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Amashidi ayisisekelo e-Polycarbonate amakhadi omazisi, izincwadi zokushayela namakhasi edatha yamaphasipoti. Ukujiya ngokwezifiso, umbala, ukukhanya okukhanyayo, amamaki angaphezulu kanye nama-laserable, namasampula e-B2B okuphrinta, ukucwala nokuhlola.
Ishidi le-WLS-PC Core
WALLIS
| Umbala: | |
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| Ubuningi: | |
Ishidi le -Wallis polycarbonate core linikezwa amaphrinta okuphepha, abakhiqizi bamakhadi, abakhiqizi be-inlay, izihlanganisi zesistimu kanye nosonkontileka bamadokhumenti abakha iziqinisekiso zobunikazi zezinhlaka eziningi. Amamaki e-PC amhlophe, asobala kanye nephrojekthi ethile angalungiselelwa amakhadi omazisi kazwelonke, izincwadi zokushayela, izimvume zokuhlala, amakhasi edatha ye-e-passport, izincwadi zokungena kanye nezinye izakhiwo zamakhadi empilo ende.
Ugqinsi olutholakalayo lusukela ku -50μm kuya ku-800μm , olunamafomethi ajwayelekile eshidi afana no-505×590mm no-295×485mm. Abathengi bangacacisa ukushuba, ukukhanya, umbala, ukuthungwa kwendawo, ukwelashwa kokuphrinta, impendulo ye-laser, ifilimu evikelayo kanye nokupakishwa kokuthekelisa ngokuya ngokwakhiwa kwedokhumenti egunyaziwe kanye nemishini yokukhiqiza.
Inothi lokukhetha elibalulekile: 'Ishidi le-PC core,' 'ifilimu ye-PC ephrintekayo,' 'ifilimu ye-PC ehluzekayo' kanye 'imbondela ye-PC esobala' ichaza izendlalelo ezisebenzayo ezihlukene. Ukusebenza kokumaka nge-laser kuwukwakhiwa- kanye nongqimba oluthize; kufanele kuqinisekiswe ngohlelo lwangempela lwelaser, isitaki sesendlalelo kanye nethagethi yomuntu siqu ngaphambi kokukhiqizwa kwenqwaba.
Izakhiwo zedokhumenti ye-PC Egcwele: yakhelwe izendlalelo ze-polycarbonate ezihambisanayo ezihlangana ngaphansi kokushisa okulawulwayo nokucindezela.
Ukuphrinta okuqondene nephrojekthi: i-offset, isikrini nokuphrinta kwe-UV kungahlolwa ngoyinki okhethiwe kanye nesistimu yokwelapha.
Izinketho ezilasekayo: zitholakala uma isendlalelo esishiwo kufanele sikhiqize umbala ompunga olawulwayo noma umehluko omnyama.
Ukuguqulwa kwe-OEM: ukujiya okwenziwe ngokwezifiso, usayizi weshidi, umbala, indawo kanye nokupakishwa kokukhiqizwa kwezimboni.
Ukuqinisekiswa kwesampula: ukuhlolwa kokuphrinta, i-lamination, i-laser, ukusika kanye nokuqedwa kwedokhumenti ngaphambi kokuvunywa kwezentengiso.
Cela Amasampula Eshidi Eliyinhloko Le-PC Nokubuyekezwa Kobuchwepheshe
Amanani angezansi achaza ububanzi bomkhiqizo wamanje kanye nedatha yereferensi evamile. Ukubekezelela kokugcina, izakhiwo zokubona, impendulo ye-laser, imingcele yokubeka i-lamination kanye nenqubo yokwamukela kufanele kurekhodwe ekucacisweni okugunyaziwe okugunyaziwe noma Isampula Legolide lephrojekthi ngayinye.
| Ukucaciswa Kwepharamitha | Okutholakalayo |
|---|---|
| Okubalulekile | Ifilimu ye-Polycarbonate (PC) noma ishidi lezinhlaka eziningi zemibhalo yokuphepha |
| Iqhaza Lokusebenza | Ingqikithi, ingqikithi ephrintiwe noma isendlalelo sesakhiwo sangaphakathi esiqondene nephrojekthi; qinisekisa ukuthi ibanga elikhethiwe liyasebenziseka yini |
| Ubukhulu Ububanzi | 50–800μm (0.05–0.80mm); ukutholakala kokugcina kuncike ebangeni, umbala, indawo kanye nevolumu yokuhleleka |
| Osayizi Beshidi Elijwayelekile | 505×590mm, 295×485mm nobukhulu obenziwe ngezifiso |
| Umbala kanye ne-Opacity | Okumhlophe, okusobala noma okwenziwe ngokwezifiso; chaza ukukhanya, ubumhlophe nokubekezelela umbala lapho kudingeka |
| Izinketho Zobuso | I-matte, i-matte emihle, ukuthungwa okucwebezelayo noma okuqondene nephrojekthi; ukuphrinta ukwelashwa etholakalayo ngokwezinga |
| Izinqubo Zokuphrinta | I-offset, isikrini sikasilika kanye nokuphrinta kwe-UV kuncike ku-inki, ukwelashwa kusengaphambili, ukuphulukiswa kanye nokuhlolwa kwe-lamination |
| Ukwenza kube ngokwakho i-Laser | Ukwakheka kwe-laserable kuyatholakala; cacisa ubude begagasi be-laser, isu lokugxilisa ingqondo, ukuqhathanisa okuqondiwe kanye nesimo sesendlalelo |
| I-Lamination | Lamination PC elawulwa izinga lokushisa eliphezulu; izinga lokushisa, ingcindezi, indawo yokuhlala kanye nokupholisa kuncike esitaki esiphelele |
| Ukuhlanganiswa Kwe-elekthronikhi | Ingahlolwa ngokufakwa ngaphandle kokuthinta, amamojula okuxhumana kanye nezakhiwo zamawindi angafihli |
| Ukupakisha | Ifilimu evikelayo, ukugoqa okumelana nomswakama, amabhokisi, amaphalethi namalebula eqoqo enziwe ngokwezifiso |
| I-MOQ nesikhathi sokuhola | Kuqinisekiswe ngokwebanga, ubukhulu, umbala, indawo, ukubekezelela kanye neshejuli yokukhiqiza |
Lezi zibalo ziwusizo engxoxweni yokuqala yobunjiniyela kodwa aziyona incazelo eqinisekisiwe yendawo yonke yalo lonke ibanga le-PC. I-TDS yokugcina, indlela yokuhlola nokubekezelela kufanele kuqinisekiswe ngezinto ezikhethiwe.
| Inkomba Yendawo | / Iyunithi Yendlela | Isithenjwa | Esijwayelekile |
|---|---|---|---|
| Ukuminyana | - | g/cm³ | 1.22 ±0.05 |
| Amandla Okuqina | Umshini / ovundlile | I-MPa | ≥50 |
| Amandla Okuqina | Eguquguqukayo / mpo | I-MPa | ≥50 |
| I-Vicat Softening Temperature | Isimo sokuhlola esicacisiwe esizoqinisekiswa | °C | 145 ±2 |
| I-Surface Dyne Level | Indawo ephrintiwe ephrintiwe | amadethi/cm | ≥38 |
| Ukujiya Ukubekezelelana | Uhlelo lokulinganisa oluqondene nephrojekthi | μm noma % | Qinisekisa ngokwebanga kanye nencazelo yokuthenga |
| Ukuncipha / Ukucaba | Ngemuva komjikelezo we-lamination ovunyelwe | - | Chaza ngesitaki sekhadi esiphelele |
Idokhumenti ye-polycarbonate evikelekile ngokuvamile iqukethe izendlalelo ze-PC ezimbalwa ezinemisebenzi eyahlukene. Ukusebenzisa amatemu alungile ku-RFQ kuvimbela abathengi ekutholeni imbondela ebonisa ngale lapho bedinga umongo ophrintekayo opaque, noma ifilimu engalahleki lapho bedinga ukwenza ngezifiso i-laser yangaphakathi.
| Uhlobo | Lwesendlalelo Oluyinhloko | Imibuzo Ye-RFQ Ebalulekile |
|---|---|---|
| White / Opaque PC Core | Inikeza ukungafihli, ingemuva lombala, ukujiya nokusekelwa kwesakhiwo; ingase futhi iphathe ihluzo eziphrintiwe | Ugqinsi oludingekayo, ubumhlophe, ukukhanya, indawo engaphezulu, indlela yokuphrinta kanye nokuthi kuyadingeka yini impendulo ye-laser |
| I-Transparent PC Core / Window Film | Idala izindawo ezibonisa ngale, amawindi noma izendlalelo zesakhiwo zangaphakathi | Ukucaca okubonakalayo, inkungu, ukuthungwa, ukujiya, ijometri yefasitela nokuhambisana kwe-lamination |
| Ifilimu Ye-PC Ephrintekayo | Ithola i-offset, isikrini noma oyinki be-UV ngaphambi kokucwenga | Uhlangothi lokuphrinta, izinga le-dyne, isistimu ye-inki, ukuphulukisa, ukunamathela kanye nethagethi yombala |
| Laserable PC Film | Ikhiqiza ukungafani kwe-laser okulawulwayo kombhalo, ukuma ngobude noma ihluzo zokuphepha | Isistimu ye-laser, ubude begagasi, ukujula kwefocal, grayscale, ukuminyana okumnyama, imfuneko ethintekayo kanye nesimo sesendlalelo |
| Imbondela ye-PC Engalahleki | Ivikela izendlalelo eziphrintiwe noma ezinwebekayo ngaphandle kokwengeza ukusabela kwe-laser okungafunwa | Ukungafihli, ukuthungwa kwendawo, ukujiya, ukuziphatha kokuklwebha kanye nokukhishwa kwamapuleti |
| Imbondela ye-PC Ehlanganisiwe / Ebophayo | Isebenzisa i-coating ukuze ithuthukise ukubopha ku-hybrid ethile noma ukwakhiwa okuphrintiwe | Uhlangothi lokumboza, i-substrate ehambisanayo, i-peel target, umjikelezo wokushisa nezimo zokugcina |
Inombolo ngqo nendawo yezendlalelo kunqunywa umklami wedokhumenti. Isibonelo esilandelayo sibonisa ukuthi kungani ishidi eliwumongo kufanele likhethwe njengengxenye yesitaki esiphelele kunokuba likhethwe njengempahla eyodwa.
| Isibonelo Isikhundla | Inhloso Ebalulekile | Nokuqinisekisa |
|---|---|---|
| Indawo Engaphandle | Imbondela ye-PC ebonisa ngale engalahleki noma evikelayo | Ukuthungwa kwendawo, ukuvikelwa kokuhuzuka, ukucaca kokubonakalayo nokuhambisana nokujula kokwenza kube ngokwakho |
| Isendlalelo Sokwenza Ngezifiso I-Laser | Ifilimu ye-PC ekhanyayo noma emhlophe | Ukuma ngobude, umbhalo, isikali esimpunga, i-CLI/MLI noma imidwebo ye-laser eqondene nephrojekthi ethile |
| Isendlalelo Esiphrintiwe | Ifilimu ye-PC ephrintekayo emhlophe noma esobala | I-Guilloche, i-microtext, ihluzo ze-UV, isizinda kanye nezinto eziguquguqukayo zedizayini |
| Ingqikithi Yesakhiwo | Ishidi le-PC elimhlophe, elisobala noma elinemibala | Yakha ukujiya kwedokhumenti, ukuqina, ukufiphala kanye nobuqotho besendlalelo sangaphakathi |
| I-Electronic Inlay Layer | I-antenna ehambisana ne-PC kanye ne-chip inlay | Ukuma kwe-chip, ukulungiswa kwe-antenna, ukusatshalaliswa kwengcindezi kanye nokusebenza kwe-RF yangemuva kokulala |
| Iwindi / Isendlalelo Sokuphepha | Faka i-PC esobala noma isendlalelo sewindi elenziwe ngezifiso | Ijiyomethri yewindi, ukubhaliswa, ukuhlanganisa konqenqema kanye nekhwalithi yokubona |
| Reverse Izendlalelo | Ukuhlelwa okuphrintiwe, okwenziwe ngezibuko kanye nokumbondelana njengokuklanywa | Ukujiya okulinganiselayo, ukucaba, ukuziphatha okugobayo nokulinganisa kwedokhumenti okuphelile |
Izendlalelo ze-polycarbonate ezihambisanayo zingakha umzimba wekhadi ohlangene ngaphansi kokushisa okuqinisekisiwe, ingcindezi kanye nomjikelezo wokupholisa. Inani lokuvikeleka livela ekwakhiweni okuphelele okuhlanganisiwe: ukwakhiwa kongqimba, oyinki abaphrintiwe, idizayini ye-inlay, amafasitela, imbondela nokwenza kube ngokwakho konke kufanele kwenziwe ndawonye.
Amamaki e-PC e-Laserable angakha umbhalo, izinombolo, ukuma ngobude nolwazi olumpunga ngaphansi kwendawo yedokhumenti. Ibanga elikhethiwe kufanele lihlolelwe ukugqama, ukucaca, ukujula kwefocal, ukushintsha kombala kwesendlalelo kanye nomthelela ezendlalelo eziseduze ezibonisa ngale noma eziphrintiwe.
Amafilimu akhanyayo amhlophe angafihla izimpondo futhi anikeze ingemuva lokuphrinta elilawulwayo, kuyilapho amafilimu abonisa ngale angasekela amafasitela nezakhiwo zokuphepha ezibonakalayo. Ukufiphala, ubumhlophe, inkungu kanye nokuthungwa kwendawo kufanele kucaciswe njengamanani alinganisekayo lapho ukwakheka kwedokhumenti kuncike kukho.
Amashidi ayisisekelo e-PC asetshenziswa ezinhlelweni zokushisa eziphakeme zokushisa, kodwa ukusebenza kwe-dimensional kuncike ebangeni kanye nomjikelezo. Kala ukuqondiswa komshini kanye nokushwabana okuphambeneyo, ukugoqa kweshidi, ukujiya okuqediwe nokuba flat ngemva kokufudumeza kwangempela nokulandelana kokupholisa.
Izinto eziyinhloko ezilungile zincike empilweni yedokhumenti, ubuchwepheshe bokwenza kube ngokwakho, okokusebenza kokukhiqiza, okuhlosiwe kwezindleko kanye nezimfuneko zokuhambisana. I-PC akuyona ngokuzenzakalelayo ukukhetha okungcono kakhulu kuwo wonke amakhadi okuhweba, futhi i-PVC noma i-PETG akufanele ithathelwe indawo kudokhumenti yokuphepha ye-PC egcwele egunyaziwe ngaphandle kokufaneleka.
| I-Selection Factor | Polycarbonate Core | PVC Core | PETG Core |
|---|---|---|---|
| Izinhlelo Ezijwayelekile | Omazisi bezwe, izincwadi zokushayela, izimvume zokuhlala, amakhasi edatha yamaphasipoti kanye nemininingwane evikelekile ehlala isikhathi eside | Ibhange, ubulungu, isipho, ihhotela, i-telecom kanye namakhadi okuhweba ajwayelekile | Amakhadi okuthengisa kanye nezakhiwo ezikhethiwe ze-PVC ezinezinga lokushisa eliphansi ezihlala isikhathi eside noma ezincishisiwe |
| Lamination System | Isitaki se-PC esihambisana nezinga lokushisa eliphezulu esinokupholisa okulawulwayo | Umjikelezo ojwayelekile we-PVC lamination wamakhadi | PETG-specific noma ehambisanayo hybrid umjikelezo |
| Ukwenza kube ngokwakho i-Laser | Amamaki asebenzisekayo enzelwe inhloso asetshenziswa kabanzi ukwenza kube ngokwakho kwangaphakathi | Ngokuvamile incike ekuphrintiwe noma okunye ukwenza kube ngokwakho ngaphandle uma kuklanywe ngokukhethekile | Amabanga akhethekile angase atholakale; qinisekisa ukuziphatha kwe-laser kwangempela |
| IWindows esobala | Ifaneleka kahle imiklamo yefasitela esobala ye-PC egcwele lapho yenziwe njengesitaki | Kungenzeka ngokufaka noma ukumbondelana kodwa ukuziphatha okuhlanganisiwe okuhlukile | Kungenzeka ku-PETG izakhiwo ezihambisanayo |
| Ukuxuba Material | Ukusebenza okuhle kakhulu ngokuvamile kudinga umndeni wesendlalelo ohambisanayo oqinisekisiwe | Izakhiwo zeHybrid zidinga ukunamathela nokuhlolwa kokuncipha | Izakhiwo ezihlanganisiwe zidinga ukunamathela kanye nokuhlolwa komjikelezo oshisayo |
| Ukufaneleka | Ukuhlolwa kwedokhumenti ephelele, ukugunyazwa kwedizayini yokuvikela kanye nokwamukelwa okuqondene nephrojekthi ethile | Ukuphrinta, i-lamination kanye nokuqinisekiswa kwekhadi eliphelile | Ukuphrinta, i-lamination, ukuqina nokuqinisekiswa kwekhadi eliphelile |
I-PC core material ingacaciswa kuziqinisekiso zikahulumeni ezendlalelo eziningi ezidinga ijiyomethri yekhadi eliqinile, ukwenziwa ngezifiso kwe-laser yangaphakathi kanye nokuhlanganiswa nezici zokuphepha ezibonakalayo noma zikagesi. Ukufaneleka kokugcina kulawulwa isiphathimandla esikhiphayo kanye nemininingwane egunyaziwe yedokhumenti.
Emakhasini edatha yepasipoti, ishidi eliyinhloko liyingxenye eyodwa kuphela yokwakha. Abathengi kufanele futhi bachaze ukuhlanganiswa kwamahinge, ukubekwa kwe-chip nezinti, amawindi abonisa ngale, ukulandelana kongqimba, ubuchwepheshe bokwenza kube ngokwakho, ukuqina kwekhasi kanye nezidingo zokuhlanganisa izincwajana.
Izinhlelo zamalayisense okushayela zingase zisebenzise izendlalelo ze-PC ezikhanyayo nezingafihli ezithombeni eziphrintiwe, izithombe ze-laser, imiphumela ethintekayo kanye nolwazi olufundeka ngomshini. Ukwamukela okubalulekile kufanele kufake phakathi ukuhlolwa kobukhulu, ukubona, ukugoba kanye nokwenza kube ngokwakho.
Isisebenzi sempilo ende, amaphoyisa, amasosha, ukunakekelwa kwezempilo kanye nemininingwane yokufinyelela bangasebenzisa izakhiwo ze-PC lapho iphrojekthi idinga ukwakhiwa okuqinile kanye nokwenza komuntu siqu okulawulwayo. Ukuhambisana kobuchwepheshe bokufinyelela kufanele kuqinisekiswe ngokwehlukana ne-substrate yepulasitiki.
Ama-inlay ahambisana ne-PC angashumeka ngaphakathi kwesitaki sesendlalelo esilinganiselwe. Qinisekisa imvamisa ye-antenna, indawo ye-chip, i-module cavity, ikhoyili noma ijometri ye-antenna egxilile, ingcindezi yokukhanya nokusebenza kokufunda ngaphambi nangemuva kokwenza kube ngokwakho.
| Izinketho Zento Yokwenza Ngokwezifiso | Ukuxoxa | Ngolwazi Oludingekayo Kumthengi |
|---|---|---|
| Ubukhulu kanye Nosayizi Weshidi | 50–800μm ububanzi, amashidi ajwayelekile noma asikwe ngokwezifiso | Umdwebo wesendlalelo, ukujiya okuqediwe, usayizi wepuleti, ukugoqa kanye nesakhiwo sokusika |
| Umbala kanye ne-Opacity | Umbala omhlophe, osobala noma oqondene nephrojekthi | Ithagethi yombala, i-opacity noma imfuneko yokudlulisela, indlela yokugunyaza |
| Ukwakheka Kobuso | I-matte, i-matte emihle, ecwebezelayo noma ukuthungwa okucacisiwe | Inqubo yokuphrinta, ukuphela kwepuleti, ithagethi ethintekayo kanye nokubukeka kwedokhumenti |
| Ukwelapha Ukuphrinta | I-offset, isikrini noma indawo ephrintekayo ye-UV ngokwebanga | Ibhrendi ye-inki, isistimu yokwelapha, i-dyne target kanye nendlela yokunamathela |
| Impendulo ye-Laser | Okungalahleki, okulayisekayo noma okuhlukile kwephrojekthi ethile | Imishini ye-laser, ubude begagasi, ukujula kwefocal, ukuminyana okumnyama kanye nethagethi ye-grayscale |
| Ifilimu Evikelayo | Ukuvikelwa kohlangothi olulodwa noma okubili lapho kutholakala khona | Ukuqondiswa kwekhasi, izidingo zegumbi elihlanzekile nokuphathwa kokukhiqiza |
| Ukupakisha | Amakhathoni, amaphalethi, isithiyo somswakama kanye namalebula ayimfihlo | Inani lephakethe, imikhawulo yephalethi, indawo okuyiwa kuyo kanye nefomethi yokulandeleka kwenqwaba |
Hambisa isitaki sedokhumenti: hlinzeka ngomdwebo wesendlalelo onogqinsi, umsebenzi, umbala, ukuphrinta, i-laser nezinto zikagesi kuzo zonke izendlalelo.
Qinisekisa amamaki ekhandidethi: hlukanisa izinto eziwumgogodla, eziphrintekayo, ezilasekayo, ezingalahleki nezimboziwe ngaphambi kokuba amasampula asikwe.
Yenza ukuhlola okungenayo: ukujiya kwerekhodi, ubukhulu, ukucaba, ukubukeka, umbala, ifilimu evikelayo kanye nokuhlonza inqwaba.
Amasampula okukhiqiza wokuphrinta: sebenzisa i-offset yangempela, isikrini noma uyinki we-UV, izilungiselelo zokuphulukisa kanye nokufakwa kwemidwebo.
Layisha isitaki esigcwele: sebenzisa amapuleti ensimbi ahleliwe, amakhushini, izendlalelo zokukhulula, ukucindezela, ukufudumeza nokulandelana kokupholisa.
Hlola ukwenza kube ngokwakho: hlola ukugqama kwe-laser, isikali esimpunga, ukujula kwefocal, ukulungiswa kombhalo nokusebenzisana nezici eziphrintiwe noma ezibonisa ngale.
Gcwalisa ukuhlolwa kwedokhumenti: hlola ukumelana nekhasi, ukucaba, ukugoba, ukugoqa, ikhwalithi yonqenqema, ukubhaliswa kwewindi nokusebenza kwe-RFID lapho kufanele khona.
Gunyaza Isampuli Esagolide: sayina ukwakhiwa okwamukelwe, iwindi lenqubo, indlela yokuhlola, imibandela yokupakisha kanye nesici ngaphambi kokunikezwa kwenqwaba.
Xoxa ngeSitaki Sekhadi Le-PC yakho no-Wallis
| Isiteji Sokuhlola | Kunconyiwe Ukuhlola | Isisekelo Sokwamukela I-B2B |
|---|---|---|
| Izinto Ezingenayo | Imephu yokuqina, ubukhulu beshidi, isikwele, ukucaba, ukonakala kwendawo, ifilimu evikelayo nelebula yenqwaba | Ukucaciswa okugunyaziwe, uhlelo lwamasampula kanye nendlela yokulinganisa elinganiselwe |
| Izakhiwo ze-Optical | Ubumhlophe, umehluko wombala, ukufiphala, ukudluliswa, inkungu kanye nokucwebezela lapho kufanele khona | Ithuluzi elichazwe umthengi, elikhanyayo, elisekelayo kanye nokubekezelela |
| Ukuphrinta | Ileveli yeDyne, ukumanzisa, ukuminyana kwesithombe, ukunamathela kukayinki, ukuphulukisa, ukuvimba nokuvumelana kombala | Isistimu kayinki yangempela nesampula ephrintiwe egunyaziwe |
| I-Lamination | Ukubhaliswa kwesendlalelo, ukuhlanganisa, ukuziphatha kwekhasi, ukushwabana, ukugoqa, amabhamuza, ukukhishwa kwepuleti nogqinsi oluqediwe | Umjikelezo wesitaki esigcwele ogunyaziwe nesampuli epholile |
| Ukwenza kube ngokwakho i-Laser | Ukugqama, indawo empunga, ukulungiswa, ukujula kwefocal, idatha ephindaphindiwe nama-artifact onqenqema | Isistimu ye-laser yangempela nefayela elenziwe ngezifiso eligunyaziwe |
| Ukusebenza Kwe-elekthronikhi | Umsebenzi we-chip, ukuqhubeka kwe-antenna, impendulo yemvamisa kanye nebanga lokufunda ngaphambi nangemuva kokucwenga | Isifundi esicacisiwe, indawo yokuhlola kanye nesimo sombhalo wekhodi |
| Ukuguqulwa | Ukusika ukufa, ukugaya, ukubhoboza, ikhwalithi yonqenqema, ubukhulu kanye nokuma kwemojuli yesikhala | Kugunyazwe ukubekezelelwa kwemishini yokudweba kanye nomfula ongezansi |
| Ukupakisha | Ukuvikelwa kwendawo, umgoqo womswakamo, ubuningi bephakethe, isimo sephalethi namalebula okulandeleka | I-oda lokuthenga kanye nemiyalelo yokupakisha egunyaziwe |
| Inkinga | Engaba Yimbangela | Ukuhlola Nezenzo Zokulungisa |
|---|---|---|
| Ukubopha Kwengqimba Ebuthakathaka | Ibanga elingahambisani, ukushisa ngaphansi, ingcindezi enganele, umgoqo we-inki olashiwe noma ukungcola | Qinisekisa ungqimba lomndeni nesimo; hlola ukufakwa kukayinki; lungisa ukushisa okuqinisekisiwe, ingcindezi kanye newindi lokuhlala |
| I-Curl yekhadi noma i-Warpage | Isitaki esingalingani, ukuncipha kokuqondisa, ukushisisa okungalingani noma ukukhishwa kwengcindezi yangaphambi kwesikhathi | Ukuqina kongqimba lwebhalansi; qopha isiqondiso se-MD/TD; epholile ngaphansi kwengcindezi elawulwayo |
| I-Low Laser Contrast | Ibanga elingalungile, ukujula kwefocal okungalungile, amandla aphansi noma isendlalelo esilayisikayo sibekwe sijule kakhulu | Qinisekisa ukwakheka kanye nokuma kongqimba; thuthukisa imingcele ye-laser usebenzisa i-matrix yokuhlola elawulwayo |
| Ubumnyama be-Laser obungafunwa | Izinto ezizwela i-laser ezisetshenziswa lapho kudingeka khona isendlalelo esicacile esingasabeki | Faka esikhundleni ngefilimu engaqinisekiswanga noma buyekeza isu eligxilile nokulandelana kwesendlalelo |
| I-Ink Delamination | Amandla angaphezulu aphansi, uyinki ongahambelani, ukwelapha okungaphelele noma ukumbozwa kukayinki osindayo | Hlola i-dyne kanye neminyaka yokwelashwa; ukuhlola inki ukunamathela ngaphambi nangemva lamination |
| I-Antenna Ebonakalayo noma I-Chip | I-opacity enganele, umgogodla omncane, ukubekwa kwengxenye embi noma imprint yokucindezela | Khulisa ukukhanya okuqinisekisiwe; buyekeza ibhalansi yesendlalelo kanye nembobo ye-inlay; hlola umcamelo kanye nesistimu yepuleti lensimbi |
| Iphutha Lokubhalisa Iwindi | Sika ukubekezelela ukufaka, ukunyakaza kokuhlangana noma ukuncipha kokushisa | Chaza ukubekezelelana kokubhaliswa kwe-X/Y; sebenzisa amamaki okuqondanisa nokulinganisa ngemva kokupholisa |
Amashidi e-PC kufanele ahlale ehlanzekile, eyisicaba futhi evikelekile kumswakama, uthuli, imihuzuko kanye nokushintsha kwezinga lokushisa ngokweqile. Gcina izinto zokusebenza emaphaketheni azo oqobo kuze kusetshenziswe, vumela okokusebenza okunesimo ukuze kufinyelele indawo yegumbi lokukhiqiza ngaphambi kokuvula, futhi ulandele ukulawula kokuqala lapho iminyaka yokwelashwa kwendawo ithinta ukuphrinta.
Sebenzisa ifilimu yokuzivikela, ukugoqa okuhlanganayo noma okuhlanzekile okufanele endaweni ekhethiwe.
Gcina amashidi aphansi kuma-pallet asekelwe futhi ugweme imithwalo yendawo engathula ama-curl.
Vikela amakhathoni ekuminyanisweni ngesikhathi sokudluliselwa kwe-warehouse kanye nokuthunyelwa kwamanye amazwe.
Khomba ibanga, ukujiya, indawo engaphezulu, uhlangothi oluphrintekayo, inombolo yeqoqo kanye nenani kuphakheji ngayinye.
Gcina amamaki e-laserable futhi angalahleki ehlukene ngokomzimba ukuze uvimbele ukuhlangana kokukhiqiza.
I-Wallis ihlinzeka ngezinhlelo ze-card-material kunokuphatha yonke ifilimu ye-PC njengomkhiqizo ofanayo. Isibuyekezo se-B2B singamboza amashidi angumongo, izendlalelo eziphrintekayo, izimbondela ezibonisa ngale, amafilimu asebenzisekayo, izakhiwo ezifakwa ngaphakathi kanye nokupakishwa ukuze abathengi bakwazi ukuqhathanisa izinto ezihlongozwayo nesitaki esisodwa esiphelele sedokhumenti.
Ukukhethwa kwebanga okususelwe kuhlelo lokusebenza: hlukanisa ukukhanya, ukuphrinta, impendulo ye-laser nomsebenzi wokumbondela.
Ukuguqula ngokwezifiso: ukujiya, ubukhulu, indawo, umbala kanye nokupakishwa okuvikelekile kwezakhiwo zokukhiqiza.
Ukuqinisekiswa kwesampula-kuqala: izinto zokuphrinta, i-lamination, i-laser kanye nokuhlolwa kwemibhalo eqediwe.
Ukuxhumana kweqoqo: ukucaciswa kokuthenga, amalebula nemibandela yekhwalithi yokunikezwa okuphindayo.
Ukuxhumanisa ukuthekelisa: ukupakishwa okuvikelekile nokusekelwa kokuthunyelwa kwezimboni zamakhadi, abasabalalisi nosonkontileka bemibhalo yezokuphepha.
Cela i-B2B PC Core Sheet Amasampula kanye Nezintengo
Isendlalelo se-PC esifiphele, esisobala noma esinemibala esisetshenziswa ngaphakathi kwekhadi le-multilayer noma idokhumenti. Kuye ngebanga, ingase inikeze isakhiwo, ukukhanya, ukuphrinta noma impendulo ye-laser elawulwayo. Akufanele kudidaniswe ngokuzenzakalela nembondela yokuvikela esobala.
Ibanga lamanje lingama-50–800μm. Ugqinsi olukhethiwe kufanele lubalwe kanye nezimbondela, izendlalelo eziphrintekayo, izendlalelo ezilasekayo, ama-inlay e-electronic kanye nogqinsi lwedokhumenti ehlosiwe eqondisiwe.
Cha. Ukumaka nge-laser kuncike ekwakhekeni nasekumeni kwesendlalelo okuhlosiwe. Cacisa ukuthi ingabe isendlalelo kufanele singasebenzi, singempunga kalula noma sihluke kakhulu, bese sivivinya ngezinto zangempela ze-laser.
Amabanga aphrintekayo angahlolwa ukuze kutholwe i-offset, isikrini sikasilika kanye nokuphrinta kwe-UV. Qinisekisa uhlangothi oluphrintekayo, izinga le-dyne, isistimu ye-inki, izimo zokuphulukisa nokunamathela ngemva kokucwenga ngaphambi kokukhiqizwa kwezentengiso.
Zombili zingasabela kumandla we-laser, kodwa zithatha izikhundla ezihlukene futhi zenza izindima ezihlukene zesakhiwo noma zokubuka. Inketho ithinta ukujula kokugxila, ukubukeka kokuma ngobude, ukubonakala nokuklama kwesici sokuvikela.
Isakhiwo esiyingxubevange singenzeka kuphela ngemva kokuqinisekisa ukwanda okushisayo, ukuziphatha okuthambile, ukubopha, ukuncipha kanye nokuqina kwekhadi eliphelile. Ungacabangi ukuthi into edizayinelwe isitaki se-PC egcwele izohlangana kahle ne-PVC noma i-PETG.
Akukho kulungiselelwa kwendawo yonke. Izinga lokushisa, ingcindezi, indawo yokuhlala, izinga lerempu nokupholisa kuncike ebangeni, ukujiya kweshidi, ukumbozwa kukayinki, ukwakheka kwe-inlay, isistimu yepuleti nesitaki esiphelele. Sungula iwindi lokukhiqiza ngokusebenzisa izivivinyo ezilawulwayo.
Ingahlolwa njengesendlalelo esisodwa ekwakhiweni okuphelele kwekhasi ledatha. Iphrojekthi kumele iqinisekise ngokuhlukana ukwakhiwa kwamahinji, amafasitela asobala, izingxenye ze-elekthronikhi, i-lamination, ukwenziwa komuntu siqu kwe-laser, ukuhlanganiswa kwamabhukwana kanye nezidingo zegunya lokukhipha.
Cha. Ukuvikeleka kwedokhumenti kuvela ekwakhiweni okulawulwayo nasekukhiqizweni kokuqinisekisa okuphelele, okuhlanganisa izinto zokwakha, ukuphrinta, ukwenza kube ngokwakho nge-laser, izingxenye ze-elekthronikhi, izici zokuphepha, ukukhishwa kanye namasistimu okuqinisekisa.
Yebo, kuncike ebangeni nokuba nokwenzeka kokukhiqiza. Nikeza ngemibala elinganisekayo, ukufiphala, inkungu, isicwebezelisi noma ukuthungwa okuqondiwe futhi uchaze ukuthi umthengi uzokuvumela kanjani lokho.
Zigcine zihlanzekile, zomile, ziyisicaba futhi zivikelekile ephaketheni lokuqala. Gwema ukujiya, uthuli nokulimala kwendawo. Faka amaphakethe angavulwanga endaweni yokukhiqiza ngaphambi kokusetshenziswa lapho inqolobane namazinga okushisa ekamelo ehluka.
Ubukhulu bokuhlola, ukuphrinta, ukunamathela kukayinki, ukucwazimula, ukushwabana, ukucaba, ukuziphatha kwekhasi, ukungafani kwe-laser, ukusika nokusebenza kwe-RFID lapho kufanele khona. Gunyaza Isampula Legolide kanye nemibandela yokwamukela ebhaliwe.
Nikeza uhlelo lokusebenza, umdwebo wengqimba, ukujiya, usayizi weshidi, umbala, ukukhanya, indawo engaphezulu, inqubo yokuphrinta, imfuneko ye-laser, ivolumu yonyaka, izidingo zesampula, ukupakishwa nendawo oya kuyo.
| Imininingwane Yento Ye-RFQ | Ezonikezwa |
|---|---|
| Isicelo sedokhumenti | Umazisi kazwelonke, izincwadi zokushayela, imvume yokuhlala, ikhasi ledatha yephasipoti, imininingwane yokufinyelela noma olunye uhlelo |
| Umsebenzi Wesendlalelo | I-Opaque core, ingqikithi ekhanyelayo, isendlalelo esiphrintekayo, isendlalelo esilasekayo noma imbondela engalayisi |
| Ubukhulu | Ubukhulu, usayizi weshidi, indawo esebenzisekayo, isiqondiso sokusanhlamvu / i-extrusion kanye nokubekezelelana kobukhulu |
| Izidingo ze-Optical | Umbala, ubumhlophe, ukukhanya, ukudluliswa, inkungu, isicwebezelisi nokuthungwa kwendawo |
| Ukuphrinta | I-offset, isikrini noma inqubo ye-UV, uhlobo lweyinki, uhlelo lokuphulukisa kanye nokufakwa kwemidwebo |
| I-Laser | Umshini, ubude begagasi, isu lokugxila, ukugqama okuqondiwe, indawo empunga nokujula kwesendlalelo okuhlosiwe |
| I-Lamination | Gcwalisa isitaki, ipuleti kanye nesistimu yomcamelo, izinga lokushisa, ingcindezi, indawo yokuhlala kanye nokupholisa |
| Ezogesi | I-chip, i-antenna, imojula, iwindi noma ukuhlanganiswa kwehinge lapho kufanele khona |
| Imininingwane Yezohwebo | Ubuningi besampula, umthamo wesilingo, isibikezelo sonyaka, indawo okuyiwa kuyo kanye nemfuneko yokupakisha |
