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Wholesale PVC kor shit fɔ ID, bank, SIM, akses ɛn RFID kad prodakshɔn. Kastom tiknes, saiz, kala, Vicat gred, surface dyne ɛn roughness, wit sampul tɛst ɛn ɛkspɔt pak ɔlsay na di wɔl.
WLS- PVC Core sheet
WALLIS
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| Sayz: | |
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Wallis PVC kor shit na rigid kad sabstret we dɛn divɛlɔp fɔ profeshɔnal plastic kad manufakchurin, print kad bɔdi, PVC inlay prodakshɔn, ɛn kɔntaktlɛs RFID kad strɔkchɔ. Yuz am as sɛntral strɔkchɔral layt, i de sɔpɔt kad flatnɛs, mɛkanikal trɛnk, kɔntrol fleksibiliti, printin pefɔmɛns, ɛn stebul ɔt laminɛshɔn.
Di matirial na fɔ B2B kad manifakta dɛn we de mek ID kad, bank kad, SIM kad, akses kad, ɔtel ki kad, mɛmbaship kad, gift kad, transpɔt kad, ɛn RFID smat kad. Tik, sheet dimɛnshɔn, kɔlɔ, Vicat gred, sɔfayz dayn, ɛn sɔfa rɔfnɛs kin mach to di kad kɔnstrɔkshɔn ɛn daunstrim ikwipmɛnt.
Fɔ evaluet di prɔjek, di wan dɛn we de bay fɔ sho di kayn kad we dɔn dɔn, di totɛl kad tik, di we aw dɛn de print, Overlay film ɔ inlay strɔkchɔ, di kɔndishɔn fɔ lamineshɔn, ɛn di fɔmat we dɛn nid fɔ mek di shit. Dɔn Wallis kin pripia wan fayn sampul fɔ print, lamin, panch, ɛn fɔ tɛst kad we dɔn dɔn bifo dɛn prodyuz am bɔku bɔku wan.
Di valyu dɛn we de dɔŋ ya na bay di kɔrɛnt prɔdak spɛsifikɛshɔn we dɛn gi fɔ dis pej. Faynal rikwaymɛnt dɛn fɔ kɔnfɔm bay prodak gred, aprɔv sampul, kot, ɛn batch dɔkyumentri bifo mas prodakshɔn.
| Test Aytem | Yunit | Spɛsifi k Rizult | Rilevans to Kad Prodakshɔn | |
|---|---|---|---|---|
| Tik we i tik | mm | 0.10–0.50 | Selekt akɔdin to di print kɔr, inlay, Overlay film layers, ɛn target finish-kad tik. | |
| Tik | g/cm⊃3 we de na di bɔdi; | 1,42 ± 0,05. Di wan dɛn we de wok | Sɔpɔt kɔnsistɛns shit wet, rigiditi, panch bihayvya, ɛn laminated kad strɔkchɔ. | |
| Tensile Strɔng we pɔsin kin gɛt | Bifo ɛn biɛn | MPa | ≥44 | I de ɛp di kɔr fɔ mek i nɔ strɛch ɛn mɛkanikal strɛs we i de kɔnvɔyt ɛn yuz kad. |
| Ɔp ɛn dɔŋ | ≥46 | |||
| Vicat Softening Point we dɛn kin yuz fɔ mek tin dɛn | Ɔdinari Kad Gret | °C | 78 ± 2. Di wan dɛn we de wok | Jɛnɛral print ɛn laminɛt PVC kad strɔkchɔ dɛn. |
| Bank Kad Gret | 74 ± 2. Di wan dɛn we de wok | Gret sɛlɛkshɔn fɔ mach wit di aprɔv bank-kad kɔnstrɔkshɔn ɛn lamineshɔn saykl. | ||
| SIM Kad Gret | 90 ± 2. Di wan dɛn we de wok | Higher thermal gred fɔ SIM kad bɔdi prɔsesin, sɔbjɛkt to prɔjek validɛshɔn. | ||
| Surface Dyne we de na di wɔl | dinayn/cm | ≥34 | Sɔpɔt wet ɛn ink adheshon; printin tɛst dɛn stil nid fɔ de fɔ di ink sistem we dɛn dɔn pik. | |
| Surface Roughness we di ples gɛt | Ra | μm | 0.7–1.8 | Influεns sheet fidin, ink transfכm, lamineshכn kכntakt, εn fainal sכfayz yunifכmiti. |
| Rz | 4.0–12 | |||
PVC kor shit na di strכkchכral sabstεrayt we dεn posishכn bitwin di prכtektiv Overlay film s dεm fכ wan laminated plastic kad. Dipen pan di dizayn, dɛn kin print di kɔr dairekt wan, yuz am as midul layt we nɔ print, ɔ chenj am to plein ɔ ilɛktronik inlay we go ebul fɔ put ɛntena, chip mɔdyul, ɔ ɔda tin we de wok.
difrεnt frכm Overlay film film, we de protεkt di kad sεf fכs, di kכr shit de kכntribyut mכst pan di kad bכdi in opasiti, stiffness, flat, εn dimεnshכnal stεbiliti. So kɔnsistɛns matirial prɔpati dɛn impɔtant fɔ rɛjista, laminashɔn, panch, pɔsnalayzeshɔn, ɛn ɔtomatik kad handel.
PVC Core sheet Matirial
Kad-Grɛd PVC Sabstret
Kad projɛkt dɛn nɔ fɔ pik PVC kɔr matirial bay tiknes nɔmɔ. Di gred we fit dipen bak pan di tɛmal rispɔns, di we aw dɛn de print, ɛmbaded ilɛktroniks, ɛmbos ɔ pɔsnalayzeshɔn prɔses, kad layf, ɛn di kɔmplit lamineshɔn stak.
| Kad Aplikeshɔn | Tipik Kɔr Rikwaymɛnt | Sɛlɛkshɔn Fokus | Rikɔmɛnd Valideshɔn |
|---|---|---|---|
| Standart ID, Mɛmbaship ɛn Gift Kad dɛn | Printable ɔ nɔ-printed wayt PVC kɔr wit balans rigiditi ɛn lamination rispɔns. | Tik, wayt, flat, print adheshon, day-kat, ɛn finish-kad fleksibiliti. | Print, laminate, panch, ɛn bɛnd-tɛst ripɔt kad dɛn. |
| Bank ɛn Faynanshɛl Kad dɛn | Kontrol kad-grɛd PVC mach to di apruv Overlay film , magnɛtik strɛp, chip, ɛn pɔsnalayzeshɔn prɔses. | Batch yunifom, lamineshɔn winda, ɛmbos ɔ modul ɛmbadin, ɛn lɔng tɛm kad hanlin. | Apruv di kɔmplit kad kɔnstrɔkshɔn, nɔto di kɔr sheet insay aysolɛshɔn. |
| RFID ɛn Kɔntaktlɛs Prelam inlay s | Kor ɔ bays shit kɔmpitabl wit ɛntena ɛn chip plesmɛnt plus gred lamination. | Vikat bihayvya, sheet flatnɛs, chip protɛkshɔn, ɛntena pozishɔn, ɛn bond intɛgriti. | RF pefomans, kros-sekshon, peel, lamination, en panch test. |
| SIM ɛn Tɛlikɔm Kad dɛn | Ay-tɛmpracha gred usay di aprɔv SIM kad bɔdi prɔses nid am. | Tɛmral stebiliti, panch akkuracy, modul kaviti prɔsesin, ɛn kad-bɔdi trɛnk. | Tɛmral saykl, panch, mɔdyul asɛmbli, ɛn dimɛnshɔnal chɛk. |
Jɛnɛral-pɔpɔs gred dɛn fayn fɔ ID kad, mɛmbaship kad, ɔtel ki kad, lɔyalti kad, ɛn prɔmoshɔnal kad we di sheet we yu dɔn pik kɔmpitabl wit di printa, Overlay film , laminatɔ, ɛn target kad kɔnstrɔkshɔn.
Faynansh ɔl kad prodakshɔn nid fɔ gɛt tayt kɔntrol kɔmbaynshɔn fɔ kɔr shit, Overlay film s, magnɛtik strɛp matirial, chip mɔdyul, printin, laminɛshɔn, ɛn pɔsnalayzeshɔn. Di wan dɛn we de bay fɔ gi di ful layt strɔkchɔ ɛn di aprɔval krayteria we dɛn de aks fɔ bank-kad gred.
Kɔntaktlɛs kad inlays de put ilɛktronik kɔmpɔnɛnt dɛn insay di kad bɔdi. Wan fayn PVC bays shit fɔ laminat we i nɔ shift di ɛntena ɔ aplay pasmak tɛmal ɛn mɛkanikal strɛs to di chip eria. Trayal prodakshɔn fɔ kɔnfɔm ɔl tu di kad mɛkanik ɛn RF pefɔmɛns.
SIM kad matirial kin nid difrɛn tɛmal gred ɛn kɔnvɔyt bihayvya frɔm ɔdinari PVC kad dɛn. Shit tiknes, Vicat valyu, surface prɔpati, panch layout, modul cavity, ɛn daunstrim asɛmbli fɔ spɛsifa bifo sampul pripia.
| Lay | Praymari Fɔnkshɔn | Ki Kɔmpatibiliti Chɛk |
|---|---|---|
| Na di ɔp Overlay film | I de protɛkt di printin ɛn i kin gɛt magnɛtik strɛp, ɔlogram, ɔ spɛshal kɔtin. | Bonding, surface finish, magnetic stripe posishun, ɛn pɔsnalayzeshɔn rikwaymɛnt dɛn. |
| Print PVC Kɔr | I de kɛr grafik, tɛks, sikyɔriti at wok, logo, ɛn difrɛn dizayn ɛlimɛnt dɛn. | Ink sistem, surface dyne, roughness, kala kɔnsistɛns, ɛn rɛjista. |
| Midul Kɔr ɔ RFID Inlay | Bil kad tik ɛn i kin gɛt ɛntena ɛn chip. | Vicat gred, ilɛktroniks protɛkshɔn, flatnɛs, ɛn layt tiknɛs kɔlkyulɛshɔn. |
| Rivas Printed Kɔr | Provayd rivas-sayd dizayn ɛn ɔda strɔkchɔral tiknɛs. | Print-to-print alaynɛshɔn, kɔlɔ, ɛn lamineshɔn balans. |
| Na di bɔt Overlay film | Sial ɛn protɛkt di rivays sɔfays. | Bond trɛnk, surface texture, ɛn finish-kad flatnɛs. |
Stebul shit jɔyometri de ɛp fɔ mek dɛn kɔntinyu fɔ gɛt di kad stak we dɛn want ɛn i de sɔpɔt kɔnsistɛns fidin, printin, laminɛshɔn, panch, ɛn finish-kad tik. Fɔ ay-volyum prodakshɔn, di wan dɛn we de bay fɔ gri pan di tolɛreshɔn ɛn di we aw dɛn de tek sampul na di spɛsifikɛshɔn we dɛn dɔn gri fɔ.
Surface dyne inflɔws aw printin ink de wet di PVC surface, we roughness de afɛkt transfa ɛn kɔntakt. Di dayn valyu we de na di list de gi wan sɛlɛkshɔn rɛfrɛns, bɔt di fayn ink, di we aw dɛn de mɛn am, di prɛs sɛtin dɛn, di istri we dɛn de kip di tin dɛn, ɛn di tritmɛnt we dɛn de trit di sɔfayz fɔ de na di prodakshɔn ikwipmɛnt.
Vicat softening bihayvya de infכlכw aw di sheet de rεspכnd di tεm we di hεt εn prεshכn lamineshכn de. Difrɛn kad strɔkchɔ kin nid difrɛn gred, mɔ we ɛntena, chip, magnɛtik strɛp, SIM mɔdyul, ɔ spɛshal Overlay film s involv.
Balans trɛnk ɛn fleksibiliti de ɛp fɔ ridyus krak krak, bɔr pasmak, difɔmeshɔn, ɛn kad ed dɛn we nɔ de kɔnsistɛns. Tul kondishɔn, kɔt dairekshɔn, shit kondishɔn, ɛn aktual prodakshɔn spid kin afɛkt bak kɔnvɔyt pefɔmɛns.
Print PVC card Aplikeshɔn dɛn
Smart card ɛn Inlay Aplikeshɔn dɛn
PVC kor shit kin spɛsifa fɔ ɔfset printin, silk-skrin printin, UV printin, ɔ yuz am as midul layt we nɔ print. Kɔmpatibiliti dipen pan di ɛksaktɔl sheet sɔfa ɛn ink sistɛm. Di wan dɛn we de bay fɔ gi di we aw dɛn de print ɛn du tɛst fɔ adheshon, kɔlɔ, kɔrɛkt, ɛn ɔva-laminɛshɔn.
Di kɔr shit kin kam togɛda wit PVC printin shit, Overlay film s we nɔ kɔt, Overlay film s we kɔt, magnɛtik strɛp Overlay film s, ɔ prelam inlay. Tɛmpratura, prɛshɔn, tɛm fɔ de, kol, stak simɛtri, ɛn rilis matirial fɔ bi ɔptimayz fɔ di kɔmplit kɔnstrɔkshɔn.
Fɔ kad dɛn we nɔ gɛt kɔntakt, dɛn fɔ evalyu di matirial wit di aktual ɛntena jɔyometri, di chip pozishɔn, di kaviti dizayn, di tik we di prɛlam tik, ɛn di layout fɔ di kad. RF ridin distans, rεsכnans, chip sכvayvεns, laminεshכn flat, εn panch rεjistεshכn fכ kכnfכm bifo volyum prodakshכn.
Kad panch, modul kaviti mil, hot-mɛlt ɛmbadin, ɛmbos, ɛn ɔda finish ɔpreshɔn dɛn fɔ tɛst pan di aprɔv laminated kad. Kor-shit rizulyt nכmכ nכ kin prεdikt εvri finish-kad prכsεs.
Wan klia akseptɛns plan de ridyus di agyumɛnt ɛn ripit tɛst. Dɛn fɔ gri pan di rayt limit dɛn na di spɛsifikɛshɔn fɔ bay bikɔs dɛn kin difrɛn bay gred, tik, sheet fɔmat, di we aw dɛn de print, ɛn kad program.
| Inspekshɔn Eria | Rikɔmɛnd Chɛk | Baya Disishɔn |
|---|---|---|
| Dimenshɔn dɛn | Tik, sheet lɔng ɛn waid, skwea, edj kwaliti, ɛn stak alaynɛshɔn. | Kɔnfɛm tolɛreshɔn ɛn mɛzhɔmɛnt we dɛn de yuz pan di spɛsifikɛshɔn we dɛn dɔn gri fɔ. |
| Sho | Kɔlɔ, kɔntaminɛshɔn, skrach, pinhol, rɔf, dayn lɛvɛl, ɛn print-sayd aydentifikeshɔn. | Apruv vijual limit ɛn sampul rɛfrɛns bifo mas prodakshɔn. |
| Mekanikal Prɔpati dɛn | Densiti, tɛnsiɛl trɛnk, rigiditi, fleksibiliti, panch bihayvya, ɛn finish-kad bɛnd pefɔmɛns. | Yuz di we dɛn we dɛn gri fɔ du tɛst ɛn di sɛmpul dɛn we dɛn dɔn kɔndishɔn. |
| Tɛmral ɛn Lamineshɔn Rispɔns | Vicat gred, shrinkage, warpage, bubbles, delamination, kol flatnɛs, ɛn layt rɛjista. | Validate wit di komplit prodakshɔn stak ɛn aktual laminator. |
| Print ɛn Pɔsin in yon | Ink adheshon, kala riprodakshɔn, kɔring, Overlay film bond, ɛmbos, magnɛtik strɛp, chip, ɛn pɔsnalayzeshɔn. | Apruv wan gold sampul we gɛt kad we dɔn dɔn. |
| Pakɛj ɛn Trasibiliti | Kwantiti, lɛbl, lɔt nɔmba, mɔstɔ protɛkshɔn, palet kɔndishɔn, ɛn shipmɛnt dɔkyumentri. | Difayn di lɛbl fɔmat ɛn di dɔkyumɛnt dɛn we dɛn nid na di ɔda we fɔ bay. |
Sɔbmit di prɔjek spɛsifikɛshɔn: di kayn kad, di tik we dɛn dɔn dɔn, di layt strɔkchɔ, di tik we di shit tik, di sayz we di shit gɛt, di kɔlɔ, di we aw dɛn de print, di kɔndishɔn fɔ laminɛshɔn, ɛn di dimand we dɛn kin aks fɔ ɛvri ia.
Pik wan kandidet gred: ɔdinari kad, bank-kad strɔkchɔ, RFID prelam, SIM kad, kɔr we dɛn kin print, ɔ midul kɔr we nɔ print.
Test di sheet: printability, ink adhesion, lamination, flatness, kot, panch, ɛn dimɛnshɔnal stebiliti.
Test di kad we dɔn dɔn: bɛnd, pul, chip ɔ ɛntena wok, magnɛtik strɛp, pɔsnalayzeshɔn, ɛn kad-rida kɔmpatibiliti as i apɔynt.
Apruv di golden sampul: rikodɔ di matirial gred, kɔnstrɔkshɔn, sɛtin, di we aw i luk, ɛn di krayteria fɔ aksept.
Rilis di bɔlk ɔda: yuz di aprɔv sampul ɛn spɛsifikɛshɔn as di bay ɛn kwaliti rɛfrɛns.
Prodakshɔn kɔnsistɛns dipen pan fɔmyulashɔn kɔntrol, kalenda ɔ ɛkstrushɔn stebiliti, sɔfayz tritmɛnt, tiknɛs kɔntrol, kɔt akkuracy, inspekshɔn, ɛn protɛkt pakej. Di faktri pikchɔ dɛn we de dɔŋ ya, dɛn kip dɛn frɔm di ɔrijinal prɔdak pej.
PVC di kɔr sheet dɛn fɔ pak ɛn kip fɔ mek dɛn nɔ flat, fɔ mek dɛn nɔ gɛt pawa na di say we dɛn de, fɔ mek dɛn klin, ɛn fɔ mek dɛn nɔ ebul fɔ print. Dɛn kin tɔk bɔt di kɔnfigyushɔn fɔ pak di tin dɛn akɔdin to di sheet saiz, kwantiti, transpɔt rod, ɛn di tin dɛn we di pɔsin we de bay fɔ handle.
Yuz fim ɔ bag dɛn we de protɛkt yu fɔ ridyus dɔst, mɔs, ɛn di dɔti we de na di say we yu de.
Yuz katon, rigid bod, palet, edj protɛkshɔn, ɛn sikyuɔr strap as i fit fɔ di ɔda.
Stɔr sheet dɛn flat na say we klin ɛn dray ɛn protɛkt dɛn frɔm dairekt san layt, ɔt sɔs, ɛn ebi ebi prɛshɔn we nɔ ivin.
Alaw matirial fɔ kondishɔn na di prodakshɔn ɛnvayrɔmɛnt bifo dɛn print ɔ lamin usay tɛmpracha difrɛns impɔtant.
Yuz lɔt lɛbl ɛn fɔs-in, fɔs-ɔut stok kɔntrol fɔ sɔpɔt traysabiliti ɛn kɔnsistɛns prɔsesin.
Ekspɔt Lod Protɛkshɔn
Palletized Sheet Packaging we dɛn kin yuz fɔ mek tin dɛn
Kad-fokus matirial sɔpɔt: PVC kɔr shit dɛn kin tɔk bɔt togɛda wit printabl shit, Overlay film s, magnɛtik strɛp matirial, ɛn RFID inlay strɔkchɔ.
Gret maching: sɛlɛkshɔn kin tink bɔt ɔdinari kad, bank-kad strɔkchɔ, SIM kad prodakshɔn, ɛn kɔntaktlɛs prɛlam rikwaymɛnt.
Kastom kɔnvɛnshɔn: dɛn kin rivyu di tik, saiz, kɔlɔ, di say we dɛn de, di kɔt, lɛbl, ɛn pak fɔ di prɔjek.
Sampul-fɔs prɔses: bayer dɛn kin tɛst printin, lamineshɔn, panch, ɛn finish-kad pefɔmɛns bifo dɛn gri fɔ bɔku saplai.
Ɛkspɔt ɔda sɔpɔt: spɛsifikɛshɔn kɔnfɔmeshɔn, pak kɔdineshɔn, lɔt aydentifikeshɔn, ɛn intanashɔnal shipmɛnt pripiamɛnt de fɔ ɔlsay ɔda.
| Infɔmeshɔn | Ɛgzampul | Wetin Mek I Impɔtant |
|---|---|---|
| Tayp fɔ Kad | ID kad, bank kad, SIM kad, RFID kad, ɔtel ki kad | Ditarmin di fit matirial gred ɛn validɛshɔn plan. |
| Core sheet Tik we pɔsin kin tik | 0.10–0.50mm ɔ prɔjek rikwaymɛnt | Kontrol kad stak, rigiditi, ɛn matirial kɔnsɔmshɔn. |
| Shit Sayz ɛn Kwantiti | A4, A3, prodakshɔn layout, kɔstɔm shit, kilogram ɔ shit | Nid fɔ kɔt plan, pak, prayz, ɛn lɔjistik. |
| Kɔlɔ ɛn Opasiti | Wayt, blak, kɔlɔ, ɔ kɔstɔm rɛfrɛns | Afɛkt fɔmyulashɔn, printin bakgrɔn, ɛn ɔda maching. |
| Di we aw dɛn de print | Ɔfset, silk skrin, UV , ɔ kɔr we nɔ print | Ditarmin surface pripiamɛnt ɛn sampul tɛst rikwaymɛnt. |
| Kad Layer Strukchɔ | Overlay film + print kor + RFID inlay + print kor + Overlay film | Rikwayd fɔ evaluate tiknɛs balans ɛn lamination kɔmpatibiliti. |
| Lamineshɔn Kɔndishɔn dɛn | Tɛmpratura, prɛshɔn, tɛm fɔ de, di we aw dɛn kin kol | Sɔpɔt di rayt Vicat gred sɛlɛkshɔn ɛn fɔ sɔlv prɔblɛm. |
| Dokumɛnt dɛn we dɛn nid | TDS, COA, tɛst ripɔt, pak lɛbl, kɔmplians riŋwe | Alaw fɔ kɔnfɔm di dɔkyumɛnt we de bifo yu ɔda. |
Di fizik spɛsifikɛshɔn na dis pej de list 0.10–0.50mm. Di tik we fit dipen pan di kɔmplit kad kɔnstrɔkshɔn ɛn finish-kad target. Ɔda tin dɛn we dɛn nid fɔ sɛn fɔ mek dɛn kɔnfɔm di tɛknikal ɛn prodakshɔn.
Di kɔr sheet de mek di strɔkchɔral bɔdi fɔ di kad ɛn i kin kɛr printin ɔ ilɛktronik kɔmpɔnɛnt dɛn. Overlay film kin bi wan tin we de na do we de protɛkt di printin ɛn i kin gɛt kɔtin, magnɛtik strɛp, ɔlogram, ɔ ɔda sɔfayz wok dɛn.
Yɛs. wan fayn PVC gred kin yuz as di bays ɔ strɔkchɔral layt fɔ kɔntaktlɛs prɛlam inlays. Di matirial fɔ validet wit di aktual ɛntena, chip, lamineshɔn saykl, inlay tiknes, panch layout, ɛn RF pefɔmɛns rikwaymɛnt dɛn.
Di spɛsifikɛshɔn we dɛn gi de list wan 90 ± 2°C Vicat gred fɔ SIM kad aplikeshɔn dɛn. Faynal suitabiliti fɔ kɔnfyus agens di SIM kad bɔdi strɔkchɔ, panch prɔses, modul kaviti, asɛmbli kɔndishɔn, ɛn di kɔstɔma tɛst rikwaymɛnt dɛn.
PVC kad sheet kin pripia fɔ ɔfset ɔ silk-skrin printin, bɔt di rayt gred fɔ mach di prɔses we dɛn bin want. Di wan dɛn we de bay fɔ tɛst ink wet, adheshon, curing, kala, lamination, ɛn finish-kad pefɔmɛns bifo dɛn prodyuz am bɔku bɔku wan.
Surface dyne de afɛkt ink wet ɛn adhesion, we roughness de inflɔws printin kɔntakt, sheet fidin, ɛn lamination. Dɛn tu fɔ tink bɔt togɛda wit ink kemistri, prɛs kɔndishɔn, stɔrɔj, ɛn di Overlay film we dɛn dɔn pik.
Dɛn kin rivyu di kɔstɔm rikwaymɛnt fɔ tik, dimɛnshɔn, kɔlɔ, sɔfayz dayn, rɔf, kɔt, lɛbl, ɛn pak. Fisibiliti, MOQ, lida tɛm, ɛn tolɛreshɔn dɛn dipen pan di spɛsifikɛshɔn we dɛn aks fɔ.
Test di sheet tru di komplit wokflɔ: printin, curing, lamination, kul, panch, pɔsnalayzeshɔn, chip ɔ antena prɔsesin, ɛn finish-kad tɛst. Wan golden sampul ɛn rayt spɛsifikɛshɔn fɔ apruv bifo di fɔs bɔlk ɔda.
Yes, provid di PVC kor, magnɛtik strɛp Overlay film , printin, lamination, ɛn finish-kad tiknes kɔmpitabl. Stripe pozishɔn, kɔstɔm, bond trɛnk, ɛnkɔdin, ɛn pɔsnalayzeshɔn fɔ verify pan kad dɛn we dɔn dɔn.
Fɔ pak tin dɛn kin yuz bag ɔ fim we de protɛkt pɔsin, katon ɔ rigid bod, palet, edj protɛkshɔn, strap, lɛbl, ɛn mɔstɔ protɛkshɔn akɔdin to di sheet fɔmat ɛn di we aw dɛn ship am. Di las pak plan fɔ kɔnfɔm insay di kot.
Dɛn kin tɔk bɔt di sampul we de afta dɛn dɔn gi di kad aplikeshɔn, di tik, saiz, kɔlɔ, di sɔfa we dɛn nid, ɛn di plan fɔ tɛst. I fayn fɔ mek dɛn gri fɔ sampul bifo dɛn mek am bay we dɛn mek am ɔ we gɛt bɔku bɔku mɔni.
Inklud di kayn kad, di tik we dɛn dɔn tarɛkt, di layt strɔkchɔ, di tik we di kɔr gɛt, di sheet saiz, di kɔlɔ, di we aw dɛn de print, di we aw dɛn de print, di kwantiti we dɛn kin yuz ɛvri ia, di tin dɛn we dɛn kin pak, ɛn di dɔkyumɛnt dɛn we dɛn nid. Dɛn ditil ya de alaw fɔ pik di gred kwik kwik wan ɛn kot.
Kɔntakt Wallis Plastic fɔ PVC kɔr shit dɛn we dɛn kin yuz fɔ mek kad, print kad bɔdi, RFID prelam inlay, bank kad, SIM kad, ɛn smat kad prodakshɔn. Send yu teknikol rikwaymɛnt fɔ gɛt gred rɛkɛmɔndeshɔn, sampul plan, ɛn B2B kot.
