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ISHIDI LE-WLS-INKJET
WALLIS
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Ifilimu ye -Wallis ecwebile ye-polycarbonate ehlanganiswe Ifilimu ye-overlay inikezwa ngogqinsi obungu-0.08mm no-0.10mm ukuze kufakwe ikhadi lochwepheshe. Isendlalelo se PC esikhanyayo sivikela izithombe eziphrintiwe futhi sisekela ukwakhiwa kwezendlalelo eziningi okuhlala isikhathi eside kwamakhadi omazisi, imininingwane yokufinyelela, amakhadi ahlakaniphile, amalayisense okushayela, amakhasi edatha yephasipoti namanye amaphrojekthi wamakhadi avikelekile.
Abathengi bangacacisa amabanga PC anandiwe, anameka aqinile, anganandiwe noma alashekayo ngokuya ngesendlalelo esiphrintiwe, impahla yekhadi lomzimba, okokusebenza kwe-lamination kanye nenqubo yomuntu siqu. Usayizi weshidi, ukuthungwa kwendawo, uhlangothi lokwemboza, ifomethi yokusika nokupakishwa kungathuthukiswa OEM ezimbonini zamakhadi neziguquli zemibhalo yezokuphepha.
Amanani alandelayo afingqa izinketho zomkhiqizo eziboniswe ekhasini lamanje. Ukubekezelela ukushuba kokugcina, ukwakhiwa kokumboza, ukuthungwa, ukusebenza kwamehlo kanye nefasitela le-lamination kufanele kuqinisekiswe eshidini ledatha yobuchwepheshe elivunyiwe, isampula kanye nesampula yokukhiqiza.
| Ipharamitha | Etholakalayo | Iphoyinti Lokuqinisekisa I-B2B |
|---|---|---|
| Izinto eziyisisekelo | I-polycarbonate ekhanyelayo ( PC ) | Qinisekisa izinga le-resin nokuthi iphrojekthi idinga ifilimu elijwayelekile, elisebenza nge-laser noma elikhethekile. |
| Ukuqina Okujwayelekile | 0.08mm / 80μm futhi 0.10mm / 100μm | Qinisekisa ukushuba okulinganiselwe, ukubekezelelana okuvunyelwe kanye nokwakhiwa kwekhadi eliqediwe eliphelele. |
| Ifomethi | A4, A3 namashidi asikwe ngokwezifiso | Nikeza ubukhulu beshidi, okusanhlamvu noma inkombandlela yomshini, isikwele kanye nezidingo zokubhalisa. |
| Ifilimu ye-overlay Ibanga | Izinketho ezinamekwe, ezinombala oqinile, ezingaboshiwe futhi ezilasekayo | Ibanga elilungile lincike kungqimba ephrintiwe eseduze, isistimu kayinki, impahla yekhadi lomzimba kanye nomklamo wokwenza umuntu nge-laser. |
| Ubuso | Icacile, icwebezelayo, i-matte, iqhwa noma ukuthungwa okucacisiwe | Gunyaza isicwebezelisi, inkungu, isiqondiso sokuthungwa kanye nomthelela obonakalayo ngesampula ebonakalayo. |
| I-Coating Side | Ukwelashwa kwebhondi ohlangothini olulodwa noma iphrojekthi ethile | Khomba ngokucacile uhlangothi lwe-lamination kanye nohlangothi oluphrintiwe emisebenzini yobuciko, emaphaketheni naseziqondisweni zokusebenza. |
| Inketho ye-Magnetic Stripe | I-LoCo noma ukulungiselelwa kazibuthe kwe-HiCo kungase kucashunwe ngokwehlukana | Qinisekisa ukuphoqelela, ububanzi bomugqa, indawo, umumo nokuhambisana nesishumeki sekhodi. Amabanga kazibuthe ayizakhiwo ezihlukene. |
| Ifomu Lokuhlinzeka | Sika amashidi; ezinye izinketho zokuguqula zingaphansi kokubuyekezwa | Qinisekisa ifilimu evikelayo, i-interleaving, isibalo sashidi, amalebula amabhokisi kanye nezidingo zephalethi. |
I- PC enamathiselwe Ifilimu ye-overlay isendlalelo sangaphandle esikhanyelayo esisetshenziswa ngaphezu kwesendlalelo sekhadi eliphrintiwe phakathi nokushisa nokucindezela kokushisa. Isisekelo se-polycarbonate sinikeza ukucaca okubonakalayo, ukuqina kanye nokuzinza kwe-dimensional, kuyilapho indawo yokubopha elungisiwe ikhethwa ukuthuthukisa ukunamathela kwe-interlayer ekwakhiweni kwekhadi okuhlosiwe.
I- Ifilimu ye-overlay ayilona ikhadi eliphelele futhi ayidali ukuphepha ngokwayo. Ukusebenza kwayo kuncike PC kumgogodla noma ku-inlay ephrintiwe, inki kanye nekhemistri enamathelayo, i-chip eshumekiwe noma i-antenna, umjikelezo we-lamination, ingcindezi yokupholisa, inqubo yokusika kanye nendlela yokugcina yomuntu siqu.
Ibanga elihlanganisiwe likhethwa lapho ungqimba oluphrintiwe oluseduze noma olukhethekile ludinga isixhumi esibonakalayo esilungisiwe. Uhlangothi lokumboza kufanele lubhekane nesendlalelo esiphrintiwe esigunyaziwe, futhi amandla e-peel kufanele alinganiswe ngemuva kokuthi ikhadi eliphelele lenziwe laminated kanye ne-conditioned.
Ifilimu elinamekwe ngokuqinile lihloselwe izimo zokubopha ezidinga kakhulu, njengokufakwa kukayinki osindayo, izendlalelo zokuphrinta okukhethekile noma ukwakhiwa okuyingxube. Akufanele kukhethwe kuphela egameni lomkhiqizo; isistimu ye-inki, imingcele ye-substrate kanye ne-lamination kufanele ihlolwe ndawonye.
Ifilimu PC engaboshiwe ingase isetshenziswe ezakhiweni ezihambisanayo zonke- PC lapho amafilimu akhethiwe ehlangana ngokuqondile ngaphansi kokushisa okulawulwayo nokucindezela. Ukufaneleka kwayo kufanele kuqinisekiswe ngamamaki efilimu kanye nokwakhiwa kwemibhalo.
I-Laserable Ifilimu ye-overlay iqukethe ukwakheka okuphendula nge-laser okudizayinelwe ukwenza kube ngokwakho okunokugqama okuphezulu ngaphakathi komzimba wekhadi. I-coated ejwayelekile ecacile Ifilimu ye-overlay akumele kuthathwe ngokuthi iyalaseka. Abathengi kufanele bacacise ubude begagasi be-laser, ukujula kokwenza kube ngokwakho, ukugqama kwesithombe, idizayini enewindi elicacile kanye nezidingo zokuphepha.
0.08mm Sula PC Ifilimu ye-overlay
0.10mm Sula PC Ifilimu ye-overlay
| Isici Sokukhetha | 0.08mm / 80μm | 0.10mm / 100μm |
|---|---|---|
| Iqhaza Lomklamo Ojwayelekile | Ungqimba oluvikelayo oluncane lapho isitaki sekhadi esiphelele sinemvume yogqinsi olulinganiselwe. | Isendlalelo esingaphandle esijiyile lapho kudingeka umnikelo wezinto ezengeziwe noma indawo eqine kakhudlwana. |
| Isitaki Sekhadi | Isebenziseka kuzakhiwo ezinezendlalelo eziningi eziqukethe izingqimba ezimbalwa zokuphrinta, ukuphepha noma zikagesi. | Iwusizo uma isakhiwo esiyinhloko sizacile noma idizayini yabela ukujiya okwengeziwe kokuthi Ifilimu ye-overlay . |
| Icubungula isibuyekezo | Hlola ukuphatha, ukulawula okumile, ukuphakelwa kwamashidi, ukubhaliswa kanye nengozi yokugoqa. | Hlola isikhathi sokushisa, ingcindezi yokupholisa, umthwalo wokubhoboza kanye nokuqina kokugcina kwekhadi. |
| Isinqumo Sokugcina | Khetha ukujiya emdwebeni wekhadi ophelele, hhayi kokuthi Ifilimu ye-overlay kuphela. Qinisekisa ukushuba okuphelele, i-lamination, flatness, ukugoba, i-torsion, ikhwalithi yomphetho kanye nokwenza kube ngokwakho ngemva kokukhiqiza. | |
| Isidingo Sephrojekthi | Ibanga Elinconywayo ukuze Lihlole | Ukuqinisekisa Okudingekayo |
|---|---|---|
| Ukuvikela okusobala phezu kwesendlalelo esiphrintiwe PC esihambisanayo | Okungagqokiwe noma okunganandisiwe kucace PC Ifilimu ye-overlay | Ukucaca okubonakalayo, ukusebenzisana kokuphrinta, i-lamination bond kanye nokuthungwa kwendawo. |
| Ukufakwa kukayinki osindayo noma isixhumi esibonakalayo esiphrintiwe esinzima | Kucace okunamekwe ngokuqinile PC Ifilimu ye-overlay | Ukwelashwa kwe-inki, ukuhambisana kwe-coating, amandla e-peel kanye ne-delamination yonqenqema ngemva kokulungiswa. |
| Idokhumenti ye-ID evikelekile eyenziwe nge-laser | I-Laserable PC Ifilimu ye-overlay noma isendlalelo esidizayinelwe kalula | Ubude beza be-Laser, ukugqama, ukulungiswa, ukujula, isithombe sesipoki nokusebenza kwewindi elicacile. |
| Indawo yokuqinisekisa ye-matte noma ethintekayo | I-matte ecacisiwe, i-fine-matte, i-velvet noma ukuthungwa kwesithwathwa | Ukucwebezela, inkungu, ukufundeka, ukubukeka okuthintekayo kanye nokuhuzuka ngemva kokucwenga. |
| Ikhadi lomugqa wamagnetic | Ezinikezelwe PC umugqa kazibuthe Ifilimu ye-overlay | Ukuphoqwa, ukubekwa kwemigqa, umbhalo wekhodi, isinyathelo esingaphezulu, ukunamathela kanye nokuhuzuka. |
| PC Ifilimu ye-overlay iboshelwe kokuthi PVC , PETG , okunamathelayo noma isendlalelo esikhethekile | Ibanga elihambisana nephrojekthi elihambisanayo noma elinamathelayo | Ukunwetshwa okushisayo kwe-Hybrid-material, amandla ebhondi, ukugoqa, ukuqhekeka nokuguga okusheshayo. |
Ifilimu ye-overlay izinto ezibonakalayo kufanele zikhethwe njengengxenye yesistimu yekhadi eliphelele. Ukufaka enye i-polymer kwenye ngaphandle kokulungisa umnyombo, umjikelezo wokumboza kanye ne-lamination kungabangela ukuhlangana okubuthakathaka, ukugoqa, inkungu noma ukuqhekeka.
| I-Material | Common Strength | Typical Project Fit | Indawo Yokufaneleka Eyinhloko |
|---|---|---|---|
| PC | Ukuqina, ukumelana nokushisa, ukuzinza kwe-dimensional nokuhambisana nokwakhiwa kwamakhadi PC okuvikeleka okuphezulu. | Umazisi kahulumeni, ilayisense yokushayela, ikhasi ledatha yephasipoti, imininingwane evikelekile kanye namaphrojekthi ahlala isikhathi eside e-e-card. | Qinisekisa ukuqina kwe-laser, ukuthungwa, ukucindezelwa kwangaphakathi, ukunamathela kanye nokuqedela PC -ibhondi yesendlalelo. |
| PVC | Ukucubungula okungabizi kakhulu kanye nokusetshenziswa okubanzi ekukhiqizeni okujwayelekile kwamakhadi epulasitiki. | Ubulungu, isipho, ukufinyelela, ihhotela namakhadi okuhweba ajwayelekile. | Qinisekisa i-Vicat, i-coating, ukuhambisana kukayinki kanye nezidingo zokuqina kwekhadi. |
| PETG | Ukubukeka okucacile nezici eziwusizo zokubopha ezakhiweni zamakhadi PETG ezihambisanayo. | PETG -amakhadi asekelwe, izinhlelo ezizinzile ezikhethiwe kanye nemiklamo ekhethekile ebonisa ngale. | Qinisekisa Ifilimu ye-overlay /ukuhambisana okuyisisekelo, ukushwabana, iwindi lokucwala nokuziphatha kokusika. |
Ezakhiweni eziningi zamakhadi, ihluzo ziphrintwa kungqimba lwangaphakathi olumhlophe noma olusobala lwe- PC bese zivikelwa okucacile Ifilimu ye-overlay . Ukuphrinta okuqondile ngaphandle Ifilimu ye-overlay kudinga indawo ephrintekayo egunyazwe ngokwehlukana. Ungacabangi ukuthi i-bonding coating nayo iyingubo yokunyathelisa.
Izendlalelo ezihambisanayo PC zingakha umzimba wekhadi ohlanganiswe kakhulu ngaphansi kwezinga lokushisa elilawulwayo nokucindezela. Izincomo zokumboza umphakeli, ukuma kwefilimu, izidingo zokomiswa kwangaphambili, umjikelezo wokucwenga kanye nenqubo yokupholisa kufanele kulandelwe. Idokhumenti eqediwe kufanele ihlolwe kunokuthembela ezintweni zefilimu eluhlaza kuphela.
Uma PC ihlanganiswa ne PVC , PETG , amafilimu anamathelayo, ama-coatings aphrintiwe noma ama-inlays kagesi, umehluko ekuziphatheni okuthambisayo kanye nokwandiswa kwe-thermal kungase kuthinte ukubopha nokucaba. Kudingeka ibanga elihlanganisiwe eliqondene nephrojekthi kanye ne-pilot lamination.
Ukucaca okujwayelekile PC Ifilimu ye-overlay kunikeza ukuvikeleka kodwa kungase kungakhiqizi umehluko we-laser odingekayo. Kumadokhumenti e-ID enziwe nge-laser, cacisa ukuthi kuyadingeka yini umbhalo, ukuma ngobude, ukuqoshwa okuthintekayo, isithombe sewindi elibonisa ngale noma ukusebenza kwesithombe se-laser eminingi, bese uhlola ungqimba olulayikayo oluhlongozwayo ngezisetshenziswa ezihlosiwe.
I-Matte PC Ifilimu ye-overlay Indawo
I-Frosted PC Ifilimu ye-overlay Indawo
Amakhadi kamazisi kazwelonke nawesifunda: ukuvikela okusobala kanye nokwakhiwa okuvikelekile kwezendlalelo eziningi PC , kuncike ekucacisweni kwabakhiphile.
Amalayisense okushayela: ukuvikela okuqinile kwedatha ephrintiwe kanye nezendlalelo ozikhethela zokwenza ngelaser.
Amakhasi edatha yephasiphothi: PC Ifilimu ye-overlay izingxenye zezinhlaka zedokhumenti yokuvikeleka okuphezulu.
I-ID ye-elekthronikhi kanye nemininingwane yokufinyelela: ukuvikelwa kwezendlalelo eziphrintiwe ezizungeze i-chip ehambisanayo nokwakhiwa kwezinti.
Amakhadi okunakekelwa kwezempilo nawomshwalense: izifakazelo zempilo ende ezidinga izithombe ezicacile kanye nokulawulwa kwe-lamination.
Ukubhenka nokuthuthukiswa kwamakhadi okukhokha: ukuhlolwa kwezinto ezibonakalayo zamaphrojekthi alawulwa umkhiphi, uhlelo lwekhadi kanye namazinga obuchwepheshe asebenzayo.
Umfanekiso wemboni Ifilimu ye-overlay s: amalebula akhethiwe noma amaphaneli lapho izimfuneko eziqondile zokumboza, ukuphrinta nezemvelo ziye zafaneleka.
| Step | Buyer Input | Technical |
|---|---|---|
| 1. Ukubuyekezwa Kwesakhiwo | Umdwebo wesendlalelo, ukujiya kwekhadi lokugcina, i-core material, i-chip/inlay nezici zokuphepha. | Ifilimu ye-overlay ukujiya kokuqala, ibanga, ukunamathela kanye nokunconywa kwendawo. |
| 2. Ukubukeza Ukuphrinta | Inqubo yokuphrinta, uhlobo lukayinki, indlela yokwelapha, ukumbozwa kanye nobuchwepheshe bokwenza kube ngokwakho. | I-Coating-side orientation kanye nohlelo lokuhlola ukuhambisana. |
| 3. Ukunikezwa Kwesampula | Usayizi weshidi, inani nefomethi yokuhlola. | Amasampula ezinto ezimele anokuhlonza neziqondiso zokuphatha. |
| 4. I-Pilot Lamination | Izendlalelo zangempela eziphrintiwe, izinto zokusebenza, amapuleti, izinga lokushisa, ingcindezi, umjikelezo wokuhlala kanye nokupholisa. | Amashidi okushayela indiza noma amakhadi okuhlola kwebhondi, ukubona nokulinganisa. |
| 5. Isampula Legolide | Ukubukeka okugunyaziwe, umphumela we-laser, amandla ekhasi kanye nokuhlolwa kwekhadi eliqediwe. | Ireferensi ebonakalayo esayiniwe kanye nezincazelo okuvunyelwene ngazo zokukhiqiza ngobuningi. |
| 6. Ukulawulwa kweqoqo | Izinga lokuhlola, indlela yokuhlola kanye nezidingo zokulandeleka. | Amarekhodi eqoqo, amalebula kanye nombiko wokuhlolwa okuvunyelwene ngawo lapho kunenkontileka. |
Imikhawulo yokwamukela kufanele kuvunyelwane ngayo ngaphambi koku-oda. Izindlela zokuhlola namanani angase ahluke ngohlelo lwedokhumenti yokuphepha, ngakho-ke izinto ezilandelayo ziwuhlaka olusebenzayo lokufaneleka esikhundleni sokucaciswa kwendawo yonke.
| Into Yokuhlola | Okufanele Uhlole | Isiteji Esinconyiwe |
|---|---|---|
| Ubukhulu kanye Nobukhulu | Ukushuba okuzisholo, ukuhluka, ubukhulu beshidi, ubukwele kanye nesimo somphetho. | Izinto ezisetshenziswayo ezingenayo kanye neqoqo ngalinye lokukhiqiza. |
| Ukubukeka kwe-Optical | Ukungafihli, inkungu, isicwebezelisi, ukuthungwa, ukungcoliswa, amajeli, ukuklwebheka kanye nemigqa yokumboza. | Ukuhlolwa okungenayo nangemva kokulahlwa. |
| Ukuhlonza Kokumboza | Lungisa uhlangothi olunamekwe, ukufana kokunamathela, ukumaka inkatho kanye nokuma kwephakheji. | Ngaphambi kokuphrinta noma i-lamination. |
| I-Lamination Bond | Amandla e-peel, ukuhlukaniswa konqenqema, amabhamuza, ukwenza isiliva kanye ne-delamination ngemva kokubeka isimo. | Amakhadi okushayela kanye namasampula ekhadi aphelile. |
| Ukuzinza kweDimensional | I-Curl, ukuncipha, ukuhlanekezela, ukucaba kwekhadi nokubhaliswa ngemva kokushisa nokupholisa. | Ngemuva kokushayela umshayeli futhi noma nini lapho umjikelezo ushintsha. |
| Ukuqina Kobuso | Ukuhuzuka, ukuklwebheka, ukuchayeka kwamakhemikhali kanye nokumelana nokuhlanza kusetshenziswa indlela yokuhlola iphrojekthi. | Ukufaneleka kwekhadi eliqedile. |
| Ukusebenza kwe-Laser | Ukugqama, ukulungiswa, isikali esimpunga, ukujula, isici esithintekayo kanye nekhwalithi yesithombe sewindi samabanga asebenzisekayo. | Isampula yegolide nokuqinisekiswa kwenqwaba lapho kudingeka. |
| Umsebenzi we-Electronic | Ukusabela kwe-chip, ibanga lokufunda ngaphandle kokuthinta kanye nokuqhubeka kwe-antenna ngaphambi nangemuva kokucwiliswa. | Linga futhi uqede ukuhlolwa kwamakhadi ahlakaniphile. |
Izindawo ezicacile Ifilimu ye-overlay kufanele zivikelwe othulini, imihuzuko, umswakama nokunqwabelana okungalungile. Ukupakishwa kungase kuhlanganise ifilimu evikelayo noma ukushiya phakathi, ukugoqa okumelana nomswakama, amabhokisi, amaphalethi namalebula angokwezifiso. Gcina impahla engavuliwe eyisicaba endaweni ehlanzekile neyomile kude nelanga eliqondile, imithombo yokushisa namakhemikhali anolaka.
Ngaphambi kokusetshenziswa, vumela amashidi apakishiwe ukuthi afinyelele isimo segumbi lokukhiqiza futhi ulandele indlela yokuphatha okuvunyelwene ngayo noma inqubo yokomisa kwangaphambili. Ungawasusi amaphakheji okuvikela ngaphambi kwesikhathi esidingekayo, futhi ugcine ukuhlonza okusohlangothini olunamathelayo ngephakethe ngalinye eliyingxenye.
I-Pallet Packaging evikelekile
Vikela Ukupakisha Okuthekelisa
I-Wallis isekela izimboni zamakhadi, amaphrinta okuvikela, iziguquli kanye nabasabalalisi bezinto ezibonakalayo PC ngamafilimu abalulekile, acacile Ifilimu ye-overlay s, amafilimu ahlanganiswe Ifilimu ye-overlay , amafilimu asebenzisekayo, umugqa uzibuthe Ifilimu ye-overlay nezinto zamakhadi ezihlobene. Inzuzo engokoqobo ikhono lokubuyekeza isitaki sekhadi esiphelele esikhundleni sokucaphuna ishidi elingalodwa elibonisa ngale.
0.08mm kanye no-0.10mm ecacile PC Ifilimu ye-overlay izinketho zokuhlola ukukhiqizwa kwekhadi.
Izakhiwo ezinamekwe, ezinamekwe ngokuqinile, ezingamboziwe, ezilasekayo nezikhethekile ezingaphansi kokubuyekezwa kwephrojekthi.
Ukusika amashidi ngokwezifiso, ukuthungwa kwendawo, ukuma kwe-coating, amalebula nokupakisha okuthekelisa.
Amasampula ezinto ezibonakalayo zokuphrinta, i-lamination, i-laser kanye nokuqinisekiswa kwekhadi eliphelile.
Ukusekela okuphelele- PC kanye nezakhiwo zamakhadi ayingxube afanelekayo.
Ukucaciswa kweqoqo kanye nokulawula Isampula Legolide lokuphinda ama-oda OEM .
Ithimba Lezobuchwepheshe Nezithekelisa
Amaphrojekthi we-Global B2B
Izinto zamakhadi Ukukhiqiza
| Ulwazi Oludingekayo Imininingwane | Yesibonelo Yokuhlinzeka |
|---|---|
| Isicelo | Umazisi kazwelonke, ilayisense yokushayela, ikhasi ledatha yephasipoti, ikhadi lokufinyelela, ikhadi le-e-khadi, ukuhlolwa kwebhange noma imboni Ifilimu ye-overlay . |
| Isakhiwo Sekhadi | Umdwebo wesendlalelo esigcwele, impahla ngayinye nogqinsi, ukujiya kwekhadi lokugcina, iwindi elicacile nezinto zikagesi ezishumekiwe. |
| Ifilimu ye-overlay Imfuneko | 0.08mm noma 0.10mm, inandiwe/ayinandiwe/eqinile-inamakwe/i-laserable, ukuthungwa kwendawo kanye nohlangothi lokunamathela. |
| Ukuphrinta Noyinki | Ukuphrinta kwe-offset, isikrini, idijithali noma ukuphepha; uphawu lukayinki, uhlelo lokuphulukisa kanye nokufakwa kukayinki. |
| Inqubo ye-Lamination | Imishini, uhlobo lwepuleti, izinga lokushisa, ingcindezi, isikhathi sokuhlala, ingcindezi yokupholisa kanye nencazelo yesici samanje. |
| Ukwenza kube ngokwakho | Imodeli ye-laser nobude begagasi, imfuneko yokuqhathanisa, isici esithintekayo, isithombe esinewindi elicacile noma ukwenza kube ngokwakho okungeyona eyelaser. |
| Ishidi nokupakishwa | Ububanzi × ubude, inani, inani lephekhi, ifilimu yokuvikela, ilebula yebhokisi kanye nezidingo zephalethi. |
| Amadokhumenti Ekhwalithi | I-TDS, i-SDS, umbiko wokuhlola, ukulandeleka, izimemezelo zokulawula noma amadokhumenti aqondene nomkhiphi. |
Isetshenziswa njengesendlalelo sangaphandle esisobala ekhadini le-polycarbonate elaminethiwe kanye nezakhiwo zemibhalo yokuphepha. Ivikela imininingwane ephrintiwe futhi ingaba negalelo ekuthembekeni kwamakhadi omazisi, amalayisense okushayela, ama-e-cards nezinye iziqinisekiso eziqeqeshiwe.
Okumboziwe Ifilimu ye-overlay kunendawo ehlanganisiwe elungisiwe ehloselwe ukuthuthukisa ukunamathela kusendlalelo esiseduze esigunyaziwe. Ifilimu PC engamboziwe ingase ifanelekele zonke- PC izakhiwo ezihambisanayo. Ukukhetha okulungile kuncike kungqimba oluphrintiwe, uyinki, ibanga lefilimu kanye nomjikelezo we-lamination.
Akunjalo. Ukuqoshwa kwe-laser kudinga ibanga elisabela nge-laser elidizayinelwe ubude begagasi obuhlosiwe nokugqamayo. Cacisa izimfuneko ze-laser ngaphambi kokuthatha isampula kunokuthatha ukuthi yonke into ebonisa ngale PC Ifilimu ye-overlay ingenziwa ibe ngeyakho nge-laser.
Khetha emdwebeni ophelele wesendlalelo sekhadi kanye nethagethi yokujiya yokugcina. Ibanga elingu-0.08mm lishiya ukushuba okwengeziwe kwezendlalelo zangaphakathi, kuyilapho u-0.10mm unikela ngempahla eyengeziwe esakhiweni sangaphandle. Kokubili kudinga ukuhlolwa kwekhadi eliqediwe.
Ukwakhiwa okuxubile kungase kwenzeke ngendawo enamathelayo efanelekile noma isendlalelo esibophezelayo, kodwa kufanele sihlolwe ngenxa yokuthi PC , PVC kanye ne PETG inokuziphatha okuhlukile kokushisa nobukhulu. Ungafaki konke- PC umjikelezo wokulanisa ekhadini eliyingxubevange ngaphandle kokufaneleka.
Ukuphrinta okuqondile kudinga indawo ephrintekayo evunyelwe ngokwehlukana. Ezakhiweni eziningi zamakhadi, ukuphrinta kwenziwa kumongo wangaphakathi noma isendlalelo sokuphrinta futhi okucacile Ifilimu ye-overlay kune-laminated ngaphezu kwayo. I-bonding coating ayiyona into ezenzakalelayo yokuphrinta.
Ukucwebezela okucacile, okucwebezelayo, okucwebezelayo, okuyisithwathwa noma okunye ukwakheka kwephrojekthi ethile kungase kuhlolwe. Ukutholakala kwe-texture kanye nesicwebezelisi esiqondile noma inkungu kufanele kuqinisekiswe ngesampula ebonakalayo kanye nekhotheshini.
Ayikho Ifilimu ye-overlay eyodwa engaqinisekisa lokho. Izendlalelo ezihambisanayo PC zingakha isakhiwo esihlanganiswe ngokuqinile, kodwa ukuvikeleka kuncike ekwakhiweni kwedokhumenti ephelele, izinto ezilawulwayo, ukwenza ngezifiso i-laser, ama-chips, ukuphrinta kokuvikela, ukukhishwa kanye nesistimu yokuqinisekisa.
Izakhiwo zomugqa kazibuthe ozinikele Ifilimu ye-overlay zingacashunwa. Qinisekisa ukuphoqelela kwe-LoCo noma kwe-HiCo, ububanzi bomugqa, indawo, umumo, isinyathelo esingaphezulu nokuhambisana nesishumeki esihlosiwe nezinga lekhadi.
Ukuhlola ukusebenzisana kokuphrinta, i-lamination bond, i-curl, ukukhanya okukhanyayo, ukuthungwa kwendawo, ukusika, ukugoba, ukuxubha, ukuhuzuka, ukuchayeka kwamakhemikhali, ukwenza ngezifiso i-laser kanye nomsebenzi we-elekthronikhi lapho kufanele khona. Gunyaza Isampula Legolide ngaphambi kokunikezwa kwenqwaba.
Yebo. I-A4, i-A3 kanye namashidi asikwe ngokwezifiso angabuyekezwa kanye nefilimu yokuvikela, ukushiya phakathi, ubuningi bephakethe, amalebula, amabhokisi kanye nezidingo zephalethi. Izinketho zokugcina zincike ebangeni lefilimu elikhethiwe kanye nokucaciswa kwe-oda.
Hlinzeka ngohlelo lwekhadi, ukwakheka kwesendlalelo esigcwele, Ifilimu ye-overlay ukujiya, imfuneko eboshiwe noma enwebekayo, usayizi weshidi, inqubo yokuphrinta, uyinki, umjikelezo wokumboza, isistimu ye-laser nokuhlola okudingekayo. Lokhu kuvumela isampuli ehambisana kakhulu ukuthi ikhethwe.
