Dual-Frequency RFID TK4100 + F08 Inlay Prelam Sheet for Smart Cards
Wallis dual-frequency RFID TK4100 + F08 inlay prelam sheet is a semi-finished functional core for manufacturers producing hybrid access, employee ID, campus, membership, hotel and multi-system smart cards. It integrates an independent LF 125kHz TK4100 credential and an independent HF 13.56MHz F08 credential in one card layout, allowing a finished card to interact with two compatible reader infrastructures.
The LF and HF circuits remain separate: each frequency has its own chip, antenna or coil, protocol behavior and reader compatibility. For reliable mass production, the chip references, reader models, antenna position, sheet layout, finished card structure and target read performance should be confirmed before tooling and bulk lamination.
Technical Specifications
| Parameter | Reference Specification and B2B Confirmation Point |
| Product Type | Dual-frequency RFID inlay prelam sheet for subsequent overlay lamination, printing, punching and card personalization. |
| Standard Combination | LF 125kHz TK4100 + HF 13.56MHz F08. Confirm the exact chip manufacturer, memory configuration, UID format and reader/system requirements on the purchase specification. |
| Available Layouts | 2×5 (A4), 3×7, 3×8 and other customized sheet matrices. Final sheet dimensions, card pitch, margins, registration marks and punching direction should follow the approved drawing. |
| Reference Prelam Thickness | Approximately 0.55–0.60mm for the current LF + HF structure. Actual thickness and tolerance depend on chip package, antenna construction, substrate and final card stack. |
| Base Material | PVC as the standard option; other compatible card substrates may be evaluated according to the lamination structure and project requirements. |
| LF Antenna | Typically a wound copper coil designed for the selected 125kHz chip and reader environment. |
| HF Antenna | Etched or embedded antenna design tuned for the selected 13.56MHz chip, card stack and reader environment. |
| Surface | Blank prelaminated functional core, intended to be combined with printable core sheets and/or transparent overlays. |
| Customization | Chip combination, antenna geometry, layout, thickness, sheet size, registration marks, material structure, packaging and labeling. |
| Sample Approval | Engineering samples and a Golden Sample are recommended before mass production. Availability, quantity and freight are confirmed per project. |
![TK4100 125kHz RFID inlay prelam sheet for dual-frequency smart card production]()
LF 125kHz TK4100 Inlay Structure
![F08 13.56MHz RFID inlay prelam sheet for hybrid smart ID cards]()
HF 13.56MHz F08 Inlay Structure
What Is a TK4100 + F08 Dual-Frequency RFID Prelam?
A dual-frequency RFID prelam is a laminated intermediate sheet containing two independent contactless circuits in each card position. The TK4100 circuit is used for compatible 125kHz proximity-reader applications, while the F08 circuit is used with compatible 13.56MHz reader systems.
Combining the two circuits in one card body is useful when an organization must maintain a legacy LF access system while adding a separate HF application. It does not merge the two protocols or databases. The card issuer must enroll and manage each credential in the corresponding system.
TK4100 LF 125kHz Function
TK4100 is commonly selected as a read-only identification credential for compatible 125kHz proximity readers. It is generally used when the system reads a fixed identification number rather than storing application data. The exact bit format, facility-code handling and reader compatibility should be confirmed with the access-control integrator.
F08 HF 13.56MHz Function
F08 is commonly used as a 13.56MHz contactless memory credential in compatible systems. The buyer should confirm the exact F08 version, memory organization, keys, UID handling, sector data and personalization method. A 13.56MHz operating frequency alone does not guarantee compatibility with smartphones, NFC applications, MIFARE-branded systems or every ISO/IEC 14443 reader.
Dual Frequency Is Not the Same as Dual Interface
In smart-card terminology, dual frequency normally means two contactless radio systems such as LF + HF. Dual interface usually refers to a contact chip plus a contactless interface. Use the correct term in drawings, quotations and system documentation to prevent procurement errors.
TK4100 and F08 Compatibility Checklist
| Item | TK4100 Side | F08 Side |
| Frequency | 125kHz LF | 13.56MHz HF |
| Typical Role | Fixed-ID proximity credential for compatible access or attendance readers. | Read/write memory credential for compatible HF card applications. |
| Reader Information Required | Reader brand/model, supported data format, expected card number and target read distance. | Reader brand/model, protocol, memory/key requirements, UID policy and expected transaction workflow. |
| Personalization | Usually based on the factory-programmed identifier; confirm whether the system requires a specific number format. | May require sector programming, keys, data files or issuer-side enrollment. |
| Security Positioning | Suitable for projects that accept a basic read-only LF credential. | Suitability depends on the exact chip and security policy. New or high-security projects should specify an approved secure chip platform. |
| Phone Compatibility | Standard smartphones do not normally read 125kHz proximity credentials. | Do not assume smartphone compatibility; verify the exact chip, protocol and target phone operating system. |
Why Antenna Engineering Matters in a Dual-Frequency Card
Two antennas placed inside one thin card can influence resonance, read distance, lamination behavior and punching clearance. Antenna geometry should therefore be designed as one integrated card structure rather than combining two independent inlays without validation.
Antenna Separation and Coupling
The LF coil and HF antenna should be positioned to minimize unwanted coupling and to leave clear zones for card edges, contact modules, magnetic stripes, signature panels, holes or special die-cut features. The design should be tested with the actual finished-card stack because printed layers, overlays and nearby conductive elements can affect RF performance.
Chip Position and Surface Flatness
Chip package locations may require local cavities, cushioning layers or controlled material build-up. Poor chip-area design can cause bumps, trapped air, print distortion, delamination or punching damage. The approved drawing should identify chip coordinates and permitted local thickness.
Reader-Specific Tuning
A card that reads well on one desktop reader may perform differently on a wall-mounted access reader, hotel lock, turnstile or handheld terminal. Sample cards should be tested on every reader model included in the deployment, from multiple orientations and after final lamination.
![13.56MHz HF RFID card reader application for hybrid smart cards]()
HF Reader Application
![RFID and NFC card application requiring reader and protocol verification]()
RFID Application Example
Custom Sheet Layout and Card Structure
The prelam layout must align with the customer’s printing plates, laminator, collation method, punching tool and finished-card orientation. A layout name such as 3×8 is not enough to release production; a dimensioned drawing is required.
| Drawing Item | Information to Confirm |
| Sheet Format | Overall sheet width and length, matrix, card pitch, edge margins and feed direction. |
| Card Position | Finished card outline, corner radius, punching centerline and front/back orientation. |
| LF Circuit | Coil dimensions, turns, chip position, lead routing and protected no-cut area. |
| HF Circuit | Antenna outline, bridge/chip position, tuning target and protected no-cut area. |
| Registration | Optical marks, punching marks, print registration marks and allowable X/Y displacement. |
| Other Features | Contact-module cavity, magnetic stripe zone, signature panel, photo area, slot hole or custom shape. |
| Card Stack | Printable core, prelam, overlays, adhesives, total target thickness and layer sequence. |
![finished hybrid RFID card structure made from a dual-frequency prelam inlay]()
Finished Hybrid RFID Card Structure
![dual-frequency RFID inlay prelam sheet layout for smart card manufacturing]()
Dual-Frequency Inlay Layout
Card Lamination and Conversion Workflow
1. Confirm the Electronic Specification
Provide the required LF and HF chip references, reader models, card-number format, programming requirements and acceptance distance. Do not approve a chip based only on frequency.
2. Approve the Mechanical Drawing
Confirm sheet size, matrix, card pitch, antenna outline, chip coordinates, registration marks, punching direction and the full layer stack.
3. Build Engineering Samples
Test bare prelam sheets and finished cards. Check chip function, antenna response, surface flatness, lamination compatibility, visual appearance and reader performance.
4. Optimize Lamination
Temperature, pressure, dwell time, heating rate and cooling conditions should be developed using the selected substrate and overlay. Excessive heat or pressure may move the antenna, deform the chip area or change RF tuning.
5. Approve the Golden Sample
A signed Golden Sample should define the acceptable card appearance, dimensions, electronic behavior and reader performance for subsequent batch inspection.
6. Start Controlled Bulk Production
Use lot identification and agreed sampling plans to maintain traceability from chips and antennas through prelam production, card lamination and final delivery.
Quality Control for Dual-Frequency RFID Prelam Sheets
| Inspection | What to Check | Recommended Stage |
| Chip Identity | Exact LF/HF chip reference, UID or serial data, lot traceability and visible chip damage. | Incoming components and finished prelam. |
| Antenna Integrity | Continuity, bonding points, coil lead condition and antenna defects. | Before and after prelamination. |
| RF Response | LF and HF function independently, target reader compatibility, orientation and read-distance window. | Bare prelam and finished card. |
| Cross-Interaction | Confirm that activating one reader does not create unacceptable behavior in the second circuit. | Engineering sample and Golden Sample. |
| Layout Registration | Chip and antenna position against X/Y coordinates, punching line and no-cut zones. | Every production lot. |
| Mechanical Quality | Sheet dimensions, thickness, flatness, bubbles, contamination, local chip bump and surface damage. | Prelam release inspection. |
| Lamination Result | Peel resistance, warpage, card thickness, edge quality and chip-area appearance. | Finished-card validation. |
| Personalization | Correct LF number capture, HF memory/key operation and database enrollment. | Issuer or system-integrator validation. |
Recommended Applications
The TK4100 + F08 combination is most suitable where two existing reader environments must be supported in one physical credential and both systems have been verified against the selected chips.
Employee and contractor cards used across legacy LF access points and a separate HF application.
Campus, club or property-management cards integrating two compatible credential systems.
Time-attendance and building-access projects requiring separate LF and HF identifiers.
Migration projects in which an organization is transitioning from 125kHz readers to 13.56MHz infrastructure.
OEM smart-card production where the card factory controls the complete print, lamination and punching process.
For hotel locks, transport, payment, government credentials or other controlled systems, compatibility and security approval must come from the system owner. A frequency match alone is not sufficient.
Chip Selection Beyond TK4100 + F08
| Project Need | Possible Direction | Important Qualification |
| Basic LF Identification | TK4100 or another approved read-only LF credential. | Confirm reader data format and card-number requirements. |
| Writable LF Credential | A compatible writable LF chip may be evaluated. | Confirm programming tools, memory, password/security and legal system authorization. |
| Legacy HF Memory Card | F08 or another system-approved 13.56MHz memory chip. | Confirm keys, UID behavior, memory map and reader firmware. |
| New Security-Sensitive HF Project | Specify a modern secure chip platform approved by the system owner. | Define cryptography, key management, lifecycle and certification requirements before antenna design. |
| Phone-Tap Marketing | Select an NFC Forum-compatible chip designed for smartphone interaction. | Test on target iOS and Android devices; do not assume F08 compatibility. |
| Longer-Range Tracking | A UHF combination can be engineered as a different hybrid structure. | Region, reader, antenna orientation and finished-card RF testing are required. |
Packaging and Handling
RFID prelam sheets should be protected from bending, electrostatic discharge, pressure points, high humidity, contamination and uncontrolled heat. Packaging specifications should match the sheet size, chip profile, shipment method and required lot traceability.
Use clean interleaving or protective film to reduce surface scratching and particle transfer.
Keep sheets flat and support the full area during handling.
Separate production lots and identify chip combination, layout, quantity and inspection status.
Allow material to equilibrate in the production environment before lamination when storage and workshop conditions differ significantly.
![Wallis RFID inlay prelam production and inspection for smart card manufacturers]()
![protective export packaging for dual-frequency RFID inlay prelam sheets]()
Why Source Dual-Frequency RFID Prelam from Wallis?
Wallis supports card factories, RFID solution providers and material distributors with project-based chip matching, custom antenna engineering, sheet-layout development and card-material integration. The objective is to supply a prelam structure that can be validated in the buyer’s actual reader and lamination environment.
Engineering-oriented specification: chip, antenna, reader, layout and card stack are reviewed together.
Custom layout support: matrices, dimensions, registration marks and chip coordinates can follow the buyer’s tooling.
Material integration: matching printable sheets and overlays can be discussed for the complete card structure.
Sample-led qualification: engineering samples and Golden Sample approval reduce mass-production risk.
B2B documentation: drawings, product specifications, lot identification and inspection requirements can be aligned with the purchase order.
Information Required for a Fast B2B Quotation
| Required Information | Example or Explanation |
| LF Chip and Reader | TK4100 or alternative; reader brand/model; required output/card-number format. |
| HF Chip and Reader | Exact F08 version or alternative; reader brand/model; protocol, keys, memory and UID requirements. |
| Target Performance | Minimum/maximum read distance, orientation and test setup for each frequency. |
| Sheet Drawing | Overall size, layout, card pitch, punching marks, feed direction and card orientation. |
| Finished Card Stack | Core sheets, overlays, adhesives, printed layers and target total thickness. |
| Other Card Features | Magnetic stripe, contact chip, signature panel, slot, transparent area or special shape. |
| Order Information | Sample quantity, forecast volume, packaging, destination and required documentation. |
Frequently Asked Questions
What is a TK4100 + F08 dual-frequency RFID prelam sheet?
It is a semi-finished card core containing a 125kHz TK4100 circuit and a separate 13.56MHz F08 circuit in each card position. The sheet is later combined with printable layers and overlays, laminated and punched into finished cards.
Do TK4100 and F08 share the same antenna or memory?
No. They are independent chips with separate antenna structures, frequencies and data behavior. The LF and HF credentials are enrolled and managed separately.
Is TK4100 writable?
TK4100 is generally selected as a read-only LF identification credential. When a writable LF function is required, specify the reader, programming equipment and approved alternative chip before quotation.
Is F08 the same as MIFARE Classic?
F08 and MIFARE Classic may be used in similar legacy 13.56MHz application environments, but they should not be presented as the same branded chip. Confirm the exact chip manufacturer, protocol behavior, memory, keys, UID requirements and reader compatibility.
Can the F08 side be read by every NFC smartphone?
No. Operating at 13.56MHz does not automatically make a chip interoperable with all NFC phones. Smartphone compatibility depends on the exact chip and protocol, phone hardware, operating system and application.
Can this prelam be used for hotel key cards?
It can only be considered after the hotel lock manufacturer or system integrator confirms the required chip, protocol, UID/key behavior and reader compatibility. Hotel systems are not interchangeable based on frequency alone.
Is TK4100 + F08 suitable for payment or high-security government cards?
Do not assume so. Payment and high-security credential projects require system-approved chips, cryptography, certifications, personalization controls and complete-card testing. A more secure chip platform may be required.
Can the sheet layout be customized?
Yes. Sheet dimensions, card matrix, antenna geometry, chip coordinates, registration marks, thickness and card orientation can be developed from an approved technical drawing.
What thickness is available?
The current reference range for this LF + HF prelam is approximately 0.55–0.60mm. Actual thickness and tolerance depend on the electronic components, antenna construction, substrate and required final card stack.
How should we test the samples?
Test both frequencies independently on every target reader, then repeat after printing, lamination, punching and personalization. Also inspect card thickness, warpage, chip-area flatness, peeling and antenna position.
Can Wallis provide only the prelam or a complete card-material stack?
The project can be discussed as a prelam-only supply or as a coordinated card-material structure including printable core sheets and overlays. All layers should be qualified together before bulk production.
What should be included in the purchase specification?
Include exact chip references, reader models, protocol and data requirements, layout drawing, antenna/chip coordinates, thickness and dimensional tolerances, RF acceptance criteria, packaging, inspection plan and approved Golden Sample.
