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Leqephe la kakaretso la PVC bakeng sa ID, banka, SIM, phihlello le tlhahiso ea likarete tsa RFID . Botenya ba tloaelo, boholo, 'mala, boemo ba Vicat, dyne ea bokaholimo le bohloeki, ka liteko tsa sampole le liphutheloana tsa kantle ho naha lefatšeng ka bophara.
WLS- PVC Letlapa la mantlha
WALLIS
| Mmala: | |
|---|---|
| Boholo: | |
| Bongata: | |
Wallis PVC core sheet ke karolo e thata ea karete e etselitsoeng ho etsa likarete tsa polasetiki tsa profeshenale, likarolo tsa likarete tse hatisitsoeng, PVC tlhahiso ea inlay, le meaho ea likarete tse se nang mabitso RFID . E sebelisoa e le lera le bohareng la mohaho, e tšehetsa ho bata ha karete, matla a mochine, ho feto-fetoha ha maemo, ho sebetsa ha khatiso, le mocheso o tsitsitseng oa mocheso.
Thepa e etselitsoe baetsi ba likarete tsa B2B ba hlahisang likarete tsa ID, likarete tsa banka, SIM card, likarete tsa ho kena, likarete tsa linotlolo tsa hotele, likarete tsa botho, likarete tsa limpho, likarete tsa lipalangoang, le RFID likarete tse bohlale. Botenya, litekanyo tsa lakane, 'mala, boemo ba Vicat, dyne ea holim'a metsi, le bokaholimo ba bokaholimo li ka bapisoa le thepa ea kaho ea karete le lisebelisoa tse tlase.
Bakeng sa tlhahlobo ea morero, bareki ba lokela ho hlakisa mofuta oa karete e phethiloeng, botenya ba karete eohle, ts'ebetso ea khatiso, Filimi ea overlay kapa sebopeho sa inlay, maemo a lamination, le sebopeho sa lakane se hlokahalang. Joale Wallis e ka lokisa sampole e loketseng bakeng sa khatiso, lamination, punching, le tlhahlobo ea karete e felileng pele ho tlhahiso e ngata.
Litefiso tse latelang li ipapisitse le lintlha tsa hajoale tsa sehlahisoa se fanoeng bakeng sa leqephe lena. Litlhoko tsa ho qetela li lokela ho netefatsoa ke sehlopha sa sehlahisoa, sampole e amohetsoeng, khotheishene le litokomane tsa batch pele ho tlhahiso ea bongata.
| Ntho ea Teko | Yuniti ea | e Hlalositseng Sephetho sa Tšebeliso | ho Tlhahiso ea Karete | |
|---|---|---|---|---|
| Botenya | mm | 0.10–0.50 | E khethiloe ho latela li-cores tse hatisitsoeng, inlay, Filimi ea overlay layers, le botenya ba karete e phethiloeng. | |
| Botenya | g/cm³ | 1.42 ± 0.05 | E tšehetsa boima bo sa fetoheng ba lakane, ho tiea, boitšoaro ba ho phunya, le sebopeho sa karete ea laminated. | |
| Matla a tšepe | E tshekaletseng | MPa | ≥44 | E thusa mantlha ho hanela ho otlolla le khatello ea maikutlo nakong ea ho fetolela le tšebeliso ea karete. |
| E otlolohileng | ≥46 | |||
| Vicat Softening Point | Tloaelehileng Card Kereiti | °C | 78 ± 2 | Kakaretso e hatisitsoeng le laminated PVC meaho ea likarete. |
| Kereiti ea karete ea banka | 74 ± 2 | Khetho ea kereiti e lokela ho tsamaisana le kaho ea karete ea banka e lumelletsoeng le potoloho ea lamination. | ||
| Kereiti ea SIM Card | 90 ± 2 | Boemo bo phahameng ba mocheso bakeng sa ts'ebetso ea 'mele ea SIM card, ho ipapisitse le netefatso ea projeke. | ||
| Surface Dyne | dynes/cm | ≥34 | E tšehetsa ho kolobisa le ho khomarela enke; liteko tsa khatiso li lula li hlokahala bakeng sa sistimi e khethiloeng ea enke. | |
| Bokhopo ba Sekaho | Ra | μm | 0.7–1.8 | E susumetsa phepelo ea maqephe, phetisetso ea enke, ho kopana le lamination, le ho ts'oana ha bokaholimo ba ho qetela. |
| Rz | 4.0–12 | |||
Letlapa la mantlha la PVC ke karoloana ea sebopeho e behiloeng lipakeng tsa ts'ireletso ea Filimi ea overlay s ea karete ea polasetiki ea laminated. Ho itšetlehile ka moralo, motheo o ka hatisoa ka ho toba, oa sebelisoa e le lera le bohareng le sa hatisoang, kapa oa fetoloa hore e be lesela le hlakileng kapa la elektronike le amohelang antenna, chip module kapa karolo e 'ngoe e sebetsang.
Ho fapana le filimi ea Filimi ea overlay , e sireletsang bokaholimo ba karete, leqephe la mantlha le kenya letsoho boholo ba 'mele oa karete o opacity, ho satalla, ho bata, le botsitso ba sebopeho. Ka hona, thepa e lumellanang e bohlokoa bakeng sa ngoliso, lamination, punching, personalization, le automated card handles.
PVC Letlapa la mantlha Boitsebiso
Karete-Kereite PVC Substrate
Mesebetsi ea likarete ha ea lokela ho khetha PVC lisebelisoa tsa mantlha ka botenya feela. Kereiti e loketseng e boetse e ipapisitse le karabelo ea mocheso, mokhoa oa khatiso, lisebelisoa tsa elektroniki tse kentsoeng, mokhoa oa ho khabisa kapa oa motho ka mong, bophelo ba karete, le stack e felletseng ea lamination.
| Kopo ea Karete | e Tloaelehileng ea Tlhokahalo | ea Tlhokahalo ea Tlhokahalo | e khothalelitsoeng |
|---|---|---|---|
| ID e Tloaelehileng, Likarete tsa Botho le Limpho | E ka hatisoang kapa e sa hatisoang e tšoeu PVC ea mantlha e nang le botsitso bo leka-lekaneng le karabelo ea lamination. | Botenya, bosoeu, flatness, print adhesion, die-cutting, le finish-flexible card. | Hatisa, laminate, punch, le likarete tsa moemeli oa tlhahlobo ea bend. |
| Likarete tsa Banka le tsa Lichelete | Likarete tse laoloang tsa karete PVC tse tsamaellanang le tse amohetsoeng Filimi ea overlay , mothalo oa makenete, chip, le mokhoa oa ho iketsetsa motho. | Ho tšoana ha sehlopha, fensetere ea lamination, embossing kapa embedding ea module, le ho sebetsana le likarete tsa nako e telele. | Amohela kaho e felletseng ea karete, eseng leqephe la mantlha le le bang. |
| RFID le Contactless Inlay e laminiloeng esale pele s | Lakane ea mantlha kapa ea motheo e tsamaellana le antenna le ho beoa ha chip hammoho le lamination e hlophisitsoeng. | Boitšoaro ba Vicat, ho hlaka ha leqephe, ts'ireletso ea chip, boemo ba antenna, le botšepehi ba bonto. | Ts'ebetso ea RF, likarolo tse fapaneng, peel, lamination, le liteko tsa ho phunya. |
| Likarete tsa SIM le Telecom | Boemo ba mocheso o phahameng moo ho hlokoang ke tšebetso e amohetsoeng ea 'mele oa SIM card. | Thermal botsitso, ho phunya ho nepahala, ho sebetsa ha module cavity, le matla a karete ea 'mele. | Potoloho ea mocheso, punch, kopano ea module, le licheke tsa boholo. |
Limaraka tsa kakaretso li loketse likarete tsa ID, likarete tsa botho, likarete tsa linotlolo tsa hotele, likarete tsa botšepehi, le likarete tsa papatso ha leqephe le khethiloeng le lumellana le printa, Filimi ea overlay , laminator, le kaho ea likarete tse shebiloeng.
Tlhahiso ea likarete tsa lichelete e hloka motsoako o laoloang ka thata oa li-core sheets, Filimi ea overlay s, lisebelisoa tsa magnetic stripe, chip modules, printing, lamination, le personalization. Bareki ba lokela ho fana ka sebopeho se felletseng le litekanyetso tsa tumello ha ba kopa kereiti ea karete ea banka.
Likarolo tsa likarete tse se nang mabitso li beha likarolo tsa elektroniki kahare ho 'mele oa karete. Letlapa la motheo le loketseng PVC le tlameha ho laminate ntle le ho suthisetsa lenakana kapa ho sebelisa khatello e feteletseng ea mocheso le mochini sebakeng sa chip. Tlhahiso ea liteko e lokela ho netefatsa mechanics ea likarete le ts'ebetso ea RF.
Lisebelisoa tsa SIM card li ka hloka boemo bo fapaneng ba mocheso le boitšoaro bo fetotsoeng ho tsoa ho likarete tse tloaelehileng tsa PVC . Botenya ba maqephe, boleng ba Vicat, thepa ea bokaholimo, sebopeho sa ho phunya, sekoti sa module, le kopano e tlase ea noka li lokela ho hlalosoa pele ho tlhophiso ea sampole.
| Layer | Primary Function | Key Check Compability Check |
|---|---|---|
| Holimo Filimi ea overlay | E sireletsa khatiso mme e ka 'na ea nka khoele ea makenete, hologram, kapa coating e khethehileng. | Bonding, pheletso ea bokaholimo, boemo ba mothapo oa makenete, le litlhoko tsa motho ka mong. |
| E hatisitsoeng PVC Ea mantlha | E na le litšoantšo, mongolo, litšoantšo tsa ts'ireletso, li-logos le likarolo tse fapaneng tsa moralo. | Sistimi ea enke, dyne ea holim'a metsi, ho ba mahoashe, ho lumellana ha mebala le ho ngolisa. |
| Middle Core kapa RFID Inlay | E haha botenya ba karete mme e kanna ea ba le lenakana le chip. | Boemo ba Vicat, ts'ireletso ea elektroniki, ho bata, le lipalo tsa botenya ba lera. |
| Reverse Printed Core | E fana ka moralo o ka morao-rao le botenya bo eketsehileng ba sebopeho. | Ho tsamaisana le khatiso ho isa khatisong, mebala le ho leka-lekana ha lamination. |
| Tlase Filimi ea overlay | E koala le ho sireletsa bokaholimo bo ka morao. | Matla a bond, sebopeho sa bokaholimo, le flatness ea karete e felileng. |
Geometry ea leqephe e tsitsitseng e thusa ho boloka karete e reriloeng mme e ts'ehetsa phepelo e tsitsitseng, khatiso, lamination, ho phunya le botenya ba karete e felileng. Bakeng sa tlhahiso e phahameng, bareki ba lokela ho lumellana ka mamello le mekhoa ea lisampole ka mokhoa o amohelehang.
Surface dyne e susumetsa ka moo li-inks tsa khatiso li kolobisang bokaholimo ba PVC , athe ho ba mahoashe ho ama phetiso le khokahano. Boleng ba dyne bo thathamisitsoeng bo fana ka boitsebiso ba khetho, empa enke ea ho qetela, mokhoa oa ho phekola, litlhophiso tsa khatiso, histori ea polokelo, le phekolo ea holim'a metsi e lokela ho netefatsoa ka thepa ea tlhahiso.
Boitšoaro ba ho nolofatsa Vicat bo susumetsa tsela eo lakane e arabelang ka eona nakong ea mocheso le khatello ea lamination. Mehaho e fapaneng ea likarete e ka hloka limaraka tse fapaneng, haholo ha li-antenna, lichipisi, likhoele tsa makenete, li-SIM modules, kapa specialty Filimi ea overlay s li ameha.
Matla a leka-lekaneng le ho feto-fetoha ha maemo ho thusa ho fokotsa ho phunyeha, li-burrs tse feteletseng, deformation, le likarolo tse sa tsitsang tsa likarete. Boemo ba sesebelisoa, tataiso ea ho seha, boemo ba maqephe, le lebelo la sebele la tlhahiso le tsona li ama ts'ebetso ea ho fetola.
E hatisitsoeng Karete ea PVC Lisebelisoa
Karete e bohlale le Inlay Likopo
PVC li-core sheets li ka hlalosoa bakeng sa khatiso ea offset, khatiso ea silika-screen, UV ea khatiso, kapa ea sebelisoa e le karolo e bohareng e sa hatisoang. Ho lumellana ho itšetlehile ka mokhoa o nepahetseng oa lakane le tsamaiso ea enke. Bareki ba lokela ho fana ka mokhoa oa ho hatisa le ho etsa liteko tsa ho khomarela, mebala, ho phekola le ho feta-lamination.
The core sheet e ka kopanngoa le PVC printing sheets, unncoated Filimi ea overlay s, coated Filimi ea overlay s, magnetic stripe Filimi ea overlay s, kapa prelam inlays. Mocheso, khatello, nako ea ho lula, ho pholisa, stack symmetry le lisebelisoa tsa tokollo li lokela ho ntlafatsoa bakeng sa kaho e felletseng.
Bakeng sa likarete tse se nang mabitso, thepa e lokela ho hlahlojoa ka geometry ea 'nete ea antenna, boemo ba chip, moralo oa cavity, botenya ba prelam, le moralo oa likarete. Sebaka sa ho bala sa RF, resonance, chip survival, lamination flatness, le ngoliso ea punching li lokela ho netefatsoa pele ho tlhahiso ea molumo.
Ho phunya karete, ho sila ka moqomo, ho kenya hot-melt, embossing, le mesebetsi e meng ea ho qetela e lokela ho lekoa kareteng e lumelletsoeng ea laminated. Liphetho tsa maqephe a mantlha feela li ke ke tsa bolela esale pele tšebetso e 'ngoe le e 'ngoe ea karete e felileng.
Morero o hlakileng oa ho amohela o fokotsa likhohlano le ho pheta liteko. Meeli e nepahetseng e lokela ho lumellanoa ka litlhaloso tsa theko hobane e ka fapana ho ea ka kereiti, botenya, sebopeho sa maqephe, mokhoa oa khatiso le lenaneo la karete.
| Sebaka sa Tlhahlobo | se khothalelitsoe Hlahloba | Qeto ea Moreki |
|---|---|---|
| Litekanyo | Botenya, bolelele le bophara ba lakane, lisekoere, boleng bo holimo, le ho tsamaisana ha stack. | Netefatsa mamello le mokhoa oa ho lekanya holim'a litlhaloso tse amohetsoeng. |
| Bokaholimo | Mmala, tšilafalo, mengoapo, masoba, mahoashe, dyne level, le print-side identification. | Amohela meeli ea pono le mohlala pele ho tlhahiso ea bongata. |
| Thepa ea Mechini | Boitšoaro ba ho teteana, ho tiea, ho tiea, ho tenyetseha le maemo, boits'oaro ba ho otla, le ts'ebetso ea ho kobeha ha karete e felileng. | Sebelisa mekhoa ea tlhahlobo eo ho lumellanoeng ka eona le lisampole tse hlophisitsoeng. |
| Karabelo ea Thermal le Lamination | Boemo ba Vicat, shrinkage, warpage, bubbles, delamination, cooling flatness, le layer ngoliso. | Netefatsa ka stack e feletseng ea tlhahiso le laminator ea sebele. |
| Khatiso le Boikemisetso | Ho khomarela enke, ho hlahisa mebala, ho folisa, Filimi ea overlay bond, embossing, khoele ea makenete, chip, le ho iketsetsa motho. | Amohela mohlala oa karete ea khauta e felileng. |
| Packaging le Traceability | Bongata, lileibole, nomoro ea lotho, tšireletso ea mongobo, boemo ba pallet, le litokomane tsa thomello. | Hlalosa sebopeho sa lileibole le litokomane tse hlokahalang ka tatellano ea theko. |
Fana ka litlhaloso tsa morero: mofuta oa karete, botenya bo felileng, sebopeho sa lera, botenya ba lakane, boholo ba lakane, 'mala, mokhoa oa khatiso, maemo a lamination, le tlhokeho ea selemo.
Kgetha kereiti ya moithuti: karete e tlwaelehileng, sebopeho sa karete ya banka, RFID prelam, SIM card, printable core, kapa bohareng bo sa hatisoang.
Lekola leqephe: ho hatisoa, ho khomarela enke, lamination, flatness, ho itšeha, ho phunya, le botsitso ba sebopeho.
Lekola karete e phethiloeng: ho kobeha, peel, ts'ebetso ea chip kapa antenna, mola oa makenete, motho ka mong, le tšebelisano ea sebali sa likarete ha ho hlokahala.
Amohela sampole ea khauta: rekota boemo ba thepa, kaho, litlhophiso, chebahalo le litekanyetso tsa ho amohela.
Lokolla odara ea bongata: sebelisa sampole e amohetsoeng le litlhaloso joalo ka referense ea theko le boleng.
Ho tsitsa ha tlhahiso ho ipapisitse le taolo ea tlhahiso, ho tsitsa hoa almanaka kapa extrusion, kalafo ea bokaholimo, taolo ea botenya, ho nepahala ha seha, tlhahlobo le liphutheloana tse sirelelitsoeng. Litšoantšo tse ka tlase tsa feme li bolokiloe leqepheng la sehlahisoa sa mantlha.
PVC lipampiri tsa mantlha li lokela ho pakoa le ho bolokoa ho boloka ho bata, matla a bokaholimo, bohloeki, le ho hatisoa. Litlhophiso tsa ho paka li ka tšohloa ho latela boholo ba leqephe, bongata, tsela ea lipalangoang le litlhoko tsa ho sebetsana le bareki.
Sebelisa filimi kapa mekotla e sireletsang ho fokotsa lerōle, mongobo le tšilafalo holim'a metsi.
Sebelisa mabokose, liboto tse thata, liphalete, tšireletso ea moeli, le likhoele tse sireletsehileng ho latela taelo.
Boloka maqephe a bataletseng sebakeng se hloekileng, se omeletseng 'me u a sireletse letsatsing le tobileng, mehloling ea mocheso le khatello e matla e sa lekaneng.
Lumella thepa hore e be boemong ba tikoloho ea tlhahiso pele ho khatiso kapa lamination moo phapang ea mocheso e leng ea bohlokoa.
Sebelisa lileibole tsa lotho le taolo ea setoko ea pele, ea pele ho ts'ehetsa ho latelloa le ts'ebetso e tsitsitseng.
Export Loading Protection
Palletized Sheet Packaging
Tšehetso ea lisebelisoa tse shebaneng le karete: PVC lipampiri tsa mantlha li ka buisanoa hammoho le maqephe a ka hatisoang, Filimi ea overlay s, lisebelisoa tsa mebala ea makenete, le RFID meaho ea inlay.
Ho bapisa kereiti: khetho e ka nka likarete tse tloaelehileng, meaho ea likarete tsa banka, tlhahiso ea SIM card, le litlhoko tsa prelam tse se nang mabitso.
Phetoho ea tloaelo: botenya, boholo, 'mala, litšobotsi tsa bokaholimo, ho itšeha, ho ngola, le ho paka li ka hlahlojoa molemong oa morero.
Mokhoa oa pele oa mohlala: bareki ba ka etsa liteko tsa khatiso, lamination, punching, le ts'ebetso ea karete e felileng pele ba amohela phepelo ea bongata.
Ts'ehetso ea odara ea kantle ho naha: netefatso ea lintlha, khokahano ea ho paka, boitsebahatso ba lotho, le litokisetso tsa thomello ea machabeng lia fumaneha bakeng sa liodara tse ngata.
| Ke | Hobane'ng | ha Bo Bohlokoa |
|---|---|---|
| Mofuta oa karete | Karete ea boitsebiso, karete ea banka, SIM card, RFID karete, karete ea linotlolo tsa hotele | E khetha kereiti e loketseng ea thepa le moralo oa netefatso. |
| Letlapa la mantlha Botenya | 0.10–0.50mm kapa tlhoko ea morero | E laola pokello ea likarete, ho tiea, le tšebeliso ea thepa. |
| Boholo ba Leqephe le Bongata | A4, A3, sebopeho sa tlhahiso, leqephe la tloaelo, lik'hilograma kapa maqephe | E ea hlokahala bakeng sa moralo oa ho itšeha, ho paka, ho beha litheko le ho tsamaisa thepa. |
| Mmala le Opacity | E tšoeu, e ntšo, e mebala, kapa e tloaelehileng | E ama sebopeho, bokamorao ba khatiso, le ho bapisa odara. |
| Mokhoa oa ho hatisa | Offset, silk screen, UV , kapa core e sa hatisoang | E etsa qeto ea ho lokisa bokaholimo le litlhoko tsa tlhahlobo ea sampole. |
| Sebopeho sa Lera la Karete | Filimi ea overlay + printed core + RFID inlay + printed core + Filimi ea overlay | Ho hlokahala ho lekola botenya ho leka-lekana le ho lumellana ha lamination. |
| Maemo a Lamination | Mocheso, khatello, nako ea ho lula, mokhoa oa ho pholisa | E tšehetsa khetho e nepahetseng ea sehlopha sa Vicat le ho rarolla mathata. |
| Litokomane Tse Hlokehang | TDS, COA, tlaleho ea teko, label ea ho paka, kopo ea ho latela | E lumella ho ba teng ha tokomane ho netefatsoa pele o odara. |
Lintlha tse hlahang leqepheng lena li thathamisa 0.10–0.50mm. Botenya bo loketseng bo itšetlehile ka kaho e feletseng ea karete le sepheo sa karete e phethiloeng. Litlhoko tse ling li lokela ho romelloa bakeng sa netefatso ea tekheniki le tlhahiso.
Letlapa la mantlha le theha 'mele oa sebopeho sa karete mme e ka ba le lisebelisoa tsa khatiso kapa tsa elektroniki. Filimi ea overlay hangata ke lera le kantle le tšesaane le sireletsang khatiso 'me le ka kenyelletsa lirafshoa, likhoele tsa makenete, li-hologram, kapa mesebetsi e meng ea bokaholimo.
Ee. Kereiti e loketseng PVC e ka sebelisoa e le motheo kapa lera la sebopeho sa li-inlay tsa prelam tse se nang mabitso. Thepa e tlameha ho netefatsoa ka antenna ea 'nete, chip, potoloho ea lamination, botenya ba inlay, sebopeho sa ho phunya, le litlhoko tsa ts'ebetso ea RF.
Litlhaloso tse fanoeng li thathamisa boemo ba 90 ± 2°C Vicat bakeng sa lits'ebetso tsa SIM card. Ho tšoaneleha ha ho qetela ho tlameha ho netefatsoa khahlano le sebopeho sa 'mele oa SIM card, mokhoa oa ho phunya, sekoti sa module, maemo a kopano, le litlhoko tsa tlhahlobo ea bareki.
PVC likarete tsa maqephe li ka lokisetsoa khatiso ea offset kapa silika-screen, empa boemo bo nepahetseng bo tlameha ho lumellana le mokhoa o reriloeng. Bareki ba lokela ho leka ho kolobisa enke, ho khomarela, ho phekola, mmala, lamination, le ts'ebetso ea karete e felileng pele ho tlhahiso e ngata.
Surface Dyne e ama ho kolobisa le ho khomarela ha enke, athe ho ba mahoashe ho susumetsa ho kopana ha khatiso, ho fepa ka maqephe le ho lamination. Ka bobeli li lokela ho nahanoa hammoho le k'hemistri ea enke, maemo a khatiso, polokelo, le tse khethiloeng Filimi ea overlay .
Litlhoko tsa tloaelo li ka hlahlojoa bakeng sa botenya, boholo, 'mala, dyne ea holim'a metsi, ho ba boima, ho itšeha, ho ngola le ho paka. Ho khonahala, MOQ, nako ea ho etella pele, le mamello li ipapisitse le litlhaloso tse kopiloeng.
Lekola leqephe ka tšebetso e felletseng ea mosebetsi: ho hatisa, ho folisa, ho lamination, ho pholisa, ho phunya, ho iketsetsa motho, ho sebetsa ka chip kapa antenna, le tlhahlobo ea karete e felileng. Mohlala oa khauta le litlhaloso tse ngotsoeng li lokela ho amoheloa pele ho taelo ea pele ea bongata.
E, ha feela PVC konokono, mothapo oa makenete Filimi ea overlay , khatiso, lamination, le botenya ba karete e felileng li tsamaellana. Boemo ba melata, ho qobella, matla a bond, khouto, le botho li lokela ho netefatsoa ka likarete tse seng li felile.
Ho paka hangata ho sebelisa mekotla e sireletsang kapa filimi, mabokose kapa liboto tse thata, lipalete, tšireletso ea moeli, likhoele, lileibole le ts'ireletso ea mongobo ho latela sebopeho sa lakane le mokhoa oa ho romelloa. Morero oa ho qetela oa ho paka o lokela ho netefatsoa khotheishene.
Ho fumaneha ha mehlala ho ka buisanoa ka mor'a hore kopo ea karete, botenya, boholo, 'mala, tlhokahalo ea bokaholimo le moralo oa tlhahlobo li fanoe. Tumello ea mohlala e khothaletsoa pele ho tlhahiso e ikhethileng kapa e phahameng haholo.
Kenyelletsa mofuta oa karete, sepheo se felileng, sebopeho sa lera, botenya ba mantlha, boholo ba leqephe, 'mala, mokhoa oa khatiso, litlhophiso tsa lamination, palo ea selemo le selemo, liphutheloana le litokomane tse hlokahalang. Lintlha tsena li lumella khetho e potlakileng ea kereiti le khotheishene.
Ikopanye le Wallis Plastic bakeng sa PVC maqephe a mantlha a sebelisoang ho etsa likarete, mekhatlo ea likarete tse hatisitsoeng, RFID li-prelam inlays, likarete tsa banka, SIM card, le tlhahiso ea likarete tse bohlale. Romella litlhoko tsa hau tsa tekheniki ho fumana khothaletso ea kereiti, moralo oa sampole, le khotheishene ea B2B.
