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Polycarbonate musimboti mapepa emakadhi eID, marezinesi ekutyaira uye mapeji edata repasipoti. Tsika ukobvu, ruvara, opacity, pamusoro uye laserable mamakisi, ine B2B samples yekudhinda, lamination uye kuyedzwa.
WLS-PC Core Sheet
WALLIS
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Wallis polycarbonate musimboti sheet inopihwa kune ekuchengetedza maprinta, vagadziri vemakadhi, vanogadzira inlay, masisitimu ekubatanidza uye zvinyorwa makondirakiti vanogadzira multilayer identity zvitupa. Machena, akajeka uye epurojekiti-yakananga PC mamakisi anogona kugadzirirwa makadhi echitupa enyika, marezinesi ekutyaira, mvumo yekugara, e-passport data mapeji, magwaro ekuwana uye mamwe makadhi ehupenyu hurefu.
Ukobvu huripo hunobva pa50μm kusvika 800μm , nemhando dzemashizha akajairwa se505×590mm uye 295×485mm. Vatengi vanogona kutsanangura ukobvu, opacity, ruvara, kuumbwa kwepasi, kudhinda kurapwa, laser mhinduro, firimu rekudzivirira uye kurongedza kunze kwenyika zvinoenderana negwaro rakatenderwa kuvaka uye zvigadzirwa zvekugadzira.
Chinyorwa chakakosha chekusarudza: 'PC core sheet,' 'printable PC film,' 'laserable PC film' uye 'transparent PC overlay' inotsanangura mashandiro akasiyana siyana. Laser yekumaka kuita ndeyekugadzira- uye layer-yakananga; inofanirwa kusimbiswa neiyo chaiyo laser system, layer stack uye personalization chinangwa pamberi pekugadzirwa kwakawanda.
Yakazara-PC zvinyorwa zvimiro: zvakagadzirirwa inoenderana polycarbonate layers iyo fuse pasi pekudzora kupisa uye kumanikidza.
Purojekiti-chaiwo kudhinda: offset, skrini uye UV kudhinda kunogona kuongororwa neingi yakasarudzwa uye yekurapa system.
Laserable sarudzo: inowanikwa kana iyo yakatsanangurwa layer ichifanira kuburitsa inodzorwa greyscale kana dema mutsauko.
OEM kutendeuka: customized ukobvu, shizha saizi, ruvara, pamusoro uye kurongedza kuti maindasitiri kugadzirwa.
Sample kusimbiswa: kudhinda, lamination, laser, kucheka uye kupedza-gwaro bvunzo pamberi pekutengeserana mvumo.
Kumbira PC Core Sheet Samples uye Ongororo yehunyanzvi
Hwandu dziri pazasi dzinotsanangura huwandu hwechigadzirwa chazvino uye data rereferenzi. Yekupedzisira kushivirira, optical zvivakwa, laser mhinduro, lamination paramita uye maitiro ekugamuchira anofanirwa kurekodhwa mune yakabvumidzwa tekinoroji yakatarwa kana yeGoridhe Sample yepurojekiti yega yega.
| Parameter | Inowanikwa Tsanangudzo |
|---|---|
| Material | Polycarbonate (PC) firimu kana shizha remazhinji chengetedzo-gwaro zvimiro |
| Basa Rinoshanda | Core, yakadhindwa musimboti kana purojekiti-chaiyo yemukati dhizaini yemukati; simbisa kana giredhi rakasarudzwa rinogona kurongeka |
| Makobvu Range | 50–800μm (0.05–0.80mm); kuwanikwa kwekupedzisira kunoenderana negiredhi, ruvara, pamusoro uye vhoriyamu yekurongeka |
| Standard Sheet Sizes | 505×590mm, 295×485mm uye customized zviyero |
| Ruvara uye Opacity | Ichena, yakajeka kana yakagadzirirwa; tsanangura opacity, kuchena uye kushivirira kwemavara kana zvichidikanwa |
| Surface Options | Matte, yakanaka matte, inopenya kana purojekiti-yakananga mameseji; kudhinda kurapwa kunowanikwa negiredhi |
| Maitirwo Ekudhinda | Offset, silk-screen uye UV kudhinda zvichienderana neingi, pretreatment, kurapa uye lamination miedzo. |
| Laser Personalization | Laserable formulations inowanikwa; tsanangura laser wavelength, focal strategy, tarisiro yekusiyanisa uye layer chinzvimbo |
| Lamination | Inodzorwa yakakwirira-tembiricha PC lamination; tembiricha, kudzvanywa, kugara uye kutonhora zvinoenderana neiyo yakazara stack |
| Electronic Integration | Inogona kuongororwa neasina kuonana inlays, kuonana mamodule uye transparent-hwindo zvimiro |
| Packaging | Firimu redziviriro, kuputira hunyoro, makatoni, mapallets uye akagadziridzwa batch label. |
| MOQ uye Nguva Yekutungamira | Yakasimbiswa zvinoenderana negiredhi, zviyero, ruvara, pamusoro, kushivirira uye chirongwa chekugadzira |
Nhamba idzi dzinobatsira pakukurukurirana kweinjiniya kwekutanga asi haisi vimbiso yepasirese yakatarwa kune yega PC giredhi. Iyo yekupedzisira TDS, nzira yekuongorora uye kushivirira kunofanirwa kusimbiswa kune yakasarudzwa zvinhu.
| Property | Direction / Method | Unit | Typical Reference |
|---|---|---|---|
| Density | - | g/cm³ | 1.22 ±0.05 |
| Tensile Simba | Machine / yakatwasuka | MPa | ≥50 |
| Tensile Simba | Yakachinjika / yakatwasuka | MPa | ≥50 |
| Vicat Softening Temperature | Yakatarwa bvunzo mamiriro kuti asimbiswe | °C | 145 ±2 |
| Surface Dyne Level | Yakarapwa inodhinda pamusoro | dhine/cm | ≥38 |
| Makobvu Tolerance | Chirongwa chekuyera chirongwa | μm kana % | Simbisa negiredhi uye nemitengo yekutenga |
| Shrinkage / flatness | Mushure mekubvumirwa lamination cycle | - | Tsanangura nekadhi rakazara |
Gwaro rakachengeteka repolycarbonate rinowanzo kuve nemateru ePC akati wandei ane mabasa akasiyana. Kushandisa izwi rechokwadi muRFQ kunodzivirira vatengi kuti vasagamuchire akafukidzwa akajeka pavanenge vachida opaque inodhinda musimboti, kana bhaisikopo risingaverengeke pavanenge vachida yemukati laser personalization.
| Layer Type | Primary Function | Key RFQ Mibvunzo |
|---|---|---|
| Ichena / Opaque PC Core | Inopa opacity, ruvara rwemashure, ukobvu uye rutsigiro rwechimiro; inogonawo kutakura mifananidzo yakadhindwa | Inodiwa ukobvu, kuchena, opacity, pamusoro, kudhinda nzira uye kana laser mhinduro inodiwa |
| Transparent PC Core / Window Firimu | Inogadzira nzvimbo dzakajeka, mahwindo kana zvemukati zvimiro zvikamu | Optical kujeka, haze, magadzirirwo, ukobvu, hwindo geometry uye lamination kuenderana |
| Inodhindwa PC Firimu | Inogamuchira offset, skrini kana UV ingi pamberi pelamination | Kudhinda divi, dyne level, inki system, kurapa, adhesion uye ruvara chinangwa |
| Laserable PC Firimu | Inogadzira inodzorwa laser musiyano wemavara, mufananidzo kana kuchengetedza magiraidhi | Laser system, wavelength, focal kudzika, greyscale, dema density, tactile chinodiwa uye layer chinzvimbo. |
| Isiri-Laserable PC Overlay | Inodzivirira akadhindwa kana laser akaturikidzana pasina kuwedzera isingadiwe laser reaction | Kujeka, kuumbwa kwepasi, ukobvu, maitiro ekukwenya uye kuburitswa kweplate |
| Yakaputirwa / Bonding PC Overlay | Inoshandisa coating kuvandudza bonding mune yakatsanangurwa yakasanganiswa kana yakadhindwa kuvaka | Coating side, inoenderana substrate, peel chinangwa, kupisa kutenderera uye kuchengetedza mamiriro |
Nhamba chaiyo uye nzvimbo yezvikamu zvinotemerwa nemugadziri wegwaro. Muenzaniso unotevera unoratidza kuti sei pepa repakati richifanira kusarudzwa sechikamu chezerere kwete sechinhu chakasarudzika.
| Muenzaniso Position | Inogoneka Chinyorwa | Chinangwa uye Kusimbiswa |
|---|---|---|
| Outer Surface | Transparent isiri-laserable kana inodzivirira PC pamusoro | Surface texture, abrasion protection, optical kujeka uye kuenderana nekudzika kwemunhu |
| Laser Personalization Layer | Transparent kana chena laserable PC firimu | Mufananidzo, zvinyorwa, greyscale, CLI/MLI kana purojekiti-chaiyo laser mifananidzo |
| Printed Layer | Inodhindwa chena kana yakajeka PC firimu | Guilloche, microtext, UV magiraidhi, kumashure uye akasiyana dhizaini zvinhu |
| Structural Core | Ichena, yakajeka kana ine ruvara PC musimboti sheet | Inovaka ukobvu hwegwaro, kusimba, opacity uye yemukati layer kutendeseka |
| Electronic Inlay Layer | PC-inoenderana antenna uye chip inlay | Chip chinzvimbo, antenna tuning, kudzvanywa kugovera uye post-lamination RF kuita |
| Hwindo / Chengetedzo Layer | Transparent PC isa kana customized hwindo layer | Window geometry, kunyoreswa, edge fusion uye optical mhando |
| Reverse Layers | Mirrored akadhindwa, laserable uye overlay marongero sezvakagadzirwa | Kuenzana ukobvu, flatness, kukotama maitiro uye akapedza gwaro symmetry |
Inoenderana polycarbonate layers inogona kuumba yakabatana kadhi muviri pasi pekupisa kwakasimbiswa, kudzvanywa uye kutonhora kutenderera. Iko kukosha kwekuchengetedza kunobva kune yakazara yakasungirirwa kuvaka: dhizaini dhizaini, yakadhindwa ingi, inlay dhizaini, windows, overlays uye personalization zvese zvinofanirwa kugadzirwa pamwechete.
Laserable PC mamakisi anogona kugadzira zvinyorwa, nhamba, mapikicha uye grayscale ruzivo pazasi pegwaro repamusoro. Giredhi rakasarudzwa rinofanirwa kuyedzwa kusiyanisa, kugadzirisa, kudzika kwefocal, layer discoloration uye kukanganisa pazvikamu zviri pedyo zvinoonekera kana zvakadhindwa.
Mafirimu machena machena anogona kuvanza antenna uye nekupa inodzorwa kudhinda kumashure, nepo mafirimu akajeka anogona kutsigira windows uye optical kuchengetedza marongero. Opacity, kuchena, haze uye kuumbwa kwepasi kunofanirwa kutsanangurwa sezviyero zvinoyerwa uko dhizaini yedhizaini inotsamira pazviri.
Mapepa epakati ePC anoshandiswa mune akakwira-tembiricha lamination masisitimu, asi kuita kwedimensional kunoenderana negiredhi uye kutenderera. Mema muchina-kutungamirwa uye kuchinjika shrinkage, sheet curl, yapera ukobvu uye flatness mushure mekudziya chaiko uye kutonhora kutevedzana.
Iyo chaiyo yakakosha zvinhu zvinoenderana nehupenyu hwegwaro, personalization tekinoroji, zvigadzirwa zvekugadzira, mutengo wakanangana uye zvinodiwa zvekuteerera. PC haisi yega sarudzo yakanakisa kune yega yega kadhi rekutengesa, uye PVC kana PETG haifanirwe kutsiviwa mune yakabvumidzwa yakazara-PC yekuchengetedza gwaro pasina kufanirwa.
| Sarudzo Factor | Polycarbonate Core | PVC Core | PETG Core |
|---|---|---|---|
| Mapurogiramu Akajairika | Zvitupa zvenyika, marezinesi ekutyaira, magwaro ekugara, mapeji edata repasipoti uye magwaro akachengeteka akasimba | Bhengi, nhengo, chipo, hotera, telecom uye makadhi ekutengesa | Makadhi eCommerce uye akasarudzwa akadzika-tembiricha akasimba kana akaderedzwa-PVC zvimiro |
| Lamination System | Yepamusoro-tembiricha inoenderana PC stack ine inodzorwa kutonhora | Yakajairika PVC kadhi lamination kutenderera | PETG-chaiyo kana inoenderana hybrid kutenderera |
| Laser Personalization | Chinangwa-chakagadzirwa laserable mamakisi anoshandiswa zvakanyanya kune yemukati personalization | Kazhinji inotsamira pakudhinda kana kumwe kuzviitira munhu kunze kwekunge akagadzirwa chaizvo | Special mamakisi anogona kuwanikwa; simbisa maitiro chaiwo e-laser |
| Transparent Windows | Yakanyatsokodzera kuzere-PC pachena-hwindo dhizaini kana yakagadzirwa senge stack | Zvinogoneka nekuisa kana kuvharika asi akasiyana fusion maitiro | Inogoneka mune inowirirana PETG zvimiro |
| Material Mixing | Kuita kwakanakisa kazhinji kunoda yakasimbiswa inoenderana layer mhuri | Hybrid zvimiro zvinoda adhesion uye shrinkage miedzo | Hybrid zvimiro zvinoda adhesion uye thermal-cycle miedzo |
| Qualification | Kuedzwa kwakazara kwegwaro, kuchengetedzwa kwedhizaini mvumo uye kugamuchirwa kwakanangana neprojekiti | Kudhinda, lamination uye kupedza-kadhi kusimbiswa | Kudhinda, lamination, kusimba uye kupera-kadhi kusimbiswa |
PC musimboti zvinhu zvinogona kutsanangurwa mu multilayer hurumende zvitupa zvinoda durable kadhi geometry, yemukati laser personalization uye kubatanidzwa nekuona kana zvemagetsi kuchengetedza maficha. Kukodzera kwekupedzisira kunodzorwa nemvumo yekupa uye yakatenderwa gwaro rinotsanangurwa.
Kune mapeji e data repasipoti, iyo yakakosha pepa inongova chikamu chimwe chete chekuvaka. Vatengi vanofanirawo kutsanangura kubatanidzwa kwehinge, chip uye antenna kuiswa, mahwindo akajeka, layer sequence, personalization tekinoroji, kuomarara kwepeji uye kabhuku kanoungana zvinodiwa.
Zvirongwa zverezinesi rekutyaira zvinogona kushandisa maPC akajeka uye akajeka akadhindwa mifananidzo, laser portraits, tactile mhedzisiro uye ruzivo rwunoverengwa nemuchina. Kugamuchirwa kwezvinhu kunofanirwa kusanganisira dimensional, optical, bending uye personalization bvunzo.
Mushandi wehupenyu hurefu, mapurisa, mauto, hutano hwehutano uye ruzivo rwekuwana vanogona kushandisa zvimiro zvePC apo chirongwa chinoda kuvakwa kwakasimba uye kudzorwa munhu. Kusvika tekinoroji kuenderana kunofanirwa kusimbiswa zvakasiyana kubva kune epurasitiki substrate.
PC-inoenderana inlays inogona kuisirwa mukati meiyo yakaenzana layer stack. Simbisa antenna frequency, chip chinzvimbo, module mhango, coil kana etched antenna geometry, lamination pressure uye kuverenga kuita pamberi uye mushure memunhu.
| Customization Item | Sarudzo dzeKukurukura | Ruzivo Runodiwa kubva kune Mutengi |
|---|---|---|
| Hukuru uye Sheet size | 50–800μm renji, akajairwa kana akachekwa-akachekwa mapepa | Layer kudhirowa, kupedzwa ukobvu, saizi yeplate, collation uye kucheka marongero |
| Ruvara uye Opacity | Muchena, pachena kana purojekiti-yakananga ruvara | Ruvara rwakananga, opacity kana kutapurirana kunodiwa, nzira yekubvumidza |
| Surface Texture | Matte, yakanaka matte, inopenya kana yakatsanangurwa manyorerwo | Kudhinda maitiro, kupera kweplate, tactile chinangwa uye kutaridzika kwegwaro |
| Kudhinda Kurapa | Offset, skrini kana UV-inodhinda pamusoro negiredhi | Ink brand, yekurapa system, dyne chinangwa uye nzira yekunamatira |
| Laser Response | Isiri-laserable, laserable kana purojekiti-chaiwo musiyano | Laser midziyo, wavelength, focal kudzika, dema density uye greyscale chinangwa |
| Dziviriro Firimu | Kudzivirirwa kwedivi rimwe kana maviri kunowanikwa | Peel direction, yakachena-yekamuri zvinodiwa uye kugadzira kubata |
| Packaging | Makatoni, mapallets, mwando chipingamupinyi uye zvinyorwa zvepachivande | Pack huwandu, pallet miganhu, kwekuenda uye batch traceability fomati |
Tumira iyo stack yegwaro: ipa dhizaini yekudhirowa neukobvu, basa, ruvara, kudhinda, laser uye zvemagetsi zvinhu kune yega yega.
Simbisa mamakisi emumiriri: siyanisa musimboti, unodhindwa, unogona kurongeka, usinga-raseable uye wakavharwa masampula asati achekwa.
Mhanyai kuuya yekuongorora: kurekodha ukobvu, zviyero, flatness, chitarisiko, ruvara, inodzivirira firimu uye batch chitupa.
Dhinda masampula ekugadzira: shandisa iyo chaiyo yekubvisa, skrini kana UV inki, kurapa marongero uye kufukidzwa kwehunyanzvi.
Laminate iyo yakazara stack: shandisa yakarongwa simbi mahwendefa, makushion, kuburitsa maseru, kumanikidza, kudziyisa uye kutonhora kutevedzana.
Yedza kusarudzika: ongorora kusiyanisa kwelaser, greyscale, kudzika kwakadzika, kugadzirisa kwemavara uye kupindirana neakadhindwa kana akajeka maficha.
Yakazara gwaro bvunzo: ongorora peel kuramba, flatness, kukotama, torsion, mupendero mhando, kunyoreswa kwehwindo uye kuita kweRFID pazvinoshanda.
Bvumira Yegoridhe Sample: saina chivakwa chinogamuchirwa, hwindo rekuita, nzira yekuongorora, kurongedza uye kukanganisa maitiro pamberi pekupa kwakawanda.
Kurukura Yako PC Kadhi Stack naWallis
| Inspection Stage | Yakakurudzirwa Cheki | B2B Kugamuchira Basis |
|---|---|---|
| Incoming Material | Mepu yehukobvu, hukuru hwemashizha, kuenzana, kupfava, kuremara kwepamusoro, firimu rekudzivirira uye batch label. | Yakatemerwa yakatarwa, sampling chirongwa uye calibrated kuyerwa nzira |
| Optical Properties | Huchena, musiyano weruvara, kupenya, kutapurirana, mhute uye kupenya pazvinoshanda | Mutengi-anotsanangurwa chiridzwa, chinovhenekera, kutsigira uye kushivirira |
| Kudhinda | Dyne level, wetting, image density, inki adhesion, kurapa, kuvhara uye kuenderana kwemavara | Chaiyo inki system uye yakadhindwa sampuro yakadhindwa |
| Lamination | Layer kunyoreswa, fusion, peel maitiro, shrinkage, curl, mabhuru, kuburitswa kweplate uye kupera kweukobvu | Yakatenderwa yakazara-stack kutenderera uye yakatonhodzwa sampuli |
| Laser Personalization | Musiyano, greyscale, resolution, kudzika kwakadzika, data yakadzokororwa uye edge artifacts | Chaiyo laser system uye yakatenderwa personalization faira |
| Electronic Performance | Chip basa, kuenderera kwe antenna, frequency mhinduro uye kuverenga chinhambwe pamberi uye mushure mekucheka | Yakatsanangurwa muverengi, bvunzo chinzvimbo uye encoding mamiriro |
| Kutendeuka | Kufa kucheka, kugaya, kubaya, kumucheto mhando, zviyero uye module cavity chinzvimbo | Yakatenderwa kudhirowa uye kudzika kwemvura kushivirira kwemidziyo |
| Packaging | Kudzivirirwa kwepamusoro, hunyoro chipingamupinyi, huwandu hwepakiti, pallet mamiriro uye traceability zvinyorwa | Kutenga odha uye kubvumidzwa kurongedza kuraira |
| Nyaya | Inogoneka Inokonzeresa | Macheki uye Magadzirirwo Ekuita |
|---|---|---|
| Weak Layer Bonding | Giredhi risingaenderane, pasi-kupisa, kusakwana kudzvanywa, kurapa inki barriers kana kusvibiswa | Simbisa layer mhuri uye kutaridzika; ongorora kuvharwa kweinki; gadzirisa kupisa kwakasimbiswa, kudzvanywa uye kugara hwindo |
| Kadhi Curl kana Warpage | Unbalanced stack, directional shrinkage, kusaenzana kudziyisa kana kukurumidza kuburitswa | Balance layer thick; rekodhi MD/TD kutungamira; inotonhorera pasi pesimba rinodzorwa |
| Low Laser Contrast | Giredhi isiriyo, kudzika kwefocal kusiriyo, simba rakaderera kana laser layer rakaiswa zvakadzika zvakanyanya | Simbisa kuumbwa uye nzvimbo yakatsetseka; optimize laser parameters uchishandisa inodzorwa bvunzo matrix |
| Isingadiwe Laser Kusviba | Laser-sensitive material yakashandiswa apo yakajeka isina-reactive layer yaidiwa | Tsiva neyakaomeserwa isina-laser firimu kana gadziridza focal strategy uye layer kutevedzana |
| Ink Delamination | Simba repasi pasi, inki isingaenderane, kurapa isina kukwana kana inorema inki kufukidzwa | Tarisa dyne uye zera rekurapa; bvunzo inki adhesion pamberi uye pashure lamination |
| Inooneka Antenna kana Chip | Kusakwana opacity, mutete core, kushata kwechikamu chekuisa kana kudzvanywa kudhindwa | Wedzera opacity yakasimbiswa; dzokorora chiyero chemukati uye inlay cavity; ongorora cushion uye simbi ndiro system |
| Window Registration Error | Cheka kushivirira kwekuisa, collation movement kana thermal shrinkage | Tsanangura X / Y kunyoresa kushivirira; shandisa mitsetse yekuenzanisa uye kuyera mushure mekutonhora |
Mapepa ePC anofanirwa kuramba akachena, akapfava uye akadzivirirwa kubva kune unyoro, guruva, zvikweshwa uye zvakanyanya tembiricha shanduko. Chengetedza zvinhu mupakeji yazvo yepakutanga kusvika yashandiswa, tendera zvinhu zvakamisikidzwa kuti zvisvike munzvimbo yekugadzira-yekamuri usati wavhura, uye tevera yekutanga-mu-yekutanga-kunze kutonga uko zera rekurapa rinokanganisa kudhinda.
Shandisa firimu rekudzivirira, kupindirana kana kuputira kwakachena kwakakodzera kune yakasarudzwa nzvimbo.
Chengetedza mapepa akatsetseka pamapallet anotsigirwa uye dzivirira mitoro yenzvimbo inogona kuunza curl.
Chengetedza makatoni kubva mukumisikidzwa panguva yekuendesa dura uye kutumira kune dzimwe nyika.
Ziva giredhi, ukobvu, pamusoro, inodhinda divi, batch nhamba uye huwandu pasuru yega yega.
Chengetedza laserable uye isiri-laserable mamakisi akapatsanurwa mumuviri kudzivirira kugadzirwa musanganiswa-ups.
Wallis inopa kadhi-zvinhu masisitimu pane kubata yega PC firimu sechigadzirwa chimwe chete. Iyo B2B ongororo inogona kuvhara epakati mashiti, anodhinda akaturikidzana, akajeka akafukidzira, mafirimu anokwenenzverwa, inlay zvimiro uye kurongedza kuitira kuti vatengi vakwanise kuenzanisa zvinhu zvakarongwa vachipesana nepepa rakazara stack.
Kusarudzwa-kwakavakirwa giredhi kusarudzwa: siyanisa opacity, printability, laser mhinduro uye overlay basa.
Tsika kushandura: ukobvu, hukuru, pamusoro, ruvara uye inodzivirira kurongedza kwekugadzira marongero.
Sample-yekutanga kusimbiswa: zvinhu zvekudhinda, lamination, laser uye kupedza-gwaro miedzo.
Kukurukurirana kweBatch: zvirevo zvekutenga, mavara uye maitiro emhando yekudzokorora kupa.
Export coordination: kuchengetedza kurongedza uye kutumira rutsigiro kune mafekitori emakadhi, vanogovera uye kuchengetedza-gwaro makondirakiti.
Kumbira B2B PC Core Sheet Samples uye Mitengo
Iyo PC isina kujeka, yakajeka kana ine mavara PC layer inoshandiswa mukati me multilayer kadhi kana gwaro. Zvichienderana negiredhi, inogona kupa chimiro, opacity, printability kana inodzorwa laser mhinduro. Haifanirwe kuvhiringwa otomatiki neyakavharika inodzivirira.
Ikozvino mutsara ndeye 50-800μm. Ukobvu hwakasarudzwa hunofanirwa kuverengerwa pamwe chete nekufukidzira, zvidimbu zvinodhinda, zvigadziko zvinogoneka, magetsi inlays uye chinangwa chakapedzwa-gwaro ukobvu.
Kwete. Laser kumaka kunoenderana nekugadzira uye chinangwa chedhizaini chinzvimbo. Rondedzera kana iyo layer ichifanira kunge isiri-reactive, grayscale laserable kana yakakwira-kusiyanisa laserable, wobva waiedza neiyo chaiyo laser midziyo.
Anodhinda mamakisi anogona kuongororwa kuti abvise, silk-screen uye UV kudhinda. Simbisa iyo inodhinda divi, dyne level, inki system, kurapa mamiriro uye adhesion mushure me lamination pamberi pekutengesa kugadzirwa.
Ose ari maviri anogona kuita kune laser simba, asi ivo vanotora zvinzvimbo zvakasiyana uye vanoshandira akasiyana zvimiro kana zvemeso mabasa. Sarudzo inobata kudzika kwekutarisa, kutaridzika kwemufananidzo, kujeka uye kuchengetedza-chimiro dhizaini.
Chimiro chehybrid chinogoneka chete mushure mekusimbisa kuwedzera kwekupisa, kupfavisa maitiro, kusungirirana, shrinkage uye kupera-kadhi kusimba. Usafungidzira kuti chinhu chakagadzirirwa yakazara-PC stack ichasevha zvakanaka nePVC kana PETG.
Hapana gadziriro yepasi rose. Tembiricha, kudzvanywa, kugara, chiyero cherampu uye kutonhora zvinoenderana negiredhi, ukobvu hweshiti, kufukidzwa kweinki, inlay chimiro, plate system uye yakazara stack. Gadzira hwindo rekugadzira kuburikidza nemiedzo inodzorwa.
Inogona kuongororwa sechikamu chimwe mune yakazara data-peji dhizaini. Iyo purojekiti inofanirwa kupatsanura kuvaka hinge, mahwindo akajeka, zvinhu zvemagetsi, lamination, laser personalization, kuungana kwebhurocha uye kuburitsa-mvumo zvinodiwa.
Kwete. Kuchengetedzwa kwegwaro kunobva kune yakadzorwa dhizaini uye kugadzirwa kwechokwadi chakazara, zvinosanganisira zvinhu, kudhinda, laser personalization, zvemagetsi zvikamu, chengetedzo maficha, kuburitsa uye verification masisitimu.
Hongu, zvichienderana negiredhi uye kugona kwekugadzira. Ipa ruvara runogona kuyerwa, opacity, haze, gloss kana mameseji tarisiro uye tsanangura kuti mutengi anozvibvumira sei.
Chengetedza dzakachena, dzakaoma, dzakapfava uye dzakachengetedzwa mupakeji yepakutanga. Dzivisa condensation, guruva uye pamusoro kukuvara. Mamiriro asina kuvhurwa mapaketi kunzvimbo yekugadzira isati yashandiswa kana imba yekuchengetera uye tembiricha yekamuri zvichisiyana.
Kuyera ukobvu, kudhinda, inki adhesion, lamination, shrinkage, flatness, peel maitiro, laser musiyano, kucheka uye RFID kuita pazvinoshanda. Bvumira Yegoridhe Sample uye yakanyorwa yekugamuchira maitiro.
Ipa iyo application, layer kudhirowa, ukobvu, saizi yeshiti, ruvara, opacity, pamusoro, kudhinda maitiro, laser inodiwa, vhoriyamu yegore, sampling zvinodiwa, kurongedza uye kwainoenda.
| RFQ Item | Details yekupa |
|---|---|
| Document Application | Chitupa chenyika, rezenisi rekutyaira, mvumo yekugara, peji redata repasipoti, magwaro ekuwana kana chimwe chirongwa |
| Layer Basa | Opaque core, transparent core, printable layer, laserable layer kana isiri-laser over overlay |
| Dimensions | Ukobvu, saizi yeshiti, nzvimbo inoshandiswa, zviyo / extrusion gwara uye kushivirira kwedimensional |
| Optical Zvinodiwa | Ruvara, kuchena, kupenya, kutapurirana, mhute, kupenya uye kutaridzika kwepamusoro |
| Kudhinda | Offset, skrini kana UV maitiro, inki brand, yekurapa system uye yekuvhara yemifananidzo |
| Laser | Muchina, wavelength, zano rekutarisa, chinangwa chekusiyanisa, greyscale uye yakanangwa layer kudzika |
| Lamination | Yakazara stack, ndiro uye cushion system, tembiricha, kudzvanywa, kugara uye kutonhora |
| Electronics | Chip, antenna, module, hwindo kana hinge yekubatanidza pazvinoshanda |
| Commercial Details | Sample uwandu, vhoriyamu yekuyedza, kufanotaura kwegore, kwekuenda uye kurongedza zvinodiwa |
