Polycarbonate core sheets a wɔde yɛ ID card, karka tumi krataa ne akwantu tumi krataa data nkratafa. Amanneɛbɔ thickness, kɔla, opacity, soro ne laserable grades, ne B2B nhwɛsode ma tintim, lamination ne sɔhwɛ.
WLS-PC Core Krataa a Wɔde Di Dwuma
WALLIS na ɔkyerɛwee
| Kɔla: | |
|---|---|
| Kɛse: | |
| Nea ɛwɔ hɔ: | |
| Dodow: | |
Wallis polycarbonate core krataa no ma ahobanbɔ tintimfo, kaad ayɛfo, inlay ayɛfo, nhyehyɛe a wɔde bom ne nkrataa adwumayɛfo a wɔreyɛ multilayer identity credentials. Wɔde Wobetumi asiesie PC abasobɔde fitaa, a ɛda adi na ɛyɛ adwuma pɔtee bi ama ɔman ID kaad, karka tumi krataa, tumi krataa a ɛkyerɛ sɛ obi tena, e-passport data nkratafa, akwan a wɔfa so kɔ hɔ ne kaad nhyehyɛe afoforo a ɛtra hɔ kyɛ.
Nsuo a ɛwɔ hɔ no firi 50μm kɔsi 800μm , a ɛwɔ krataa a wɔde di dwuma daa te sɛ 505×590mm ne 295×485mm. Adetɔfo betumi akyerɛ ne kɛse, opacity, kɔla, soro texture, tintim ayaresa, laser mmuae, ahobammɔ film ne export packaging sɛnea wɔapene nkrataa adansi ne production mfiri.
Nkyekyɛmu a ɛho hia: 'PC core krataa,' 'PC sini a wotumi tintim,' 'PC sini a wotumi tintim' ne 'PC a ɛkata so a ɛda adi' kyerɛkyerɛ dwumadie layers ahodoɔ mu. Laser agyiraehyɛde adwumayɛ yɛ formulation- ne layer-specific; ɛsɛ sɛ wɔde laser nhyehyɛe ankasa, layer stack ne personalization botae no si so dua ansa na wɔayɛ no kɛse.
Full-PC nkrataa nhyehyɛe: wɔayɛ ama polycarbonate layers a ɛne ne ho hyia a ɛfrafra wɔ ɔhyew ne nhyɛso a wɔahyɛ so.
Project-specific printing: wobetumi de ink ne curing nhyehyɛe a wɔapaw no asusuw offset, screen ne UV tintim ho.
Laserable options: ɛwɔ hɔ bere a ɛsɛ sɛ layer a wɔakyerɛ no ma controlled grayscale anaa black contrast.
OEM nsakrae: customized thickness, krataa kɛse, kɔla, soro ne packaging ma mfiridwuma mu.
Nhwɛsoɔ validation: tintim, lamination, laser, twa ne wie-nwoma sɔhwɛ ansa na aguadi pene.
Bisa PC Core Sheet Nhwɛsode ne Mfiridwuma mu Nhwehwɛmu

Nsonsonoe a ɛwɔ aseɛ ha no kyerɛkyerɛ mprempren nneɛma ahodoɔ ne nsɛm a wɔde gyina hɔ ma a wɔtaa de di dwuma. Ɛsɛ sɛ wɔkyerɛw tolerances a etwa to, optical properties, laser response, lamination parameters ne acceptance criteria wɔ technical specification a wɔapene so anaa Golden Sample ma adwuma biara.
| Parameter | a Ɛwɔ Hɔ Nkyerɛkyerɛmu |
|---|---|
| Atadeɛ | Polycarbonate (PC) sini anaa krataa a wɔde yɛ ahobammɔ-nwoma nhyehyɛe ahorow a ɛwɔ ntoatoaso pii |
| Dwuma a Wɔde Di Dwuma a Wɔde Di Dwuma | Core, printed core anaa project-specific emu nhyehyeɛ layer; si so dua sɛ ebia grade a wɔapaw no yɛ laserable |
| Thickness Range a Ɛyɛ Fɛ | 50-800μm (0.05-0.80mm) ne nea ɛwɔ hɔ; awieɛ a ɛbɛba no gyina grade, kɔla, soro ne order dodoɔ so |
| Nkratafa a Wɔde Di Dwuma Wɔ Standard | 505 × 590mm, 295 × 485mm na wɔayɛ no sɛnea wɔpɛ |
| Kɔla ne Opacity | White, transparent anaasɛ wɔayɛ no sɛnea wɔpɛ; kyerɛkyerɛ opacity, fitaa ne kɔla tolerance mu bere a ɛho hia |
| Nneɛma a Wɔpaw wɔ Surface | Matte, matte pa, glossy anaa project-specific texture; printing treatment a ɛwɔ hɔ sɛnea grade te |
| Nneɛma a Wɔde tintim nhoma | Offset, silk-screen ne UV tintim a ɛwɔ ink, pretreatment, curing ne lamination sɔhwɛ ahorow ase |
| Laser Personalization a Wɔde Yɛ Nneɛma | Laserable formulations a ɛwɔ hɔ; kyerɛ laser asorɔkye tenten, focal strategy, botae nsonsonoe ne layer gyinabea |
| Lamination a wɔde yɛ nneɛma | PC lamination a ɛyɛ hyew a ɛkorɔn a wɔahyɛ so; ɔhyew, nhyɛso, tra ne onwini gyina stack a edi mũ no so |
| Ɛlektrɔnik Nneɛma a Wɔde Bom | Wobetumi de contactless inlays, contact modules ne transparent-mfɛnsere nhyehyɛe asusuw ho |
| Nneɛma a wɔde kyekyere nneɛma | Ahobammɔ film, nsu-resistant wrapping, cartons, pallets ne customized batch labels |
| MOQ ne Bere a Wɔde Di Dwuma | Wɔasi so dua sɛnea grade, nsusuwii, kɔla, soro, tolerances ne production nhyehyɛe |
Saa akontabuo yi ho wɔ mfasoɔ ma mfiridwuma ho nkɔmmɔdie a ɛdi kan nanso ɛnyɛ amansan nyinaa nkyerɛkyerɛmu a wɔahyɛ ho bɔ ma PC grade biara. Ɛsɛ sɛ wɔsi TDS a etwa toɔ, ɔkwan a wɔfa so hwɛ ne abodwokyɛreɛ no so dua ma nneɛma a wɔapaw no.
| Agyapadeɛ | Akwankyerɛ / Ɔkwan | Unit | Typical Reference |
|---|---|---|---|
| Muduro | — . | g/cm⊃3 na ɛwɔ hɔ; | 1.22 ±0.05 na ɛwɔ hɔ |
| Ahoɔden a Wɔde Tensile | Afiri / a ɛkɔ soro | MPa | ≥50 na ɛwɔ hɔ |
| Ahoɔden a Wɔde Tensile | Transverse / gyina hɔ pintinn | MPa | ≥50 na ɛwɔ hɔ |
| Vicat Ɔhyew a Ɛma Ɛyɛ Dwo | Sɔhwɛ tebea pɔtee a ɛsɛ sɛ wosi so dua | °C | 145 ±2 na ɛwɔ hɔ |
| Surface Dyne Level a ɛwɔ soro | Wɔayɛ no aduru a wotumi tintim no | dynes/cm | ≥38 na ɛwɔ hɔ |
| Thickness Tolerance a Wɔde Ma | Dwumadi pɔtee bi a wɔde susuw nneɛma ho nhyehyɛe | μm anaa % . | Si so dua denam grade ne adetɔ ho nkyerɛkyerɛmu so |
| Shrinkage / Ɛyɛ petee | Afei a wɔapene so lamination cycle | — . | Kyerɛkyerɛ mu denam kaad stack a edi mũ no so |
Polycarbonate krataa a ahobammɔ wom taa kura PC layers pii a ɛsono nnwuma. Sɛ wɔde nsɛmfua a ɛteɛ di dwuma wɔ RFQ no mu a, ɛmma adetɔfo nnya nkataso a ɛda adi bere a wohia opaque printable core, anaasɛ non-laserable film bere a wohia emu laser personalization.
| Layer Type | Dwumadie Titiriw | Key RFQ Nsɛmmisa |
|---|---|---|
| PC Core a ɛyɛ fitaa / Opaque | Ɛma opacity, kɔla akyi, thickness ne structural mmoa; betumi nso de mfonini ahorow a wɔatintim akɔ | Ɛhwehwɛ sɛ ɛyɛ kɛse, fitaa, opacity, soro, ɔkwan a wɔfa so tintim ne sɛ ebia laser mmuae ho hia |
| PC Core / Mfɛnsere Film a ɛda adi pefee | Ɔbɔ mmeae a ɛda adi pefee, mfɛnsere anaa emu adansi ntoatoaso | Optical pefeeyɛ, haze, texture, thickness, window geometry ne lamination a ɛne ne ho hyia |
| PC Film a Wotumi tintim | Ogye offset, screen anaa UV inks ansa na wɔayɛ lamination | Printing fã, dyne level, ink nhyehyɛe, ayaresa, adhesion ne kɔla botae |
| PC Film a wɔde laser yɛ adwuma | Ma laser nsonsonoe a wɔahyɛ so ma nkyerɛwee, mfonini anaa ahobammɔ mfonini ahorow | Laser nhyehyɛe, asorɔkye tenten, focal bun, grayscale, tuntum density, tactile ahwehwɛde ne layer gyinabea |
| PC Overlay a Ɛnyɛ Laserable | Bɔ layers a wɔatintim anaa laserable ho ban a ɛmfa laser reaction a wɔmpɛ nka ho | Transparency, surface texture, thickness, scratch suban ne mprɛte a wɔayi no adi |
| Coated / Bonding PC Nkatasoɔ | Ɔde ade a wɔde kata so di dwuma de ma bonding tu mpɔn wɔ afrafra anaa wɔatintim adan pɔtee bi mu | Coating afã, compatible substrate, peel botae, ɔhyew kyinhyia ne storage tebea horow |
Layer dodow pɔtee ne beae a ɛwɔ no, nea ɔyɛ krataa no ho nhyehyɛe no na ɔkyerɛ. Nhwɛsoɔ a ɛdidi soɔ yi kyerɛ deɛ enti a ɛsɛ sɛ wɔpaw core sheet no sɛ stack a ɛdi mũ no fã sene sɛ ɛbɛyɛ aguadeɛ a atew ne ho.
| Nhwɛso Gyinabea | Possible Material | Botae ne Validation |
|---|---|---|
| Akyirikyiri Nneɛma | Transparent non-laserable anaasɛ ahobammɔ PC overlay | Surface texture, abrasion ahobammɔ, optical pefee ne compatibility ne personalization bun |
| Laser Personalization Layer a Wɔde Yɛ Adwuma | Transparent anaa fitaa laserable PC sini | Mfonini, nkyerɛwee, grayscale, CLI/MLI anaa adwuma pɔtee bi laser mfonini |
| Layer a Wɔatintim | PC sini fitaa anaa nea ɛda adi a wotumi tintim | Guilloche, microtext, UV mfonini, akyi mfonini ne nneɛma a wɔde yɛ nneɛma a ɛsakra |
| Nneɛma a Wɔde Yɛ Adwuma | White, transparent anaa kɔla PC core krataa | Ɔkyekye nkrataa thickness, rigidity, opacity ne emu layer mudi mu kura |
| Ɛlektrɔnik Inlay Layer a Wɔde Yɛ Nneɛma | Antenna ne chip inlay a ɛne PC hyia | Chip gyinabea, antenna tuning, nhyɛso kyekyɛ ne post-lamination RF adwumayɛ |
| Mfɛnsere / Ahobammɔ Layer | Transparent PC insert anaasɛ mfɛnsere layer a wɔayɛ no sɛnea wɔpɛ | Mfɛnsere geometry, dinkyerɛw, ano fusion ne optical su |
| Reverse Layers a Wɔde Yɛ Adwuma | Mirrored tintim, laserable ne overlay nhyehyɛe sɛnea wɔayɛ | Kari pɛ thickness, flatness, bending suban ne wie document symmetry |
Polycarbonate layers a ɛne ne ho hyia betumi ayɛ card nipadua a ɛka bom wɔ ɔhyew, nhyɛso ne onwini kyinhyia a wɔagye atom ase. Ahobammɔ bo no fi bonded adansi a edi mũ no mu: ɛsɛ sɛ wɔyɛ layer formulation, printed inks, inlay design, windows, overlays ne personalization nyinaa bom.
Laserable PC grades betumi ayɛ nkyerɛwee, nɔma, mfonini ne grayscale nsɛm wɔ krataa no ani. Ɛsɛ sɛ wɔsɔ abasobɔde a wɔapaw no hwɛ sɛ ɛwɔ nsonsonoe, nsusuwii, focal depth, layer kɔla a ɛsakra ne nkɛntɛnso a ɛwɔ layers a ɛbɛn a ɛyɛ transparent anaa printed so.
White opaque films betumi de antennas asie na ama wɔadi tintim akyi, bere a transparent films betumi aboa mfɛnsere ne optical security nhyehyɛe ahorow. Ɛsɛ sɛ wɔkyerɛ opacity, whiteness, haze ne surface texture sɛ values a wotumi susu wɔ baabi a document design gyina so.
Wɔde PC core sheets di dwuma wɔ elevated-temperature lamination systems mu, nanso dimensional adwumayɛ gyina grade ne cycle so. Sua afiri-kwankyerɛ ne transverse shrinkage, krataa curl, wie thickness ne flatness akyi ankasa ɔhyew ne onwini nnidiso nnidiso.

Nneɛma titiriw a ɛteɛ no gyina nkrataa nkwa nna, ankorankoro mfiridwuma, nnwinnade a wɔde yɛ nneɛma, ɛka a wɔde asi wɔn ani so ne ahwehwɛde ahorow a ɛfa sɛnea wodi so so. PC nyɛ nea eye sen biara a wobetumi apaw ama aguadi kaad biara ankasa, na ɛnsɛ sɛ wɔde PVC anaa PETG si PC ahobammɔ krataa a wɔapene so a ɛyɛ PC mũ no nyinaa ananmu a wɔsan mfata bio.
| Nneɛma a Wɔpaw | Polycarbonate Core | PVC Core | PETG Core |
|---|---|---|---|
| Dwumadi Ahorow a Wɔtaa Yɛ | Ɔman ID, karka tumi krataa, tumi krataa a ɛkyerɛ sɛ obi tena, akwantu tumi krataa data nkratafa ne adansedi nkrataa a ahobammɔ wom a ɛtra hɔ kyɛ | Sikakorabea, asɔremma, akyɛde, ahɔhodan, telefon so nkitahodi ne aguadi nkrataa nyinaa | Aguadi nkrataa ne nneɛma a wɔapaw a ɛyɛ hyew a ɛba fam a ɛtra hɔ kyɛ anaasɛ PVC a wɔatew so |
| Lamination Nhyehyɛe | PC stack a ɛne ɔhyew a ɛkorɔn hyia a ɛwɔ onwini a wɔahyɛ so | Amanneɛbɔ PVC kaad lamination kyinhyia | PETG-specific anaasɛ ɛne no hyia hybrid cycle |
| Laser Personalization a Wɔde Yɛ Nneɛma | Atirimpɔw-ayɛ laserable grades kɛse a wɔde di dwuma ma emu personalization | Mpɛn pii no, ɛde ne ho to nhoma tintim anaa nneɛma foforo a ɛfa obi ankasa ho so gye sɛ wɔayɛ no titiriw | Ebia wobenya abasobɔde soronko; validate laser suban ankasa |
| Windows a ɛda adi pefee | Ɛfata yiye ma full-PC transparent-window designs bere a wɔayɛ no sɛ stack no | Ɛbɛyɛ yie ne inserts anaa overlays nanso ɛsono fusion suban | Ebetumi aba wɔ PETG nhyehyɛe ahorow a ɛne ne ho hyia mu |
| Nneɛma a Wɔde Frafra | Adwumayɛ a eye sen biara taa hwehwɛ sɛ wonya layer abusua a ɛne no hyia a wɔagye atom | Hybrid structures hia adhesion ne shrinkage sɔhwɛ ahorow | Hybrid structures hia adhesion ne thermal-cycle sɔhwɛ ahorow |
| Abodinkrataa | Nwoma sɔhwɛ a edi mũ, ahobanbɔ nhyehyɛe ho pene ne adwuma pɔtee bi a wogye tom | Printing, lamination ne wie-kaad validation | Printing, lamination, durability ne wie-kaad validation |
PC core nneɛma betumi akyerɛ wɔ multilayer aban adansedi nkrataa a ɛhwehwɛ sɛ kaad geometry a ɛtra hɔ kyɛ, emu laser personalization ne nkabom ne aniwa anaa ɛlɛtrɔnik ahobammɔ nneɛma. Aban a ɛde ma ne nkrataa a wɔapene so no na ɛhwɛ sɛnea ɛfata a etwa to no so.
Wɔ akwantu tumi krataa data nkratafa ho no, krataa titiriw no yɛ ɔdansi no fã biako pɛ. Ɛsɛ sɛ adetɔfo nso kyerɛkyerɛ hinge nkabom, chip ne antenna a wɔde si hɔ, mfɛnsere a ɛda adi pefee, layer nnidiso nnidiso, personalization mfiridwuma, kratafa stiffness ne nhomawa nhyiam ahwehwɛde ahorow mu.
Driving-licence programs betumi de PC layers a ɛnyɛ hann na ɛda adi pefee adi dwuma ama mfonini a wɔatintim, laser mfonini, tactile effects ne nsɛm a mfiri betumi akenkan. Ɛsɛ sɛ nneɛma a wogye tom no ka dimensional, optical, bending ne personalization sɔhwɛ ahorow ho.
Adwumayɛfoɔ a ɔtena ase kyɛ, polisifoɔ, asraafoɔ, akwahosan ne kwan a wɔfa so nya kwan ho adansedie bɛtumi de PC nhyehyɛeɛ adi dwuma berɛ a adwuma no hwehwɛ sɛ wɔsi dan a ɛyɛ den ne ankorankoro a wɔahyɛ so. Ɛsɛ sɛ wɔhwɛ sɛ access technology no hyia wɔ ɔkwan soronko so fi plastic substrate no ho.
Wobetumi de inlays a ɛne PC hyia ahyɛ mu wɔ layer stack a ɛkari pɛ mu. Validate antenna frequency, chip gyinabea, module cavity, coil anaa etched antenna geometry, lamination nhyɛso ne akenkan adwumayɛ ansa na ne akyi personalization.
| Customization Item | Options to Discuss | Nsɛm a Wɔhwehwɛ fi Adetɔfo hɔ |
|---|---|---|
| Nneɛma a Ɛyɛ Den ne Nkratafa Kɛse | 50–800μm kwan, gyinapɛn anaa amanne-twitwa nkrataa | Layer mfonini, wie thickness, mprɛte kɛse, collation ne twa nhyehyɛe |
| Kɔla ne Opacity | Kɔla fitaa, ɛda adi anaasɛ ɛfa adwuma pɔtee bi ho | Kɔla botae, opacity anaasɛ nkrasɛm ahwehwɛde, pene kwan |
| Nneɛma a Wɔde Yɛ Nneɛma a Ɛwɔ Anim | Matte, matte a ɛyɛ fɛ, glossy anaa nea wɔakyerɛ sɛ ɛyɛ | Printing nhyehyɛe, mprɛte wie, tactile botae ne krataa hwɛbea |
| Printing Ayaresa a Wɔde Yɛ Adwuma | Offset, screen anaa UV-printable soro sɛnea grade | Ink brand, ayaresa nhyehyɛe, dyne botae ne adhesion kwan |
| Laser Mmuae a Wɔde Ma | Non-laserable, laserable anaa project-specific nsonsonoe | Laser mfiri, asorɔkye tenten, focal depth, tuntum density ne grayscale botae |
| Sini a Ɛbɔ Ho Ban | Ahobanbɔ a ɛwɔ ɔfã biako anaa ɔfã abien wɔ baabi a ɛwɔ hɔ | Peel akwankyerɛ, clean-room ahwehwɛde ne production handling |
| Nneɛma a wɔde kyekyere nneɛma | Cartons, pallets, nsuo akwansideɛ ne kokoam nkyerɛwdeɛ | Pack dodow, pallet anohyeto, baabi a wɔrekɔ ne batch traceability format |

Fa krataa stack no kɔ: fa layer drawing a ɛwɔ thickness, dwumadie, kɔla, printing, laser ne electronic elements ma layer biara.
Si candidate grades no so dua: kyerɛ nsonsonoe a ɛda core, printable, laserable, non-laserable ne coated nneɛma mu ansa na wɔatwitwa samples.
Run incoming inspection: kyerɛwtohɔ thickness, dimensions, flatness, hwɛbea, kɔla, ahobammɔ film ne batch identification.
Print production samples: fa offset ankasa, screen anaa UV ink, curing nhyehyɛe ne adwini a wɔde kata so di dwuma.
Laminate stack mũ no nyinaa: fa nhyehyɛe dade mprɛte, cushions, release layers, nhyɛso, ɔhyew ne onwini nnidiso nnidiso.
Sɔ personalization hwɛ: hwehwɛ laser nsonsonoe, grayscale, focal depth, text resolution ne nkitahodi a ɛne tintim anaa transparent features.
Nwoma sɔhwɛ a edi mũ: hwɛ peel resistance, flatness, bending, torsion, edge quality, window registration ne RFID adwumayɛ wɔ baabi a ɛfata.
Approve a Golden Sample: fa wo nsa hyɛ adansi, dwumadie mfɛnsere, ɔkwan a wɔfa so hwɛ, nneɛma a wɔde kyekyere ne sintɔ gyinapɛn a wɔagye atom ansa na wɔde ama pii.
Wo ne Wallis nsusuw Wo PC Card Stack ho
| Inspection Stage | Nhwehwɛmu a wɔkamfo kyerɛ | B2B Gye a wogye tom |
|---|---|---|
| Nneɛma a Ɛba | Thickness map, krataa no nsusuwii, squareness, flatness, soro sintɔ, ahobammɔ film ne batch label | Wɔapene specification, sampling nhyehyɛe ne calibrated susudua kwan |
| Nneɛma a Wɔde Hwɛ Aniwa So | Whiteness, kɔla nsonsonoe, opacity, transmission, haze ne gloss baabi a ɛfata | Adetɔfo-kyerɛkyerɛ adwinnade, hann, akyi ne abodwokyɛre |
| Nhoma tintim | Dyne level, wetting, mfonini density, ink adhesion, ayaresa, siw ne kɔla a ɛkɔ so pɛpɛɛpɛ | Ink nhyehyɛe ankasa ne nhwɛsode a wɔatintim a wɔapene so |
| Lamination a wɔde yɛ nneɛma | Layer registration, fusion, peel suban, shrinkage, curl, bubbles, mprɛte gyae ne wie thickness | Wɔapene so full-stack cycle ne cooled nhwɛsode |
| Laser Personalization a Wɔde Yɛ Nneɛma | Nsonsonoe, grayscale, resolution, focal depth, data a wɔasan ayɛ ne edge artifacts | Ankasa laser nhyehyɛe ne apene personalization fael |
| Ɛlektrɔnik Nneɛma a Wɔde Yɛ Adwuma | Chip dwumadie, antenna kɔ so, frequency mmuaeɛ ne akenkan kwan ansa na lamination ne akyi | Ɔkenkanfo a wɔakyerɛ, sɔhwɛ gyinabea ne encoding tebea |
| Nsakrae | Die twa, milling, punching, ano su, nsusuwii ne module cavity gyinabea | Wɔapene so sɛ wɔbɛtwe mfonini ne mfiri a ɛwɔ fam no abodwokyɛre |
| Nneɛma a wɔde kyekyere nneɛma | Surface ahobanbɔ, nsuo akwansideɛ, pack dodoɔ, pallet tebea ne traceability labels | Adetɔ ho nhyehyɛe ne nkyerɛkyerɛ a wɔapene so sɛ wɔde bɛhyɛ nneɛma mu |
| Issue | Possible Deuses | Nhwehwɛmu ne Nneyɛe a Wɔde Siesie |
|---|---|---|
| Layer Bonding a Ɛyɛ Mmerewa | Grade a ɛne ne ho nhyia, ɔhyew a ɛba fam, nhyɛso a ɛnnɔɔso, ink akwanside a wɔasa anaasɛ efĩ | Si layer abusua ne orientation so dua; hwɛ sɛnea ink akata so; sesa ɔhyew, nhyɛso ne mfɛnsere a wɔtra mu a wɔagye atom |
| Kaad Curl anaa Warpage | Stack a ɛnkari pɛ, directional shrinkage, ɔhyew a ɛnteɛ anaasɛ nhyɛso a ɛba ntɛm | Balance layer no mu duru; kyerɛwtohɔ MD/TD akwankyerɛ; onwini wɔ nhyɛso a wɔahyɛ so ase |
| Laser Nsonsonoe a Ɛba Fam | Grade a ɛnteɛ, focal depth a ɛnteɛ, ahoɔden a ɛba fam anaasɛ laserable layer a wɔde asi hɔ a emu dɔ dodo | Hwɛ sɛnea wɔayɛ no ne layer gyinabea; optimize laser parameters denam sɔhwɛ matrix a wɔahyɛ so |
| Laser a Wɔmpɛ sɛ Wɔyɛ Esum | Laser-sensitive nneɛma a wɔde dii dwuma wɔ baabi a na ɛho hia sɛ wɔde pefee a ɛnyɛ nea ɛyɛ adwuma | Fa sini a wɔagye atom a ɛnyɛ laserable si ananmu anaasɛ san hwɛ focal strategy ne layer sequence mu |
| Ink Delamination a Wɔde Yɛ Nneɛma | Ahoɔden a ɛba fam wɔ soro, ink a ɛne ne ho nhyia, curing a enni mũ anaasɛ ink a emu yɛ duru a ɛkata so | Hwɛ dyne ne mfe a wɔde sa yare; sɔ ink adhesion hwɛ ansa na wɔayɛ lamination ne akyi |
| Antenna anaa Chip a wotumi hu | Opacity a ɛnnɔɔso, thin core, component placement a enye anaasɛ pressure imprint | Ma opacity a wɔagye atom no nkɔ soro; hwɛ layer kari pɛ ne inlay cavity; hwɛ cushion ne dade mprɛte nhyehyɛe |
| Window Registration Mfomso a Ɛba | Twitwa insert tolerance, collation kankyee anaa ɔhyew shrinkage | Kyerɛkyerɛ X/Y dinkyerɛw ho abodwokyɛre mu; fa alignment marks di dwuma na susuw bere a ayɛ nwini awie no |
Ɛsɛ sɛ PC nkrataa kɔ so tew, ɛyɛ petee na wɔbɔ ho ban fi nsu, mfutuma, nsensanee ne ɔhyew mu nsakrae a ɛboro so ho. Fa nneɛma sie nea wɔde ahyɛ mu mfiase no mu kosi sɛ wode bedi dwuma, ma nneɛma a wɔayɛ no yiye no nkɔ baabi a wɔyɛ nneɛma no ansa na woabue, na di nea edi kan wɔ nea edi kan a wɔde di dwuma no akyi wɔ baabi a mfe a wɔde yɛ nneɛma a ɛwɔ soro no ka nhoma tintim no.
Fa film a ɛbɔ ho ban, interleaving anaa wrapping a ɛho tew a ɛfata ɔfasu a woapaw no di dwuma.
Fa nkratafa sie petee wɔ pallets a wɔboa so na kwati nnesoa a ɛwɔ baabi a ebetumi de curl aba.
Bɔ nnaka ho ban fi nsu a ɛbɛtɔ ho bere a wode rekɔ adekoradan mu na wode rekɔ amannɔne no.
Kyerɛ grade, thickness, surface, printable side, batch number ne dodow a ɛwɔ package biara so.
Ma laserable ne non-laserable grades honam fam tetew mu na asiw production mix-ups ano.
Wallis de kaad-nneɛma nhyehyɛe ahorow ma sen sɛ wɔbɛfa PC sini biara sɛ ade koro no ara. B2B nhwehwɛmu no betumi akata core sheets, printable layers, transparent overlays, laserable films, inlay structures ne packaging so sɛnea ɛbɛyɛ a adetɔfo betumi de nneɛma a wɔahyɛ ho nyansa no atoto document stack biako a edi mũ ho.
Application-based grade selection: nsonsonoeɛ da opacity, printability, laser mmuaeɛ ne overlay dwumadie.
Amanneɛbɔ nsakrae: thickness, dimensions, soro, kɔla ne ahobammɔ packaging ma production layouts.
Nhwɛso-di kan validation: nneɛma a wɔde tintim, lamination, laser ne finished-document sɔhwɛ ahorow.
Batch nkitahodi: adetɔ ho nsɛm, nkyerɛwde ne su pa gyinapɛn a wɔde ma mpɛn pii.
Export nkitahodi: ahobammɔ packing ne po so hyɛn mmoa ma card adwumayɛbea ahorow, kyekyɛfo ne ahobammɔ-nkrataa adwumayɛfo.
Bisa B2B PC Core Sheet Nhwɛsode ne Bo
Ɛyɛ PC layer a ɛyɛ opaque, transparent anaa kɔla a wɔde di dwuma wɔ multilayer card anaa document mu. Ɛgyina grade no so no, ebetumi ama nhyehyɛe, opacity, printability anaasɛ controlled laser response. Ɛnsɛ sɛ wɔde frafra ara kwa ne ahobammɔ a ɛda adi pefee a wɔde kata so.
Mprempren kwan a ɛwɔ hɔ no yɛ 50–800μm. Ɛsɛ sɛ wɔbu ne kɛseɛ a wɔapaw no bom ne nkatasoɔ, ntoatoasoɔ a wɔtumi tintim, ntoatoasoɔ a wɔtumi tintim, ɛlɛtrɔnik inlays ne botaeɛ a wɔawie-nwoma no mu duru.
Dabi Laser agyiraehyɛde gyina formulation ne layer gyinabea a wɔahyɛ da ayɛ so. Kyerɛ sɛ ebia ɛsɛ sɛ layer no yɛ non-reactive, grayscale laserable anaasɛ high-contrast laserable, afei sɔ no hwɛ ne laser mfiri ankasa.
Wobetumi asusuw abasobɔde a wotumi tintim ho wɔ offset, silk-screen ne UV tintim ho. Si so dua sɛ wotumi tintim ɔfã, dyne level, ink nhyehyɛe, curing tebea ne adhesion akyi lamination ansa na aguadi ayɛ.
Wɔn baanu nyinaa betumi ayɛ wɔn ade wɔ laser ahoɔden ho, nanso ɛsono gyinabea na wɔsom dwumadi ahorow a ɛsono wɔ nhyehyɛe anaa aniwa so. Paw no ka focus depth, portrait appearance, transparency ne security-feature design.
Afrafra nhyehyɛe betumi aba bere a wɔagye ɔhyew ntrɛwmu, softening suban, bonding, shrinkage ne finished-card durability atom akyi nkutoo. Mfa no sɛ ade bi a wɔayɛ ama full-PC stack no bɛfrafra yiye ne PVC anaa PETG.
Amansan tebea biara nni hɔ. Ɔhyew, nhyɛso, tra, ramp rate ne onwini gyina grade, krataa no kɛse, ink a ɛkata so, inlay nhyehyɛe, mprɛte nhyehyɛe ne stack nyinaa so. Fa sɔhwɛ ahorow a wɔahyɛ da ayɛ so de production window no si hɔ.
Wobetumi asusuw ho sɛ ɔfa biako wɔ data-kratafa nhyehyɛe a edi mũ mu. Ɛsɛ sɛ adwuma no wɔ ɔkwan soronko so gye hinge adansi, mfɛnsere a ɛda adi pefee, ɛlɛtrɔnik nneɛma, lamination, laser personalization, nhomawa a wɔboaboa ano ne nea wɔde ma-tumidi ahwehwɛde ahorow no tom.
Dabi, nkrataa ahobanbɔ fi nhyehyɛe a wɔhwɛ so ne sɛnea wɔyɛ adansedi krataa a edi mũ no mu, a nneɛma, tintim, laser personalization, ɛlɛtrɔnik nneɛma, ahobammɔ nneɛma, nhyehyɛe a wɔde ma ne nea ɛkyerɛ sɛ ɛyɛ nokware ka ho.
Yiw, egyina grade ne production feasibility so. Fa kɔla, opacity, haze, gloss anaa texture botae ahorow a wotumi susuw ma na kyerɛkyerɛ sɛnea adetɔfo no bɛpene so.
Ma wɔn ho ntew, ɛnyɛ nwunu, ɛnyɛ petee na bɔ ho ban wɔ nea wɔde ahyɛ mu mfiase no mu. Kwati nsu a ɛyɛ nwini, mfutuma ne ɔfasu a ɛsɛe. Fa packs a wɔanbue no hyɛ baabi a wɔyɛ nneɛma no ansa na wode adi dwuma bere a ɛsono adekoradan ne dan mu hyew no.
Sɔhwɛ ne kɛse, tintim, ink adhesion, lamination, shrinkage, flatness, peel suban, laser nsonsonoe, twa ne RFID adwumayɛ wɔ baabi a ɛfata. Pene Sika Nhwɛsode ne gyinapɛn a wɔakyerɛw a wɔde gye tom so.
Fa application, layer mfonini, thickness, krataa kɛse, kɔla, opacity, soro, tintim nhyehyɛe, laser ahwehwɛde, afe afe volume, sampling ahiade, packaging ne destination ma.
| RFQ Item | Nsɛm a Wɔde Ma |
|---|---|
| Nwoma a Wɔde Di Dwuma | Ɔman ID, karka tumi krataa, tumi krataa a ɛkyerɛ sɛ obi tena, akwantu tumi krataa data krataafa, adansedi krataa a ɛkyerɛ sɛ obi tumi kɔ hɔ anaa nhyehyɛe foforo |
| Layer Dwumadie | Opaque core, transparent core, printable layer, laserable layer anaasɛ ɛnyɛ laserable overlay |
| Nsusuwii ahorow | Thickness, krataa kɛse, beae a wotumi de di dwuma, aburow / extrusion akwankyerɛ ne dimensional tolerance |
| Ahwehwɛde a Ɛfa Optical Ho | Kɔla, fitaa, opacity, transmission, haze, gloss ne soro texture |
| Nhoma tintim | Offset, screen anaa UV nhyehyɛe, ink brand, curing nhyehyɛe ne adwinni a wɔde kata so |
| Laser a wɔde di dwuma | Afiri, asorɔkye tenten, adwene a wɔde si biribi so, botae nsonsonoe, grayscale ne layer bun a wɔahyɛ da ayɛ |
| Lamination a wɔde yɛ nneɛma | Complete stack, mprɛte ne cushion nhyehyɛe, ɔhyew, nhyɛso, tra ne onwini |
| Ɛlektrɔnik mfiri a Wɔde Di Dwuma | Chip, antenna, module, window anaa hinge nkabom wɔ baabi a ɛfata |
| Aguadi Ho Nsɛm | Nhwɛso dodow, sɔhwɛ dodow, afe afe nkɔmhyɛ, baabi a wɔrekɔ ne packing ahwehwɛde |
Fi Yɛn Dwumadi no ase