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I-Wholesale PVC core sheet ye-ID, ibhange, i-SIM, ukufinyelela kanye nokukhiqizwa kwekhadi le-RFID. Ukujiya ngokwezifiso, usayizi, umbala, ibanga le-Vicat, i-surface dyne kanye nokuqina, nokuhlolwa kwesampula nokupakishwa kokuthekelisa emhlabeni wonke.
Ishidi le-WLS-PVC Core
WALLIS
| Umbala: | |
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| Usayizi: | |
| Ubuningi: | |
Ishidi le -Wallis PVC core liyi-substrate eqinile yekhadi eyenzelwe ukukhiqizwa kwamakhadi epulasitiki, imizimba yamakhadi aphrintiwe, ukukhiqizwa kwe-inlay ye-PVC, kanye nezakhiwo zamakhadi e-RFID angathinteki. Isetshenziswa njengesendlalelo sesakhiwo esimaphakathi, isekela ukucaba kwekhadi, amandla emishini, ukuguquguquka okulawulwayo, ukusebenza kokuphrinta, kanye nokushisa okuzinzile.
Okubalulekile kuhloselwe abakhiqizi bamakhadi e-B2B abakhiqiza amakhadi omazisi, amakhadi asebhange, ama-SIM card, amakhadi okufinyelela, amakhadi okhiye behhotela, amakhadi obulungu, amakhadi esipho, amakhadi okuthutha, namakhadi ahlakaniphile e-RFID. Ubukhulu, ubukhulu beshidi, umbala, ibanga le-Vicat, i-surface dyne, kanye nokuqina kwengaphezulu kungafaniswa nokwakhiwa kwekhadi kanye nezinto zokusebenza ezingezansi.
Ukuze kuhlolwe iphrojekthi, abathengi kufanele bacacise uhlobo lwekhadi eliqediwe, ubukhulu bekhadi eliphelele, inqubo yokuphrinta, imbondela noma isakhiwo se-inlay, izimo ze-lamination, nefomethi yeshidi edingekayo. U-Wallis angabese elungiselela isampula elifanelekile lokuphrinta, ukucwiliswa, ukushaywa, nokuhlolwa kwekhadi eliqediwe ngaphambi kokukhiqizwa kwenqwaba.
Amanani alandelayo asekelwe esimisweni somkhiqizo samanje esinikezwe leli khasi. Izidingo zokugcina kufanele ziqinisekiswe ngebanga lomkhiqizo, isampula eligunyaziwe, ikhotheshini, kanye nemibhalo yeqoqo ngaphambi kokukhiqizwa ngobuningi.
| Yento Yokuhlola | Iyunithi | Eshiwo Umphumela | Ohlobene Ekukhiqizweni Kwekhadi | |
|---|---|---|---|---|
| Ubukhulu | mm | 0.10–0.50 | Kukhethwe ngokuya ngomongo ophrintiwe, inlay, izendlalelo zembondela, kanye nokujiya okuqondiwe kwekhadi eliphelile. | |
| Ukuminyana | g/cm³ | 1.42 ± 0.05 | Isekela isisindo seshidi esingaguquki, ukuqina, ukuziphatha kokushaya, kanye nesakhiwo sekhadi elaminethiwe. | |
| Amandla Okuqina | Okuvundlile | I-MPa | ≥44 | Isiza ingqikithi imelana nokwelula kanye nengcindezi yemishini ngesikhathi sokuguqula kanye nokusebenzisa ikhadi. |
| Iqondile | ≥46 | |||
| I-Vicat Softening Point | Ibanga Lekhadi Elijwayelekile | °C | 78 ±2 | Izakhiwo zekhadi le-PVC eliphrintiwe elijwayelekile nelinomlayini. |
| IBanga Lekhadi Lebhange | 74 ±2 | Ukukhethwa kwebanga kufanele kuqhathaniswe nomjikelezo wokwakhiwa kwekhadi lasebhange eligunyaziwe kanye nomjikelezo we-lamination. | ||
| Ibanga le-SIM Card | 90 ±2 | Ibanga elishisayo eliphezulu lokucubungula umzimba wekhadi le-SIM, ngaphansi kokuqinisekiswa kwephrojekthi. | ||
| I-Surface Dyne | amadethi/cm | ≥34 | Isekela ukumanzisa nokunamathela kweyinki; ukuhlolwa kokuphrinta kuhlala kudingekile ohlelweni lukayinki olukhethiwe. | |
| Ukuqina Kobuso | Ra | μm | 0.7–1.8 | Ithonya ukuphakelwa kwamashidi, ukudluliswa kukayinki, ukuthintana kwe-lamination, nokufana kokugcina kwendawo. |
| Rz | 4.0–12 | |||
Ishidi elingumongo le-PVC liyi-substrate yesakhiwo ebekwe phakathi kwezimbondela ezivikelayo zekhadi lepulasitiki elinomlayini. Kuye ngomklamo, ingqikithi ingase iphrintwe ngokuqondile, isetshenziswe njengesendlalelo esiphakathi esingaphrintiwe, noma siguqulwe sibe inlay engenalutho noma ye-elekthronikhi ehlanganisa i-antenna, i-chip module, noma enye ingxenye esebenzayo.
Ngokungafani nefilimu eyimbondela, evikela ngokuyinhloko ingaphezulu lekhadi, ishidi eliwumongo linikela ingxenye enkulu yokungafihli komzimba wekhadi, ukuqina, ukucaba, nokuzinza kwe-dimensional. Ngakho-ke izakhiwo zempahla ezingaguquki zibalulekile ekubhaliseni, ekufakeni amanzi, ekubetheni ngezibhakela, ekwenzeni kube ngokwakho, nasekuphatheni amakhadi ngokuzenzakalelayo.
I-PVC Core Sheet Material
Ikhadi le-PVC Substrate yekhadi
Amaphrojekthi wekhadi akufanele akhethe i-PVC core material ngokujiya kuphela. Ibanga elifanele liphinde lincike ekuphenduleni okushisayo, indlela yokuphrinta, i-electronics egxilile, inqubo yokufaka imbossing noma yomuntu siqu, impilo yekhadi, kanye nesitaki esiphelele se-lamination.
| Isicelo Sekhadi | Ukuqinisekisa Okujwayelekile Kwesidingo | Sokukhetha Ukugxila | Okunconyiwe |
|---|---|---|---|
| Umazisi Ojwayelekile, Amakhadi Obulungu kanye Namakhadi | Ingqikithi ye-PVC emhlophe ephrintekayo noma engaphrintiwe enokuqina okulinganiselwe kanye nokuphendula okucwebezelayo. | Ubukhulu, ubumhlophe, ukucaba, ukunamathela kokuphrinta, ukusika ukufa, kanye nokuguquguquka kwekhadi eliqedile. | Phrinta, laminate, punch, namakhadi omele ukuhlolwa kwe-goba. |
| Amakhadi Ebhange Nezezimali | I-PVC yebanga lekhadi elawulwayo ifaniswe nembondela egunyaziwe, umugqa kazibuthe, i-chip, nenqubo yokwenza kube ngokwakho. | Ukufana kweqoqo, iwindi lokucwenga, ukushumeka noma ukushumeka kwemojuli, nokuphatha amakhadi esikhathi eside. | Gunyaza ukwakhiwa kwekhadi eliphelele, hhayi ishidi eliyinhloko elibekwe lodwa. |
| I-RFID kanye ne-Contactless Prelam Inlays | Ishidi eliwumgogodla noma eliyisisekelo elihambisana ne-antenna nokubekwa kwe-chip kanye ne-lamination esezingeni. | Ukuziphatha kwe-Vicat, ukukhanya kweshidi, ukuvikelwa kwe-chip, ukuma kwe-antenna, nobuqotho bebhondi. | Ukusebenza kwe-RF, i-cross-section, ikhasi, i-lamination, nokuhlolwa kokubhoboza. |
| I-SIM kanye ne-Telecom Cards | Izinga lokushisa eliphezulu lapho kudingwa inqubo yomzimba ye-SIM khadi egunyaziwe. | Ukuzinza kokushisa, ukunemba kokushaya, ukucubungula umgodi wemojuli, namandla omzimba wekhadi. | Umjikelezo wokushisa, i-punch, ukuhlanganiswa kwamamojula, nokuhlola kobukhulu. |
Amabanga enhloso evamile afanele amakhadi omazisi, amakhadi obulungu, amakhadi okhiye behhotela, amakhadi okwethembeka, namakhadi okukhangisa lapho ishidi elikhethiwe lihambisana nephrinta, imbondela, i-laminator, nokwakhiwa kwekhadi eliqondiwe.
Ukukhiqizwa kwamakhadi wezezimali kudinga inhlanganisela elawulwa ngokuqinile yamashidi angumongo, ukumbondelana, izinto zomugqa kazibuthe, amamojula we-chip, ukuphrinta, ukulanyiswa, kanye nokwenza kube ngokwakho. Abathengi kufanele banikeze uhlaka olugcwele lwesendlalelo kanye nemibandela yokugunyaza lapho becela ibanga lekhadi lasebhange.
Ukufakwa kwamakhadi ngaphandle kokuthinta kubeka izingxenye ze-elekthronikhi ngaphakathi komzimba wekhadi. Ishidi eliyisisekelo le-PVC elifanelekile kufanele licwebezele ngaphandle kokugudluza uthi noma ukufaka ukucindezeleka okushisayo nokwemishini endaweni ye-chip. Ukukhiqizwa kwesilingo kufanele kuqinisekise kokubili ukukhanda kwamakhadi nokusebenza kwe-RF.
Izinto zekhadi le-SIM zingadinga izinga elishisayo elihlukile kanye nokuziphatha okuguqula kusuka kumakhadi ajwayelekile e-PVC. Ukujiya kweshidi, inani le-Vicat, izakhiwo ezingaphezulu, isakhiwo sokubhoboza, umgodi wemojuli, kanye nokuhlanganisa okungezansi komfula kufanele kucaciswe ngaphambi kokulungiselela isampula.
| Esendlalelo | Primary | Ukuhlola Ukuhambisana Kokhiye |
|---|---|---|
| Imbondela ephezulu | Ivikela ukuphrinta futhi ingase iphathe umugqa kazibuthe, ihologram, noma ukunamathela okukhethekile. | Ukubopha, ukuphela kwendawo, ukuma komugqa kazibuthe, nezidingo zokwenza kube ngokwakho. |
| I-PVC Core ephrintiwe | Iphethe imifanekiso, umbhalo, umsebenzi wobuciko wokuvikela, amalogo, nezinto zedizayini eziguquguqukayo. | Isistimu ye-inki, i-surface dyne, ukuhwalala, ukungaguquguquki kombala, nokubhaliswa. |
| I-Middle Core noma i-RFID Inlay | Yakha ukujiya kwekhadi futhi ingaqukatha uthi ne-chip. | Ibanga le-Vicat, ukuvikelwa kwe-electronics, flatness, nokubala kogqinsi lwesendlalelo. |
| I-Reverse Printed Core | Ihlinzeka ngomklamo obheke emuva kanye nokujiya kwesakhiwo okwengeziwe. | Ukuqondanisa kokuphrinta-ukuze kuphrinte, umbala, nebhalansi ye-lamination. |
| Imbondela engezansi | Ivala futhi ivikele indawo engemuva. | Amandla ebhondi, ukuthungwa kwendawo, nokucaba kwekhadi eliphelile. |
Ijiyomethri yeshidi elizinzile isiza ukugcina isitaki samakhadi esihlosiwe futhi isekela ukuphakelwa okungaguquguquki, ukuphrinta, ukucwiliswa, ukubhoboza, nogqinsi lwamakhadi aphelile. Ngokukhiqizwa kwevolumu ephezulu, abathengi kufanele bavumelane ngokubekezelelana nezindlela zesampula ekucacisweni okugunyaziwe.
I-Surface dyne ithonya indlela oyinki bokuphrinta abamanzisa ngayo indawo ye-PVC, kuyilapho ubuhholo buthinta ukudluliswa nokuxhumana. Inani le-dyne esohlwini linikeza ireferensi yokukhetha, kodwa uyinki wokugcina, indlela yokwelapha, izilungiselelo zokucindezela, umlando wesitoreji, nokuphathwa kwendawo kufanele kuqinisekiswe kumshini wokukhiqiza.
Ukuziphatha kokuthambisa i-Vicat kuthonya indlela ishidi eliphendula ngayo phakathi nokushisa nokucindezela ingcindezi. Izakhiwo zamakhadi ahlukene zingase zidinge amamaki ahlukene, ikakhulukazi uma izimpondo, ama-chips, imigqa kazibuthe, amamojula e-SIM, noma izimbondela ezikhethekile.
Amandla alinganiselayo kanye nokuvumelana nezimo kusiza ukunciphisa ukuqhekeka, ama-burrs amaningi, ukuwohloka, kanye nemiphetho yamakhadi engahambisani. Isimo sethuluzi, isiqondiso sokusika, isimo seshidi, kanye nesivinini sangempela sokukhiqiza nakho kuthinta ukuguqula ukusebenza.
Izicelo Zekhadi Le-PVC Ephrintiwe
I-Smart Card kanye nezinhlelo zokusebenza ezifakiwe
Amashidi angumongo we-PVC angacaciswa ukuphrinta kwe-offset, ukuphrinta kwesikrini sikasilika, ukuphrinta kwe-UV, noma kusetshenziswe njengesendlalelo esimaphakathi esingaphrintiwe. Ukuhambisana kuncike endaweni eyishidi kanye nesistimu kayinki. Abathengi kufanele banikeze inqubo yokuphrinta futhi benze izivivinyo zokunamathela, umbala, ukuphulukisa, kanye nokuhlolwa kwe-lamination ngaphezulu.
Ishidi eliwumgogodla lingase lihlanganiswe namashidi okuphrinta e-PVC, imbondela engamboziwe, imbondela emboziwe, imbondela yemigqa kazibuthe, noma ama-prelam inlay. Izinga lokushisa, ingcindezi, isikhathi sokuhlala, ukupholisa, ukulingana kwesitaki, nezinto zokukhulula kufanele kuthuthukiswe ukuze kwakhiwe ngokuphelele.
Emakhadini angathintwa, okokusebenza kufanele kuhlolwe ngejiyomethri ye-antenna, indawo ye-chip, idizayini yesikhala, ukujiya kwe-prelam, kanye nesakhiwo sekhadi. Ibanga lokufunda le-RF, i-resonance, ukusinda kwe-chip, ukukhanya kwe-lamination, nokubhaliswa kokubhoboza kufanele kuqinisekiswe ngaphambi kokukhiqizwa kwevolumu.
Ukubethelwa kwekhadi, ukugaywa komgodi wemojula, ukushumeka kwe-hot-melt, ukugqamisa, neminye imisebenzi yokuqeda kufanele kuhlolwe ekhadini eline-laminated eligunyaziwe. Imiphumela ye-core-sheet iyodwa ayikwazi ukubikezela yonke inqubo yekhadi eliqediwe.
Uhlelo lokwamukela olucacile lunciphisa izingxabano futhi luphinde ukuhlola. Imikhawulo eqondile kufanele kuvunyelwane ngayo ekucacisweni kokuthenga ngoba ingahluka ngokwebanga, ukujiya, ifomethi yeshidi, indlela yokuphrinta, nohlelo lwekhadi.
| Indawo Yokuhlola | Kunconyiwe Hlola | Isinqumo Somthengi |
|---|---|---|
| Ubukhulu | Ubukhulu, ubude beshidi nobubanzi, ubukhulu, ikhwalithi yonqenqema, nokuqondanisa kwesitaki. | Qinisekisa ukubekezelela kanye nendlela yokulinganisa ekucacisweni okugunyaziwe. |
| Ubuso | Umbala, ukungcola, imihuzuko, izimbobo, ukuhwaqa, izinga le-dyne, nokuhlonza uhlangothi lokuphrinta. | Gunyaza imikhawulo ebonakalayo kanye nereferensi yesampula ngaphambi kokukhiqizwa ngobuningi. |
| Izakhiwo Zemishini | Ukuminyana, amandla aqinile, ukuqina, ukuguquguquka, ukuziphatha kokushaya, nokusebenza kokugoba kwekhadi eliphelile. | Sebenzisa izindlela zokuhlola okuvunyelwene ngazo namasampuli anesimo. |
| I-Thermal kanye ne-Lamination Response | Ibanga le-Vicat, i-shrinkage, i-warpage, amabhamuza, i-delamination, ukupholisa okupholile, nokubhaliswa kwesendlalelo. | Qinisekisa ngesitaki esiphelele sokukhiqiza kanye ne-laminator yangempela. |
| Ukuphrinta nokwenza kube ngokwakho | Ukunamathela kukayinki, ukuzalaniswa kombala, ukuphulukiswa, ibhondi embondelayo, ukugqamisa, umugqa kazibuthe, i-chip, nokwenza kube ngokwakho. | Gunyaza isampula legolide lekhadi eliqediwe. |
| Ukupakisha kanye nokulandeleka | Ubuningi, amalebula, inombolo yenkatho, ukuvikelwa komswakama, isimo sephalethi, kanye nemibhalo yokuthunyelwa. | Chaza ifomethi yelebula namadokhumenti adingekayo ohlelweni lokuthenga. |
Thumela ukucaciswa kwephrojekthi: uhlobo lwekhadi, ukujiya okuqediwe, ukwakheka kongqimba, ukujiya kweshidi, usayizi weshidi, umbala, inqubo yokuphrinta, izimo zokumboza, kanye nesidingo sonyaka.
Khetha ibanga lekhandidethi: ikhadi elijwayelekile, ukwakheka kwekhadi lasebhange, i-RFID prelam, i-SIM khadi, umgogodla ophrintekayo, noma umgogodla ongaphrintiwe.
Hlola ishidi: ukuphrinta, ukunamathela kukayinki, i-lamination, flatness, ukusika, ukubhoboza, nokuzinza kwe-dimensional.
Hlola ikhadi eliqediwe: ukugoba, ikhasi, umsebenzi we-chip noma othi, umugqa kazibuthe, ukwenza kube ngokwakho, nokuhambelana kwesifundi sekhadi njengoba kusebenza.
Gunyaza isampula yegolide: rekhoda izinga lokubalulekile, ukwakhiwa, izilungiselelo, ukubukeka, kanye nemibandela yokwamukela.
Khipha i-oda lenqwaba: sebenzisa isampula eligunyaziwe kanye nokucaciswa njengereferensi yokuthenga nekhwalithi.
Ukungaguquguquki kokukhiqiza kuncike ekulawuleni ukwakheka, ukuqina kwekhalenda noma i-extrusion, ukuphathwa kwendawo, ukulawula ukushuba, ukunemba kokusika, ukuhlolwa, kanye nokupakishwa okuvikelekile. Izithombe zefekthri ezingezansi zigcinwe ekhasini lokuqala lomkhiqizo.
Amashidi angumgogodla we-PVC kufanele apakishwe futhi agcinwe ukuze kulondolozwe ukukhanya, amandla angaphezulu, ukuhlanzeka, nokuphrinta. Ukucushwa kokupakisha kungaxoxwa kuye ngosayizi weshidi, inani, umzila wokuthutha, kanye nezidingo zokuphatha umthengi.
Sebenzisa ifilimu yokuzivikela noma izikhwama ukunciphisa uthuli, umswakama, nokungcoliswa kwendawo.
Sebenzisa amabhokisi, amabhodi aqinile, amaphalethi, ukuvikela unqenqema, kanye nebhande elivikelekile njengoba kufanele ku-oda.
Gcina amashidi ayisicaba endaweni ehlanzekile, eyomile futhi uwavikele elangeni eliqondile, imithombo yokushisa, nokucindezela okukhulu okungalingani.
Vumela okokusebenza ukuthi kubekwe endaweni yokukhiqiza ngaphambi kokuphrinta noma ukulanyiswa lapho umehluko wezinga lokushisa ubalulekile.
Sebenzisa amalebula enkatho kanye nokulawula isitoko kuqala ukungena ukuze usekele ukulandeleka nokucubungula okungaguquguquki.
Thumela Ukuvikelwa Kokulayisha
I-Palletized Sheet Packaging
Ukusekelwa kwezinto ezigxile ekhadini: Amashidi angumongo we-PVC angaxoxwa kanye namashidi aphrintekayo, imbondela, izinto zomugqa kazibuthe, kanye nezakhiwo ze-inlay ze-RFID.
Ukufaniswa kwebanga: ukukhetha kungacabangela amakhadi ajwayelekile, izakhiwo zekhadi lasebhange, ukukhiqizwa kwekhadi le-SIM, kanye nezidingo ze-prelam ezingenakuthinta.
Ukuguqulwa ngokwezifiso: ukujiya, ubukhulu, umbala, izici ezingaphezulu, ukusika, ukulebula, nokupakishwa kungabuyekezwa kuphrojekthi.
Inqubo yesampula yokuqala: abathengi bangahlola ukuphrinta, ukucwiliswa, ukubhoboza, nokusebenza kwekhadi eliqediwe ngaphambi kokugunyaza ukunikezwa kwenqwaba.
Ukwesekwa kwe-oda lokuthekelisa: isiqinisekiso sokucaciswa, ukuhlanganisa ukupakisha, ukuhlonza inkatho, nokulungiselelwa kokuthunyelwa kwamazwe ngamazwe kuyatholakala kuma-oda we-wholesale.
| Ulwazi | Isibonelo | Kungani Kubalulekile |
|---|---|---|
| Uhlobo Lwekhadi | Ikhadi le-ID, ikhadi lasebhange, i-SIM khadi, ikhadi le-RFID, ikhadi lokhiye wehhotela | Inquma ibanga elifanele lezinto ezibonakalayo nohlelo lokuqinisekisa. |
| Ukuqina Kweshidi Eliyinhloko | 0.10–0.50mm noma isidingo sephrojekthi | Ilawula isitaki samakhadi, ukuqina, nokusetshenziswa kwezinto ezibonakalayo. |
| Usayizi Weshidi Nobuningi | I-A4, i-A3, isakhiwo sokukhiqiza, ishidi langokwezifiso, amakhilogremu noma amashidi | Kudingeka ohlelweni lokusika, ukupakisha, amanani, kanye nokuhlelwa kwezinto. |
| Umbala kanye ne-Opacity | Ireferensi emhlophe, emnyama, enombala, noma engokwezifiso | Ithinta ukwakheka, ingemuva lokuphrinta, nokumataniswa kwe-oda. |
| Inqubo Yokuphrinta | I-offset, isikrini sikasilika, i-UV, noma i-core engaphrintiwe | Inquma ukulungiswa kwendawo kanye nezidingo zokuhlolwa kwesampula. |
| Isakhiwo Sesendlalelo Sekhadi | Imbondela + ingqikithi ephrintiwe + inlay ye-RFID + ingqikithi ephrintiwe + imbondela | Kuyadingeka ukuze kuhlolwe ibhalansi yokuqina nokuhambisana kwe-lamination. |
| Izimo Lamination | Izinga lokushisa, ingcindezi, isikhathi sokuhlala, indlela yokupholisa | Isekela ukukhetha okufanele kwebanga le-Vicat nokuxazulula izinkinga. |
| Amadokhumenti Adingekayo | TDS, COA, umbiko wokuhlola, ilebula yokupakisha, isicelo sokuhambisana | Ivumela ukutholakala kwedokhumenti ukuthi kuqinisekiswe ngaphambi koku-oda. |
Ukucaciswa komzimba kuleli khasi kuklelisa u-0.10–0.50mm. Ubukhulu obufanele buncike ekwakhiweni kwekhadi eliphelele kanye nethagethi yekhadi eliqediwe. Ezinye izidingo kufanele zithunyelwe ukuze kuqinisekiswe ubuchwepheshe nokukhiqiza.
Ishidi elingumongo lakha indikimba yesakhiwo sekhadi futhi lingase liphathe izinto zokuphrinta noma ze-elekthronikhi. Imbondela ngokuvamile iyisendlalelo sangaphandle esincanyana esivikela ukuphrinta futhi singafaka ama-coatings, imigqa kazibuthe, ama-hologram, noma eminye imisebenzi yangaphezulu.
Yebo. Ibanga elifanelekile le-PVC lingasetshenziswa njengesisekelo noma ungqimba lwesakhiwo se-prelam inlay ngaphandle kokuthinta. Izinto ezisetshenziswayo kufanele ziqinisekiswe ngothi lwangempela, i-chip, umjikelezo wokucwenga, ukushuba kwe-inlay, ukwakheka kokubhoboza, kanye nezidingo zokusebenza kwe-RF.
Imininingwane enikeziwe ibala ibanga le-Vicat elingu-90 ± 2°C lezicelo ze-SIM khadi. Ukufaneleka kokugcina kufanele kuqinisekiswe ngokumelene nesakhiwo somzimba we-SIM khadi, inqubo yokubhoboza, umgodi wemojuli, izimo zokuhlanganisa, kanye nezidingo zokuhlolwa kwekhasimende.
Amashidi ekhadi le-PVC angalungiselelwa ukuphrinta i-offset noma i-silika-screen, kodwa ibanga eliqondile kufanele lihambisane nenqubo ehlosiwe. Abathengi kufanele bahlole ukumanzisa kukayinki, ukunamathela, ukuphulukisa, umbala, ukucwenga, nokusebenza kwekhadi eliqediwe ngaphambi kokukhiqizwa kwenqwaba.
I-surface dyne ithinta ukumanziswa kukayinki nokunamathela, kuyilapho ubuhhadlahhadla buthonya ukuthintana okuphrintiwe, ukuphakelwa kwamashidi, kanye nokucwenga. Kokubili kufanele kucatshangelwe kanye nekhemistri ye-inki, izimo zokucindezela, isitoreji, kanye nembondela ekhethiwe.
Izidingo zangokwezifiso zingabuyekezwa ukujiya, ubukhulu, umbala, i-surface dyne, ukuhwalala, ukusika, ukulebula, nokupakishwa. Ukuba nokwenzeka, i-MOQ, isikhathi sokuhola, nokubekezelela kuncike ekucacisweni okuceliwe.
Hlola ishidi ngokusebenzisa ukugeleza komsebenzi okuphelele: ukuphrinta, ukuphulukisa, ukuthambisa, ukupholisa, ukubhoboza, ukwenza kube ngokwakho, ukucutshungulwa kwe-chip noma i-antenna, nokuhlolwa kwekhadi eliqediwe. Isampula esagolide kanye nencazelo ebhaliwe kufanele kuvunywe ngaphambi kwe-oda lenqwaba yokuqala.
Yebo, inqobo nje uma umnyombo we-PVC, ukunqwabelanisa komugqa kazibuthe, ukuphrinta, i-lamination, nokujiya kwekhadi eliphelile kuyahambisana. Ukuma kwemigqa, ukuphoqelela, amandla ebhondi, ukubhala ngekhodi, nokwenza kube ngokwakho kufanele kuqinisekiswe emakhadini aqediwe.
Ukupakisha kuvame ukusebenzisa izikhwama zokuzivikela noma ifilimu, amabhokisi noma amabhodi aqinile, amaphalethi, ukuvikela unqenqema, ukubopha, amalebula, nokuvikela umswakama ngokuya ngefomethi yeshidi nendlela yokuthunyelwa. Uhlelo lokugcina lokupakisha kufanele luqinisekiswe kwikhotheshini.
Ukutholakala kwesampula kungaxoxwa ngemva kokunikezwa kwesicelo sekhadi, ukujiya, ubukhulu, umbala, imfuneko yendawo, kanye nohlelo lokuhlola. Ukugunyazwa kwesampula kuyanconywa ngaphambi kokukhiqizwa okwenziwe ngendlela oyifisayo noma kwevolumu ephezulu.
Faka uhlobo lwekhadi, ukujiya okuphothuliwe okuhlosiwe, ukwakheka kwesendlalelo, ukujiya kwengqikithi, usayizi weshidi, umbala, indlela yokuphrinta, izilungiselelo zokuhlobisa, ubuningi bonyaka, ukupakishwa, kanye nemibhalo edingekayo. Le mininingwane ivumela ukukhethwa kwebanga ngokushesha kanye nekhotheshini.
Xhumana ne-Wallis Plastic ukuze uthole amashidi angumongo we-PVC asetshenziswa ekwenzeni amakhadi, imizimba yamakhadi aphrintiwe, ama-RFID prelam inlay, amakhadi asebhange, ama-SIM card, nokukhiqizwa kwamakhadi ahlakaniphile. Thumela izidingo zakho zobuchwepheshe ukuze uthole izincomo zebanga, uhlelo lwesampula, kanye nekhotheshini ye-B2B.
