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ID, bank, SIM, access leh RFID card siamna atana hman tur PVC core sheet wholesale. Custom thickness, size, color, Vicat grade, surface dyne leh roughness te, khawvel pumah sample test leh export packaging te a awm bawk.
WLS-PVC Core Sheet hmanga siam a ni
WALLIS chuan a rawn ti a
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Wallis PVC core sheet hi professional plastic card siamna atana siam, printed card body, PVC inlay siamna, leh contactless RFID card structure siamna atana siam rigid card substrate a ni. Central structural layer anga hman a nih avangin card flatness, mechanical strength, controlled flexibility, printing performance, leh stable heat lamination te a support a ni.
He material hi B2B card siamtute tan ruahman a ni a, ID card, bank card, SIM card, access card, hotel key card, membership card, gift card, transport card, leh RFID smart card siamtute tan a ni. Thickness, sheet dimension, color, Vicat grade, surface dyne, leh surface roughness te hi card siam dan leh downstream equipment te nen a inmil thei a ni.
Project evaluation atan hian card lei duhte chuan card siam zawh tawh chi, card thickness zawng zawng, printing process, overlay emaw inlay structure, lamination condition, leh sheet format mamawh te an tarlang tur a ni. Chumi hnuah Wallis chuan bulk production hmain printing, lamination, punching, leh finished-card testing atan sample tling tak a buatsaih thei a ni.
A hnuaia value te hi he page atana product specification pek mek atanga lak a ni. Final requirements chu mass production hmain product grade, approved sample, quotation, leh batch documentation hmanga confirm tur a ni.
| Test Item | Unit-in | Result Relevance a tarlan | Card siamna atana | |
|---|---|---|---|---|
| Thickness a ni | mm | 0.10–0.50 inkar a ni | Printed core, inlay, overlay layer, leh target finished-card thickness a zirin thlan a ni. | |
| Sakhal zawng | g/cm⊃3 a ni a; | 1.42 ± 0.05 a ni | Sheet weight mumal tak, rigidity, punching behavior, leh laminated card structure te a support bawk. | |
| Tensile chakna a nei | Khamphei | MPa | ≥44 a ni | Converting leh card hman laiin core chu stretching leh mechanical stress do turin a pui thin. |
| Ding ngil | ≥46 a ni | |||
| Vicat Softening Point a ni | Card pangngai Grade a ni | °C a ni | 78 ± 2 a ni | PVC card structure hrang hrang, print leh laminated hmanga siam a ni. |
| Bank Card Grade a ni | 74 ± 2 a ni | Grade thlan chu bank-card siam leh lamination cycle pawm tawh nen a inmil tur a ni. | ||
| SIM Card Grade a ni | 90 ± 2 a ni | SIM card body processing atan thermal grade sang zawk, project validation a awm tur a ni. | ||
| Surface Dyne hmanga siam a ni | dynes/cm a ni | ≥34 a ni | Wetting leh ink adhesion a thlawp a; ink system thlan bik atan chuan printing test neih a ngai reng a ni. | |
| Surface Roughness a awm | Ra | μm a ni | 0.7–1.8 inkar a ni | Sheet feeding, ink transfer, lamination contact, leh final surface uniformity te a nghawng a ni. |
| Rz | 4.0–12-ah a awm | |||
PVC core sheet chu laminated plastic card-a protective overlay inkara structural substrate dah a ni. Design a zirin core chu direct-a print theih a ni a, non-printed middle layer atan hman theih a ni a, antenna, chip module emaw functional component dang emaw dah theihna tur plain emaw electronic inlay-ah emaw siam theih a ni bawk.
Overlay film ang lo takin, card chunglam a venghim ber a, core sheet hian card body opacity, stiffness, flatness leh dimensional stability tam zawk a thawhpui a ni. Chuvangin registration, lamination, punching, personalization, leh automated card handling atan hian material property inmil tak a pawimawh hle.
PVC Core Sheet hmanga siam a ni
Card-Grade PVC Substrate hmanga siam a ni
Card project-ah chuan PVC core material chu thickness chauh hmanga thlan tur a ni lo. Grade dik tak chu thermal response, printing method, embedded electronics, embossing emaw personalization process, card dam chhung, leh lamination stack kimchang takah a innghat bawk.
| Card hman dan | tlangpui Core mamawh | thlan Focus | Recommended Validation |
|---|---|---|---|
| Standard ID, Membership leh Gift Card te a awm bawk | Printable emaw non-printed emaw PVC core dum, rigidity leh lamination response inthlau tak nei. | Thickness, whiteness, flatness, print adhesion, die-cutting, leh finished-card flexibility te a awm bawk. | Print, laminate, punch, leh bend-test aiawhtu card te a awm bawk. |
| Bank leh Financial Card te a ni | Controlled card-grade PVC chu overlay, magnetic stripe, chip, leh personalization process pawm tawh nen a inmil a ni. | Batch uniformity, lamination window, embossing emaw module embedding emaw, hun rei tak chhunga card hman dan te. | Card siam kim chu pawm la, core sheet chu a hranpaa pawm ni lovin. |
| RFID leh Contactless Prelam Inlays hmanga siam a ni | Core emaw base sheet emaw antenna leh chip dahna bakah graded lamination nena inmil. | Vicat awm dan, sheet flatness, chip venhimna, antenna awmna, leh bond integrity te a awm bawk. | RF performance, cross-section, peel, lamination, leh punching test te a awm bawk. |
| SIM leh Telecom Card hmanga siam a ni | SIM card body process pawm tawhin a mamawhna hmunah temperature sang zawk grade. | Thermal stability, punching dikna, module cavity processing, leh card-body chakna te a awm bawk. | Thermal cycle, punch, module assembly, leh dimensional check te a awm bawk. |
General-purpose grade hi ID card, membership card, hotel key card, loyalty card, leh promotional card atan a tha a, chu chu sheet thlan chu printer, overlay, laminator, leh target card siamna nena inmil a nih chuan a ni.
Financial card siam nan hian core sheet, overlay, magnetic stripe material, chip module, printing, lamination, leh personalization te khauh taka control a ngai a ni. Buyers te chuan bank-card grade dil hunah full layer structure leh approval criteria an pe tur a ni.
Contactless card inlays hian card body chhungah electronic components a dah a. PVC base sheet tha tak chu antenna shift lovin emaw, chip area-ah thermal leh mechanical stress nasa lutuk pe lovin laminate tur a ni. Trial production hian card mechanics leh RF performance pahnih hi a nemnghet tur a ni.
SIM card materials hian PVC card pangngai aiin thermal grade leh converting behavior danglam tak a mamawh thei a ni. Sample buatsaih hmain sheet thickness, Vicat value, surface property, punching layout, module cavity, leh downstream assembly te tarlan hmasak tur a ni.
| Layer -a PVC Core Sheet hnathawh | dan Primary Function | Key Compatibility Check |
|---|---|---|
| Top Overlay a ni | Printing a venghim a, magnetic stripe, hologram, emaw specialty coating emaw a keng tel thei bawk. | Bonding, surface finish, magnetic stripe position, leh personalization mamawh te a ni. |
| PVC Core tihchhuah a ni | Graphics, text, security artwork, logo, leh design element hrang hrang a keng tel bawk. | Ink system, surface dyne, roughness, rawng inmilna, leh registration te a awm bawk. |
| Middle Core emaw RFID Inlay emaw a ni thei | Card thickness a siam a, antenna leh chip a awm thei bawk. | Vicat grade, electronics venhimna, flatness, leh layer thickness chhiar dan te a ni. |
| Reverse Printed Core a ni | Reverse-side design leh structural thickness dang a pe bawk. | Print-to-print alignment, rawng leh lamination balance te a awm bawk. |
| A hnuai lam Overlay a ni | Reverse surface chu a seal a, a humhim bawk. | Bond chakna, surface texture, leh finished-card flatness te a ni. |
Stable sheet geometry hian card stack ruahman chu a vawng reng thei a, feeding, printing, lamination, punching, leh finished-card thickness te pawh a support bawk. High-volume production atan chuan buyers te chuan approved specification ah tolerances leh sampling methods te chu an inrem tur a ni.
Surface dyne hian printing ink-in PVC surface a hnim dan a nghawng a, roughness erawh chuan transfer leh contact a nghawng thung. Dyne value listed hian selection reference a pe a, mahse final ink, curing method, press settings, storage history, leh surface treatment te chu production equipment-ah verified tur a ni.
Vicat softening behavior hian heat leh pressure lamination-a sheet-in a chhan dan a nghawng a ni. Card structure hrang hrangah hian grade hrang hrang a ngai thei a, a bik takin antenna, chip, magnetic stripe, SIM module emaw specialty overlay emaw a awm chuan.
Balanced strength leh flexibility hian cracking, burrs tam lutuk, deformation leh card edge inmil lo te a tihziaawm thei a ni. Tool condition, cutting direction, sheet conditioning, leh actual production speed te hian converting performance a nghawng bawk.
Printed PVC Card hman dan tur
Smart Card leh Inlay hmanga hman theih a ni
PVC core sheet hi offset printing, silk-screen printing, UV printing atan emaw, non-printed middle layer atan emaw hman theih a ni. Compatibility hi sheet surface dik tak leh ink system ah a innghat. Buyers te chuan printing process an pe tur a ni a, adhesion, color, curing, leh over-lamination test te an nei tur a ni.
Core sheet hi PVC printing sheet, uncoated overlay, coated overlay, magnetic stripe overlay, emaw prelam inlay te nen a inzawm thei bawk. Temperature, pressure, dwell time, cooling, stack symmetry, leh release materials te chu a sak zawh theih nan a tha ber tur a ni.
Contactless card tan chuan material chu antenna geometry tak tak, chip position, cavity design, prelam thickness, leh card layout te nen evaluate tur a ni. Volume siam hmain RF reading distance, resonance, chip survival, lamination flatness, leh punching registration te chu confirm hmasak phawt tur a ni.
Card punching, module cavity milling, hot-melt embedding, embossing, leh finishing operation dangte chu approved laminated card-ah test tur a ni. Core-sheet result chauh hian finished-card process zawng zawng a sawi lawk thei lo.
Acceptance plan chiang tak chuan inhnialna leh test nawn lehna a ti tlem a ni. A limit dik tak chu purchase specification-ah hian inrem tur a ni a, a chhan chu grade, thickness, sheet format, printing method, leh card program-ah te a inang lo thei a ni.
| Inspection Area | Recommended Check | Buyer thutlukna |
|---|---|---|
| Dimension hrang hrang | Thickness, sheet sei zawng leh zau zawng, squareness, edge quality, leh stack alignment te a awm bawk. | Specification pawm tawhah tolerances leh measuring method te chu nemnghet rawh. |
| Pawnlang | A rawng, bawlhhlawh, scratch, pinhole, roughness, dyne level, leh print-side identification te a awm bawk. | Mass production hmain visual limit leh sample reference pawm. |
| Mechanical lama thil awm dan | Density, tensile strength, rigidity, flexibility, punching behavior leh finished-card bend performance te a awm bawk. | Test dan inremna leh conditioned sample hmang rawh. |
| Thermal leh Lamination hmanga chhanna a ni | Vicat grade, shrinkage, warpage, bubbles, delamination, cooling flatness, leh layer registration te a awm bawk. | Production stack kimchang leh laminator tak tak hmangin validate rawh. |
| Printing leh Personalization tih te | Ink adhesion, color reproduction, curing, overlay bond, embossing, magnetic stripe, chip, leh personalization te a awm bawk. | Finish-card rangkachak sample chu pawm rawh. |
| Packaging leh Traceability te a awm bawk | Quantity, label, lot number, moisture laka invenna, pallet condition, leh shipment documentation te a awm bawk. | Purchase order-ah label format leh document mamawh te sawifiah rawh. |
Project specification submit rawh: card chi, finished thickness, layer structure, sheet thickness, sheet size, color, printing process, lamination condition, leh kum tin mamawh.
Candidate grade thlang rawh: card pangngai, bank-card structure, RFID prelam, SIM card, printable core, emaw non-printed middle core emaw.
Sheet chu test rawh: printability, ink adhesion, lamination, flatness, cutting, punching, leh dimensional stability te.
Card siam zawh tawh chu test rawh: bend, peel, chip emaw antenna function, magnetic stripe, personalization, leh card-reader compatibility a tul angin.
Golden sample pawm rawh: material grade, a sak dan, a setting, a lan dan, leh pawm dan tur tehfung ziak rawh.
Bulk order chu chhuah tir rawh: approved sample leh specification chu purchasing leh quality reference atan hmang rawh.
Production consistency chu formulation control, calendar emaw extrusion stability, surface treatment, thickness control, cutting accuracy, inspection, leh protected packaging-ah a innghat a ni. A hnuaia factory images te hi original product page atanga lak chhuah a ni.
PVC core sheet te hi a flatness, surface energy, fai, leh printability te humhim turin pack leh dahkhawm tur a ni. Packaging configuration hi sheet size, quantity, transport route, leh buyer handling mamawh dan azirin sawiho theih a ni.
Leivut, tui, leh lei chung bawlhhlawh tihtlem nan protective film emaw bag emaw hmang rawh.
Carton, rigid board, pallet, edge protection, leh order ang zela secure strapping hmang rawh.
Sheet te chu hmun thianghlim leh vawt takah flat takin dah la, ni êng direct, lumna leh pressure inang lo nasa tak lakah venhim rawh.
Printing emaw lamination emaw hmain temperature danglamna nasa tak awmna hmunah material chu production environment-ah condition tir rawh.
Traceability leh consistent processing support turin lot label leh first-in, first-out stock control hmang rawh.
Export Loading laka invenna a ni
Palletized Sheet hmanga thil siam chhuah a ni
Card-focused material support: PVC core sheet te hi printable sheet, overlay, magnetic stripe material, leh RFID inlay structure te nen sawiho theih a ni.
Grade matching: thlannaah hian card pangngai, bank-card structure, SIM card siam dan, leh contactless prelam mamawh te ngaihtuah theih a ni.
Custom conversion: a thickness, size, color, surface characteristics, cutting, labeling, leh packaging te chu project atan hian enfiah theih a ni.
Sample-first process: lei duhtute chuan bulk supply an pawm hmain printing, lamination, punching, leh finished-card performance te an test thei ang.
Export order support: specification confirmation, packing coordination, lot identification, leh international shipment buatsaih dan te chu wholesale order atan a awm a.
| Entirna | A | Pawimawh |
|---|---|---|
| Card chi hrang hrang | ID card, bank card, SIM card, RFID card, hotel key card te pawh a awm bawk | Material grade leh validation plan dik tak a ruat thin. |
| Core Sheet a thuk zawng a ni | 0.10–0.50mm emaw project mamawh a ni | Card stack, rigidity, leh material hman dan a control. |
| Sheet Size leh A zat | A4, A3, production layout, custom sheet, kilogram emaw sheet emaw a ni thei | Cutting plan, packaging, pricing, leh logistics atan a mamawh. |
| Color leh Opcity a ni | Var, dum, rawng, emaw custom reference emaw a ni | Formulation, printing background, leh order matching te a nghawng a ni. |
| Printing tih dan tur | Offset, silk screen, UV, emaw non-printed core emaw a awm thei | Surface buatsaih dan leh sample test mamawh tur a ruat thin. |
| Card Layer siam dan tur | Overlay + printed core + RFID inlay + printed core + overlay tih a ni | Thickness balance leh lamination compatibility tehna atan a ngai. |
| Lamination awm dan tur | Temperature, pressure, a awm chhung, a lum dan te | Vicat grade dik thlan leh harsatna chinfel dan tur a support. |
| Document mamawh te | TDS, COA, test report, packaging label, zawm tur dilna te a awm bawk | Order hmain document awm leh awm loh confirm theih a ni. |
He page-a physical specification-ah hian 0.10–0.50mm a awm. Thickness dik tak chu card siam zawh tawh leh finished-card target-ah a innghat a ni. Thil tul dangte chu technical leh production confirmation atan thehluh tur a ni.
Core sheet hian card structural body a siam a, printing emaw electronic component emaw a keng tel thei bawk. Overlay chu a tlangpuiin pawn lam layer te zawk, printing humhimtu a ni a, coatings, magnetic stripes, holograms emaw, surface function dang emaw a awm thei bawk.
Awle. PVC grade tling tak chu contactless prelam inlays base emaw structural layer atan hman theih a ni. Material chu antenna tak tak, chip, lamination cycle, inlay thickness, punching layout, leh RF performance mamawh tak tak nen a validate tur a ni.
Specification supply-ah hian SIM card hmanna tur 90 ± 2°C Vicat grade a awm. Final suitability chu SIM card body structure, punching process, module cavity, assembly condition, leh customer test mamawh dan nen a inmil tur a ni.
PVC card sheet hi offset emaw silk-screen printing atan siam theih a ni a, mahse grade dik tak chu a tum angin a inmil tur a ni. Buyers te chuan bulk production hmain ink wetting, adhesion, curing, color, lamination, leh finished-card performance te an test hmasa tur a ni.
Surface dyne hian ink wetting leh adhesion a nghawng a, roughness hian printing contact, sheet feeding leh lamination te a nghawng thung. An pahnih hian ink chemistry, press condition, storage, leh overlay thlan te nen ngaihtuah dun tur a ni.
Custom mamawh chu a thickness, dimensions, color, surface dyne, roughness, cutting, labeling, leh packaging te enfiah theih a ni. Feasibility, MOQ, lead time, leh tolerances te hi specification dil danah a innghat a ni.
Sheet chu workflow kimchang tak hmangin test rawh: printing, curing, lamination, cooling, punching, personalization, chip emaw antenna processing, leh finished-card testing te. Bulk order hmasa ber hmain golden sample leh written specification pawm hmasak phawt tur a ni.
Ni e, PVC core, magnetic stripe overlay, printing, lamination, leh finished-card thickness te a inmil phawt chuan. Stripe position, coercivity, bond strength, encoding, leh personalization te chu card siam zawh tawhah te enfiah tur a ni.
Packaging-ah hian sheet format leh shipment method angin protective bag emaw film emaw, carton emaw rigid board, pallet, edge protection, strapping, label, leh moisture protection te hman a ni tlangpui. Packing plan hnuhnung ber chu quotation-ah hian confirm tur a ni.
Card hman dan tur, a thickness, size, color, surface requirement, leh testing plan te pek a nih hnuah sample awm theih dan tur sawiho theih a ni. Customized emaw high-volume emaw siam hmain sample approval hmasak phawt a tha.
Card chi, target finished thickness, layer structure, core thickness, sheet size, color, printing method, lamination settings, kum khata quantity, packaging, leh documentation mamawh te pawh a tel. Heng details te hian grade thlan leh quotation rang zawk a phalsak a ni.
Card siamna atana hman, printed card body, RFID prelam inlay, bank card, SIM card, leh smart card siamna atana hman tur PVC core sheet te chu Wallis Plastic hnenah zawhfiah theih a ni. Grade recommendation, sample plan, leh B2B quotation dawng turin i technical mamawh te thawn rawh.
