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Leqephe la mantlha la PVC bakeng sa ID, banka, SIM, phihlello le tlhahiso ea karete ea RFID. Botenya ba tloaelo, boholo, 'mala, boemo ba Vicat, dyne ea bokaholimo le bohloeki, ka liteko tsa sampole le liphutheloana tsa kantle ho naha lefatšeng ka bophara.
Leqephe la mantlha la WLS-PVC
WALLIS
| Mmala: | |
|---|---|
| Boholo: | |
| Bongata: | |
Wallis PVC core sheet ke karolo e thata ea karete e etselitsoeng ho etsa likarete tsa polasetiki tsa profeshenale, lihlopha tsa likarete tse hatisitsoeng, tlhahiso ea inlay ea PVC, le meaho ea likarete tsa RFID tse se nang mabitso. E sebelisoa e le lera le bohareng la mohaho, e tšehetsa ho bata ha karete, matla a mochine, ho feto-fetoha ha maemo, ho sebetsa ha khatiso, le mocheso o tsitsitseng oa mocheso.
Thepa e etselitsoe baetsi ba likarete tsa B2B ba hlahisang likarete tsa ID, likarete tsa banka, SIM card, likarete tsa ho kena, likarete tsa linotlolo tsa hotele, likarete tsa botho, likarete tsa limpho, likarete tsa lipalangoang, le likarete tse bohlale tsa RFID. Botenya, litekanyo tsa lakane, 'mala, boemo ba Vicat, dyne ea holim'a metsi, le bokaholimo ba bokaholimo li ka bapisoa le thepa ea kaho ea karete le thepa e tlase.
Bakeng sa tlhahlobo ea morero, bareki ba lokela ho hlakisa mofuta oa karete e phethiloeng, botenya ba karete eohle, ts'ebetso ea khatiso, moaho o koaheletsoeng kapa oa inlay, maemo a lamination, le sebopeho sa lakane se hlokahalang. Joale Wallis e ka lokisa sampole e loketseng bakeng sa khatiso, lamination, punching, le tlhahlobo ea karete e felileng pele ho tlhahiso e ngata.
Litefiso tse latelang li ipapisitse le lintlha tsa hajoale tsa sehlahisoa se fanoeng bakeng sa leqephe lena. Litlhoko tsa ho qetela li lokela ho netefatsoa ke sehlopha sa sehlahisoa, sampole e amohetsoeng, khotheishene le litokomane tsa batch pele ho tlhahiso ea bongata.
| Ntho ea Teko | Yuniti ea | e Hlalositseng Sephetho sa Tšebeliso | ho Tlhahiso ea Karete | |
|---|---|---|---|---|
| Botenya | mm | 0.10–0.50 | E khethiloe ho ea ka mantlha e hatisitsoeng, inlay, li-overlay layers, le botenya ba karete e felileng. | |
| Botenya | g/cm³ | 1.42 ± 0.05 | E tšehetsa boima bo sa fetoheng ba lakane, ho tiea, boitšoaro ba ho phunya, le sebopeho sa karete ea laminated. | |
| Matla a tšepe | E tshekaletseng | MPa | ≥44 | E thusa mantlha ho hanela khatello ea maikutlo le khatello ea maikutlo nakong ea ho fetolela le tšebeliso ea karete. |
| E otlolohileng | ≥46 | |||
| Vicat Softening Point | Tloaelehileng Card Kereiti | °C | 78 ± 2 | Kakaretso e hatisitsoeng le laminated PVC karete mehaho. |
| Kereiti ea karete ea banka | 74 ± 2 | Khetho ea kereiti e lokela ho tsamaisana le kaho ea karete ea banka e lumelletsoeng le potoloho ea lamination. | ||
| Kereiti ea SIM Card | 90 ± 2 | Boemo bo phahameng ba mocheso bakeng sa ts'ebetso ea 'mele ea SIM card, ho ipapisitse le netefatso ea projeke. | ||
| Surface Dyne | dynes/cm | ≥34 | E tšehetsa ho kolobisa le ho khomarela enke; liteko tsa khatiso li lula li hlokahala bakeng sa sistimi e khethiloeng ea enke. | |
| Bokhopo ba Sekaho | Ra | μm | 0.7–1.8 | E susumetsa phepelo ea maqephe, phetisetso ea enke, ho kopana le lamination, le ho ts'oana ha bokaholimo ba ho qetela. |
| Rz | 4.0–12 | |||
Letlapa la mantlha la PVC ke karolo e ka tlase ea sebopeho e behiloeng lipakeng tsa tšireletso ea karete ea polasetiki ea laminated. Ho itšetlehile ka moralo, motheo o ka hatisoa ka ho toba, oa sebelisoa e le lera le bohareng le sa hatisoang, kapa oa fetoloa hore e be lesela le hlakileng kapa la elektronike le amohelang antenna, chip module kapa karolo e 'ngoe e sebetsang.
Ho fapana le filimi e koahelang, e sireletsang bokaholimo ba karete, leqephe la mantlha le kenya letsoho boholo ba 'mele oa karete ho opacity, ho satalla, ho bata le botsitso ba sebopeho. Ka hona, thepa e lumellanang e bohlokoa bakeng sa ngoliso, lamination, punching, personalization, le automated card handles.
Letlapa la PVC Core
Karete-Kereiti PVC Substrate
Merero ea karete ha ea lokela ho khetha lisebelisoa tsa mantlha tsa PVC ka botenya feela. Kereiti e loketseng e boetse e ipapisitse le karabelo ea mocheso, mokhoa oa khatiso, lisebelisoa tsa elektroniki tse kentsoeng, mokhoa oa ho khabisa kapa oa motho ka mong, bophelo ba karete, le stack e felletseng ea lamination.
| Kopo ea Karete | e Tloaelehileng ea Tlhokahalo ea Tlhokahalo | ea Tlhokomelo | e khothalelitsoeng |
|---|---|---|---|
| ID e Tloaelehileng, Likarete tsa Botho le Limpho | Mokotla oa PVC o ka hatisoang kapa o sa hatisoang o nang le botsitso bo leka-lekaneng le karabelo ea lamination. | Botenya, bosoeu, flatness, print adhesion, die-cutting, le finish-flexible card. | Hatisa, laminate, punch, le likarete tsa moemeli oa tlhahlobo ea bend. |
| Likarete tsa Banka le tsa Lichelete | PVC ea boemo ba karete e laoloang e tsamaellanang le sekoahelo se amohetsoeng, mola oa makenete, chip, le mokhoa oa ho iketsetsa motho. | Ho tšoana ha sehlopha, fensetere ea lamination, embossing kapa embedding ea module, le ho sebetsana le likarete tsa nako e telele. | Amohela kaho e felletseng ea karete, eseng leqephe la mantlha le le bang. |
| RFID le Contactless Prelam Inlays | Lakane ea mantlha kapa ea motheo e tsamaellana le antenna le ho beoa ha chip hammoho le lamination e hlophisitsoeng. | Boitšoaro ba Vicat, ho hlaka ha leqephe, ts'ireletso ea chip, boemo ba antenna, le botšepehi ba bonto. | Ts'ebetso ea RF, likarolo tse fapaneng, peel, lamination, le liteko tsa ho phunya. |
| Likarete tsa SIM le Telecom | Boemo ba mocheso o phahameng moo ho hlokoang ke tšebetso e amohetsoeng ea 'mele oa SIM card. | Thermal botsitso, ho phunya ho nepahala, ho sebetsa ha module cavity, le matla a karete ea 'mele. | Potoloho ea mocheso, punch, kopano ea module, le licheke tsa boholo. |
Limaraka tsa kakaretso li loketse likarete tsa ID, likarete tsa litho, likarete tsa linotlolo tsa hotele, likarete tsa botšepehi, le likarete tsa papatso ha leqephe le khethiloeng le lumellana le printa, likoahelo, laminator, le kaho ea likarete tse shebiloeng.
Tlhahiso ea likarete tsa lichelete e hloka motsoako o laoloang ka thata oa maqephe a mantlha, li-overlays, lisebelisoa tsa marang-rang a khoheli, li-module tsa chip, khatiso, lamination, le motho ka mong. Bareki ba lokela ho fana ka sebopeho se felletseng le litekanyetso tsa tumello ha ba kopa kereiti ea karete ea banka.
Likarolo tsa likarete tse se nang mabitso li beha likarolo tsa elektroniki kahare ho 'mele oa karete. Letlapa le loketseng la PVC le tlameha ho laminate ntle le ho fetola antenna kapa ho sebelisa khatello e feteletseng ea mocheso le mochini sebakeng sa chip. Tlhahiso ea liteko e lokela ho netefatsa mechanics ea likarete le ts'ebetso ea RF.
Lisebelisoa tsa SIM card li ka hloka boemo bo fapaneng ba mocheso le ho fetola boitšoaro ho tsoa ho likarete tse tloaelehileng tsa PVC. Botenya ba maqephe, boleng ba Vicat, thepa ea bokaholimo, sebopeho sa ho phunya, sekoti sa module, le kopano e tlase ea noka li lokela ho hlalosoa pele ho tlhophiso ea sampole.
| Layer | Primary Function | Key Check Compatibility Check |
|---|---|---|
| Ho Koaheloa ka holimo | E sireletsa khatiso mme e ka 'na ea nka khoele ea makenete, hologram, kapa coating e khethehileng. | Bonding, pheletso ea bokaholimo, boemo ba mothapo oa makenete, le litlhoko tsa motho ka mong. |
| PVC Core e hatisitsoeng | E na le litšoantšo, mongolo, litšoantšo tsa ts'ireletso, li-logos le likarolo tse fapaneng tsa moralo. | Sistimi ea enke, dyne ea holim'a metsi, ho ba mahoashe, ho lumellana ha mebala le ho ngolisa. |
| Middle Core kapa RFID Inlay | E haha botenya ba karete mme e kanna ea ba le lenakana le chip. | Boemo ba Vicat, ts'ireletso ea elektroniki, ho bata, le lipalo tsa botenya ba lera. |
| Reverse Printed Core | E fana ka moralo o ka morao-rao le botenya bo eketsehileng ba sebopeho. | Ho tsamaisana le khatiso ho ea khatisong, mebala le ho leka-lekana ha lamination. |
| Sekoahelo se ka Tlase | E koala le ho sireletsa bokaholimo bo ka morao. | Matla a bond, sebopeho sa bokaholimo, le flatness ea karete e felileng. |
Geometry ea leqephe e tsitsitseng e thusa ho boloka karete e reriloeng mme e ts'ehetsa phepelo e tsitsitseng, khatiso, lamination, ho phunya le botenya ba karete e felileng. Bakeng sa tlhahiso e phahameng, bareki ba lokela ho lumellana ka mamello le mekhoa ea lisampole ka mokhoa o amohelehang.
Surface Dyne e susumetsa hore na li-inks tsa khatiso li kolobisa bokaholimo ba PVC joang, athe bohloeki bo ama phetiso le ho ikopanya. Boleng ba dyne bo thathamisitsoeng bo fana ka boitsebiso ba khetho, empa enke ea ho qetela, mokhoa oa ho phekola, litlhophiso tsa khatiso, histori ea polokelo, le phekolo ea holim'a metsi e lokela ho netefatsoa ka thepa ea tlhahiso.
Boitšoaro ba ho nolofatsa Vicat bo susumetsa tsela eo lakane e arabelang ka eona nakong ea mocheso le khatello ea lamination. Mehaho e fapaneng ea likarete e ka hloka limaraka tse fapaneng, haholo ha li-antenna, li-chips, likhoele tsa makenete, li-SIM module, kapa likoahelo tse khethehileng li ameha.
Matla a leka-lekaneng le ho feto-fetoha ha maemo ho thusa ho fokotsa ho phatloha, li-burrs tse feteletseng, deformation, le likarolo tse sa lumellaneng tsa likarete. Boemo ba sesebelisoa, tataiso ea ho seha, boemo ba maqephe, le lebelo la sebele la tlhahiso le tsona li ama ts'ebetso ea ho fetola.
Likopo tse hatisitsoeng tsa karete ea PVC
Smart Card le Lisebelisoa tsa Inlay
Lishiti tsa mantlha tsa PVC li ka hlalosoa bakeng sa khatiso ea offset, khatiso ea sekirini sa silika, khatiso ea UV, kapa ea sebelisoa e le lera le sa hatisoeng le bohareng. Ho lumellana ho itšetlehile ka mokhoa o nepahetseng oa lakane le tsamaiso ea enke. Bareki ba lokela ho fana ka mokhoa oa ho hatisa le ho etsa liteko tsa ho khomarela, mebala, ho phekola le ho feta-lamination.
Letlapa la mantlha le ka kopanngoa le lipampiri tsa khatiso tsa PVC, likoahelo tse sa koaheloang, li-overlays tse koahetsoeng, methapo ea makenete, kapa li-prelam inlays. Mocheso, khatello, nako ea ho lula, ho pholisa, stack symmetry, le lisebelisoa tsa tokollo li lokela ho ntlafatsoa bakeng sa kaho e felletseng.
Bakeng sa likarete tse se nang mabitso, thepa e lokela ho hlahlojoa ka sebopeho sa 'nete sa antenna, boemo ba chip, moralo oa cavity, botenya ba prelam le moralo oa likarete. Sebaka sa ho bala sa RF, resonance, chip survival, lamination flatness, le ngoliso ea punching li lokela ho netefatsoa pele ho tlhahiso ea molumo.
Ho phunya karete, ho sila moqomo, ho kopanya hot-melt, embossing, le lits'ebetso tse ling tsa ho qetela li lokela ho lekoa kareteng e lumelletsoeng ea laminated. Liphetho tsa maqephe a mantlha feela li ke ke tsa bolela esale pele tšebetso e 'ngoe le e 'ngoe ea karete e felileng.
Morero o hlakileng oa ho amohela o fokotsa likhohlano le ho pheta liteko. Meeli e nepahetseng e lokela ho lumellanoa ka litlhaloso tsa theko hobane e ka fapana ho ea ka kereiti, botenya, sebopeho sa maqephe, mokhoa oa khatiso le lenaneo la karete.
| Sebaka sa Tlhahlobo | se khothalelitsoe Hlahloba | Qeto ea Moreki |
|---|---|---|
| Litekanyo | Botenya, bolelele ba lakane le bophara, lisekoere, boleng bo holimo, le tlhophiso ea lipampiri. | Netefatsa mamello le mokhoa oa ho lekanya holim'a litlhaloso tse amohetsoeng. |
| Bokaholimo | Mmala, tšilafalo, mengoapo, masoba, mahoashe, dyne level, le print-side identification. | Amohela meeli ea pono le litšupiso tsa sampole pele ho tlhahiso ea bongata. |
| Thepa ea Mechini | Boitšoaro ba ho teteana, ho tiea, ho tiea, ho tenyetseha, boitšoaro ba ho otla, le ts'ebetso ea ho kobeha ha karete e felileng. | Sebelisa mekhoa ea tlhahlobo eo ho lumellanoeng ka eona le lisampole tse hlophisitsoeng. |
| Karabelo ea Thermal le Lamination | Boemo ba Vicat, shrinkage, warpage, bubbles, delamination, cooling flatness, le layer ngoliso. | Netefatsa ka stack e feletseng ea tlhahiso le laminator ea sebele. |
| Khatiso le Boikemisetso | Ho khomarela enke, ho hlahisa mebala, ho folisa, bonto e koahelang, embossing, khoele ea makenete, chip, le motho ka mong. | Amohela mohlala oa karete ea khauta e felileng. |
| Packaging le Traceability | Bongata, lileibole, nomoro ea lotho, ts'ireletso ea mongobo, boemo ba pallet, le litokomane tsa thomello. | Hlalosa sebopeho sa lileibole le litokomane tse hlokahalang ka tatellano ea theko. |
Fana ka litlhaloso tsa morero: mofuta oa karete, botenya bo felileng, sebopeho sa lera, botenya ba lakane, boholo ba lakane, 'mala, mokhoa oa khatiso, maemo a lamination, le tlhokeho ea selemo.
Khetha kereiti ea mokhethoa: karete e tloaelehileng, sebopeho sa karete ea banka, RFID prelam, SIM card, printable core, kapa bohareng bo sa hatisoang.
Lekola leqephe: ho hatisoa, ho khomarela enke, lamination, flatness, ho itšeha, ho phunya, le botsitso ba sebopeho.
Lekola karete e phethiloeng: ho kobeha, peel, ts'ebetso ea chip kapa antenna, mola oa makenete, motho ka mong, le tšebelisano ea sebali sa likarete ha ho hlokahala.
Amohela sampole ea khauta: rekota boemo ba thepa, kaho, litlhophiso, chebahalo le litekanyetso tsa ho amohela.
Lokolla odara ea bongata: sebelisa sampole e amohetsoeng le litlhaloso joalo ka referense ea theko le boleng.
Ho tsitsa ha tlhahiso ho ipapisitse le taolo ea tlhahiso, botsitso ba almanaka kapa extrusion, kalafo ea bokaholimo, taolo ea botenya, ho nepahala ha seha, tlhahlobo le liphutheloana tse sirelelitsoeng. Litšoantšo tse ka tlase tsa feme li bolokiloe leqepheng la sehlahisoa sa mantlha.
Lipampiri tsa mantlha tsa PVC li lokela ho phutheloa le ho bolokoa ho boloka ho bata, matla a holim'a metsi, bohloeki le ho hatisoa. Litlhophiso tsa ho paka li ka tšohloa ho latela boholo ba leqephe, bongata, tsela ea lipalangoang le litlhoko tsa ho sebetsana le bareki.
Sebelisa filimi kapa mekotla e sireletsang ho fokotsa lerōle, mongobo le tšilafalo holim'a metsi.
Sebelisa mabokose, liboto tse thata, liphalete, tšireletso ea moeli, le likhoele tse sireletsehileng ho latela taelo.
Boloka maqephe a bataletseng sebakeng se hloekileng, se omeletseng 'me u a sireletse letsatsing le tobileng, mehloling ea mocheso le khatello e matla e sa lekaneng.
Lumella thepa hore e be boemong ba tikoloho ea tlhahiso pele ho khatiso kapa lamination moo phapang ea mocheso e leng ea bohlokoa.
Sebelisa lileibole tsa lotho le taolo ea setoko ea pele, ea pele ho ts'ehetsa ho latelloa le ts'ebetso e tsitsitseng.
Export Loading Protection
Palletized Sheet Packaging
Ts'ehetso ea lisebelisoa tse shebaneng le karete: Lishiti tsa mantlha tsa PVC li ka buisanoa hammoho le maqephe a ka hatisoang, likoahelo, lisebelisoa tsa likhoele tsa makenete, le meaho ea inlay ea RFID.
Ho bapisa kereiti: khetho e ka nka likarete tse tloaelehileng, meaho ea likarete tsa banka, tlhahiso ea SIM card, le litlhoko tsa prelam tse se nang mabitso.
Phetoho ea tloaelo: botenya, boholo, 'mala, litšobotsi tsa bokaholimo, ho itšeha, ho ngola, le ho paka li ka hlahlojoa molemong oa morero.
Mokhoa oa pele oa sampole: bareki ba ka etsa liteko tsa khatiso, lamination, punching, le ts'ebetso ea karete e felileng pele ba amohela phepelo ea bongata.
Ts'ehetso ea odara ea kantle ho naha: netefatso ea lintlha, khokahano ea ho paka, boitsebahatso ba lotho, le litokisetso tsa thomello ea machabeng li teng bakeng sa liodara tse ngata.
| Information | Mohlala | Ke Hobane'ng ha e Le Bohlokoa |
|---|---|---|
| Mofuta oa karete | Karete ea boitsebiso, karete ea banka, SIM card, RFID card, karete ea linotlolo tsa hotele | E khetha kereiti e loketseng ea thepa le moralo oa netefatso. |
| Botenya ba Leqephe la Core | 0.10–0.50mm kapa tlhoko ea morero | E laola pokello ea likarete, ho tiea, le tšebeliso ea thepa. |
| Boholo ba Leqephe le Bongata | A4, A3, sebopeho sa tlhahiso, leqephe la tloaelo, lik'hilograma kapa maqephe | E ea hlokahala bakeng sa moralo oa ho itšeha, ho paka, ho beha litheko le ho tsamaisa thepa. |
| Mmala le Opacity | E tšoeu, e ntšo, e mebala, kapa e tloaelehileng | E ama sebopeho, bokamorao ba khatiso, le ho bapisa odara. |
| Mokhoa oa ho hatisa | Offset, skrineng sa silika, UV, kapa core e sa hatisoang | E etsa qeto ea ho lokisa bokaholimo le litlhoko tsa tlhahlobo ea sampole. |
| Sebopeho sa Lera la Karete | Koko + e hatisitsoeng + RFID inlay + core e hatisitsoeng + e koahelang | Ho hlokahala ho lekola botenya ho leka-lekana le ho lumellana ha lamination. |
| Maemo a Lamination | Mocheso, khatello, nako ea ho lula, mokhoa oa ho pholisa | E tšehetsa khetho e nepahetseng ea sehlopha sa Vicat le ho rarolla mathata. |
| Litokomane Tse Hlokehang | TDS, COA, tlaleho ea teko, label ea ho paka, kopo ea ho latela | E lumella ho ba teng ha tokomane ho netefatsoa pele o odara. |
Lintlha tse hlahang leqepheng lena li thathamisa 0.10–0.50mm. Botenya bo loketseng bo itšetlehile ka kaho e feletseng ea karete le sepheo sa karete e phethiloeng. Litlhoko tse ling li lokela ho romelloa bakeng sa netefatso ea tekheniki le tlhahiso.
Letlapa la mantlha le theha 'mele oa sebopeho sa karete mme e ka ba le lisebelisoa tsa khatiso kapa tsa elektroniki. Hangata sekoahelo ke lera le ka ntle le tšesaane le sireletsang khatiso 'me le ka kenyelletsa lilae, likhoele tsa makenete, li-hologram, kapa mesebetsi e meng ea bokaholimo.
Ee. Sehlopha se loketseng sa PVC se ka sebelisoa e le motheo kapa lera la sebopeho sa li-inlay tsa prelam tse se nang mabitso. Thepa e tlameha ho netefatsoa ka antenna ea 'nete, chip, potoloho ea lamination, botenya ba inlay, sebopeho sa ho phunya, le litlhoko tsa ts'ebetso ea RF.
Litlhaloso tse fanoeng li thathamisa boemo ba 90 ± 2°C Vicat bakeng sa lits'ebetso tsa SIM card. Ho tšoaneleha ha ho qetela ho tlameha ho netefatsoa khahlano le sebopeho sa 'mele oa SIM card, mokhoa oa ho phunya, sekoti sa module, maemo a kopano, le litlhoko tsa tlhahlobo ea bareki.
Lipampiri tsa likarete tsa PVC li ka lokisoa bakeng sa khatiso ea offset kapa silika-screen, empa boemo bo nepahetseng bo tlameha ho lumellana le mokhoa o reriloeng. Bareki ba lokela ho leka ho kolobisa enke, ho khomarela, ho phekola, mebala, lamination, le ts'ebetso ea karete e felileng pele ho tlhahiso e ngata.
Surface Dyne e ama ho kolobisa le ho khomarela ha enke, ha ho ba mahoashe ho susumetsa ho kopana ha khatiso, ho fepa ka maqephe le ho lamination. Ka bobeli li lokela ho nahanoa hammoho le k'hemistri ea enke, maemo a khatiso, polokelo, le sekoaelo se khethiloeng.
Litlhoko tsa tloaelo li ka hlahlojoa bakeng sa botenya, boholo, 'mala, dyne ea holim'a metsi, ho ba boima, ho itšeha, ho ngola le ho paka. Ho khonahala, MOQ, nako ea ho etella pele, le mamello li ipapisitse le litlhaloso tse kopiloeng.
Lekola leqephe ka tšebetso e felletseng ea mosebetsi: ho hatisa, ho folisa, ho lamination, ho pholisa, ho phunya, ho iketsetsa motho, ho sebetsa ka chip kapa antenna, le tlhahlobo ea karete e felileng. Mohlala oa khauta le litlhaloso tse ngotsoeng li lokela ho amoheloa pele ho taelo ea pele ea bongata.
Ee, ha feela mantlha a PVC, methapo ea makenete e koaheletsoeng, khatiso, lamination, le botenya ba karete e felileng li tsamaellana. Boemo ba mothapo, ho qobella, matla a bond, khouto, le ho iketsetsa motho ka mong li lokela ho netefatsoa ka likarete tse seng li felile.
Ho paka hangata ho sebelisa mekotla e sireletsang kapa filimi, mabokose kapa liboto tse thata, lipalete, tšireletso ea moeli, likhoele, lileibole le ts'ireletso ea mongobo ho latela sebopeho sa lakane le mokhoa oa ho romelloa. Morero oa ho qetela oa ho paka o lokela ho netefatsoa khotheishene.
Ho fumaneha ha mehlala ho ka buisanoa ka mor'a hore kopo ea karete, botenya, boholo, 'mala, tlhokahalo ea bokaholimo le moralo oa tlhahlobo li fanoe. Tumello ea sampole e khothaletsoa pele ho tlhahiso e ikhethileng kapa e phahameng haholo.
Kenyelletsa mofuta oa karete, sepheo se felileng, sebopeho sa lera, botenya ba mantlha, boholo ba leqephe, 'mala, mokhoa oa khatiso, litlhophiso tsa lamination, palo ea selemo le selemo, liphutheloana le litokomane tse hlokahalang. Lintlha tsena li lumella khetho e potlakileng ea kereiti le khotheishene.
Ikopanye le Wallis Plastic bakeng sa maqephe a mantlha a PVC a sebelisoang ho etsa likarete, mekhatlo ea likarete tse hatisitsoeng, li-inlay tsa RFID prelam, likarete tsa banka, likarete tsa SIM, le tlhahiso ea likarete tse bohlale. Romella litlhoko tsa hau tsa tekheniki ho fumana khothaletso ea kereiti, moralo oa sampole, le khotheishene ea B2B.
