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WLS-INKJƐT SHEET
WALLIS
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| Wid : | |
| Tik : | |
| Surface: | |
| Kwantiti: | |
Wallis klia polycarbonate koted ovalay film de saplae in 0.08mm en 0.10mm tiknes fo profeshonal kad lamination. Di transparent PC layt de protɛkt grafik dɛn we dɛn print ɛn sɔpɔt durable multi-layer kɔnstrɔkshɔn fɔ aydentiti kad, akses kredibiliti, smat kad, drayva laysens, paspɔt data pej ɛn ɔda sikyɔriti kad prɔjek dɛn.
Di wan dɛn we de bay kin spɛsifa di PC gred dɛn we dɛn kɔt, strɔng, we nɔ kɔt ɔ we dɛn kin yuz lɛsa akɔdin to di layt we dɛn print, kad-bɔdi matirial, lamination ikwipmɛnt ɛn pɔsnalayzeshɔn prɔses. Shit saiz, surface texture, coating side, cutting format ɛn pakej kin divɛlɔp fɔ OEM kad faktri ɛn sikyɔriti-dɔkyumɛnt kɔnvɔta.
Di valyu dɛn we de dɔŋ ya de sɔma di prɔdak opshɔn dɛn we dɛn sho na di pej we de naw. Faynal tiknɛs tolɛreshɔn, kɔtin kɔnstrɔkshɔn, tɛkstɔr, ɔptik pefɔmɛns ɛn laminɛshɔn winda fɔ kɔnfyus insay di aprɔv tɛknikal data shit, kot ɛn prodakshɔn sampul.
| Paramita | Avaylabl Spɛsifikeshɔn | B2B Kɔnfɔmeshɔn Point |
|---|---|---|
| Base Material | Transparent polikabɔnɛt (PC) . | Kɔnfɛm rɛsin gred ɛn if di prɔjek nid standad, laser-riaktiv ɔ spɛshal sikyɔriti fim. |
| Standart Tiknɛs we de na di wɔl | 0.08mm / 80μm ɛn 0,10mm / 100μm | Konfam nominal tiknes, permitted tolerans ɛn totɛl finish-kad kɔnstrɔkshɔn. |
| Fɔmat | A4, A3 ɛn kɔstɔm-kɔt sheet dɛn | Gi sheet dimɛnshɔn, gren ɔ mashin dairekshɔn, skwea ɛn rɛjista rikwaymɛnt. |
| Ovalayz Gret | Opshɔn dɛn we dɛn kɔt, we strɔng, we nɔ kɔt ɛn we dɛn kin yuz lɛsa | Di kɔrɛkt gred dipen pan di adjasent print layt, ink sistɛm, kad-bɔdi matirial ɛn laser-pɔsɔnalayzeshɔn dizayn. |
| Sho | Klia, glos, mat, frɔst ɔ spɛsifikɛd tɛkstɔr | Apruv glos, haz, tɛkstɔr dairekshɔn ɛn vijual ifɛkt wit wan fizik sampul. |
| Sayd we dɛn kin yuz fɔ kɔtin | Singl-sayd ɔ prɔjɛkt-spɛsifi k bonding tritmɛnt | Fɔ no klia wan di lamination sayd ɛn print sayd insay artwok, pak ɛn ɔpreshɔn instrɔkshɔn. |
| Magnɛtik Strayp Opshɔn | LoCo ɔ HiCo magnɛtik kɔnfigyushɔn dɛn kin kot sɛpret | Kɔnfɛm kɔs, strɛp wit, pozishɔn, ɔriɛnteshɔn ɛn ɛnkɔda kɔmpatibiliti. Magnɛtik gred dɛn na difrɛn kɔnstrɔkshɔn dɛn. |
| Fɔm fɔ di Sapɔt | Kɔt sheet dɛn; ɔda kɔnvɔyt opshɔn dɛn we dɛn kin rivyu | Kɔnfɛm protɛktiv fim, intaliv, sheet kɔnt, katon lɛbl ɛn palet rikwaymɛnt. |
Wan PC kɔt ɔvlay na di transparent ɔda layt we dɛn kin yuz ɔp wan print kad layt we dɛn de du ɔt-ɛn-prɛshɔn lamination. Di polycarbonate bays de suplai optik klia, tafnɛs ɛn dimɛnshɔnal stebiliti, we di pripia bɔnding sɔfays de pik fɔ impɔtant intalay adheshon insay di intended kad kɔnstrɔkshɔn.
Di ɔvlay nɔto di kɔmplit kad ɛn i nɔ de mek sikyɔriti bay insɛf. I pefɔmɛns dipen pan di PC kɔr ɔ print inlay, ink ɛn kɔtin kemistri, ɛmbaded chip ɔ ɛntena, lamineshɔn saykl, kol prɛshɔn, kɔt prɔses ɛn fayn pɔsnalayzeshɔn we.
Dɛn kin pik wan gred we dɛn kɔt we di adjasent print ɔ spɛshal layt nid fɔ gɛt pripia bonding intafɛs. Di sayd we dɛn de kɔt fɔ fes di layt we dɛn dɔn gri fɔ print, ɛn dɛn fɔ mɛzhɔ di trɛnk we di kad gɛt afta dɛn dɔn laminate ɛn kɔndishɔn di kɔmplit kad.
Strɔng-kɔt fim na fɔ mɔ dimand bonding kɔndishɔn, lɛk ebi ink kɔvarej, spɛshal print layers ɔ haybrid kɔnstrɔkshɔn. Nɔto fɔ jɔs pik am frɔm di prɔdak in nem; di ink sistεm, sabstεrayt εn laminεshכn paramita dεm fכ evaluate tכgeda.
Nɔn-kɔt transparent PC film kin yuz insay kɔmpitabl ɔl-PC strɔkchɔ usay di film dɛn we dɛn dɔn pik kin bon dairekt ɔnda kɔntrol ɔt ɛn prɛshɔn. I fit fɔ kɔnfyus wit di ɛksaktɔl fim gred ɛn dɔkyumɛnt kɔnstrɔkshɔn.
Laserable overlay gɛt wan laser-responsive fɔmyulashɔn we dɛn mek fɔ ay-kɔntrast pɔsnalayzeshɔn insay di kad bɔdi. Wan standad klia koted ovalay nɔ fɔ asum se i laserable. Di wan dɛn we de bay fɔ spɛsifa di laser wɛvlɛnj, pɔsnalayzeshɔn dip, imej kɔntrast, klia-windo dizayn ɛn sikyɔriti rikwaymɛnt dɛn.
0.08mm Klia PC Ɔvlay
0.10mm Klia PC Ɔvlay
| Selekshɔn Faktɔ | 0.08mm / 80μm | 0.10mm / 100μm |
|---|---|---|
| Tipik Dizayn Rol we dɛn kin du | Tinna protɛktiv layt usay di totɛl kad stak gɛt limited tiknɛs alawɛns. | Tik ɔta layt usay ɔda matirial kɔntribyushɔn ɔ wan mɔ robust sɔfays nid fɔ de. |
| Kad Stak we dɛn kin yuz | Yuzful fɔ multi-layer strɔkchɔ dɛn we gɛt sɔm print, sikyɔriti ɔ ilɛktronik layers. | Yusful we di kɔr strɔkchɔ tinap ɔ di dizayn alɔkat mɔ tik to di ɔvlay. |
| Rivyu fɔ Prɔses | Chek hanlin, statik kontrכl, shit fidin, rεjistεshכn εn risk fכ kכl. | Chek di tɛm we yu de ɔt, di prɛshɔn we yu de kol, di lod we yu de panch ɛn di fayn we aw di kad de stiff. |
| Faynal Disishɔn | Pik tik frɔm di kɔmplit kad drɔin, nɔto frɔm di ɔvlay nɔmɔ. Validate totɛl tiknɛs, laminɛshɔn, flatnɛs, bɛnd, torshɔn, edj kwaliti ɛn pɔsnalayzeshɔn afta prodakshɔn. | |
| Projek Rikwaymɛnt | Rikɔmɛnd Gret fɔ Evaluate | Rikwayd Valideshɔn |
|---|---|---|
| Transparent protɛkshɔn oba wan kɔmpitabl PC print layt | Nɔn-kɔt ɔ standad kɔt klia PC ɔvlay | Optik klia, print intarakshɔn, laminɛshɔn bond ɛn sɔfays tɛkstɔr. |
| Hevi ink kɔvarej ɔ at fɔ print intafɛs | Strɔng-kɔt klia PC ɔvlay | Ink curing, coating compatibility, peel strɛngth ɛn edj delamination afta kondishɔn. |
| Laser-pɔsɔnalized sikyɔriti ID dɔkyumɛnt | Laserable PC ovalay ɔ dizayn laserable layt | Laser wevlɛnj, kɔntrast, rizɔlt, dip, gɔst imej ɛn klia-windo pefɔmɛns. |
| Mat ɔ taktil kredibiliti sɔfays | Spesifi k mat, fayn-mat, velvet ɔ frɔst tɛkstɔr | Glos, haze, ridabiliti, taktil apinans ɛn abrashɔn afta lamination. |
| Magnɛtik strɛp kad | Dediket PC magnɛtik strɛp ɔvlay | Kɔs, strɛp plesmɛnt, ɛnkɔdin, sɔfayz stɛp, adheshon ɛn abrashɔn. |
| PC ɔvlay we dɛn bon to PVC, PETG, adhesive ɔ spɛshal layt | Projek-spɛsifi k kɔt ɔ adhesive-kɔmpatibl gred | Hybrid-material thermal expansion, bond strכng, kכl, krak krak εn aksεlεrat εj. |
Dɛn fɔ pik di tin dɛn we dɛn go yuz fɔ ɔvalayz as pat pan di kɔmplit kad sistɛm. if yu sכbstityuyt wan polimכr fכ כda wan we yu nכ ajɔst di kכr, kכt εn laminεshכn saykl i kin mek wik bכnd, kכl, hεz כ krak.
| Matirial | Kɔmɔn Strɔng | Tipik Projɛkt Fit | Men Kwalifayeshɔn Point |
|---|---|---|---|
| PC | Tafnɛs, ɔt rɛsistɛns, dimɛnshɔnal stebiliti ɛn kɔmpatibiliti wit ay-sikyɔriti PC kad kɔnstrɔkshɔn dɛn. | Gɔvmɛnt ID, drayva laysens, paspɔt data pej, sikrit kredibiliti ɛn i-kad prɔjek dɛn we go de te. | Kɔnfɔm laserability, tɛkstɔr, intanɛnt strɛs, kɔtin ɛn kɔmplit PC-layer bond. |
| PVC we dɛn kin yuz | Kɔst-ɛfɛktiv prɔsesin ɛn brayt yus insay kɔvɛnshɔnal plastic-kad prodakshɔn. | Membaship, gift, akses, ɔtel ɛn standad kɔmɛshɔnal kad dɛn. | Kɔnfɛm Vicat, kɔtin, ink kɔmpitibliti ɛn kad durabiliti rikwaymɛnt. |
| PETG we dɛn kɔl PETG | Klir apinans ɛn yusful bonding kwaliti dɛn na kɔmpitabl PETG kad strɔkchɔ dɛn. | PETG-based kad, sɛlɛkɛt sataynabul-matirial program ɛn spɛshal transparent dizayn. | Kɔnfɛm ɔvlay/kɔr kɔmpatibiliti, shrinkage, laminɛshɔn winda ɛn kɔt bihayvya. |
Insay bɔku pan di kad strɔkchɔ dɛn, dɛn kin print grafik dɛn pan wayt ɔ transparent intanɛnt PC layt ɛn afta dat dɛn kin protɛkt dɛn bay di klia ɔvlay. Fɔ print dairekt pan di ɛksternal ɔvlay nid fɔ gɛt sɛpret apruv say fɔ print. Nɔ tink se bonding kɔtin na printin kɔtin bak.
Kɔmpatibl PC layers kin fɔm wan ayli intagreted kad bɔdi ɔnda kɔntrol tɛmpracha ɛn prɛshɔn. Di spɔlayt in kɔtin rɛkɛmɔndeshɔn, film ɔriɛnteshɔn, prɛ-dray rikwaymɛnt, lamineshɔn saykl ɛn kol prosidyushɔn fɔ fala. Dɛn fɔ tɛst di dɔkyumɛnt we dɔn dɔn pas fɔ abop pan raw-film prɔpati dɛn nɔmɔ.
We dɛn jɔyn PC wit PVC, PETG, adhesive film, printed coatings ɔ electronic inlays, difrɛns pan softening behavior ɛn thermal expansion kin afɛkt bonding ɛn flatness. Wan projɛkt-spɛsifi k kɔt gred ɛn payɔt laminɛshɔn nid fɔ de.
Standard klia PC ɔvlay de gi protɛkshɔn bɔt i nɔ kin prodyuz di laser kɔntrast we dɛn nid. Fɔ laser-personalized ID dɔkyumɛnt, spɛsifa if tɛks, pɔtrɛt, taktil engravin, transparent-windo imej ɔ bɔku laser imej funkshɔnaliti nid fɔ de, dɔn tɛst di prɔpɔz laserable layt wit di ikwipmɛnt we yu want.
Mat PC Ovlay Surface
Frosted PC Ovlay Surface
Nashɔnal ɛn rijinal ID kad: transparent protɛkshɔn ɛn sikyuɔr malti-layer PC kɔnstrɔkshɔn, we de ɔnda di ishua spɛsifikɛshɔn dɛn.
Drayva laysens: durable print-data protɛkshɔn ɛn opshɔnal laser-pɔsɔnalayzeshɔn layers.
Paspɔt data pej dɛn: PC ɔvlay kɔmpɔnɛnt dɛn fɔ kwalifay ay-sikyɔriti dɔkyumɛnt strɔkchɔ dɛn.
Ilɛktronik ID ɛn akses kredibiliti: protɛkshɔn fɔ print layers rawnd kɔmpitabl chip ɛn ɛntena kɔnstrɔkshɔn dɛn.
Ɛlthkɛr ɛn inshɔrans kad: lɔng layf kredibiliti we nid klia grafik ɛn kɔntrol lamination.
Banking ɛn pemɛnt-kad divɛlɔpmɛnt: matirial ɛvalueshɔn fɔ prɔjek dɛn we di pɔsin we gi di kad de gayd, kad skim ɛn di tɛknikal standad dɛn we dɛn kin yuz.
Indastrial grafik ɔvlay: sɔm lɛbl ɔ panɛl dɛn we dɛn dɔn pik usay dɛn dɔn kwalifay di rayt kɔtin, printin ɛn envayrɔmɛnt rikwaymɛnt dɛn.
| Step | Baya Input | Teknik Autput |
|---|---|---|
| 1. Rivyu fɔ Strukchɔ | Laya drɔin, fayn kad tiknɛs, kɔr matirial, chip/inlay ɛn sikyɔriti ficha dɛn. | Fɔs ɔvlay tik, gred, kɔtin ɛn sɔfays rɛkɛmɔndeshɔn. |
| 2. Rivyu fɔ Print | Printin proses, ink brand, curing method, kɔvarej ɛn pɔsnalayzeshɔn teknɔlɔji. | Kotin-sayd oriɛnteshɔn ɛn kɔmpatibiliti tɛst plan. |
| 3. Sampul Sapɔt | Shit saiz, kwantiti ɛn tɛst fɔmat. | Riprεsεntεtiv mεtirial sεmpl wit idεntifikεshכn εn hεndlin instrכkshכn. |
| 4. Paylɔt Laminɛshɔn | Aktual print layers, ikwipmɛnt, plet, tɛmpracha, prɛshɔn, dwɛl ɛn kol saykl. | Paylɔt shit ɔ kad fɔ bond, optik ɛn dimɛnshɔnal ɛvalueshɔn. |
| 5. Golden Sampul we gɛt fɔ du wit am | Aprɔv apinans, laser rizɔlt, peel trɛnk ɛn finish-kad tɛst. | Sayn fizik rɛfrɛns ɛn gri spɛsifikɛshɔn fɔ bɔlk prodakshɔn. |
| 6. Batch Kɔntrol | Inspekshɔn lɛvɛl, tɛst we ɛn traysabiliti rikwaymɛnt dɛn. | Batch rɛkɔd, lɛbl ɛn gri inspekshɔn ripɔt usay dɛn gɛt kɔntrakt. |
Dɛn fɔ gri pan di say dɛn we dɛn fɔ aksept bifo dɛn ɔda. Di we aw dɛn de du di tɛst ɛn di valyu dɛn kin difrɛn bay di sikyɔriti-dɔkyumɛnt program, so di tin dɛn we de dɔŋ ya na prɛktikal kwalifayeshɔn fɔm pas fɔ bi yunivasal spɛsifikɛshɔn dɛn.
| Inspekshɔn Aytem | Wetin fɔ Chɛk | Stej we dɛn Rikɔmɛnd |
|---|---|---|
| Tik ɛn Sayz | Nominal tik, vεryushכn, shit dimεnshכn, skwea εn ed kכndishכn. | Inkam raw matirial ɛn ɛni prodakshɔn batch. |
| Optik Apɛndiks | Transperɛns, haz, glos, tɛkstɔr, kɔntaminɛshɔn, jel, skrach ɛn kɔtin strik. | Inkam inspekshɔn ɛn afta lamination. |
| Identifikeshɔn fɔ di Kɔtin | Kɔrɛkt kɔt sayd, kɔtin yunifom, lɔt mak ɛn pak ɔryenteshɔn. | Bifo yu print ɔ lamination. |
| Laminashɔn Bɔnd | Pil trɛnk, edj separeshɔn, bɔbul, silva ɛn delamination afta kondishɔn. | Paylɔt kad ɛn rutin finish-kad sampling. |
| Dimɛnshɔnal Stebiliti | Krɔl, shrinkage, distɔrshɔn, kad flatnɛs ɛn rɛjista afta yu dɔn ɔt ɛn kol. | Afta payɔt lamination ɛn ɛnitɛm we di saykl chenj. |
| Surface Durability we go de fɔ lɔng tɛm | Abrashɔn, skrach, kemikal ɛksplɔshɔn ɛn klin rɛsistɛns yuz di prɔjek tɛst we. | Finished-kad kwalifayeshɔn. |
| Laser Pɔfɔmɛnshɔn | Kɔntrast, rizɔlt, greyskel, dip, taktil ficha ɛn winda-imej kwaliti fɔ laserable gred dɛn. | Golden Sample ɛn batch verifyeshɔn usay dɛn nid am. |
| Ilɛktronik Fɔnkshɔn | Chip rispɔns, kɔntaktlɛs rid distans ɛn ɛntena kɔntinyu bifo ɛn afta laminɛshɔn. | Paylɔt ɛn dɔn fɔ tɛst smat-kad. |
Klin ɔvlay sɔfays fɔ protɛkt frɔm dɔst, skrat, mɔstɔ ɛn kɔrɛkt stak. Di pak kin inklud fim we de protɛkt ɔ intaliv, rap we nɔ de mek wata, katon, palet ɛn kɔstɔm lɛbl. Stɔr di tin dɛn we yu nɔ opin flat na klin, dray ɛnvayrɔmɛnt fa frɔm dairekt san layt, ɔt sɔs ɛn agresiv kemikal.
Bifo yu yuz am, alaw di sheet dɛn we dɛn pak fɔ rich di kɔndishɔn na di prodakshɔn-rum ɛn fala di we aw dɛn gri fɔ handle ɔ fɔ dray bifo tɛm. Nɔ pul di pak we de protɛkt am bifo tɛm pas aw i nid, ɛn kip di kɔtin-sayd aydentifikeshɔn wit ɛni pat pan di pak.
Palet we dɛn dɔn protɛkt
Sikyu Ɛkspɔt Pakɛj
Wallis de sɔpɔt kad faktri, sikyɔriti printa, kɔnvɔta ɛn matirial distribyushɔn wit PC kɔr film, klia ɔvlay, kɔt ɔvlay, laserable film, magnɛtik strɛp ɔvlay ɛn rilat kad matirial. Di prɛktikal advantej na di ebul fɔ rivyu di kɔmplit kad stak instead fɔ kot wan isol transparent sheet.
0.08mm ɛn 0.10mm klia PC ɔvlay opshɔn fɔ kad-prɔdakshɔn ɛvalueshɔn.
Kɔt, strɔng-kɔt, nɔ-kɔt, laserable ɛn spɛshal kɔnstrɔkshɔn dɛn we de ɔnda di prɔjek rivyu.
Kastom shit kɔt, sɔfays tɛkstɔr, kɔtin ɔriɛnteshɔn, lɛbl ɛn ɛkspɔt pak.
Matirial sɛmpul fɔ print, lamination, laser ɛn finish-kad validɛshɔn.
Sɔpɔt fɔ ful-PC ɛn kwalifay haybrid kad strɔkchɔ dɛn.
Batch spesifikeshɔn ɛn Golden Sample kɔntrol fɔ ripit OEM ɔda dɛn.
Teknik ɛn Ɛkspɔt Tim
Globɛl B2B Projɛkt dɛn
Kad Matirial Prodakshɔn
| Infɔmeshɔn we dɛn nid | Ɛgzampul Ditiɛl dɛn fɔ Gi |
|---|---|
| Aplay fɔm | Nashɔnal ID, drayva laysens, paspɔt data pej, akses kad, i-kad, banking ɛvalueshɔn ɔ industrial ɔvlay. |
| Strukchɔ fɔ di Kad | Ful layt drɔin, ɛni matirial ɛn tik, fayn kad tik, klia winda ɛn ɛmbaded ilɛktroniks. |
| Di Rikwaymɛnt fɔ Ɔvlay | 0.08mm ɔ 0.10mm, kɔt/nɔ-kɔt/strɔng-kɔt/lɛsabl, sɔfayz tɛkstɔr ɛn kɔt sayd. |
| Print ɛn Ink | Ɔfset, skrin, dijital ɔ sikyɔriti printin; ink brand, curing sistem ɛn ink kɔvarej. |
| Lamineshɔn Prɔses | Ikwipmɛnt, di kayn plet, tɛmpracha, prɛshɔn, di tɛm we dɛn de de, di prɛshɔn we dɛn de kol ɛn di diskrɔpshɔn fɔ di difrɛns we de naw. |
| Pɔsin in yon | Laser mɔdel ɛn wɛvlɛnj, kɔntrast rikwaymɛnt, taktil ficha, klia-windo imej ɔ nɔ-laser pɔsnalayzeshɔn. |
| Sheet ɛn Pakɛj | Wid × lɔng, kwantiti, pak kɔnt, protɛktiv film, katon lɛbl ɛn palet rikwaymɛnt. |
| Kwaliti Dokumɛnt dɛn | TDS, SDS, inspekshɔn ripɔt, traysabiliti, rigyuletɔri diklareshɔn ɔ di isyu-spɛsifi k dɔkyumɛnt dɛn. |
I de yuz as transparent ɔda layt insay laminated polycarbonate kad ɛn sikyɔriti-dɔkyumɛnt strɔkchɔ dɛn. I de protɛkt infɔmeshɔn we dɛn print ɛn i kin ɛp fɔ mek di mɛkanikal intɛgriti fɔ ID kad, drayva laysens, i-kad ɛn ɔda kwalifay kredibiliti dɛn.
Koted ovalay gɛt wan pripia bonding surface we dɛn intend fɔ impruv adheshon to di apruv adjacent layt. Nɔn-kɔt PC film kin fayn fɔ kɔmpitabl ɔl-PC strɔkchɔ dɛn. Di kɔrɛkt choice dipen pan di print layt, ink, film gred ɛn lamination saykl.
Nɔto fɔ se na so i bi. Laser engraving nid fɔ gɛt laser-responsive gred we dɛn mek fɔ di wevlɛnj ɛn kɔntrast we dɛn want. Spɛsifik di laser rikwaymɛnt bifo yu sampul pas fɔ tek am se ɛvri transparent PC ɔvlay kin pɔsnalayz bay laser.
Pik frɔm di kɔmplit kad-layer drɔin ɛn fayn tiknɛs target. di 0.08mm gred de lef mכr tik fכ intanεt layεr dεm, we 0.10mm de kכntribyut mכr mεtirial to di כta strכkchכ. Dɛn tu nid fɔ tɛst wit kad we dɔn dɔn.
Haybrid kɔnstrɔkshɔn kin pɔsibul wit wan fayn kɔtin ɔ bonding layt, bɔt dɛn fɔ tɛst am bikɔs PC, PVC ɛn PETG gɛt difrɛn tɛmal ɛn dimɛnshɔnal bihayvya. Nɔ aplay ɔl-PC lamineshɔn saykl to haybrid kad we nɔ gɛt kwalifayeshɔn.
Fɔ print dairekt wan nid fɔ gɛt say we dɛn dɔn gri fɔ print. Insay bɔku kad strɔkchɔ dɛn, dɛn kin print pan di intanɛnt kɔr ɔ print layt ɛn dɛn kin lamin di klia ɔvlay ɔp am. Bonding coating nɔto fɔ print kɔtin ɔtomɛtik wan.
Dɛn kin ebul fɔ evalyu klia glos, mat, fayn-mat, frɔst ɔ ɔda prɔjek-spɛsifi k tɛkstɔr dɛn. Tekschɔ we de ɛn di ɛksaktɔ glos ɔ haz fɔ kɔnfyus wit fizik sampul ɛn kot.
No wan ɔvlay nɔ go ebul fɔ gi garanti fɔ dat. Kɔmpatibl PC layers kin fɔm wan strɔng intagreted strɔkchɔ, bɔt sikyɔriti dipen pan di kɔmplit dɔkyumɛnt dizayn, kɔntrol matirial, laser pɔsnalayzeshɔn, chips, sikyɔriti printin, ishu ɛn verifyeshɔn sistem.
Dɛn kin kot dediket magnɛtik strɛp ɔvlay kɔnstrɔkshɔn dɛn. Kɔnfɛm LoCo ɔ HiCo kɔstɔm, strɛp wit, pozishɔn, ɔriɛnteshɔn, sɔfayz stɛp ɛn kɔmpitibliti wit di ɛnkɔda ɛn kad standad we dɛn want.
Test printin intarakshɔn, lamineshɔn bond, kɔl, optik klia, sɔfayz tɛkstɔr, kɔt, bɛnd, tɔshɔn, abrashɔn, kemikal ɛksplɔshɔn, lɛsa pɔsnalayzeshɔn ɛn ilɛktronik fɛnshɔn usay i apɔynt. Apruv wan Golden Sample bifo bulk saplae.
Yɛs. A4, A3 ɛn kɔstɔm-kat shit dɛn kin rivyu togɛda wit protɛktiv fim, intaliv, pak kwantiti, lɛbl, katon ɛn palet rikwaymɛnt. Faynal opshɔn dɛn dipen pan di fim gred we yu dɔn pik ɛn di ɔda spɛsifikɛshɔn.
Gi di kad aplikeshɔn, ful layt strɔkchɔ, ɔvlay tiknes, kɔt ɔ laserable rikwaymɛnt, shit saiz, printin prɔses, ink, lamination saykl, laser sistem ɛn rikwayd tɛst dɛn. Dis kin mek dɛn ebul fɔ pik wan sampul we gɛt fɔ du wit mɔ.
