Wholesale PVC core krataa ma ID, sikakorabea, SIM, kwan a wɔfa so nya ne RFID kaad a wɔyɛ. Amanneɛbɔ thickness, kɛse, kɔla, Vicat grade, soro dyne ne roughness, ne nhwɛsode sɔhwɛ ne export packaging wiase nyinaa.
WLS-PVC Core Krataa a Wɔde Di Dwuma
WALLIS na ɔkyerɛwee
| Kɔla: | |
|---|---|
| Kɛse: | |
| Nea ɛwɔ hɔ: | |
| Dodow: | |
Wallis PVC core krataa yɛ rigid card substrate a wɔayɛ ama adwumayɛfo plastic card manufacturing, printed card nipadua, PVC inlay production, ne contactless RFID card nhyehyɛe. Wɔde di dwuma sɛ mfinimfini dan no fã, ɛboa kaad no petee, mfiri ahoɔden, nea wɔahyɛ so a ɛyɛ mmerɛw, tintim adwumayɛ, ne ɔhyew a ɛyɛ den lamination.
Wɔayɛ nneɛma no ama wɔn a wɔyɛ B2B kaad a wɔyɛ ID kaad, sikakorabea kaad, SIM kaad, akwan a wɔfa so kɔ hɔ, ahɔhodan mu safe kaad, asɔremma kaad, akyɛde kaad, akwantu kaad, ne RFID smart card. Wobetumi de ne kɛse, ne kɛse, ne kɛse, ne kɔla, Vicat grade, ne soro dyne, ne ne soro a ɛyɛ den no atoto kaad no adansi ne nnwinnade a ɛwɔ nsu no ase no ho.
Wɔ adwuma no mu nhwehwɛmu mu no, ɛsɛ sɛ adetɔfo kyerɛ kaad no su a wɔawie, kaad no mu duru nyinaa, ɔkwan a wɔfa so tintim, sɛnea wɔde kata so anaasɛ wɔde bɛhyɛ mu, tebea a wɔde kata so, ne krataa no kwan a wɔhwehwɛ. Afei Wallis betumi asiesie nhwɛsode a ɛfata ama tintim, lamination, punching, ne awie-kaad sɔhwɛ ansa na wɔayɛ no kɛse.
Nneɛma a edidi so yi gyina mprempren nneɛma ho nkyerɛkyerɛmu a wɔde ama wɔ krataafa yi so. Ɛsɛ sɛ wɔde afiri no grade, nhwɛsoɔ a wɔapene so, quotation, ne batch documentation si ahwehwɛdeɛ a ɛtwa toɔ no so dua ansa na wɔayɛ no kɛseɛ.
| Sɔhwɛ Adeɛ | Unit | Specified Result | Relevance to Kaad a Wɔyɛ | |
|---|---|---|---|---|
| Nneɛma a ɛyɛ den | mm | 0.10–0.50 na ɛwɔ hɔ | Wɔpaw sɛnea wɔatintim core, inlay, overlay layers, ne target finished-card thickness te. | |
| Muduro | g/cm⊃3 na ɛwɔ hɔ; | 1.42 ± 0.05 na ɛwɔ hɔ | Boa krataa mu duru a ɛkɔ so daa, rigidity, punching suban, ne laminated card nhyehyɛe. | |
| Ahoɔden a Wɔde Tensile | Ne tɛtrɛtɛ mu | MPa | ≥44 na ɛwɔ hɔ | Ɛboa core no ma ɛko tia ntrɛwmu ne mfiridwuma mu nhyɛso bere a wɔresakra na wɔde kaad redi dwuma no. |
| Tenten mu | ≥46 na ɛwɔ hɔ | |||
| Vicat Nneɛma a Wɔde Yɛ Dwo | Kaad a Wɔde Di Dwuma a Wɔtaa De Di Dwuma | °C | 78 ± 2 na ɛyɛ | General tintim ne laminated PVC kaad nhyehyɛe. |
| Sikakorabea Kaad Grade | 74 ± 2 na ɛyɛ | Ɛsɛ sɛ wɔde abasobɔde a wɔpaw no hyia sikakorabea-kaad adansi ne lamination kyinhyia a wɔapene so no. | ||
| SIM Kaad no mu abasobɔde | 90 ± 2 na ɛyɛ | Ɔhyew grade a ɛkorɔn ma SIM card nipadua dwumadie, a ɛgyina adwuma no mu adansedie so. | ||
| Surface Dyne a wɔde yɛ nneɛma | dynes/cm | ≥34 na ɛwɔ hɔ | Ɛboa wetting ne ink adhesion; tintim sɔhwɛ ahorow da so ara ho hia ma ink nhyehyɛe a wɔapaw no. | |
| Surface Roughness a Ɛyɛ Fɛ | Ra | μm | 0.7–1.8 na ɛwɔ hɔ | Ɛnya krataa a wɔde ma, ink a wɔde kɔ baabi foforo, lamination contact, ne nea etwa to a ɛwɔ soro no so nkɛntɛnso. |
| Rz | 4.0–12 na ɛwɔ hɔ | |||
PVC core krataa yɛ structure substrate a wɔde si plastic card a wɔabɔ no laminated a ɛbɔ ho ban no ntam. Ɛdenam sɛnea wɔayɛ no so no, wobetumi atintim core no tẽẽ, de adi dwuma sɛ mfinimfini fã a wɔantintim, anaasɛ wɔadan no ayɛ no plain anaa ɛlɛtrɔnik inlay a ɛma antenna, chip module, anaa ade foforo a ɛyɛ adwuma.
Nea ɛnte sɛ sini a wɔde kata so, a ɛbɔ kaad no ani ho ban titiriw no, krataa a ɛwɔ akyi no boa ma kaad no nipadua no yɛ nea ɛnyɛ hann, ɛyɛ den, ɛyɛ petee, na ɛma ne kɛse gyina pintinn. Enti nneɛma a ɛkɔ so daa ho hia ma dinkyerɛw, lamination, punching, personalization, ne automated card handling.
PVC Core Krataa Nneɛma a Wɔde Yɛ
Kaad-Grade PVC Substrate a Wɔde Di Dwuma
Ɛnsɛ sɛ card projects paw PVC core material denam ne kɛse nkutoo so. Grade a ɛfata nso gyina ɔhyew mmuae, ɔkwan a wɔfa so tintim, ɛlɛtrɔnik mfiri a wɔde ahyɛ mu, embossing anaa personalization nhyehyɛe, kaad nkwa, ne lamination stack a edi mũ so.
| Kaad Dwumadie | Typical Core Ahwehwɛdeɛ | Paw Focus | Recommended Validation |
|---|---|---|---|
| Standard ID, Asɔremma ne Akyɛdeɛ Kaad | PVC core fitaa a wotumi tintim anaasɛ wɔantintim a ɛwɔ kari pɛ rigidity ne lamination mmuae. | Ne kɛse, ɛyɛ fitaa, ɛyɛ tratraa, nea ɛbata nhoma a wɔde tintim ho, nea wotwa, ne sɛnea wɔde kaad a wɔawie no tumi sesa. | Print, laminate, punch, ne bend-test ananmusifo nkrataa. |
| Sikakorabea ne Sikasɛm ho Kaad | Controlled card-grade PVC a ɛne overlay, magnetic stripe, chip, ne personalization nhyehyɛe a wɔapene so no hyiae. | Batch biakoyɛ, lamination mfɛnsere, embossing anaa module embedding, ne bere tenten kaad ho dwumadie. | Pene kaad adansi no nyinaa so, na ɛnyɛ krataa titiriw no wɔ baabi a atew ne ho. |
| RFID ne Prelam Inlays a Ɛnyɛ Nkitahodi | Core anaa base krataa a ɛne antenna ne chip a wɔde si hɔ ne graded lamination hyia. | Vicat suban, krataa a ɛyɛ tratraa, chip ahobammɔ, antenna gyinabea, ne bond mudi mu kura. | RF adwumayɛ, cross-section, peel, lamination, ne punching sɔhwɛ ahorow. |
| SIM ne Telecom Kaad a Wɔde Di Dwuma | Ɔhyew a ɛkorɔn grade wɔ baabi a SIM kaad nipadua nhyehyɛe a wɔapene so no hwehwɛ. | Ɔhyew a ɛyɛ den, punching pɛpɛɛpɛ, module cavity processing, ne card-body ahoɔden. | Ɔhyew kyinhyia, punch, module nhyiam, ne dimensional nhwehwɛmu. |
Abasobɔde a wɔde di dwuma wɔ ɔkwan a ɛkɔ akyiri so no fata ma ID nkrataa, asɔremma kaad, ahɔhodan mu safe kaad, nokwaredi nkrataa, ne nsɛm a wɔde hyɛ nkurɔfo nkuran bere a krataa a wɔapaw no ne printa, overlay, laminator, ne target card adansi no hyia no.
Sikasɛm kaad a wɔyɛ no hwehwɛ sɛ wɔde core sheets, overlays, magnetic stripe materials, chip modules, printing, lamination, ne personalization a wɔaka abom a wɔhwɛ so denneennen. Ɛsɛ sɛ adetɔfo de layer nhyehyɛe a edi mũ ne pene a wɔpene so no ma bere a wɔrebisa sikakorabea-kaad abasobɔde no.
Kaad inlays a entumi nkɔ so de ɛlɛtrɔnik nneɛma gu kaad no nipadua mu. Ɛsɛ sɛ PVC base sheet a ɛfata yɛ laminate a ɛnsesa antenna no anaasɛ wɔmfa ɔhyew ne mfiri nhyɛso a ɛboro so mma chip beae no. Ɛsɛ sɛ sɔhwɛ a wɔyɛ no si kaad mfiridwuma ne RF adwumayɛ nyinaa so dua.
Ebia SIM kaad nneɛma bɛhia thermal grade soronko ne nsakraeɛ suban a ɛfiri PVC card a ɛyɛ mpapahwekwa mu. Ɛsɛ sɛ wɔkyerɛ krataa no mu duru, Vicat bo, ɔfasuo su, punching nhyehyɛɛ, module cavity, ne downstream assembly ansa na wɔasiesie nhwɛsoɔ.

| Layer mu | Titiriw Dwumadi | Safoa Nhyiam Hwɛ |
|---|---|---|
| Top Overlay a Wɔde Kata So | Ɛbɔ nhoma tintim ho ban na ebetumi akura magnetic stripe, hologram, anaasɛ ade titiriw bi a wɔde kata so. | Bonding, surface finish, magnetic stripe gyinabea, ne personalization ahwehwɛde ahorow. |
| PVC Core a Wɔatintim | Ɛkura mfonini, nsɛm, ahobanbɔ adwini, ahyɛnsodeɛ, ne adwini mu nneɛma a ɛsakra. | Ink nhyehyɛe, soro dyne, roughness, kɔla a ɛkɔ so pɛpɛɛpɛ, ne registration. |
| Mfinimfini Core anaa RFID Inlay | Ɛkyekye card thickness na ebia ɛwɔ antenna ne chip. | Vicat grade, ɛlɛtrɔnik ahobammɔ, flatness, ne layer thickness akontaabu. |
| Reverse Printed Core a Wɔatintim no Akyi | Ɛma akyi-afã nhyehyɛe ne foforo structural thickness. | Print-to-print a ɛne ne ho hyia, kɔla, ne lamination kari pɛ. |
| Bottom Overlay a Wɔde Kata So | Seals na ɛbɔ akyi no ho ban. | Bond ahoɔden, surface texture, ne finished-card flatness. |
Stable sheet geometry boa ma wɔhwɛ kaad stack a wɔahyɛ da ayɛ no so na ɛboa ma wɔde aduan, tintim, lamination, punching, ne finished-card thickness a ɛkɔ so daa. Sɛ wɔyɛ nneɛma pii a, ɛsɛ sɛ adetɔfo pene so wɔ abodwokyɛre ne akwan a wɔfa so yɛ nhwɛsode wɔ nkyerɛkyerɛmu a wɔapene so no mu.
Surface dyne nya sɛnea printing inks ma PVC no ani yɛ nwini no so nkɛntɛnso, bere a roughness nya transfer ne contact so nkɛntɛnso. Dyne bo a wɔakyerɛw no ma wonya nkyerɛkyerɛmu a wɔde paw, nanso ɛsɛ sɛ wɔhwɛ ink a etwa to, ɔkwan a wɔfa so sa yare, nhyehyɛe a wɔde tintim, abakɔsɛm a wɔde sie, ne nea wɔde yɛ adwuma wɔ soro no ho adanse wɔ mfiri a wɔde yɛ nneɛma so.
Vicat softening suban nya sɛnea krataa no yɛ n’ade bere a ɔhyew ne nhyɛso lamination no so nkɛntɛnso. Ebia kaad nhyehyɛe ahorow bɛhwehwɛ sɛ wɔde nkyerɛwde ahorow ma, titiriw bere a antenna, chips, magnetic stripes, SIM modules, anaa specialty overlays ka ho no.
Ahoɔden a ɛkari pɛ ne sɛnea ɛyɛ mmerɛw no boa ma mpaapaemu, burrs a ɛboro so, deformation, ne card anoano a ɛnyɛ pɛpɛɛpɛ so tew. Adwinnade tebea, ntwitwa akwankyerɛ, krataa a wɔde yɛ adwuma, ne ahoɔhare ankasa a wɔyɛ nso nya nsakrae adwumayɛ so nkɛntɛnso.
PVC Kaad Dwumadi a Wɔatintim
Smart Card ne Inlay Nnwuma a Wɔde Di Dwuma
Wobetumi akyerɛ PVC core nkratafa ama offset tintim, silk-screen tintim, UV tintim, anaasɛ wɔde bedi dwuma sɛ mfinimfini fã a wɔantintim. Nhyiamu gyina krataa no ani pɛpɛɛpɛ ne ink nhyehyɛe so. Ɛsɛ sɛ adetɔfo de ɔkwan a wɔfa so tintim nhoma no ma na wɔyɛ adhesion, color, curing, ne over-lamination sɔhwɛ ahorow.
Wobetumi de core krataa no aka PVC tintim nkrataa, nkataso a wɔmfa nkata so, nkataso a wɔakata so, nkataso a wɔde magnetic stripe, anaa prelam a wɔde akata so. Ɛsɛ sɛ wɔyɛ ɔhyew, nhyɛso, bere a wɔde tra hɔ, onwini, stack symmetry, ne nneɛma a wɔde gyae no yiye ma adansi no nyinaa.
Wɔ kaad a enni nkitahodi ho no, ɛsɛ sɛ wɔde antena geometry ankasa, chip gyinabea, cavity design, prelam thickness, ne card nhyehyɛe na ɛsɔ nneɛma no hwɛ. Ɛsɛ sɛ wosi RF akenkan kwan, resonance, chip nkwa, lamination flatness, ne punching registration so dua ansa na volume production.
Ɛsɛ sɛ wɔsɔ kaad punching, module cavity milling, hot-melt embedding, embossing, ne finishing adwuma afoforo hwɛ wɔ laminated card a wɔapene so no so. Core-sheet aba nkutoo ntumi nkyerɛ biribiara a wɔawie-kaad nhyehyɛe.
Nhyehyɛe a emu da hɔ a wɔde gye tom no brɛ akasakasa ne sɔhwɛ a wɔsan yɛ no ase. Ɛsɛ sɛ wɔpene anohyeto pɔtee no so wɔ adetɔ ho nkyerɛkyerɛmu no mu efisɛ ebetumi ayɛ soronko wɔ grade, ne kɛse, krataa no kwan a wɔfa so tintim, ɔkwan a wɔfa so tintim, ne kaad nhyehyɛe so.
| Nhwehwɛmu Beae | a Wɔkamfo Kyerɛ Hwɛ | Adetɔfo Gyinaesi |
|---|---|---|
| Nsusuwii ahorow | Ne kɛse, krataa tenten ne ne tɛtrɛtɛ, ne ahinanan, anoano su, ne sɛnea stack no hyia. | Si abodwokyɛre ne ɔkwan a wɔfa so susuw no so dua wɔ nkyerɛkyerɛmu a wɔapene so no so. |
| Ani | Kɔla, efĩ, nsensanee, pinholes, roughness, dyne level, ne print-side identification. | Pene anohyeto ahorow a wɔde aniwa hu ne nhwɛsode a wɔde gyina so so ansa na wɔayɛ no kɛse. |
| Mfiridwuma mu Nneɛma a Ɛwɔ Hɔ | Density, tensile ahoɔden, rigidity, flexibility, punching suban, ne finished-card bend adwumayɛ. | Fa sɔhwɛ akwan a wɔapene so ne nhwɛsode ahorow a wɔahyɛ da ayɛ di dwuma. |
| Ɔhyew ne Lamination Mmuae | Vicat grade, shrinkage, warpage, bubbles, delamination, onwini a ɛyɛ tratraa, ne layer registration. | Validate ne nyinaa production stack ne ankasa laminator. |
| Ntintim ne Nneɛma a Wɔde Yɛ Nnipa | Ink a ɛbata ho, kɔla a wɔsan yɛ, ayaresa, overlay bond, embossing, magnetic stripe, chip, ne personalization. | Pene sika kɔkɔɔ nhwɛsode a wɔawie-kaad so. |
| Nneɛma a Wɔde kyekyere ne Traceability | Dodow, nkyerɛwde, lot nɔma, nsu ho banbɔ, pallet tebea, ne nkrataa a wɔde mena. | Kyerɛkyerɛ label format ne nkrataa a wɔhwehwɛ wɔ adetɔ krataa no mu. |
Fa adwuma no ho nkyerɛkyerɛmu kɔma: kaad no su, ne kɛse a wɔawie, ne layer nhyehyɛe, krataa no mu duru, krataa no kɛse, kɔla, tintim kwan, lamination tebea, ne afe afe ahwehwɛde.
Paw ɔkannifo abasobɔde: kaad a ɛyɛ mpapahwekwa, sikakorabea-kaad nhyehyɛe, RFID prelam, SIM kaad, core a wotumi tintim, anaa mfinimfini core a wɔantintim.
Sɔ krataa no hwɛ: sɛnea wotumi tintim, ink a ɛbata ho, lamination, flatness, twa, punching, ne dimensional stability.
Sɔ kaad a wɔawie no hwɛ: bend, peel, chip anaa antenna dwumadie, magnetic stripe, personalization, ne card-reader compatibility sɛdeɛ ɛfata.
pene sika kɔkɔɔ nhwɛsode no so: kyerɛw nneɛma no grade, adansi, nhyehyɛe, sɛnea ɛte, ne gyinapɛn ahorow a wɔde gye tom.
Gyae dodow a wɔkra no: fa nhwɛsode ne nkyerɛkyerɛmu a wɔapene so no di dwuma sɛ adetɔ ne su pa ho nkyerɛkyerɛmu.
Nneɛma a wɔyɛ no pɛpɛɛpɛ gyina nnuru a wɔde yɛ no sohwɛ, kalenda anaa extrusion a ɛgyina pintinn, ɔfasuo ayaresa, ne kɛseɛ sohwɛ, twitwa a ɛyɛ pɛpɛɛpɛ, nhwehwɛmu, ne nneɛma a wɔde ahyɛ mu a wɔabɔ ho ban. Wɔakora adwumayɛbea mfonini ahorow a ɛwɔ ase ha no so afi mfitiase ade no kratafa no so.
Ɛsɛ sɛ wɔhyehyɛ PVC core nkratafa na wɔkora so na ama ayɛ petee, ahoɔden a ɛwɔ soro, ahotew, ne nea wotumi tintim. Wobetumi aka nneɛma a wɔde kyekyere nneɛma ho nhyehyɛe ho asɛm sɛnea krataa no kɛse, dodow, ɔkwan a wɔfa so de nneɛma kɔ, ne nea adetɔfo di ho dwuma ahwehwɛde ahorow te.
Fa film anaa nkotoku a ɛbɔ ho ban di dwuma na ama mfutuma, nsu, ne efĩ a ɛwɔ soro no so atew.
Fa nnaka, ntaaboo a ɛyɛ den, pallet, anoano ahobammɔ, ne ahama a ɛyɛ den di dwuma sɛnea ɛfata ma nea wɔkra no.
Fa nkratafa sie petee wɔ baabi a ɛhɔ tew na ɛhɔ yɛ kusuu na bɔ ho ban fi owia hann tẽẽ, ɔhyew fibea, ne nhyɛso a emu yɛ den a ɛnyɛ pɛpɛɛpɛ ho.
Ma nneɛma no nkɔ yiye wɔ baabi a wɔyɛ nneɛma no ansa na woatintim anaa woayɛ lamination wɔ baabi a ɔhyew mu nsonsonoe yɛ kɛse.
Fa lot labels ne first-in, first-out stock control di dwuma de boa traceability ne dwumadie a ɛkɔ so daa.
Export Loading Ahobammɔ
Palletized Nkratafa a Wɔde Gu Nneɛma Mu
Kaad-focused nneɛma mmoa: Wobetumi asusuw PVC core nkratafa abom ne nkrataa a wotumi tintim, nkataso, magnetic stripe nneɛma, ne RFID inlay nhyehyɛe.
Grade matching: selection betumi asusuw cards a ɛyɛ mpapahwekwa, bank-card nhyehyɛe, SIM card a wɔyɛ, ne contactless prelam ahwehwɛde ahorow ho.
Amanneɛbɔ nsakrae: wobetumi ahwɛ ne kɛse, ne kɛse, ne kɔla, ne soro su, ne twitwa, nea wɔakyerɛw so, ne nea wɔde kyekyere nneɛma mu ama adwuma no.
Nhwɛso-di kan kwan: adetɔfo betumi asɔ tintim, lamination, punching, ne finished-card adwumayɛ ahwɛ ansa na wɔapene dodow a wɔde ma.
Export order mmoa: specification confirmation, packing coordination, lot identification, ne amanaman ntam shipment ahosiesie wɔ hɔ ma wholesale orders.
| Nsɛm | Nhwɛso | Nea Enti a Ɛho Hia |
|---|---|---|
| Kaad no Ɔkwan a Wɔfa so Yɛ | ID kaad, sikakorabea kaad, SIM kaad, RFID kaad, ahɔhodan mu safe kaad | Kyerɛ material grade a ɛfata ne validation nhyehyɛe. |
| Core Sheet no mu duru | 0.10–0.50mm anaa adwuma no ahwehwɛde | Ɔhwɛ card stack, rigidity, ne nneɛma a wɔde di dwuma so. |
| Krataa no Kɛse ne Dodow | A4, A3, adeyɛ nhyehyɛe, amanne krataa, kilogram anaa nkrataa | Ɛho hia ma cutting plan, packaging, bo, ne logistics. |
| Kɔla ne Opacity | Fitaa, tuntum, kɔla, anaa amanne kwan so nkyerɛkyerɛmu | Ɛka sɛnea wɔyɛ no, sɛnea wɔtintim no akyi, ne sɛnea wɔkra nneɛma no. |
| Ɔkwan a Wɔfa so tintim nhoma | Offset, silk screen, UV, anaasɛ core a wɔantintim | Ɔkyerɛ ɔfasuo ahosiesie ne nhwɛsoɔ sɔhwɛ ahwehwɛdeɛ. |
| Kaad Layer Nhyehyɛe | Overlay + a wɔatintim core + RFID inlay + a wɔatintim core + overlay | Ɛho hia sɛ wɔsɔ thickness kari pɛ ne lamination compatibility hwɛ. |
| Lamination Tebea Ahorow | Ɔhyew, nhyɛso, bere a wɔde tra hɔ, ɔkwan a wɔfa so yɛ onwini | Boa Vicat grade a ɛfata a wɔpaw ne ɔhaw ahorow ano aduru. |
| Nwoma a Wɔhwehwɛ | TDS, COA, sɔhwɛ amanneɛbɔ, nneɛma a wɔde kyekyere nneɛma ho nkyerɛwde, mmara sodi ho adesrɛ | Ɛma kwan ma wosi krataa a ɛwɔ hɔ so dua ansa na wɔakra. |
Honam fam nkyerɛkyerɛmu a ɛwɔ kratafa yi so no kyerɛ 0.10–0.50mm. Ne kɛse a ɛfata no gyina kaad a wɔayɛ no nyinaa ne kaad a wɔawie no botae so. Ɛsɛ sɛ wɔde ahwehwɛde afoforo kɔma ma wɔde mfiridwuma ne nneɛma a wɔyɛ ho adanse.
Krataa titiriw no na ɛyɛ kaad no nhyehyɛe nipadua na ebetumi akura nneɛma a wɔde tintim anaa ɛlɛtrɔnik nneɛma. Mpɛn pii no, ade a wɔde kata so yɛ akyi ade a ɛyɛ tratraa a ɛbɔ nhoma tintim ho ban na ebetumi ayɛ nneɛma a wɔde kata so, magnetic stripes, holograms, anaa nneɛma afoforo a wɔde kata so.
Aane. Wobetumi de PVC grade a ɛfata adi dwuma sɛ nnyinaso anaa structure layer a contactless prelam inlays. Ɛsɛ sɛ wɔde antenna ankasa, chip, lamination cycle, inlay thickness, punching nhyehyɛe, ne RF adwumayɛ ahwehwɛde ahorow di ade no ho adanse.
Nkyerɛkyerɛmu a wɔde ama no kyerɛ 90 ± 2°C Vicat grade ma SIM kaad dwumadie. Ɛsɛ sɛ wɔsi so dua sɛ ɛfata a etwa to no de gyina SIM kaad nipadua nhyehyɛe, punching nhyehyɛe, module cavity, nhyiam tebea, ne adetɔfo sɔhwɛ ahwehwɛde ahorow so.
Wobetumi asiesie PVC kaad nkrataa ama offset anaa silk-screen tintim, nanso ɛsɛ sɛ abasobɔde pɔtee no ne ɔkwan a wɔpɛ sɛ wɔfa so tintim no hyia. Ɛsɛ sɛ adetɔfo sɔ ink a ɛyɛ nsu, nea ɛbata ho, nea ɛsa, kɔla, lamination, ne sɛnea kaad a wɔawie no yɛ adwuma hwɛ ansa na wɔayɛ no kɛse.
Surface dyne nya ink a ɛyɛ nwini ne nea ɛbata ho so nkɛntɛnso, bere a roughness nya printing contact, krataa a wɔde ma, ne lamination so nkɛntɛnso. Ɛsɛ sɛ wosusuw abien no nyinaa ho ka ink chemistry, press tebea, storage, ne overlay a wɔapaw no ho.
Wobetumi ahwɛ amanne kwan so ahwehwɛde ahorow mu ama ne kɛse, ne kɛse, ne kɔla, ne soro dyne, ne roughness, nea wɔatwa, nea wɔakyerɛw so, ne nea wɔde kyekyere. Feasibility, MOQ, lead time, ne tolerances gyina nkyerɛkyerɛmu a wɔabisa no so.
Sɔ krataa no hwɛ denam adwumayɛ nhyehyɛe a edi mũ no so: tintim, ayaresa, lamination, onwini, punching, personalization, chip anaa antenna dwumadie, ne finished-card sɔhwɛ. Ɛsɛ sɛ wɔpene sika kɔkɔɔ nhwɛsode ne nkyerɛkyerɛmu a wɔakyerɛw so ansa na wɔakra nneɛma pii a edi kan.
Yiw, sɛ PVC core no, magnetic stripe overlay, printing, lamination, ne finished-card thickness no hyia a. Ɛsɛ sɛ wɔhwɛ sɛ stripe gyinabea, coercivity, bond ahoɔden, encoding, ne personalization yɛ nokware wɔ cards a wɔawie so.
Wɔtaa de nkotoku anaa sini a ɛbɔ ho ban, nnaka anaa ntaaboo a ɛyɛ den, pallet, anoano ahobammɔ, nhama a wɔde kyekyere, nkyerɛwde, ne nsu a ɛbɔ ho ban di dwuma sɛnea krataa no kwan ne ɔkwan a wɔfa so de mena no te. Ɛsɛ sɛ wosi nhyehyɛe a etwa to a wɔde bɛhyɛ nneɛma mu no so dua wɔ nsɛm a wɔafa aka no mu.
Wobetumi aka nhwɛsode a ɛwɔ hɔ ho asɛm bere a wɔde kaad no a wɔde ahyɛ mu, ne kɛse, ne kɛse, kɔla, nea wɔhwehwɛ wɔ soro, ne sɔhwɛ nhyehyɛe ama akyi. Wɔkamfo kyerɛ sɛ wɔpene nhwɛsode so ansa na wɔayɛ no sɛnea wɔpɛ anaasɛ wɔayɛ no kɛse.
Fa kaad no su, botae a wɔawie no kɛse, layer nhyehyɛe, core thickness, krataa kɛse, kɔla, ɔkwan a wɔfa so tintim, lamination nhyehyɛe, afe afe dodow, nneɛma a wɔde kyekyere, ne nkrataa a wɔhwehwɛ ka ho. Saa nsɛm yi ma kwan ma wɔpaw abasobɔde ntɛmntɛm na wɔfa nsɛm ka.
Di Wallis Plastic ho nkɔmmɔ na woanya PVC core nkratafa a wɔde yɛ kaad, kaad nipadua a wɔatintim, RFID prelam inlays, sikakorabea kaad, SIM kaad, ne smart card a wɔyɛ. Fa wo mfiridwuma ho ahwehwɛdeɛ mena na woanya abasobɔdeɛ ho nyansahyɛ, nhwɛsoɔ nhyehyɛeɛ, ne B2B quotation.
Fi Yɛn Dwumadi no ase