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WLS-INKJET SHEET hmanga siam a ni
WALLIS chuan a rawn ti a
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Wallis hian professional card siamtute tan PETG coated overlay leh PET inlay materials a supply a , ID card chhe thei lo, access card, RFID card, NFC card, payment card, transportation card, membership card, hotel key card, leh customized smart card te siam chhuak thin a ni.
Transparent PETG overlay hian laminated card pawn lam a venghim a ni. Internal PET-based layer chu electronics tel lo plain PET core sheet, antenna carrier, chip-and-antenna pre-inlay, emaw fully prelaminated RFID inlay emaw a ni thei. Heng materials te hian specification hrang hrang an nei a, lei hmain a hranin hriat chian a ngai a ni.
Thickness, sheet dimension, surface finish, coating grade, RFID configuration leh card layout te chu application ang zela siam theih a ni. Quotation-ah hian PETG overlay leh PET core/inlay te chu line item hran anga tarlan tur a ni a, individual material specification, quantities leh acceptance criteria te nen.
B2B customization: PETG overlay thickness leh finish, plain emaw RFID emaw PET inlay, LF/HF/UHF frequency, chip model, antenna material, sheet layout, sheet khata card awm zat, printed registration marks, packaging, leh OEM labeling te.
| Thilsiam | Card lamination atan PETG coated overlay leh PET inlay a awm bawk |
| Overlay Material a ni | PETG langtlang tak a ni |
| Inlay Material a ni | PET structural core emaw PET hmanga siam RFID prelaminated inlay emaw a ni |
| PETG Overlay a thuk zawng | 0.04mm–0.15mm inkar a ni a; duhthlan tur tlanglawn tak takte chu 0.06mm, 0.08mm, leh 0.10mm te an ni a; customized thickness a awm bawk |
| PET Inlay Thickness a ni | Card structure kimchang angin customized a ni a; 0.25mm leh project-specific option dangte pawh evaluate theih a ni |
| Sheet Size a ni | A4, A3, 295 × 460mm, 295 × 485mm, leh a size hrang hrang a siam theih bawk |
| Card Layout a ni | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10, emaw, a duh angin sheet imposition emaw a ni thei |
| Overlay duhthlan tur a awm | Coated overlay, strong coated overlay, non-coated overlay, specialized laser-responsive grade (a tlinna hmunah), matte overlay, leh magnetic stripe overlay te a awm bawk |
| Surface Finish a ni | Smooth, glossy, matte, frosted, anti-scratch, emaw customized finish emaw a ni thei |
| PET Inlay chi hrang hrang | Plain PET core sheet (electronics awm lo), antenna chauh hman theih PET carrier, RFID pre-inlay, RFID prelaminated inlay, emaw project-specific dual-frequency structure emaw a ni thei |
| RFID Frequency hman dan tur | 125kHz LF, 13.56MHz HF/NFC, UHF, emaw dual-frequency configuration emaw, project mamawh dan azirin |
| Chip duhthlan tur a awm | Customer-nominated emaw project-in a rawt LF, HF, NFC, leh UHF chips te chu a awm theih dan leh reader inmilna a zirin |
| Antenna duhthlan tur a awm | Copper wire antenna emaw, etched aluminum antenna emaw, antenna design siam danglam emaw a ni thei |
| Rawng | Transparent overlay a awm a; PET inlay structure dum, transparent, emaw customized emaw a ni thei |
| Dilna hrang hrang | ID card, RFID card, NFC card, access card, pawisa pekna card, transportation card, hnathawk card, membership card, hotel key card, leh smart label te a awm bawk |
| OEM Services te a ni | Material, thickness, size, layout, chip, frequency, antenna, coating, surface, printing mark, packaging, leh private labeling te a awm bawk |
Final dimensions, thickness, chip, antenna, frequency, read performance, coating, leh lamination parameters te chu technical specification leh production sample pawm tawh hmanga finfiah tur a ni.
Sourcing dik tak atan chuan protective outer film chu atanga thliar hran tur a ni internal structural PET sheet leh functional RFID inlay . 'inlay' tih thumal hi supplier hrang hrangah hman a ni a; a drawing leh sample chuan ambiguity a paih chhuak.
| Material Supplied | Main Function ah | hian RFID Electronics a awm em? | Key Purchase chungchang chipchiar takin |
|---|---|---|---|
| PETG hmanga khuh a ni | Card chunglam leh bonding interface langtlang tak | Aih | Thickness, coating side, surface finish, a chiang, sheet size, printed-core nena inmil |
| PET core sheet pangngai tak a ni | Card chhung lam thickness leh structural layer a awm | Aih | A rawng, gauge, density, thermal shrinkage, layer bonding, cut format te a awm bawk |
| Antenna chauh hmanga PET carrier a ni | Final chip attachment hmain antenna a support | Antenna chauh a ni a; bonded IC a awm lo | Antenna geometry, material, resistance, layout leh bonding pad te a awm bawk |
| PET hmanga RFID hmanga pre-inlay a ni | Chip leh antenna assembly chu a hnua card conversion atan hman theih a ni | Awle | IC part number, protocol, antenna tuning, bond integrity, sheet pitch leh functional test te a awm bawk |
| PET hmanga RFID hmanga prelam | Card-stack lamination atan encapsulated functional inlay a inpeih tawh | Awle | Prelam thickness map, chip awmna hmun, electrical yield, RF testing leh lamination compatibility te a awm bawk |
PETG overlay langtlang tak hian a takin RFID functionality a pe lo. PET-based core chu chip leh antenna mamawh te dah tel a, verified a nih loh chuan RFID inlay a ni lo.
PETG coated overlay leh PET inlay te hi laminated plastic leh smart card siamnaah hian layer hrang hrang pahnih hman dun a ni.
PETG coated overlay hi a tlangpuiin card hma leh hnung lamah dah a ni. Printed artwork a humhim a, thermal lamination laiin pawn lam layer te chu internal card structure nen a bond theih nan a pui bawk.
PET inlay chu card chhungah a awm a. Plain structural sheet emaw, antenna-only layer emaw, chip leh antenna awmna RFID prelaminated core kimchang tak emaw pawh a ni thei. Quotation dil hunah hrilhfiahna dik tak chu nemnghet tur a ni.
PETG hi glycol-modified polyester material a ni a, optical clarity, toughness, formability, leh reliable bonding mamawhna hmuna hman thin a ni. Card siamnaah chuan transparent PETG film hi protective leh decorative surface layer atan hman theih a ni.
Coating hi overlay card-contact side-ah dah a ni a, hei hian compatible printed sheet, PET layer, PETG layer, PVC layer, emaw composite card structure-a adhesion a ti tha zawk a ni. Coating grade chu printing ink, card core, temperature, pressure, leh lamination cycle te nen a inmil tur a ni.
Overlay quality hian card transparency, gloss, flatness, printed-image visibility, peel strength, surface resistance, dimensional stability, leh finished-card appearance te a nghawng a ni. Buyers te chuan nominal material specification chauh rinchhan ai chuan overlay chu ink leh laminator tak tak hmangin an test tur a ni.
PETG Coated Overlay langtlang tak a ni
Lamination atan PETG Overlay Sheet a awm a
Transparent PETG overlay hmang hian lamination hnuah pawh printed thlalak, logo, text, barcode, QR code, variable data, leh security graphics te chu chiang taka hmuh theih a ni.
Coated emaw strong-coated surface tha tak chuan overlay leh printed card layer inkara bonding a ti tha a, peeling, edge lifting, bubbles, leh interlayer separation te tihtlem nan a pui a ni.
Overlay hian printed information chu card hman pangngaia routine abrasion, moisture, fingerprint, bawlhhlawh, friction leh handling nawn fo lakah a venghim a ni.
Card design leh personalization process angin glossy, smooth, matte, frosted, low-glare, anti-scratch, leh customized surface option te chu evaluate theih a ni.
Buyers te chuan card structure leh processing mamawh angin standard coated overlay, strong-coated overlay, non-coated overlay, laserable material, emaw magnetic stripe overlay emaw an thlang thei a ni.
Plain PET core sheet chu a chhunga awm, electronic ni lo card layer a ni a, antenna emaw RFID chip emaw a awm lo. Card thickness mamawh leh structural performance-ah a pui hle. Supplier thenkhat chuan he layer atan hian 'inlay' tih thumal hmang mahse, electronic inlay nen a inmil loh nan material drawing dil rawh.
Antenna-only inlay-ah hian copper emaw aluminium emaw antenna a awm a, mahse final chip connection erawh a tel lo. Anmahni production facility-a chip bonding emaw module assembly emaw tifeltu siamtute thlan theih a ni.
RFID pre-inlay hian PET carrier-ah chip leh antenna thlan bik chu a inzawm khawm a ni. Smart card structure kimchang takah conversion, encapsulation, emaw lamination emaw siam belh zelna atana ruahman a ni.
Prelaminated RFID inlay-ah hian chip leh antenna chu card-core layer buatsaih sa chhungah dah a ni. Card siamtute chuan final lamination leh punching hmain printed core sheet leh PETG overlay te nen an inzawm khawm thei a ni.
PET RFID Inlay siam dan tur
Lamination atan Smart Card Inlay a awm bawk
125kHz LF inlay hi proximity identification, basic access control, attendance leh legacy reader system hrang hrangah hman a ni. Ran hriat theihna project atan chuan 134.2kHz configuration leh reader standard hman tur chu a hranin enfiah a ngai a; 125kHz access inlay chu a inmil anga ngaih tur a ni lo.
Chip thlan chu customer reader, data format, memory, read-only emaw rewritable emaw mamawh, security mamawh, leh system protocol nena inmil tur a ni.
13.56MHz HF emaw NFC inlay hi access control, vantlang lirthei, library card, campus card, membership program, identification, authentication, mobile interaction, leh contactless payment project atan hman theih a ni.
Chip mamawh chu reader platform hman tur, memory, encryption, authentication, protocol, read distance, operating environment, leh certification mamawh angin thlan tur a ni.
UHF inlays hi hun rei zawka hriat theihna, asset management, logistics, lirthei hriat theihna, event management, inventory, leh thil tam tak rang taka chhiar ngai application atan ngaihtuah theih a ni.
UHF frequency band, antenna design, chip, regulatory region, reader power, installation environment, a chhehvel thil, leh read distance mamawh te chu siam chhuah hmain a dik tih finfiah hmasak a ngai a ni.
Dual-frequency inlay hian card siamna pakhat chhungah RFID technology pahnih a thlunzawm a ni. Reader infrastructure pahnih nena inmilna mamawh system a support thei a, mahse chip spacing, antenna interaction, sheet layout, card thickness, leh finished-card performance te hian project-specific engineering a mamawh a ni.
Laminated smart card pangngaiah chuan PETG overlay hian card chunglam a venghim a, PET inlay hian internal structure emaw contactless function emaw a pe thung. Customized construction ah hian a hnuaia layer te hi a awm thei ang:
A hmalam chu PETG coated overlay a ni.
Hma lam printed PET, PETG, PVC, emaw composite card-core sheet emaw a ni.
Plain PET structural inlay emaw RFID PET inlay emaw chip leh antenna awmna.
Hnung lam printed card-core sheet a ni.
Hnung lam transparent PETG coated overlay a awm bawk.
Lamination lai hian heat leh pressure hian layer te chu unified card body ah a bond thin. Temperature pawmpui, pressure, heating time, cooling time, stacking direction, leh release plate te chu thil leh hmanrua dik takah a innghat a ni.
Overlay gauge hi PET core, inlay, printed layer leh target finished-card thickness atanga innghat lovin thlan theih a ni lo. ID-1 card pangngai tan chuan nominal 0.76mm finished thickness hi planning reference tangkai tak a ni a, mahse card kimchang chu lamination leh conditioning hnuah teh tur a ni.
| Layer | Nominal Gauge | chhiar dan entir nan Note |
|---|---|---|
| Hma lam PETG overlay a awm | 0.08mm a ni | A tawp berah chuan venhimna hmun; a coating leh actual gauge te chu verify rawh |
| Hma lam printed core a ni | 0.15mm a ni | Printed PET/PETG/PVC-compatible material thlan chhuah te pawh a tel |
| Center PET-a innghat core emaw prelam emaw a ni | 0.30mm a ni | Entirna atan chauh; chip zone, antenna leh core siamna atan hian gauge danglam a ngai mai thei |
| Hnunglam printed core a awm | 0.15mm a ni | Card warp leh shrinkage control turin front layer chu match rawh |
| Hnunglam PETG overlay a awm | 0.08mm a ni | Grade leh orientation inmil chu nemnghet rawh |
| Processing hmaa entirnan total | 0.76mm a ni | 0.08 + 0.15 + 0.30 + 0.15 + 0.08 a ni a; guaranteed finished dimension a ni lo |
Heat, pressure, material flow, printed ink, antenna leh chip cavities te hian card thickness tak tak chu a thlak danglam thei a ni. Average thickness leh local chip-zone thickness pahnih hi qualified finished-card sample hmangin pawm vek tur a ni.
Overlay leh inlay te hi coordinated system anga sourcing hian card siamtute chu material compatibility, layer thickness, sheet layout, registration, leh supplier pakhat atanga thil lei te enkawl turin a pui a ni.
Laminated structure hian chip leh antenna chu card body chhungah a khuh a, hei hian electronic components te chu routine handling, contamination, abrasion, leh direct surface contact atanga venhimna kawngah a pui a ni.
Transparent overlay hian printed information hmuh theihna a humhim a, internal inlay hian card mamawh thickness, structure leh electronic functionality a pe bawk.
Card siamtute chuan overlay thickness, inlay thickness, chip type, antenna dimension, sheet layout, surface finish, printed mark, magnetic stripe, signature panel, emaw functional element dang emaw an siam danglam thei a ni.
Pre-arranged inlay sheet hmang hian card tam tak chu production cycle khatah laminated leh punch theih a ni a, hei hian consistency a ti tha a, final card assembly neih laiin chip leh antenna pakhat zel dah a ngai lo.
PET RFID inlays hi hnathawkte access card, building credential, campus card, visitor card, parking card, hotel card, leh restricted-area identification atan configure theih a ni.
PETG overlay hian thlalak, hming, number, barcode leh printed information te a humhim a, PET inlay hian physical emaw contactless card function mamawh a pe thung.
Customized HF inlays te hi transportation, ticketing, fare collection, parking, campus transport, leh mobility program hrang hrang atan reader leh backend system inmil hmangin evaluate theih a ni.
Payment-card project-ah chuan chip, antenna, card-body siam dan dik, personalization process, certification, reader compatibility, leh payment-network approval hman tur dik tak a ngai a ni. Material supply chauh hian finished-card compliance a din lo.
RFID emaw NFC functionality hi retail loyalty card, gym card, club card, event card, library card, hospitality card, leh customer membership program-ah te dah tel theih a ni.
NFC chips inmil hian digital business card, product authentication, website access, event engagement, membership verification, emaw programmed function dang atan mobile-device interaction a support thei a ni.
PET inlays hi card-ah te dah theih a ni a, chutah chuan contact chip, magnetic stripe, barcode, QR code, signature panel, holographic element, emaw RFID technology tam tak pawh a awm bawk.
Finished-card dimensions, target thickness, surface finish, card dam chhung beisei, application environment, printing method, personalization method, leh function mamawh te chu nemnghet rawh.
Project-ah hian plain structural PET core, antenna-only inlay, chip-and-antenna pre-inlay, emaw complete prelaminated RFID inlay emaw a mamawh em tih sawi rawh.
Reader model, operating frequency, protocol, memory mamawh, security mamawh, data format, read distance mamawh, leh card emaw chip reference hman mek te pe rawh.
System compatibility angin chip thlang la, card layout, chip capacitance, read-distance mamawh, lamination condition leh a chhehvel thil nena inmil antenna design thlang rawh.
Sheet khata card awm zat, sheet dimension, registration mark, antenna orientation, chip position, punching margin, printed area, leh tolerance mamawh te chu nemnghet rawh.
Card-core material, ink chi, printing process, curing method, print coverage, leh laminator condition te pe la, chutiang chuan standard emaw strong coating emaw chu teh theih a ni.
Overlay leh inlay tak tak chu printer, ink, laminator, punching machine, reader, encoder, personalization hmanrua, leh finished-card quality mamawh te hmangin test rawh.
I card structure, overlay thickness, PET inlay type, frequency, chip, antenna, sheet layout, printing process, quantity, leh destination te chu project-specific recommendation atan thawn rawh.
Material Recommendation dawng rawhPETG overlay, printed card-core sheet, leh PET inlay sheet te chu conditioned, tihfai, enfiah, leh approved sheet layout leh card-layer drawing angin dah a ni.
Printed sheet-ah chuan registration mark dik tak hman a ngai a, chutiang chuan graphics, antenna awmna hmun, chip, cutting line, magnetic stripe, leh card edge te chu a inmil tawk tur a ni.
Front overlay, printed core, PET inlay, rear printed core, leh rear overlay te chu approved orientation-ah stack a ni. Coated surface te hian bonding layer dik tak an hmachhawn tur a ni.
Controlled heat leh pressure hian layer te chu a bond khawm a. Lamination recipe hi testing hmanga din tur a ni a, a chhan chu heat, pressure, emaw cycle time tam lutuk hian flatness, chip connection, antenna performance, transparency, leh sheet shrinkage te a nghawng thei a ni.
Laminated sheet te hi controlled condition hnuaiah tihlum a ni a, hei hian card structure a ti nghet a, warping, deformation, bubbles, leh uneven bonding te a tihziaawm bawk.
Laminated sheet te hi card-ah an punch a, chutah chuan printing, encoding, laser marking, embossing, chip-module installation, magnetic encoding, signature-panel application emaw finishing process dang emaw an paltlang thei a ni.
RFID card te hi chip identification, data communication, antenna continuity, reading distance, orientation, encoding, leh system compatibility te finfiah turin reader ruahmante nen test tur a ni.
PETG leh PET hi chemical nena inzawm mahse interchangeable grade an ni lo . An crystallinity, softening response, shrinkage leh surface adhesion te hi a inang lo hle. Mixed PETG/PET/PVC card stack-ah hian process validation a ngai a; universal lamination temperature emaw automatic compatibility emaw pawh ngaihtuah tur a ni lo.
| Control Point | nemnghet tur | Engvangin nge a pawimawh tih |
|---|---|---|
| Coating lam hawi | Treated face chu mark la, approved printed core nen align rawh | Reverse placement hian bonding tha lo leh edge lifting a thlen thei |
| Ink chemistry leh tihdamna | Offset, screen emaw UV ink emaw hriatchhuah; a printed surface chu a dam kim tawh chu test rawh | Under-cured ink hian bubble a siam thei a, peel strength a ti tlem thei bawk |
| PET leh PETG grade a ni | Resin grade, gauge, direction leh pretreatment dik tak record rawh | Shrinkage leh bonding behavior hrang hrang hian curl emaw distortion emaw a siam thei |
| Heat, pressure leh cooling te hi a ni | Lamination press tak tak hmangin recipe pawm tawh siam rawh | Over-processing hian card a warp thei a, chip connection a tichhia thei bawk |
| Metallic print leh RFID hmanga ziah a ni | Foil, conductive ink, magnetic stripe leh antenna inkar boruak te enfiah thin ang che | Hengte hian RF coupling emaw processing clearance emaw a nghawng thei a ni |
| Finished-card hmanga tling tur a ni | Peel, flatness, dimensions, RF read/write leh aging te enfiah thin ang che | Passing inlay chauh hian card kimchang a certify lo |
Finished-card sample leh recorded processing conditions hmangin overlay coating, printed ink, PET core, chip bonding, antenna geometry emaw final lamination cycle atanga chhiatna lo awm leh awm loh isolate rawh.
| Harsatna hmuh chhuah | A chhan awm thei | Check tura rawtna |
|---|---|---|
| Overlay peeling emaw edge lifting emaw a ni | Coated-side orientation dik lo, ink inmil lo emaw bonding tling lo emaw | Coating face, cured ink, thianghlimna leh peel-test condition te enfiah rawh |
| Bubble emaw haze emaw a awm thei | Thli tang, bawlhhlawh, residual solvent emaw heating cycle tha lo emaw | Sheet fai, ink cure, plate pressure leh thermal profile te enfiah thin ang che |
| Warping emaw shrinkage emaw a inmil lo | PET/PETG layer inthlau lo, material lam hawi emaw cooling danglamna emaw | Layer gauge leh machine kalna tur tehkhin; flatness test neih nawn leh thin ang che |
| RF card chu lamination hnuah a fail thin | IC bond chhia, antenna break emaw local pressure tam lutuk emaw | Lamination hma leh hnua RF response enfiah thin; chip zone hrang hrang enfiah thin |
| Print hnua read distance tawi zawk | Antenna detuning, metallic ink emaw beisei loh taka final-card geometry emaw hmanga siam a ni | Reader, fixture leh orientation tarlan tawhah final stack test rawh |
| Chip bump emaw hmuh theih antenna outline emaw | Cavity/compensation tling lo emaw overpressure emaw a awm | Prelam thickness map leh local material flow te enfiah leh rawh |
| Punch hian chip emaw coil emaw a tichhia | Layout misregistration emaw conductor clearance tling lo emaw a nih chuan | CAD card pitch, punching clearance leh inlay position te chu a inmil tur a ni |
| Surface scratch emaw gloss danglamna emaw a awm thei | Packaging friction, plate bawlhhlawh emaw grade mix-up emaw a awm thei | Film handling, plate finish, interleaving leh lot control te enfiah thin ang che |
Material leh coating-grade hmanga finfiah a ni.
Thickness leh sheet-dimension enfiah a ni.
Transparency, haze, gloss, leh surface-finish enfiahna te a awm bawk.
Dust, scratch, wrinkle, pinhole, leh contamination enfiah.
Coating uniformity leh coated-side hriat theihna.
Trial lamination, flatness, shrinkage, leh peel-strength te endik a ni.
PET carrier material, a thickness, a dimension, leh sheet-layout verification te a ni.
Chip model, quantity, position, leh orientation te finfiahna.
Antenna dimension, resistance, continuity, connection, leh hmuh theiha enfiah theihna.
Chip-to-antenna bonding leh electrical-function testing te a awm bawk.
Surface flatness, encapsulation, bubble, leh foreign-particle enfiahna te a ni.
Reader inbiakpawhna, UID chhiar, memory access, emaw chip thlan ang zela encoding test te.
Dimension leh thickness tihfel tawh.
Surface hmel, chiang, gloss, leh print hmuh theihna.
Layer bonding, edge adhesion, bubble, leh delamination te a awm bawk.
Card flatness, bending, torsion, leh mechanical handling te a awm bawk.
Chip chhiar, encoding, memory, antenna, leh reader nena inmil.
A tulna hmunah chuan application-specific durability, environmental, leh aging test te neih a ni.
Repeatable B2B card siamna atan chuan overlay leh inlay specification hran neiin golden sample siam la , chutah chuan purchase order tina hman tur test te chu document rawh. Checkpoint rawtna chu a hnuaia mi ang hian a ni; final tolerances leh methods te chu ziakin inremna siam tur a ni.
| Approval Item | PETG Overlay / PET Core | RFID PET Inlay / Card siam zawh tawh a ni |
|---|---|---|
| Thil awmzia (material identity) a ni | Resin grade, rawng, coating lam, supplier lot | Chip siamtu, IC dik tak, antenna leh PET carrier lot |
| Dimension hrang hrang | Thickness, sheet sei zawng/width, squareness leh thermal shrinkage te a ni | Card pitch, registration, antenna/chip awmna hmun leh local gauge te a awm bawk |
| Visual quality a ni | Haze, clarity, dust, scratches, wrinkles leh coating chhiatna te a awm | Antenna chhunzawm zel dan, chip-zone lan dan leh encapsulation lama chhiatna awm thei te |
| Process tihdikna (process validation) a ni | Ink nena inmil, lamination recipe leh peel chakna | Prelam atanga finished-card electrical yield leh tuned read range te a ni |
| Equipment nena inmil theihna | Printer, drying line, laminator, cooling leh punch hmanrua te a awm bawk | Reader model, protocol, encoder, RF fixture leh test script te a awm bawk |
| Lot control a ni | Coating formula pawm tawh, packing, labeling leh batch reference te pawh a awm bawk | Chip/antenna design pawm tawh, RF pass criteria leh change phalna pek tawhte |
| Documentation a awm bawk | TDS, COA emaw project-specific inspection report emaw inremna hmunah te | Chip lot list, electrical result, sample pawmpuina leh inremna hmuna traceability te |
Production hmain sampling plan leh sheet position tinah eng test nge tih tih leh representative sample nena khaikhin chuan confirm hmasa phawt ang che. Material-level test result chu ID siam zawh tawh emaw, payment card emaw certification anga ngaih loh tur.
Wallis hian prototype, pilot order, scheduled bulk order, leh hun rei tak chhunga card-material supply program hrang hrangte tan customized PETG overlay leh PET inlay production a support a ni.
Production coordination-ah hian material buatsaih, coating, sheet cutting, antenna siam, chip bonding, inlay assembly, electrical inspection, sheet-layout control, packaging, labeling, leh export documentation te a tel thei a ni.
PETG Overlay siam chhuah a ni
PET Inlay siam chhuah a ni
Coated overlay leh RFID inlay materials bakah hian Wallis hian a kaihhnawih PET, PETG, PVC, polycarbonate, core sheet, printable sheet, magnetic stripe overlay, leh composite card-material mamawh te chu a coordinate thei a ni.
Card siamna atana hman tur PET Sheet
PET Card Core Material hmanga siam a ni
PETG overlay surface te hi leivut, scratches, moisture, bending, fingerprint, leh contamination atanga ven a ngai a ni. RFID inlays hian pressure nasa lutuk, lumna thunun loh, static discharge, component chhiatna, leh dahna tur hmun remchang lo atanga venhimna a mamawh bawk.
PE film emaw, inner wrapping venhimna emaw chu tifai rawh.
Moisture-resistant kraft paper emaw sealed packaging emaw hmanga siam a ni.
Carton flat, reinforced box, thing case, emaw pallet packaging emaw a awm thei.
Corner leh edge venhimna hmangin deformation tihtlem a ni.
Chip, antenna leh film chunglam venhimna tur separation sheet.
Lot number, material, thickness, chip, frequency, layout, leh orientation label te a awm a.
OEM label, shipping mark, leh packing list te chu a duh ang anga siam a ni.
Material sealed chu a original packaging-ah hmun thianghlim, vawt, temperature control theihna hmunah dah rawh. Ni êng direct, lumna nasa tak, lum lutuk, phurrit rit tak, leivut, leh chemical chhe thei lakah hla takah dah rawh.
Wallis Card Material dahkhawmna hmun a ni
Quotation dilna dik tak chuan PETG overlay chauh, PET core chauh, RFID inlay chauh emaw matched set emaw i lei tih a hriat chian tur a ni . A hnuaia details te hi share hian pricing dik lo leh sampling cycle tul lo tak tak a awm loh nan a pui thin.
| Quotation Field | Details pek tur a ni |
|---|---|
| Product scope a ni | PETG coated overlay, plain PET core, antenna carrier, RFID pre-inlay, prelam emaw combined supply emaw a awm thei bawk |
| Overlay specification a awm bawk | Thickness, finish, coating direction/strength, printing process leh roll/sheet size te a ni |
| PET inlay tih hi a chiang hle | Gauge, PET grade/color, RFID option, antenna, chip leh approved drawing te a awm bawk |
| Card siam dan tur | Finished-card size leh thickness, card layout, printed core, machine leh lamination process te a ni |
| Chhiartute leh QA | Chip protocol, reader model, RF test dan tur, peel/flatness limit leh sample quantity te a awm bawk |
| Commercial order hmanga tih tur a ni | Trial volume, kum tin mamawh, target packaging, destination leh document dilna te |
Wallis hian card siamtu, RFID converter, smart card factory, security printer, distributor, personalization center, leh OEM customer te nen an thawk dun a, customized overlay leh inlay materials mamawh an ni.
One-stop PETG overlay, PET core, RFID inlay, leh card-material sourcing te a awm bawk.
Plain PET, antenna-only, RFID pre-inlay, leh prelaminated inlay option te pawh a awm bawk.
LF, HF, NFC, UHF, leh dual-frequency project hrang hrangte chu a duh ang anga siam a ni.
Chip, antenna, thickness, sheet size, leh card layout te chu a duh angin a siam a ni.
Coated, strong-coated, matte, frosted, laserable, leh magnetic overlay te pawh a awm thei.
Lamination leh reader testing atan prototype leh sample support a ni.
Quality enfiahna, lot traceability, export packaging, leh OEM labeling te a awm bawk.
Wallis hnenah i finished-card structure, material, thickness, sheet layout, RFID frequency, chip, antenna, printing method, reader information, estimated quantity, leh delivery destination te thawn rawh.
Custom Quotation dil rawhPETG overlay hi a tlangpuiin laminated card hmalam emaw hnunglam emawa transparent protective layer a ni. PET inlay hi internal structural emaw functional layer a ni a, RFID chip leh antenna a awm thei bawk.
No. PET inlay chu electronics tel lo plain structural core, antenna-only inlay, chip-and-antenna pre-inlay, emaw RFID prelaminated inlay kimchang tak a ni thei. Buyers te chuan an mamawh chi chu an tarlang tur a ni.
PETG overlay hi 0.04mm atanga 0.15mm vel a ni. Common options chu 0.06mm, 0.08mm, leh 0.10mm te a ni a, card structure a zirin customized thickness chu evaluate theih a ni bawk.
Awle. PET inlay thickness hi chip, antenna, card layer, finished-card thickness, lamination process, leh mechanical mamawh dan azirin thlan tur a ni.
Project option hrang hrangah hian 125kHz LF, 13.56MHz HF emaw NFC, UHF, leh dual-frequency configuration te pawh a tel thei. Availability chu chip thlan, antenna, layout, quantity leh application thlan danah a innghat.
Awle. Chip hming dik tak, siamtu, memory, protocol, security mamawh, reader model leh kum tin volume te pe rawh. Wallis hian availability leh inlay compatibility a evaluate thei a ni.
Copper wire leh etched aluminum antenna option te chu evaluate theih a ni. Design dik tak chu frequency, chip capacitance, card dimension, read distance, production method, leh cost target-ah a innghat a ni.
Mixed-material structure hi coating, ink, softening temperature, shrinkage, pressure leh cooling condition te a inmil chuan a awm thei a ni. Bulk production hmain sample test a ngai a ni.
Printing hi treated emaw printable surface tha tak hmangin a theih mai thei. Ink, curing method, print position, bonding side, transparency, leh lamination compatibility te chu test a ngai a ni.
Awle. Sheet khata card awm zat, sheet dimension, antenna awmna, chip awmna, registration mark, punching margin, leh card orientation te chu approved drawing angin customized theih a ni.
Test-naah hian antenna continuity, resistance, chip bonding, chip identification, reader communication, UID reading, memory access, encoding, sheet layout, thickness, leh visual inspection te a tel thei a ni.
No. Security hi chip thlan, authentication method, encryption, key, reader configuration, backend software, credential management, card personalization, leh system design pumpuiah a innghat a ni.
PET leh PETG material te hi collection leh processing system tha tak hmangin recycle theih a ni. Mahse, finished-card recyclability chu coating, ink, adhesive, chip, antenna, magnetic stripe, mixed polymer leh local recycling infrastructure-ah a innghat a ni.
Awle. Printing, coating adhesion, layer bonding, card flatness, chip reading, antenna performance, punching, personalization, leh reader compatibility te enfiah nan sample leh pilot testing neih a tha.
Khawngaihin overlay material, thickness, surface, coating, inlay type, sheet dimension, card layout, frequency, chip, antenna, printing method, reader, estimated quantity, packaging, leh delivery destination te pe rawh.
No. PETG hi glycol-modified polyester a ni a, card core atana hman PET grade te hian shrinkage, crystallinity leh heat response hrang hrang an nei thei thung. Mixed card stack chu coating leh hmanrua tak tak nen a qualified tur a ni.
Pre-inlay-ah hian a tlangpuiin carrier-ah bonded chip-and-antenna assembly a awm a, chu chuan card conversion dang a mamawh a ni. Prelam hian RFID assembly hnathawk chu card-core structure buatsaih sa chhungah a khuh a. Supply format dik tak chu drawing-ah hian tarlan tur a ni.
Overlay pahnih, printed core leh center core emaw prelam emaw nominal thickness te chu dah la, lamination hnuah actual thickness confirm rawh. Material compression, flow leh chip-zone geometry te hian tehna siam zawh tawh chu a thlak danglam thei a ni.
Automatic takin a ni lo. Standard coated PETG hi laser responsive a ni hauh lo. Laser marking atan hian grade chiang tak neih a ngai a, laser tum leh card structure zawh tawhah test a ngai bawk.
Antenna detuning, chip-bond chhiatna, metallic printing emaw card stack thlak danglam emaw hian performance a nghawng thei a ni. Lamination hma leh hnuah design inang chu reader, orientation leh measurement method tarlan hmangin test rawh.
No. Temperature dik tak, pressure, heating time leh cooling cycle dik tak chu PETG overlay grade dik tak, PET core, ink, coating, electronics leh laminator-ah a innghat a ni. Pilot-production recipe pawm tawh chu hmang rawh.
Default-ah a ni lo. Frequency, chip data format leh reader protocol hrang hrang a inang lo thei. Low-frequency RFID product zawng zawng chu a inang vek anga ngaih ai chuan application standard leh reader dik tak chu nemnghet rawh.
Material specification pawm tawh, card-stack drawing, golden sample, chip leh antenna part number, test procedure, lot traceability leh material emaw process thlak danglamna eng pawh documented approval te chu vawng reng tur a ni.
