadi.
Iigeyiji eziqhelekileyo kunye nobukhulu: Iinketho eziqhelekileyo ze-0.08-0.35mm kunye neefomathi zamaphepha ezilungelelanisiweyo zingaxoxwa.
Izilingo zokuprinta kunye ne-lamination: Iisampulu zinokuvavanywa kwi-offset, i-inkjet ye-UV, isikrini, ukuprintwa kwedijithali kunye nobushushu obuphantsi.
Inkxaso yeprojekthi ye-RFID: Izakhiwo zePhepha zingaphononongwa ngobunzima be-inlay, indawo ye-chip, i-antenna kunye nokuhambelana komfundi.
Amabango anoxanduva lokusingqongileyo: Amaxwebhu ezinto eziphathekayo anokudityaniswa nolwakhiwo lwekhadi eligqityiweyo kunye nemarike.
Ubonelelo lwe-B2B yefektri-ngqo: Ifanele abavelisi bamakhadi, abaguquli, abashicileli, iinkampani zeRFID, abarhwebi kunye nabasasazo.
Isicelo sekhadi esigqityiweyo, ubomi benkonzo obulindelekileyo kunye nemarike yendawo yokusingwa.
Umaleko we-PLA ofunekayo: undoqo oprintwayo, undoqo wombindi, umaleko ocacileyo okanye ngaphezulu.
Ukutyeba, ukunyamezela, ubungakanani bephepha, iinkozo/ukuqhelaniswa nobungakanani.
Umbala omhlophe, ocacileyo, omnyama okanye oqhelekileyo kunye nethagethi ye-opacity.
I-Offset, i-inkjet ye-UV, isikrini, i-Indigo okanye enye inkqubo yokushicilela kunye nenkqubo ye-inki.
Umatshini wokuLamination, izinto zangoku, iprofayili yeqondo lokushisa, uxinzelelo kunye nodidi lweplate.
Ubungakanani bekhadi eligqityiweyo, ubukhulu kunye ne-ISO efunekayo okanye ukucaciswa komthengi.
Itshiphu yeRFID, i-eriyali, ubukhulu be-inlay, umgca wemagnethi okanye imfuneko ye-chip yoqhagamshelwano.
Ukuvuthela, umxholo osekelwe kwibhayoloji, i-REACH, i-RoHS okanye ezinye iimfuno zoxwebhu.
Ubungakanani besampulu, uqikelelo lonyaka, indawo yokusingwa kunye neshedyuli yokuhanjiswa kwempahla eceliweyo.
Xoxa ngeProjekthi yeMaterial yeKhadi le-PLA
Akunjalo. Ukwenziwa kwekhadi kufuna ukuthambeka okulawulwayo, uburhabaxa bomphezulu, umbala, ukuncamatheliswa koshicilelo, ukunyamezelwa kobunzima kunye nokuziphatha kokulambisa. Cela ibakala elivavanyelwe ukuveliswa kwekhadi.
Ubungqingqwa obukhoyo obukhoyo bubandakanya i-0.08, 0.15, 0.17, 0.20 kunye ne-0.35mm. Iigeyiji ezenziwe ngokwezifiso zinokuphononongwa ngokwe-extrusion yamaphepha, ubume bomaleko kunye ne-MOQ.
Ewe. Ubungakanani beshiti eliqhelekileyo yi-300 × 480mm, kwaye iifomathi ezilungelelanisiweyo zinokuxoxwa ngokoyilo loshicilelo, ukufakwa kwekhadi kunye nezixhobo zokuthambisa.
Amaphepha e-PLA anokuvavanywa kwi-ID-1 amakhadi, kodwa ikhadi eligqityiweyo le-85.60 × 53.98mm kunye nobukhulu obuyi-0.76mm kufuneka buphunyezwe emva kokuprintwa, ukulanyiswa, ukupholisa nokubethelwa.
Ushicilelo lwe-Offset lunokuvavanywa ngonyango olufanelekileyo lomphezulu kunye ne-inki. Abathengi kufuneka bavavanye ukunamathela kwe-inki, ukomisa, ukuvimba, ukuxinana kombala kunye nokuchasana nomjikelezo we-lamination.
Amanqaku afanelekileyo aphathwayo okanye adityanisiweyo anokuhambelana. Amandla omphezulu, ukunyanga i-inki, ukuthamba, ivumba kunye nokudibanisa okungaphezulu kufuneka kuvavanywe kumshicileli ocetywayo.
Isixhobo sinokusebenziseka, kodwa iresiphi ye-PVC eqhelekileyo akufanele icingelwe. I-PLA ngokubanzi idinga umjikelo wobushushu ophantsi nolawulwa ngononophelo ngoxinzelelo oluqinisekisiweyo, ukuhlala kunye nokupholisa.
Oonobangela abaxhaphakileyo baquka ubushushu obugqithisileyo, iileya ezingalungelelananga, ukuqhelaniswa kwephepha elingangqinelaniyo, ukugqunywa koshicilelo ngokungalinganiyo, ukupholisa kakubi kunye nokulinganisa ikhadi phambi kokuba lilungiswe ngokupheleleyo.
Ewe, ziphantsi kwezilingo. Ubukhulu be-inlay, uyilo lwe-antenna, i-adhesive, indawo ye-chip, uxinzelelo lwe-lamination kunye nokuhambelana komfundi kufuneka kufakwe kwisakhiwo sekhadi.
I-PLA inokuthathelwa ingqalelo kusetyenziso olufutshane lwekhadi leebhokisi zehotele xa i-chip, inkqubo yokutshixa, ukuprinta, ukubonakaliswa komswakama kunye nokuphathwa ngokuphindaphindiweyo kuqinisekisiwe phambi kokuveliswa.
Ukusebenza kuxhomekeke kwibakala kunye nokwakhiwa. I-PLA inokufaneleka kumakhadi akhethiweyo amancinci kunye naphakathi, kodwa akufanele kuthathwe ukuba ifanise i-PVC, i-PETG okanye i-PC ekuxhathiseni ukushisa, impembelelo okanye ixesha elide lokuguquguquka.
Iphepha lekhadi le-PLA eliqhelekileyo alifanelekanga ngokuzenzekelayo ukukrolwa kwelaser ekhuselekileyo. I-Laser-markable formulations, umahluko, ukuphendula kobushushu kunye nokuqina kwekhadi kufuna uphuhliso oluzinikeleyo kunye novavanyo.
Elo bango lixhomekeke kwindawo eqinisekisiweyo kunye nokwakhiwa okupheleleyo. Iphepha le-PLA elicacileyo linokuthi lisetyenziswe kwimizi-mveliso, ngelixa i-inks, i-adhesives, iitshiphusi, i-eriyali, imivimbo okanye i-coatings inokutshintsha isimo sekhadi eligqityiweyo.
Kuphela xa ikhadi eligqityiweyo linesiqinisekiso esahlukileyo se-compost yasekhaya. Isiqinisekiso se-Industrial-compost asixhasi ngokuzenzekelayo ibango le-compost yasekhaya.
I-PLA kunye ne-PET zi-polymers ezahlukeneyo kwaye akufanele ngokuqhelekileyo zixutywe. Ukurisayikilishwa kwe-PLA kufuna umjelo ozinikeleyo wokuqokelela, ongafumanekiyo ngokubanzi kumakhadi.
Imibala emhlophe, ecacileyo, emnyama, eguquguqukayo kunye neyesiko ingaxoxwa. I-masterbatch yombala inokuchaphazela ushicilelo, ukunyibilika, ukusebenza koomatshini kunye nomda wesatifikethi.
Gcina ivaliwe, icaba kwaye yomile kwindawo yokugcina impahla elawulwayo kude nelanga kunye nobushushu. Khusela umphezulu kuthuli, i-oyile, imikrwelo kunye nokufuma, kunye namaphepha emeko phambi kokushicilela.
Ewe. Iisampulu zamaphepha kufuneka ziprintwe, zilamiwe, zipholiswe, zibethelwe ngenqindi kwaye zibe zezomntu ngamnye kusetyenziswa inkqubo yokuvelisa ecetywayo phambi kokuba iinkcukacha zemathiriyeli zamkelwe.
I-MOQ ixhomekeke kubukhulu, ubungakanani beshiti, umbala, unyango lomphezulu, ukugquma, ukupakisha kunye nokuba iprojekthi isebenzisa ukuqulunqwa kwekhadi-grade ekhoyo.
Nika isicelo ikhadi, uhlobo umaleko, ubukhulu, ubukhulu, umbala, indlela yoshicilelo, inkqubo lamination, RFID okanye umgca iimfuno, isiqinisekiso, ubungakanani kunye nendawo.
Qhagamshelana ne-WALLIS yePlastiki yamaphepha angundoqo ekhadi le-PLA, amaphepha aprintwayo kunye nezixhobo zekhadi-uluhlu lwesipho, ukunyaniseka, isitshixo sehotele, isiganeko, ukukhuthazwa kunye neenkqubo ze-RFID ezikhethiweyo. Iqela lethu lixhasa ukukhethwa kwegeyiji, ukuprintwa kunye nokuvavanywa kwe-lamination, ukuphononongwa kwesakhiwo sekhadi, amaxwebhu okusingqongileyo, ukucaciswa komgangatho kunye nokubonelela nge-B2B yefektri ngqo.
