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ID card, driving licenses leh passport data page-a hman tur polycarbonate core sheet te a awm bawk. Custom thickness, color, opacity, surface leh laserable grade hrang hrang a awm a, printing, lamination leh testing atan B2B sample te a awm bawk.
WLS- PC Core sheet
WALLIS
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Wallis polycarbonate core sheet hi security printer, card siamtu, inlay siamtu, system integrator leh document contractor multilayer identity credential siamtute hnenah pek a ni. White, transparent leh project-specific PC grade te chu national ID card, driving licence, residence permit, e-passport data page, access credentials leh long-life card structure dangte tan configure theih a ni.
Thickness awm thei chu 50μm atanga 800μm thleng a ni a, standard sheet format 505×590mm leh 295×485mm te a awm bawk. Buyers te chuan document siam leh siamna hmanrua pawmpui angin thickness, opacity, color, surface texture, printing treatment, laser response, protective film leh export packaging te an tarlang thei ang.
Selection hriat tur pawimawh: ' PC core sheet,' 'printable PC film,' 'laserable PC film' leh 'transparent PC Overlay film ' te hian functional layer hrang hrang an sawifiah a. Laser marking performance hi formulation- leh layer-specific a ni a; bulk production hmain laser system tak tak, layer stack leh personalization target hmanga confirm a ngai a ni.
Full- PC document structures: controlled heat leh pressure hnuaia fuse thei polycarbonate layer inmil tur atana siam.
Project-specific printing: offset, screen leh UV printing te hi ink leh curing system thlan hmangin evaluate theih a ni.
Laserable options: layer tarlan chuan controlled grayscale emaw black contrast emaw a siam chhuah a ngai hunah a awm thei.
OEM conversion: industrial production atana hman tur a thickness, sheet size, color, surface leh packaging te chu a duh angin a siam theih.
Sample validation: sumdawnna atana phalna lak hmaa printing, lamination, laser, cutting leh finished-document test te.
PC Core sheet Sample leh Technical Review dilna
A hnuaia value te hian tuna product range leh typical reference data te a tarlang a ni. Final tolerances, optical properties, laser response, lamination parameters leh acceptance criteria te chu project tin atana technical specification pawm tawh emaw Golden Sample emaw-ah ziah luh tur a ni.
| Parameter | awm thei tur Specification |
|---|---|
| Bungrua | Multilayer security-document structure siamna atana polycarbonate ( PC ) film emaw sheet emaw a ni |
| Hnathawh tur (functional Role) a ni | Core, printed core emaw project-a innghat chhungril structural layer emaw; grade thlan chu laserable a nih leh nih loh finfiah |
| Thickness Range a ni | 50–800μm (0.05–0.80mm) a ni a; final availability chu grade, color, surface leh order volume ah a innghat |
| Standard Sheet Size hrang hrang a awm | 505×590mm, 295×485mm a ni a, a size pawh a duh angin a siam thei bawk |
| Color leh Opcity a ni | White, transparent emaw, a duh ang anga siam emaw; a tul hunah opacity, whiteness leh color tolerance te sawifiah rawh |
| Surface duhthlan tur a awm | Matte, fine matte, glossy emaw project-a innghat emaw; printing treatment chu grade hrang hrangah a awm |
| Printing kalpui dan tur | Offset, silk-screen leh UV printing te chu ink, pretreatment, curing leh lamination trial hmanga tih theih a ni |
| Laser hmanga mimal tihchak | Laserable formulations awm thei te; laser wavelength, focal strategy, target contrast leh layer awmna hmun te tarlang rawh |
| Lamination a ni | Controlled temperature sang PC lamination; temperature, pressure, dwell leh cooling te hi stack kimchang ah a innghat |
| Electronic hmanga inzawmkhawmna (Electronic Integration) a ni | Contactless inlays, contact module leh transparent-window structure hmanga teh theih a ni |
| Packaging a awm bawk | Protective film, moisture-resistant wrapping, carton, pallet leh customized batch label te a awm bawk |
| MOQ leh Lead Time te a ni | Grade, dimension, color, surface, tolerances leh production schedule angin confirm a ni |
Heng figure te hi engineering chungchang sawihona hmasa ber atan a tangkai hle a, mahse PC grade tin tan chuan guaranteed universal specification a ni lo. Material thlan chhuah atan hian final TDS, inspection method leh tolerance te chu confirm tur a ni.
| Property | Direction / Method | Unit | hman dan tlangpui |
|---|---|---|---|
| Sakhal zawng | — . | g/cm⊃3 a ni a; | 1.22 ±0.05 a ni |
| Tensile chakna a nei | Machine / a dinglam a ni | MPa | ≥50 a ni |
| Tensile chakna a nei | Transverse / dinglam hawia awm | MPa | ≥50 a ni |
| Vicat Softening Temperature a ni | Test condition tarlan tawh chu finfiah tur a ni | °C a ni | 145 ±2 a ni |
| Surface Dyne Level a ni | Treated printable surface a ni | dynes/cm a ni | ≥38 a ni |
| Thickness Tolerance a ni | Project hrang hranga tehna tur ruahmanna | μm emaw % emaw a ni. | Grade leh purchase specification hmangin nemnghet rawh |
| Shrinkage / Flatness a ni | Lamination cycle pawm a nih hnuah | — . | Card stack kimchang nen define rawh |
Polycarbonate document him takah hian hna hrang hrang nei PC layer engemaw zat a awm tlangpui. RFQ-a terminology dik tak hman hian lei duhtute chuan opaque printable core an mamawh hunah transparent Overlay film an dawng thei lo va, internal laser personalization an mamawh hunah non-laserable film an dawng thei lo bawk.
| Layer Type | Primary Function | Key RFQ zawhna te chu a hnuaia mi ang hian a ni |
|---|---|---|
| A dum / A hring PC Core | Opacity, color background, thickness leh structural support a pe a; printed graphics pawh a keng tel thei bawk | Thickness mamawh, whiteness, opacity, surface, printing method leh laser response mamawh leh mamawh loh te |
| Transparent PC Core / Window Film hmanga siam a ni | Area langtlang, window emaw internal structural layer emaw a siam thin | Optical clarity, haze, texture, thickness, window geometry leh lamination nena inmil |
| Print theih PC Film | Lamination hmain offset, screen emaw UV ink a dawng thin | Printing lam, dyne level, ink system, curing, adhesion leh color target te a awm bawk |
| Laser hmanga tih theih PC Film | Text, portrait emaw security graphics atan controlled laser contrast a siam chhuak thin | Laser system, wavelength, focal depth, grayscale, black density, tactile mamawh leh layer awmna te a ni |
| Laserable ni lo PC Overlay film | Printed emaw laserable layer te chu duh loh laser reaction dah belh lovin a venghim | Transparency, surface texture, thickness, scratch behavior leh plate release te a awm bawk |
| Coated / Bonding PC Overlay film tih hi a ni. | Hybrid emaw printed construction bik emawa bonding tihchangtlun nan coating a hmang | Coating lam, substrate inmil, peel target, heat cycle leh dahna tur hmun |
Layer awm zat leh awmna dik tak chu document designer-in a ruat thin. A hnuaia entirnan hian core sheet chu isolated commodity anga thlan ai chuan complete stack-a tel anga thlan a ngaih chhan a tarlang a ni.
| Entirna Position | Thil awm thei | Tum leh Validation |
|---|---|---|
| Pawn lam atanga lo chhuak | Transparent non-laserable emaw venhimna emaw PC Overlay film | Surface texture, abrasion protection, optical clarity leh personalization depth nena inmil |
| Laser hmanga mimal siamna Layer | Transparent emaw white emaw laserable PC film | Portrait, text, grayscale, CLI/MLI emaw project hrang hranga laser graphics hmanga siam a ni |
| Printed Layer a ni | Printable white emaw transparent PC film | Guilloche, microtext, UV graphics, background leh design element hrang hrang te a awm bawk |
| Structural Core a ni | Var, langtlang emaw rawng PC core sheet | Document thickness, rigidity, opacity leh internal layer integrity te a siam thin |
| Electronic Inlay Layer hmanga siam a ni | PC -antenna leh chip inlay nena inmil | Chip position, antenna tuning, pressure distribution leh post-lamination RF performance te a ni |
| Window / Security Layer a ni | Transparent PC insert emaw, window layer siam danglam emaw | Window geometry, registration, edge fusion leh optical quality te a awm bawk |
| Reverse Layers te pawh a awm | Mirrored printed, laserable leh Overlay film design angin ruahmanna siam a ni | Thickness, flatness, bending behavior leh document symmetry siam zawh tawh te chu a inthlau hle |
Compatible polycarbonate layer te hian validated heat, pressure leh cooling cycle hnuaiah card body inzawmkhawm tak a siam thei a ni. Security value hi bonded construction kimchang atanga lo chhuak a ni: layer formulation, printed inks, inlay design, windows, Overlay film s leh personalization te hi engineer vek a ngai a ni.
Laserable PC grade hian document surface hnuaiah text, number, portrait leh grayscale information a siam thei a ni. Grade thlan chu a contrast, resolution, focal depth, layer discoloration leh a bula transparent emaw printed layer-a impact te test a ngai a ni.
White opaque film hian antenna a thup thei a, controlled print background a pe thei a, transparent film hian window leh optical security layout a support thei bawk. Document design a innghahna hmunah opacity, whiteness, haze leh surface texture te chu teh theih value atan tarlan tur a ni.
PC core sheet hi elevated-temperature lamination system-ah hman a ni a, mahse dimensional performance chu grade leh cycle-ah a innghat thung. Machine-direction leh transverse shrinkage, sheet curl, finished thickness leh flatness te chu heating leh cooling sequence tak tak hnuah teh rawh.
Core material dik tak chu document life, personalization technology, production equipment, cost target leh compliance requirement-ah a innghat a ni. PC hi automatic-in commercial card zawng zawng tan duhthlanna tha ber a ni lo va, PVC emaw PETG emaw chu requalification tel lovin approved full- PC security document-ah thlak tur a ni lo.
| A thlan theihna | Polycarbonate Core | PVC Core | PETG Core |
|---|---|---|---|
| Programme hrang hrang te | National ID, driving licence, residence permit, passport data page leh durable secure credentials te a awm bawk | Bank, membership, gift, hotel, telecom leh general commercial card te a awm bawk | Commercial card leh temperature hniam zawka chhe thei lo emaw, tihtlem- PVC structure thlan bik te |
| Lamination System hmanga siam a ni | Temperature sang zawk nena inmil PC stack controlled cooling nei | Conventional PVC card lamination cycle hman dan pangngai | PETG -hybrid cycle bik emaw, a inmil emaw |
| Laser hmanga mimal tihchak | Internal personalization atana hman lar tak, tum neia siam laserable grades | A tlangpuiin printing emaw personalization dang emaw a innghat a, a bik taka siam a nih loh chuan | Grade bik a awm thei a; laser thiltih tak tak chu a dik tih finfiah |
| Windows langtlang tak a ni | Stack anga engineer a nih chuan full- PC transparent-window design atan a tha hle | Insert emaw Overlay film s emaw hmanga tih theih ni mahse fusion behavior danglam tak | PETG structure inmil takah pawh a awm thei |
| Material Mixing a ni | Best performance ah chuan a tlangpuiin validated compatible layer family a ngai thin | Hybrid structure-ah hian adhesion leh shrinkage trial neih a ngai a ni | Hybrid structure-ah hian adhesion leh thermal-cycle trial neih a ngai a ni |
| Zir thlen chin | Document test kimchang, security design pawmpui leh project bik pawm | Printing, lamination leh finished-card hmanga tihdik a ni | Printing, lamination, durability leh finished-card hmanga tihdik a ni |
PC core material hi multilayer sorkar credential-ah tarlan theih a ni a, chu chuan card geometry nghet tak, internal laser personalization leh visual emaw electronic security feature nena inzawm tlat a mamawh a ni. Final suitability chu issuing authority leh approved document specification-in a thunun a ni.
Passport data page tan chuan core sheet hi sakna atana component pakhat chauh a ni. Buyers te hian hinge integration, chip leh antenna dah dan, transparent windows, layer sequence, personalization technology, page stiffness leh booklet assembly mamawh te pawh an sawifiah tur a ni.
Driving-licence program-te chuan printed graphics, laser portrait, tactile effects leh machine-a chhiar theih information atan opaque leh transparent PC layer an hmang thei a ni. Material pawmnaah hian dimensional, optical, bending leh personalization test te pawh a tel tur a ni.
Hun rei tak chhunga hnathawk, police, sipai, healthcare leh access credentials te chuan project-in robust construction leh controlled personalization a mamawh hunah PC structures an hmang thei a ni. Access technology inmilna chu plastic substrate aangin a hranin a finfiah tur a ni.
PC -compatible inlays chu balanced layer stack chhungah embedded theih a ni. Antenna frequency, chip position, module cavity, coil emaw etched antenna geometry, lamination pressure leh read performance te chu personalization hma leh zawh hnuah validate.
| Customization Item Options | sawihona tur | Buyer hnen atanga Information mamawh |
|---|---|---|
| Thickness leh Sheet Size te a awm bawk | 50–800μm range, standard emaw custom-cut sheet emaw a ni thei | Layer drawing, thickness zawh tawh, plate size, collation leh cutting layout te a awm bawk |
| Color leh Opcity a ni | White, transparent emaw project-a hman tur rawng emaw | Color target, opacity emaw transmission emaw mamawh, phalna pek dan |
| Surface Texture a ni | Matte, fine matte, glossy emaw texture bik emaw a awm thei | Printing process, plate finish, tactile target leh document lan dan te |
| Printing hmanga enkawl dan | Offset, screen emaw UV -grade hrang hranga print theih surface | Ink brand, curing system, dyne target leh adhesion dan te a awm bawk |
| Laser hmanga chhanna | Non-laserable, laserable emaw project hrang hranga inthlauhna | Laser hmanrua, wavelength, focal depth, black density leh grayscale target te a ni |
| Invenna Film | A awmna hmunah chuan a sir khat emaw, a sir hnih emaw venhimna | Peel lam hawi, clean-room mamawh leh production handling |
| Packaging a awm bawk | Carton, pallet, moisture barrier leh private label te a awm bawk | Pack quantity, pallet limit, destination leh batch traceability format te a ni |
Document stack submit: layer tin tan thickness, function, color, printing, laser leh electronic elements awmna layer drawing pe rawh.
Candidate grade-te chu nemnghet rawh: sample cut hmain core, printable, laserable, non-laserable leh coated materials te chu thliar hrang rawh.
Run incoming inspection: record thickness, dimensions, flatness, hmel, rawng, protective film leh batch hriat theihna.
Print production samples: offset tak tak, screen emaw UV ink hmang la, curing settings leh artwork coverage hmang rawh.
Stack kimchang chu laminate rawh: steel plate, cushion, release layer, pressure, heating leh cooling sequence ruahman angin hmang rawh.
Test personalization: laser contrast, grayscale, focal depth, text resolution leh printed emaw transparent feature nena inzawmna te endik.
Document test kimchang: a remchan dan angin peel resistance, flatness, bending, torsion, edge quality, window registration leh RFID performance te enfiah thin ang che.
Golden Sample pawm: bulk supply hmain pawm tawh construction, process window, inspection method, packing leh defect criteria sign rawh.
Wallis nen I PC Card Stack chungchang sawiho rawh
| Inspection Stage | Checks rawtna | B2B pawm dan tur |
|---|---|---|
| Thil lo lut turte | Thickness map, sheet dimension, squareness, flatness, surface defects, protective film leh batch label te a awm bawk | Specification pawm tawh, sampling plan leh calibrate measurement method te pawh a awm bawk |
| Optical Properties te a awm bawk | Whiteness, color danglamna, opacity, transmission, haze leh gloss awmna hmunah te | Buyer-in a siam instrument, illuminant, backing leh tolerance a ni |
| Printing tih a ni | Dyne level, wetting, image density, ink adhesion, curing, blocking leh color consistency te a awm bawk | Ink system tak tak leh printed sample pawm tawh |
| Lamination a ni | Layer registration, fusion, peel behavior, shrinkage, curl, bubbles, plate release leh finished thickness te a awm bawk | Full-stack cycle leh cooled sample pawm a ni |
| Laser hmanga mimal tihchak | Contrast, grayscale, resolution, focal depth, data repeated leh edge artifact te a awm bawk | Laser system tak tak leh personalization file pawm tawh |
| Electronic hmanga hnathawh dan | Chip function, antenna continuity, frequency response leh lamination hma leh hnua read distance te a ni | Reader, test position leh encoding condition tarlan a ni |
| Piantharna | Die cutting, milling, punching, edge quality, dimension leh module cavity position te a awm bawk | Drawing leh downstream equipment tolerance pawm a ni |
| Packaging a awm bawk | Surface venhimna, moisture barrier, pack quantity, pallet condition leh traceability label te a awm bawk | Purchase order leh packing instruction pawm a ni |
| Issue | A chhan awm thei | Check leh Corrective Actions |
|---|---|---|
| Layer Bonding chak lo tak a ni | Grade inmil lo, under-heating, pressure tling lo, cured ink barrier emaw contamination emaw a awm thei | Layer chhungkua leh orientation nemnghet; ink coverage enfiah thin; validated heat, pressure leh dwell window te chu siamrem theih a ni |
| Card Curl emaw Warpage emaw a ni thei | Stack balance lo, directional shrinkage, heating inang lo emaw pressure release hma emaw | Balance layer thuk zawng; MD/TD lam hawi record; controlled pressure hnuaiah a lum thei |
| Laser Contrast a hniam hle | Grade dik lo, focal depth dik lo, energy hniam emaw laserable layer thuk lutuka dah emaw a ni | Formulation leh layer awmna tur dik tak enfiah; controlled test matrix hmanga laser parameters tihchangtlun |
| Duh loh Laser Darkening | Non-reactive layer chiang tak mamawhna hmuna laser-sensitive material hman thin | Verified non-laserable film hmangin thlak emaw, focal strategy leh layer sequence siamthat emaw |
| Ink Delamination tih a ni | Surface energy hniam, ink inmil lo, curing tling lo emaw ink coverage rit tak emaw | Dyne leh enkawlna kum enfiah; lamination hma leh hnua ink adhesion test |
| Hmuh theih Antenna emaw Chip emaw | Opacity tling lo, thin core, component dah that loh emaw pressure imprint tha lo emaw | Validated opacity tihpun; layer balance leh inlay cavity te siamthat; cushion leh steel plate system te endik |
| Window-a Registration tihsual a awm | Cut insert tolerance, collation movement emaw thermal shrinkage emaw a awm thei | X/Y registration tolerance tih awmzia sawifiah; alignment mark hmang la, a lum hnuah teh rawh |
PC sheet te chu a fai a, a flat a, tui, leivut, hrual leh temperature inthlak lutuk atanga venhim a ni tur a ni. Material te chu hman hma loh chuan an original packaging-ah dah la, conditioned material chu hawn hmain production-room environment thleng turin phal la, surface treatment kum hian printing a nghawngna hmunah first-in-first-out control zawm rawh.
Protective film, interleaving emaw clean wrapping emaw hmang la, a hmun thlan tawh nena inmil tur.
Sheet te chu supported pallet-ah flat takin dah la, curl rawn luh tir thei localized loads te chu pumpelh rawh.
Warehouse transfer leh international shipping laiin carton te chu condensation atanga venhim.
Package tinah grade, thickness, surface, printable side, batch number leh quantity te hriat chian.
Laserable leh non-laserable grade te chu taksa lamah inthen darh la, production mix-up a awm loh nan.
Wallis hian PC film zawng zawng hi product inang anga ngaih ai chuan card-material system a supply a ni. B2B review hian core sheet, printable layer, transparent Overlay film s, laserable film, inlay structure leh packaging te a huam thei a, chuvangin lei duhtute chuan document stack kimchang pakhat nen an thil siam tumte chu an khaikhin thei a ni.
Application hmanga grade thlan dan: opacity, printability, laser response leh Overlay film function te thliar hrang.
Custom converting: thickness, dimensions, surface, color leh production layout hrang hrang atana venhimna packaging.
Sample-first validation: printing, lamination, laser leh finished-document trial atana hman tur thilte.
Batch communication: thil lei dan tur specification, label leh quality criteria te chu repeat supply a ni.
Export coordination: card factory, distributor leh security-document contractor te tan venhimna packing leh shipping support.
B2B dilna PC Core sheet Sample leh Pricing
Multilayer card emaw document emaw chhunga hman thin opaque, transparent emaw colored PC layer a ni. Grade a zirin structure, opacity, printability emaw controlled laser response emaw a pe thei. Transparent protective Overlay film nen chuan automatic-in a inthlau tur a ni lo.
Tuna a range chu 50–800μm a ni. Thickness thlan chu Overlay film s, printable layer, laserable layer, electronic inlays leh target finished-document thickness te nen chhut dun tur a ni.
No. Laser marking hi formulation leh intended layer position ah a innghat a ni. Layer chu non-reactive, grayscale laserable emaw high-contrast laserable emaw a nih tur thu tarlang la, chutah chuan laser hmanrua tak tak hmangin test rawh.
Printable grade te chu offset, silk-screen leh UV printing atan te evaluate theih a ni. Printable side, dyne level, ink system, curing conditions leh lamination hnua adhesion te chu sumdawnna atana siam hmain confirm hmasa phawt ang che.
An pahnih hian laser energy an react thei a, mahse hmun hrang hrang an luah a, structural emaw optical role hrang hrang an thawk bawk. He duhthlanna hian focus depth, portrait appearance, transparency leh security-feature design te a nghawng a ni.
Hybrid structure hi thermal expansion, softening behavior, bonding, shrinkage leh finished-card durability te validate hnuah chauh a awm thei a ni. Full- PC stack atana design material chu PVC emaw PETG nen a fuse dik ang tih ngaihtuah suh.
Universal setting a awm lo. Temperature, pressure, dwell, ramp rate leh cooling te hi grade, sheet thickness, ink coverage, inlay structure, plate system leh total stack ah a innghat a ni. Controlled trial hmangin production window chu din rawh.
Data-page design kimchang takah layer khat angin evaluate theih a ni. Project hian hinge siam dan, transparent windows, electronic components, lamination, laser personalization, booklet assembly leh issuing-authority mamawh te chu a hranin a validate tur a ni.
No. Document security hi credential kimchang controlled design leh siam atanga lo chhuak a ni a, chutah chuan materials, printing, laser personalization, electronic components, security features, issuance leh verification system te pawh a tel a ni.
Ni e, grade leh production feasibility a zirin. Measurable color, opacity, haze, gloss emaw texture target pe la, a lei tuin a pawm dan tur sawifiah rawh.
Original packaging-ah fai, vawt, flat leh venhimna hmunah dah tur a ni. Condensation, leivut leh lei chunglam chhiatna pumpelh rawh. Warehouse leh room temperature a inang lo chuan hman hmain pack hawn lohte chu production environment-ah condition hmasa phawt ang che.
Thickness, printing, ink adhesion, lamination, shrinkage, flatness, peel behavior, laser contrast, cutting leh RFID performance te chu a tulna hmunah test rawh. Golden Sample leh pawm dan tur ziaka pawm.
Application, layer drawing, thickness, sheet size, color, opacity, surface, printing process, laser mamawh, kum khata volume, sampling mamawh, packaging leh destination te pe rawh.
| RFQ Item | Details pek tur a ni |
|---|---|
| Document Dilna Dilna | National ID, driving licence, residence permit, passport data page, access credential emaw program dang emaw a awm thei bawk |
| Layer Function a ni | Opaque core, transparent core, print theih layer, laser theih layer emaw non-laserable emaw Overlay film |
| Dimension hrang hrang | Thickness, sheet size, hman theih area, grain / extrusion lam hawi leh dimensional tolerance te a awm bawk |
| Optical lama thil tul hrang hrang | A rawng, a var, opacity, transmission, haze, gloss leh surface texture te a awm bawk |
| Printing tih a ni | Offset, screen emaw UV process, ink brand, curing system leh artwork coverage te a ni |
| Laser hmanga tih a ni | Machine, wavelength, focus strategy, target contrast, grayscale leh layer thuk zawng tum a ni |
| Lamination a ni | Stack, plate leh cushion system kimchang, temperature, pressure, dwell leh cooling te |
| Electronics lam thil a ni | Chip, antenna, module, window emaw hinge emaw integration a awm theihna hmunah |
| Sumdawnna lam chipchiar zawk | Sample zat, trial volume, kum tin forecast, destination leh packing mamawh te |
