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Inlay/ Prelam ye
Wallis ye baara kɛ
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| Hakɛ: . | |
Wallis 13.56MHz HF RFID PVC prelam inlay sɛbɛnw dilannen don i n’a fɔ baarakɛminɛnw karti hakilitigiw, ID kartiw, don kartiw, lotɛli kilisi kartiw, tɔndenw ka kartiw, bolifɛn kartiw ani NFC-enabled card porogaramuw. Sɛbɛn kelen-kelen bɛɛ bɛ HF puce ni antɛni sugandilen dɔ fara ɲɔgɔn kan PVC jɔcogo kɔrɔsilen kɔnɔ, min labɛnnen don karti-farikolo lamini laban kama, sɛbɛnni, punch ani mɔgɔ yɛrɛ ta kama.
B2B porozɛw bɛ se ka kɛ ka kɛɲɛ ni puce modeli ye, protocole, memory, antenne geometry, sheet size, card layout, inlay thickness, chip position, material, card laban jɔli ani pakew. Layidu tacogo jɔnjɔnw ye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ani 4 × 10 ye, ni karti caman labɛncogo ladamulenw ye minnu bɛ sɔrɔ lamini plati kɛrɛnkɛrɛnnenw ni punching minɛnw na.
Chip denbayaw man kan ka fara ɲɔgɔn kan diɲɛ bɛɛ ka bɛnkansɛbɛn kelen kɔnɔ. MIFARE Classic, MIFARE Ultralight, NTAG ani MIFARE DESFire ka fɛn dilannenw bɛ baara kɛ ISO/IEC 14443 suguya A sigidaw la, k’a sɔrɔ ICODE ka fɛn dilannenw bɛ da ISO/IEC 15693 kan cogoya la. Puce tigitigi, kalanbaga, baarakɛminɛnw porogaramuw ani lakana wajibiyalen ka kan ka dafa sani antɛni tuning ani bulk production.
| Fɛn dilannen suguya | 13.56MHz HF RFID contactless prelaminated inlay sheet ka ɲɛsin plastiki-karti dilanni ma |
| Fiɲɛturukala | 13,56MHz HF ye; protocole ani air interface bɛ bɔ puce sugandilen de la |
| Layidu talenw | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 ani ladamucogo |
| Sisan ɲɛw janya ɲɛfɔli | 0,45 ± 0,02mm ɲɔgɔn na HF jɔcogo sugandilenw na; confirmer ni puce, antenne, matériel ani karti laban stack |
| Base Materials (Basifɛnw). | PVC finman walima min bɛ kɛnɛya; PETG ni polikarbonati bɛ se ka kɛ porozɛw ye minnu bɛ tali kɛ taabolo danfaralenw na |
| Antɛni Sugandili | Kupu nɛgɛ min bɛ don a kɔnɔ, aliminiyɔmu sɔgɔlen ani porozɛ kɛrɛnkɛrɛnnenw ka antɛni jɔli |
| B2B Baarakɛlaw | Puce sɔrɔli, antɛni dilanni, RF tuning, layout engineering, samples, lamination trials, kuran sɛgɛsɛgɛli, QC rapɔɔriw ani export supply |
Aw ye HF RFID Inlay Samples ni Quote ɲini
Prelam inlay ye cɛmancɛ karti dilanni sɛbɛn ye min kɔnɔ RFID puce, puce-to-antenne jɛɲɔgɔnya ani antenna tuned structure bɛ sɔrɔ plastiki layɛrɛw kɔnɔ. A ka c’a la, o tɛ karti ye min bɛ se ka sɛbɛn ka ban. Karti dilannikɛlaw bɛ prelam fara ɲɔgɔn kan ni core sheets sɛbɛnnenw ye ani overlays transparents, o kɔfɛ, u bɛ lamina, ka nɛnɛ, ka punch ani ka karti dafalenw kɛ u yɛrɛ ta ye.
Antɛni bɛ fanga sɔrɔ kalanbaga foro la, ka kunnafoniw bila kalanbaga ni puce (puce) min bɛ don a kɔnɔ, o cɛ. RF baarakɛcogo bɛ bɔ antɛni jateminɛcogo la, conducteur resistance, puce capacitance, resonance, karti fɛnw, nɛgɛ kɛrɛfɛ, karti laban janya ani kalanbaga foro fanga.
PVC core sheets sɛbɛnnenw, overlays transparents, adhesives, magnetic stripes, signature panels ani protective finishes bɛ dɔ fara prelam lamini kan. Laɲini dafalen karti janya ka kan ka labɛn ka bɔ stack dafalen na sanni ka bɔ prelam gauge dɔrɔn na.
Puce denbaya, antɛni hakɛ, conducteur, karti minɛn walima karti sigida caman cili bɛ se ka rezɔn caman cili ani ka kalan kɛcogo Changer. Dilan min dabɔra puce kelen kama, o man kan ka baara kɛ kokura a yɛrɛma puce wɛrɛ kama ni RF sumani ma kɛ.
HF Puce ni Antenna jɔcogo min bɛ don a kɔnɔ
Karti caman labɛncogo ka ɲɛsin Lamination ma
Puce ka kan ka sugandi ka bɔ kalanbaga ka protocole la, hakilijagabɔ wajibiyalen, lakana hakɛ, jago teliya, ɲɛnamaya kɛcogo, seereyaw ani porogaramuw ekosisɛti. Marka tɔgɔw i n’a fɔ MIFARE, NTAG ani ICODE ye fɛn dilannenw denbayaw ye sanni ka kɛ daɲɛw ye minnu bɛ se ka ɲɔgɔn falen-falen.
| Chip Family / Option | Protocol Positioning | Porozɛ danmadɔ Fit | Nafama B2B Kɔlɔsili |
|---|---|---|---|
| Fudan F08 / Compatible Legacy 1K Sugandili | A bɛ ɲini tuma caman na ISO/IEC 14443 suguya A bɛnkansɛbɛnw kama; yɔrɔ nimɔrɔ tigitigi ka kan ka dafa | Legacy sɔrɔli, tɔndenw ani installed-reader sinsinni porozɛw | Aw bɛ a dilabaga, hakilijagabɔ, UID, tiɲɛni, kalanbagaw ka bɛnkan ani sariya siratigɛ la taamasiyɛn ɲɛfɔli dafa |
| MIFARE Klasik EV1 1K / 4K | ISO/IEC 14443-3 A suguya, 106kbit/s | Bololabaara, tikiti, don ani tulonkɛfɛnw minnu bɛ yen | Legacy fɛn dilannenw denbaya; baara kɛ ni sigida dɔrɔn ye yɔrɔ min na sistɛmu sigilen b’a wajibiya ani ka bi fɛɛrɛ lakananen dɔ jateminɛ dilan kura kama |
| MIFARE Ultralight EV1 ye | ISO/IEC 14443 Sigida A suguya | Tiketi minnu bɛ baara danma, ko kɛtaw, kantigiya ani porogaramu nɔgɔmanw minnu tɛ se ka ɲɔgɔn sɔrɔ | Hakilila, tɔgɔlasɛbɛn ani daminɛcogo fɛnw bɛn baarakɛminɛnw ka bagabagali modɛli ma |
| NTAG 213 / 215 / 216. Bamako, Mali | NFC Forum suguya 2 Tag ani ISO/IEC 14443 suguya A | NFC ka viziti kartiw, dantigɛli-sɛbɛnw, telefɔni selilɛriw ka jɛɲɔgɔnya ani fɛn minnu bɛ tali kɛ ɲɔgɔn na | Baarakɛla hakilijagabɔ bɛ danfara ka kɛɲɛ ni modɛli ye; NDEF hakɛ, tɔgɔlasɛbɛn ani a daminɛko wajibiyalenw dafa |
| MIFARE DESFire EV3 ye | ISO/IEC 14443 A suguya A yɔrɔ 1–4 ni sanfɛ-layer lakananen baarakɛcogo | Sɔrɔ lakananen, bolifɛn, kalanso, danyɔrɔ, kantigiya ani ɲinini caman kartiw | A bɛ kilisi ɲɛnabɔli, baarakɛminɛnw yɛrɛmahɔrɔnya ani kalanbaga/porogaramuw jɛli de wajibiya |
| ICODE SLIX2 / ISO 15693 Denbaya | ISO/IEC 15693, NFC Foroba suguya 5 jɔyɔrɔfalen | Lamini-karti, gafemarayɔrɔ, nafolo, dɔnni ani poroze minnu bɛ ɲɔgɔn cɛ ka jan | A tɛ se ka ɲɔgɔn falen ni ISO/IEC 14443 suguya A kalanbagaw ye; kalanbaga ka protocole ni antenne hakɛ dafa |
Sariya caman minnu tɛ ɲɔgɔn sɔrɔ, olu bɛ baara kɛ ni 13,56MHz ye. Kalanbaga bɛ se ka ISO/IEC 14443 suguya A, suguya B, ISO/IEC 15693, NFC Forum tag suguyaw walima baarakɛminɛnw layɛrɛ dɔ dɛmɛ. Frequency dɔrɔn tɛ se ka sɔn bɛnkan ma.
Banki, wari sarali, gɔfɛrɛnaman ka danyɔrɔko ani tɛmɛsira porozɛ minnu bɛ sariya kɔnɔ, olu bɛ se ka kɛ ni puwɛntiw ye minnu sɛgɛsɛgɛlen don, ka kilisi pikiri lakananenw kɛ, ka fɛn dilanni jateminɛlen, ka bolodalenw ka sɔnni kɛ ani ka baarakɛcogo sɛgɛsɛgɛ. HF inlay jenɛriki man kan ka feere i n’a fɔ a bɛ se ka sara ni a ma kɛ ni setigiya wajibiyalen tɛ.
| Paramètre | disponible Direction | Production Control |
|---|---|---|
| 2 × 5 Layidu talen | A4-type prototype ani karti dilanni min ka dɔgɔn | Aw bɛ sɛbɛnfura hakɛ tigitigiw, karti fɔcogo ani u tɔgɔ sɛbɛnni taamasiyɛnw dafa |
| 3 × 7 / 3 × 8 ye | Industriw ka smart-card sɛbɛnw labɛncogo minnu bɛ kɛ tuma caman | Lamination plates, punching tool, printed cores ani collation direction bɛ bɛn ɲɔgɔn ma |
| 4 × 8 / 4 × 10 / 5 × 5 ye | Labɛn minnu bɛ bɔ sanfɛ ani kiliyan kɛrɛnkɛrɛnnenw ka minɛnw | RF jɛɲɔgɔnya kɔlɔsi antɛni kɛrɛfɛtaw ni sɛbɛnw bɔgɔbɔli cɛ |
| Layidu Labɛn min bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye | Karti hakɛ minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye, kilisiw, mini kartiw walima punching formats kɛrɛnkɛrɛnnenw | Aw bɛ CAD ja dilan, ka fɛn dilannenw jiracogo, puwɛnti jɔyɔrɔ, antɛni yɔrɔ ani tigɛyɔrɔ di |
| Prelam A ka bon | Sisan ɲɛw ɲɛfɔli bɛ Taa 0,45 ± 0,02mm ɲɔgɔn na; ladamu sigicogo minnu bɛ sɔrɔ | Aw bɛ moyenne, point variation, chip-bump zone ani final-card stack jatebɔ dafa |
| Minɛ | PVC finman, PVC jɛlen ani porozɛ kɛrɛnkɛrɛnnenw PETG walima PC-baarakɛminɛnw | Aw bɛ sɛgɛsɛgɛli, sirili, funteni, RF tuning ani karti dafalen muɲuli sabati |
CR80/ID-1 karti min bɛ kɛ tuma bɛɛ, a ka c’a la, o dilannen don 0,76mm kɛrɛfɛ, nka muɲuli tigitigi bɛ bɔ karti ni minɛnw ɲɛfɔli la. Kori sɛbɛnnenw, ɲɛfɛla ni kɔfɛla datugulanw, nɔrɔlanw ani sigida puwɛnti girinya ka kan ka don jatebɔ la.
Sheet bɛ se ka kɛ gauge tolerance moyenne kɔnɔ ka sɔrɔ chip zone ka bon sigida la. Kɔnɔw dilanni, a sɔgɔli, a digidigicogo ani a layɛrɛ sugandili ka kan ka bɔgɔbɔgɔ yelenw, sirili barikamaw ani puwɛnti tiɲɛni bali.
| Antenna Factor | Effect on the Card | Required Validation |
|---|---|---|
| Geometrie de Bobine (Bobine) ka baarakɛcogo | A bɛ inductance, coupling area ani tigɛyɔrɔ sɔrɔlenw kɔlɔsi | Puce capacitance, karti hakɛ, kalanden ani laɲini sigida bɛ bɛn ɲɔgɔn ma |
| Antena Filɛri Kupu | A bɛ dɛmɛ don embedded coil designs ani flexible geometry | Filɛri cɛmancɛ, a doncogo juguya, a tigɛcogo, a sirili jɛɲɔgɔnya ani a tɛmɛnen |
| Antenna Aluminium Gravée | A bɛ dɛmɛ don antɛni dilanni na ni fɛn caman ye | Trace width, resistance, corrosion protection, chip attachment ani lamination kɛcogo |
| Puce Capacitation (puce capacitance) ye | A bɛ antenne/puce circuit ka resonance Changer | Retune ni i bɛ chip denbaya walima pake Changer |
| Kartiw ka Stack | Plastiki, encre, papier, graphique métallisé ani overlays bɛ se ka coupling Changer ani ka detune antenne | Karti dafalen kɔrɔbɔ, a kana kɛ prelam gansan dɔrɔn ye |
| Baara kɛ ni Lamini ye | Nɛgɛw, telefɔniw, waribɔlanw, kartiw ani ji minnu bɛ u kɛrɛfɛ, olu bɛ se ka nɔ bila baarakɛcogo la | Kalanbaga laɲininen, a jiginni cogoya ani a baarakɛcogo jateminɛ |
Kalan yɔrɔjan bɛ bɔ puce (puce) la, antɛni yɔrɔ, jogoɲumanya hakɛ, kalanbaga fanga, kalanbaga antɛni, protocole, karti ɲɛsincogo, karti laban kulu ani sigida. Kumasen ka kan ka kɔrɔbɔli kalanbaga ni tɛmɛsira/dɛsɛ yɔrɔ jira sanni ka baara kɛ ni diɲɛ bɛɛ ka jateden kelen ye.
Antɛni minnu bɛ karti caman kan, olu bɛ yɔrɔ caman wajibiya ka bɔ tigɛyɔrɔw la, sɛbɛnni dingɛw la ani u kɛrɛfɛyɔrɔw la. RF sɛgɛsɛgɛli minnu bɛ kɛ ni sɛbɛnfura ye, olu ka kan ka jateminɛ kɛ jɛɲɔgɔnya kan antɛniw ni ɲɔgɔn cɛ sani kartiw ka sɔgɔ.
| Layer | Baarakɛcogo | Kilisi Kɔrɔsili |
|---|---|---|
| Front Overlay (Front Overlay) min bɛ kɛ | A bɛ ja sɛbɛnnenw lakana ani ka gloss, matte, frosted walima security fini di | A janya, a sirili, a sɔgɔli ani a ka mɔgɔya bɛnkan |
| Front Imprimé Core (Kɔrɔ sɛbɛnnen). | A bɛ ja jɔlenw, sɛbɛnniw, logo ani lakana sɛbɛnniw ta | Sɛbɛnni sɛbɛnni, enki furakɛli, dɔgɔyali ani RF-safe nɛgɛ nɔw |
| HF Prelam Inlay ye | Puce, antenne, kuran jogindaw ani plastiki dɛmɛnanw bɛ sɔrɔ a kɔnɔ | RF tuning, puce position, thickness, alignment, bond ani kuran sɔrɔli |
| Back Printed Core (Kɔrɔ sɛbɛnnen). | A bɛ ɲɛfɛla lamini balansi ani ka kɔfɛla ja ta | Gauge balance, magnetic-stripe position ani sɛbɛnni datugucogo |
| Back Overlay (Kɔnɔnafili). | A bɛ seko ni dɔnko baara lakana ani a bɛ se ka kɛ ni stripe, signature panel walima security feature ye | Bonding, flatness, encoding ani surface laban |
Foyi belebele minnu bɛ nɛgɛ la, enki minnu bɛ taa ni fɛnw ye walima nɛgɛdaga minnu bɛ antɛni kɛrɛfɛ, olu bɛ se ka dɔ bɔ ɲɔgɔndan walima fɛn caman sɛgɛsɛgɛli la. Aw bɛ finimugu labanw don RF sɛgɛsɛgɛliw la ani ka yɔrɔ jɛlenw mara yɔrɔ minnu na a mago bɛ u la.
Fɛnɲɛnɛma ni kɔfɛla lamini jateminɛnanw, fɛnw ɲɛsincogo ani sɛbɛnni datugucogo ka kan ka bɛn ɲɔgɔn ma ni a bɛ se ka kɛ. Asymétrique stacks bɛ se ka karti kurulen bɔ a sumaya ni a nɛnɛ kɔfɛ.
Aw bɛ stack dabɔlen dafa: Aw bɛ overlay, printed core, inlay, adhesive, stripe ani security layer bɛɛ sɛbɛn.
Aw bɛ sɛbɛnw bɛɛ labɛn : Aw bɛ fɛnw sabati sɛnɛyɔrɔ la ani ka u saniya, u ka kɛ fla ye ani u ka ja.
Aw bɛ ɲɛsincogo sɛgɛsɛgɛ: Aw bɛ sɛbɛn ɲɛ sira, karti fɔcogo, puce jɔyɔrɔ, antɛni jɔyɔrɔ, seko ni dɔnko baara ani punch taamasiyɛnw bɛn ɲɔgɔn ma.
Lamini sɛrɛkili yiriwa : Aw bɛ funteni, degun, sigiyɔrɔ, plati fini, bɔli sɛbɛn ani nɛnɛ sigi sen kan ka kɛɲɛ ni fɛnw kulu tigitigi ye.
Aw bɛ puwɛnti yɔrɔ lakana : Aw bɛ sigida tansiyɔn kɔlɔsi ani ka aw yɛrɛ tanga fɛnɲɛnamafagalan gɛlɛnw ma, plati nafamafɛnw walima fɛnw bɔli kojugu IC lamini na.
Nɛnɛ bɛ kɛ ni degun kɔrɔsilen ye : Nɛnɛ bɛ nɔ bila flati la, layɛrɛ nɔrɔli la, puwɛnti degun ani a hakɛ sabatili la.
Kɔrɔbɔli sani aw ka punch kɛ: Aw bɛ kuran baarakɛcogo lajɛ min bɛ se ka kɛ sɛbɛnfura hakɛ la, a cogoya, a bonya, a sirili ani a sɛbɛnni.
Karti dafalenw kɔrɔbɔ: Punch, personalize ani RF baarakɛcogo, hakɛw, bending ani application compatibilité sɛgɛsɛgɛ.
| Lamination Risk | A bɛ se ka kɛ sababu ye | Labɛnni siratigɛ |
|---|---|---|
| Puce (puce) Dɛsɛ | Funteni kojugu, sigida tansiyɔn, kuran tiɲɛni walima puwɛnti ɲɔgɔndan barikama | Aw ye puwɛnti pake danw lajɛ, baarakɛcogo tansiyɔn, ESD kunkankow ani ɲɔgɔndan jogo |
| Antenna Circuit da wuli | Conducteur karilen, joli juguman, tigɛ tiɲɛni walima a sɔgɔli kojugu | Aw bɛ tɛmɛsira, ɲɛminɛbaga sira, punching clearance ani masin degun sɛgɛsɛgɛ |
| Barikantan Kalansenw | Detuning, conducteur bɔnɛ, kalanden bɛnbaliya, metalized artwork walima card-stack changement | Aw bɛ rezɔn suman ani ka retune kɛ ni karti dafalen ye ani target reader |
| Puce Bump yelen ye | Kɔnɔnafili bɛrɛbɛrɛ, modulu girinya kojugu walima degun min tɛ kelen ye | Aw bɛ sigida kɔnɔnatumuw, layɛrɛ jateminɛnanw, cushioning ani pressing cogoyaw ɲɛnabɔ |
| Delamination (Dɛlamini) ye | Nɔgɔ, fɛn min tɛ bɛn ɲɔgɔn ma, funteni dɔgɔya walima nɛnɛ jugu | Aw bɛ fɛnw bɛn ɲɔgɔn ma, u saniya, u cycle ani peel baarakɛcogo lajɛ |
| Sɛbɛn walima Karti Warpage | Stack balanbaliya, funteni kojugu, degun tɛ kelen ye walima nɛnɛ teliya la min tɛ kunbɛn | Balance layers ani ka so funteni, plati flakɛli ani nɛnɛ kɛcogo ɲɛ |
| sɛgɛsɛgɛli fɛn min | bɛ ladilikan di B2B kɔlɔsili |
|---|---|
| Puce Identité (Dɔnniya min bɛ Puce) la | Aw bɛ a dilabaga, a yɔrɔ nimɔrɔ tigitigi, hakilijagabɔ, UID sugandilen, protocole ani lot traceability sɛgɛsɛgɛ |
| Kuranko Baarakɛcogo | Aw ye puce UID, hakilijagabɔ walima cikan ɲɛfɔlen kalan min bilalen bɛ karti jɔyɔrɔ bɛɛ la ka kɛɲɛ ni sɛgɛsɛgɛli bolodalen ye |
| Antɛni ka taa ɲɛ | Aw bɛ ciriw da wulilenw, surunw, jogindaw barikamaw, ɲɛminɛbagaw ka dɛsɛw ani crossover tiɲɛnenw dɔn |
| Resonance / RF Baarakɛcogo | Aw bɛ bɛnkan RF paramɛtiri walima baarakɛcogo kalan yɔrɔ suman ni sɛgɛsɛgɛli minɛnw ni fɛnɲɛnamafagalan ɲɛfɔlenw ye |
| Puce ni Antenna jɔyɔrɔ | Aw bɛ a jɔyɔrɔ lajɛ ni CAD ye, karti labɛncogo, punch clearance ani kɛrɛfɛ antennew |
| Sɛbɛnw hakɛw | Janya, a bonya, a kɛnɛ, a karti janya, a tɔgɔ sɛbɛnni dingɛw ani a dakun cogoya |
| A bonya ni a ka flakɛ | A janya cɛmancɛ, sigida puce-zone janya, kuru, bow ani point-to-point caman ɲɔgɔnna |
| Sɛgɛsɛgɛli yelen | Nɔgɔ, bugun, kurukuruw, nɔ nɛrɛmuguma, kondukiri bɔli, sɔgɔsɔgɔninjɛ ani layɛrɛ tiɲɛni |
| Karti sɛgɛsɛgɛli dafalen | RF baarakɛcogo, a bonya, a bonya, a kɔrɔta, a torsion, a funteni, a nɛnɛ, a peel ani a kalanbaga bɛnkan |
| Traceability (Sɔrɔcogo). | Puce lot, antenne lot, PVC lot, bɔli don, a labɛncogo, sɛgɛsɛgɛli porogaramu, sɛbɛn nimɔrɔ ani pake sɛbɛn |
Sɛgɛsɛgɛli dafalen bɛ se ka kɛ kuran kalanni sɛgɛsɛgɛli ye yɔrɔ bɛɛ la, ka sɔrɔ sɛgɛsɛgɛliw bɛ kɛ ka caya, minnu bɛ kɛ ni dimension, peel ani destructive ye. Sanniko ɲɛfɔli ka kan ka sɛgɛsɛgɛli fɛnw ɲɛfɔ, fɛn min bɛ sigi sen kan, sɔnni sariyaw, misali tacogo ani kunnafoni.
Prelam bɛ se ka tɛmɛ kuran sɛgɛsɛgɛli fɛ, ka sɔrɔ ka dɛsɛ hali bi funteni tɛmɛnen kɔfɛ, degun, punch walima mɔgɔ yɛrɛ ta kɔfɛ. B2B ka setigiya ka kan ka kɛ incoming-inlay ni finished-card performance fila bɛɛ ye.
| Puce | / Protocol Direction | Critical Validation |
|---|---|---|
| Baarakɛlaw ni Sɔrɔdasi Kartiw | Legacy Type A, MIFARE Plus walima DESFire ka kɛɲɛ ni doncogo sigilen ye | Kalanbagaw ka bɛnkan, kilisi ɲɛnabɔli, u tɔgɔ sɛbɛnni ani don o don kɔrɔta |
| Hotel Key Kartiw | Puce min wajibiyalen don lotɛli-lock plateforme fɛ | Lock encoder, guest-management system, karti janya ani nɛnɛ bɔli |
| Transport ani Campus Kartiw | Puce multi-application lakananen i n’a fɔ DESFire yɔrɔ min na sistɛmu architecture b’a wajibiya | Jago teliya, lakana, kalanden ka nafolo, mɔgɔya ani ɲɛnamaya taabolo |
| Mɔgɔya ni kantigiya kartiw | A suguya A hakilijagabɔ-puce, NTAG walima secure application puce ka kɛɲɛ ni porogaramu dilanni ye | Kalanbaga walima telefɔni bɛnkan, kunnafonidilan, danbe ani baarakɛcogo segin-segin |
| NFC ka jago ni jago kartiw | NTAG walima NFC Forum baarakɛɲɔgɔnya puce wɛrɛ | NDEF seko, telefɔni bɛnkan, URL lakanani ani skan jɔyɔrɔ |
| Kitabumara, Nafolo ani Lamini Kartiw | ISO/IEC 15693 / ICODE suguya ɲɛnabɔcogo | Kalanbaga ka protocole, antenne hakɛ, laɲini yɔrɔ, anti-collision ani EAS wajibiyalenw |
| Identité lakananenw ani Sarako Porozɛw | Puce lakananen min sɛgɛsɛgɛra ani application architecture min dagalen don | Seereyaw, kilisi pikiri, fɛnw dilancogo jateminɛlen ani fɛɛrɛ kɛrɛnkɛrɛnnenw ka sɔnni |
HF RFID Inlay baarakɛminɛnw ka ɲɛsin Smart Card porogaramuw ma
| Donanw / Lakanalifɛn | B2B wajibiyalen |
|---|---|
| UID (UID) ye | UID janya, ID jɔlen walima a kɛcogo gansan, kunnafonidilan cogoya ani kalanbaga dɛmɛni dafa |
| Hakilila-kodɔn | Donanw sigicogo ɲɛfɔ, sekɔtiriw/dosiyɛriw/ɲɛw, NDEF sɛbɛnni, lock bitikiw ani sɛgɛsɛgɛli |
| Lafasali-kɔlɔsili-minɛnw | Ka tigiya kunbabaw ɲɛfɔ, pikiri kɛcogo, bolifɛnw lakanani, fɛn caman sɛnɛcogo ani jatebɔ sira |
| Password / Access Configuration (daɲɛ dogolen / Sɔrɔcogo labɛnni). | Daɲɛ dogolen, dondaw, jatebɔlanw, daminɛcogo sɛgɛsɛgɛli ani lock-state testing jira yɔrɔ minnu na dɛmɛ bɛ kɛ |
| Donanw minnu bɛ se ka fɛn caman sɛmɛntiya, olu sɛbɛnnen don | Nimɔrɔ sɛbɛnnen, barɔdi walima QR kode siri ni puce data ye bɛnkan kɔlɔsili fɛ |
| Karti minnu banna | Karti minnu kɔnɔ, kilisi ɲɛnamaw, dantigɛlifɛnw walima kunnafonidilanw bɛ sɔrɔ, olu faranfasi, k’u jate ani k’u tiɲɛ ka ɲɛ |
Sistɛmu min bɛ sira di ka don dɔrɔn ka bɔ forobaciyɛn kalanni na, o bɛ se ka kɛ sababu ye ka kopi kɛ walima ka a ladege. Porozɛ minnu bɛ lakana koɲɛw ɲɛnabɔ, olu ka kan ka baara kɛ ni puce ni backend architecture ye min bɛ dɛmɛ don cryptographie tiɲɛni bɛnnenw na.
Puce lakananen dili tɛ kɛ ni application (application) sigicogo walima key management (kɔlɔsili) ɲɛnabɔli ye a yɛrɛma. A ɲɛfɔ mɔgɔ min bɛ kilisiw da, k’u mara, k’u doni ani k’u sɛgɛsɛgɛ, ani ni sigida lakananen-mɔgɔya lamini min sɛgɛsɛgɛra, o ka kan ka kɛ.
Karti hakilitigi hybride bɛ se ka HF ni LF, UHF, contact puce walima HF application wɛrɛ fara ɲɔgɔn kan. O jɔli ninnu bɛ yɔrɔ caman de wajibiya, ka antɛniw faranfasi ka ɲɛ, ka sigida janya kɔlɔsili wɛrɛw kɛ ani ka lamini ni sɛgɛsɛgɛli porogaramu kɛrɛnkɛrɛnnen dɔ kɛ.
| Hybride Structure | Baarakɛcogo Case | Engineering Risk |
|---|---|---|
| LF + HF ye | Yɛlɛma ka bɔ legacy proximity access la ka taa HF smart-card systems (karti hakilitigi) la | Antɛni yɔrɔ, ɲɔgɔndɛmɛ, karti janya ani kalanbaga fila sɛgɛsɛgɛli |
| HF + UHF ye | Danfara min bɛ kɛ yɔrɔ surun na ka fara tugu-tugu-yɔrɔ jan kan | Antɛni sitɛmu danfaralenw, fɛnw nɔfɛkow ani UHF sɛgɛsɛgɛli farikolo walima nɛgɛ kɛrɛfɛ |
| Puce HF fila | Aplikasiɔnw danfaralenw walima issuer domaines yɛrɛmahɔrɔnyalenw | Karamɔgɔ sugandili, antɛni jɛɲɔgɔnya, kunnafonidilanw tigiyali ani karti-labɛncogo gɛlɛyaw |
| Kontakt + Contactless | Dual-interface lakananen identité, telefɔni walima sarali architecture | Module cavité, antenne connexion, lamination, certification ani personnalisation |
HF prelam standard single-frequency man kan ka fɔ ko a bɛ LF walima UHF dɛmɛ a yɛrɛma. Frequency caman jɔli mago bɛ u yɛrɛ ka ja la, puce list, RF tests, thickness specification ani sɔngɔ.
Aw bɛ prelam sɛbɛnw mara ka kɛ fɛn ye min sirilen don, min saniyalen don ani min jalen don, ka yɔrɔ jan tile yeelen ni funteni tilennen na.
Aw bɛ baara kɛ ni pankurun gɛlɛnw ye, ka fɛnw don ɲɔgɔn na ani ka kartɔn lakananenw kɛ walasa ka kurukuruni, sɔgɔsɔgɔninjɛ ani chip-zone degun bali.
Aw bɛ aw yɛrɛ tanga kuran bɔli barikama ma ani ka ESD minɛcogo bɛnnenw kɛ yɔrɔ minnu na a mago bɛ a la.
Aw kana doni girinmanw bila sɛbɛnfura kan minnu tɛ kelen ye walima ka a to palɛti ka wuli.
Condition material min bɛ lamination so kɔnɔ sani a ka baara kɛ ni depo ni production cogoyaw tɛ kelen ye.
Aw bɛ pake kelen-kelen bɛɛ dɔn ka kɛɲɛ ni puce modeli ye, antɛni dilanni, a labɛncogo, a janya, a batch ani a sɛgɛsɛgɛli cogoya.
Aw bɛ baara kɛ ni fɛnw ye minnu bɛ don fɔlɔ, minnu bɛ bɔ fɔlɔ ani ka fɛnw sɛgɛsɛgɛ kokura, u maralen kɔfɛ walima u bilalen kɔfɛ waati jan kɔnɔ.
Lakanali Flat Packing for HF RFID Prelam sɛbɛnw
Prelam dilanni min bɛ se ka da a kan, o bɛ antɛni doncogo walima a sɔgɔli de wajibiya min bɛ kɔrɔsi, ka puwɛnti siri, ka sɛbɛnfura sɛbɛn, ka plastiki lamini, ka kuran sɛgɛsɛgɛli kɛ, ka a hakɛ sɛgɛsɛgɛ, ka a minɛ saniya ani ka batch traceability. Puce, antenne ja ani RF sɛgɛsɛgɛli fɛɛrɛ min dagalen don, o ka kan ka to a cogo la walasa ka segin-ka-bɔnye yamaruyaw di fo ni bɛnkan kɛra fɛn dɔ Changement contrôleré.
RFID Inlay Porozɛ ni Tekniki jɛkulu
Prelam Inlay ka baarakɛminɛnw dilanni
Antenna ni Inlay baarakɛcogo ɲɛnabɔli
Kuran ni Dimensions Sɛgɛsɛgɛli
Puce sugandili min sinsinnen bɛ baarakɛminɛnw kan: Legacy access, NFC, secure multi-application ani ISO 15693 porozɛw bɛ se ka faranfasi ka kɛɲɛ ni protocole ni lakana magow ye.
Antɛni kɛcogo ladamulen: Bobine jateminɛ, ɲɛminɛbaga, puce capacitance, karti labɛncogo ani laɲini kalanbaga bɛ se ka lajɛ ɲɔgɔn fɛ.
Sɛbɛnw labɛncogo minnu bɛ se ka sɛgɛsɛgɛ: Karti caman labɛncogo jɔnjɔnw ani kartiw fɔcogo minnu bɛ kɛ kiliyan kɛrɛnkɛrɛnnenw ye, olu bɛ sɔrɔ.
Karti ni fɛnw faralen ɲɔgɔn kan : PVC prelam bɛ se ka kɛ ɲɔgɔn fɛ ni kɔnɔna sɛbɛnnenw ye, ni dakunw ye, ni magɛnni sɛrɛkiliw ye ani ni kartiw jɔcogo dafalenw ye.
Dɛmɛ min bɛ kɛ ni seko ni dɔnko ye : Misaliw, lamini sɛgɛsɛgɛliw, RF sɛgɛsɛgɛliw, u janya sɛgɛsɛgɛli ani karti dafalenw sɛgɛsɛgɛli bɛ dɔ bɔ poroze farati la.
Factory-direct B2B supply : A bɛnnen don smart-card iziniw ma, sɛbɛnnikɛlanw, fɛn caman tigɛlikɛlaw, sistɛmu integrateurs, issuers, importateurs ani distributeurs.
Aplikasi, kalanden marka/modɛli, protocol ani logiciel plateforme installé.
Puce dilabaga tigitigi ani a yɔrɔ nimɔrɔ, hakilijagabɔ, UID ani lakana wajibiyalenw.
Sɛbɛnw labɛncogo, u hakɛ bɛɛ lajɛlen, karti fɔcogo, u tɔgɔ sɛbɛnni taamasiyɛnw ani u hakɛ.
Karti hakɛ, antɛni jɛlen yɔrɔ, puce jɔyɔrɔ ani punching ja.
Prelam fɛn, kulɛri, tɔgɔla janya ani muɲuli.
Antɛni fɛɛrɛ, laɲini rezɔn walima baarakɛcogo kalan-yɔrɔ sɛgɛsɛgɛli.
Karti laban kulu, sɛbɛnw kɔnɔfɛnw, dakunw, nɛgɛ sɛbɛnni, sɛrɛkili walima siginiden panneau.
Lamination presse, funteni, tansiyɔn, sigiyɔrɔ, nɛnɛ ani plati hakɛw.
Kuran sɛgɛsɛgɛli, RF sɛgɛsɛgɛli, dimensions sɛgɛsɛgɛli ani sɔnni sariyaw.
Encoding, key injection, UID list, data variable walima database bɛnkan.
Prototype hakɛ, san o san jateminɛ, segin-ka-bɔnye waati bolodacogo ani fɛn caman Changement-contrôle wajibiyalenw.
Packing, inspection documents, destination port ani jiginni don ɲininen.
Baro kɛ Aw ka HF RFID Inlay Porozɛ kan
O ye karti dilanko core sheet ye min kɔnɔ 13,56MHz puce ni antenne bɛ sɔrɔ plastiki layɛrɛw kɔnɔ. A lamininen don ni a kɔnɔna sɛbɛnnenw ni a datugulanw ye walasa ka karti dafalenw dilan minnu tɛ se ka ɲɔgɔn sɔrɔ.
Ayi, prelam ye cɛmancɛ baarakɛcogo ye. Karti dafalenw bɛ sɛbɛnni wɛrɛw wajibiya, ka u datugu, ka u lamini, ka u nɛnɛ, ka u punch ani ka u yɛrɛ kɛ u yɛrɛ ta ye walima ka u kodɔn.
Porozɛw bɛ se ka baara kɛ ni ISO/IEC 14443 suguya A, suguya B, ISO/IEC 15693 walima NFC Forum bɛnkan puwɛntiw ye. Protocole tigitigi bɛ bɔ IC ni reader system sugandilen na.
Ayi, u ye fɛn dilannenw denbaya suguya wɛrɛw ye minnu ka protocoles, memory, commandes, security ani applications tɛ kelen ye. Aw bɛ puce ni kalanden tigitigi sɛgɛsɛgɛ sani aw ka komandi kɛ.
O sugandili kɔrɔw minnu bɛ se ka kɛ 1K ye, olu bɛ se ka baro kɛ. Puce wajibiyalen tigitigi ani kalanbaga misali di, bawo a dilabaga, UID, hakilijagabɔ ani dantigɛli bɛnkan ka kan ka sɛgɛsɛgɛ.
A bɛ to ka kɛ fɛn ye min bɛ tali kɛ sitɛmu kɔrɔ sigilenw na, nka bi porozɛ lakananenw ka kan ka sisan fɛɛrɛ wɛrɛw jateminɛ i n’a fɔ MIFARE DESFire walima MIFARE Plus ka kɛɲɛ ni sistɛmu jɔcogo ye.
NTAG 213, 215 walima 216 ani NFC Forum baarakɛɲɔgɔnya puce wɛrɛw ye sugandiliw ye minnu bɛ kɛ tuma caman na. Modeli sugandi ka bɔ NDEF hakilijagabɔ wajibiyalenw na, telefɔni bɛnkan ani lakana fɛɛrɛw.
Puce (puce) lakananen min bɛ kɛ ni baarakɛminɛn caman ye i n’a fɔ MIFARE DESFire, o bɛ se ka kɛ ko bɛnnen ye, nka kalanden dɛmɛni, kilisi ɲɛnabɔli, seereyaw, baarakɛminɛnw dosiyew ani porogaramuw ka kan ka dafa.
ISO/IEC 15693 bɛ kɛ ka ɲɛsin lamini-karti baarakɛcogo ma yɔrɔ minnu na kalanbaga, antɛni hakɛ ani laɲini jɛɲɔgɔnya janya tɛ kelen ye ni proximity-card sitɛmuw ye minnu sinsinnen bɛ ISO/IEC 14443 kan.
Sugandili minnu bɛ kɛ tuma caman na, olu ye 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 ani 4 × 10. Labɛn minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye, olu bɛ se ka dilan ka bɔ sannikɛla ka lamini ni punch ja la.
Sisan fura ɲɛ bɛ tali kɛ 0,45 ± 0,02mm ɲɔgɔn na HF jɔcogo sugandilenw na. A laban janya bɛ bɔ puce, antenne, material, karti stack ani sigida puce-zone wajibiyalenw na.
Awɔ. Aw bɛ laɲini fini-karti janya, a dacogo ani a sɛbɛnnen-kɔnɔna jateminɛnanw, puce pake ani lamination kɛcogo di walasa stack dafalen ka se ka jate.
Awɔ. Antɛni jateminɛ bɛ se ka labɛn puce capacitance, karti hakɛ, kalanbaga, laɲini baarakɛcogo, puce jɔyɔrɔ ani tigɛyɔrɔw lamini na.
Embedded copper-wire ani etched-aluminum sugandiliw bɛ se ka baro kɛ. A jɔli ɲuman bɛ bɔ hakɛ, a kɛlɛli, a bonya, a sirili, a karti dilanni ani a RF laɲini.
Duniya bɛɛ ka yɔrɔ si tɛ yen. A bɛ bɔ puce, antenne, reader, card stack, orientation ani sigida la. Kɔrɔbɔli kalanbaga ni baarakɛyɔrɔ janya fitinin ɲɛfɔ.
A bɛ se ka kɛ RF sɛgɛsɛgɛli kɔfɛ. Nɛgɛ papiye belebele walima encre conducteur min bɛ antɛni kɛrɛfɛ, o bɛ se ka detune walima ka a tanga contactless interface ma.
Fɛn wɛrɛw jɔcogo bɛ se ka lajɛ, nka u dɔgɔyali, u sirili, u lamini funteni, u RF tuning ani u ka karti banbali muɲuli ka kan ka tiɲɛ u danma.
A ka c’a la, prelam bɛ dilan i n’a fɔ baarakɛyɔrɔ lankolon. A ka c’a la, sɛbɛnni bɛ kɛ sɛbɛn kolomaw kan minnu tɛ kelen ye, hali ni baro bɛ se ka kɛ porozɛ kɛrɛnkɛrɛnnenw jɔli kan.
Diɲɛ bɛɛ ka sigida si man kan ka bɔ kɛnɛ kan sigicogo bɛɛ la. Aw bɛ funteni, tansiyɔn, sigiyɔrɔ ani nɛnɛ yiriwa PVC tigitigi lamini na, datugulan, tintiri, puce ani antɛni jɔli.
Aw bɛ baara kɛ ni puwɛnti pakew ye minnu bɛ bɛn ɲɔgɔn ma, sigida girinya kɔlɔsilen, tabali saniyalenw, tansiyɔn balannen, funteni sɛgɛsɛgɛli min dagalen don ani kuran sɛgɛsɛgɛli sani lamini ka kɛ ani a kɔfɛ.
Kuran sɛgɛsɛgɛli dafalen bɛ se ka ɲɛfɔ. Sanni bɛnkan ka kan ka ɲɛfɔli kɛ cikan minnu bɛ lajɛ jɔyɔrɔ bɛɛ la ani tiɲɛni walima hakɛ sɛgɛsɛgɛli minnu bɛ kɛ ni misali ye.
UID kalanni, hakilijagabɔ kodɔnni, NDEF sɛbɛnni walima baarakɛminɛnw yɛrɛmahɔrɔnyali bɛ se ka kuma. Secure-key services bɛ ɲini ka ɲɛfɔli kɛrɛnkɛrɛnnen dɔ kɛ min bɛ kɔrɔsi.
Hybride designs bɛ se ka labɛn i n’a fɔ fɛn dilannenw danfaralenw. U bɛ antɛni labɛncogo kɛrɛnkɛrɛnnenw de wajibiya, u janya labɛnni, kalanbagaw ka sɛgɛsɛgɛliw ani sɔngɔko.
Awɔ. Taabolo min ka fisa, o ye ka prelam kɔrɔbɔ, ka karti kulu dafalen lamini, ka kartiw punch ani ka RF, masin ani mɔgɔya baarakɛcogo sɛgɛsɛgɛ.
MOQ bɛ bɔ puwɛnti sɔrɔli la, antɛni baarakɛminɛnw kɛcogo la, a labɛncogo, a kɛcogo, a janya, a kɔrɔbɔli porogaramu, a kodɔncogo ani ni baara bɛ se ka kɛ ni dilancogo sariyalen ye min dabɔra.
Aw bɛ puce tigitigi, kalanbaga, protocol, layidu, sɛbɛn hakɛ, karti ja, a janya, antenne laɲini, karti laban kulu, sɛgɛsɛgɛliw, hakɛ, pake ani taayɔrɔ di.
Aw ye kuma Wallis Plastic fɛ walasa ka 13.56MHz HF RFID PVC prelam inlay sɛbɛnw sɔrɔ minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye walasa ka se ka don, ID, lotɛli, tɔndenw, bolifɛnw, NFC ani smart-card dilanni. An ka jɛkulu bɛ dɛmɛ don puwɛnti sugandili la, antɛni dilanni na, sɛbɛnw labɛncogo la, RF tuning la, lamination kɔrɔbɔliw la, kuran sɛgɛsɛgɛli la, kodɔnni la, jogoɲumanya ɲɛfɔli la ani izini-direct B2B dilancogo la.
