Custom 125kHz and 13.56MHz RFID PVC Prelam Inlay Sheets
Wallis supplies 125kHz LF, 13.56MHz HF and LF + HF dual-frequency RFID PVC prelam inlay sheets for access-control cards, employee IDs, hotel key cards, membership cards, campus cards, transport credentials and system-migration projects. Each sheet integrates the selected chip, tuned antenna and plastic support layers, ready for final card lamination, printing, punching and personalization.
Standard layout references include 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 and 4 × 10. Custom sheet sizes, card pitches, chip positions, antenna geometries, material structures and thicknesses can be developed for the buyer’s lamination plates, printing sheets and punching tools.
Frequency alone does not prove compatibility. TK4100, EM4200 and ATA5577-type low-frequency products have different read-only or read/write behavior, coding and configuration options. HF chips may use ISO/IEC 14443 Type A, ISO/IEC 14443 Type B, ISO/IEC 15693 or NFC Forum specifications. The exact reader, chip model, protocol, memory, security and application software must be confirmed before antenna design and mass production.
| Product Type | LF, HF or dual-frequency RFID prelaminated inlay sheet for plastic-card manufacturing |
| Frequency Options | 125kHz LF, 13.56MHz HF, LF + HF hybrid and project-specific multi-technology structures |
| Standard Layouts | 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5, 4 × 10 and custom card layouts |
| Original LF Thickness Reference | Approximately 0.50–0.60mm for selected LF structures; exact thickness depends on chip, antenna, material and final card stack |
| Material Options | White or transparent PVC; PETG and polycarbonate-compatible structures subject to separate qualification |
| Antenna Options | Embedded copper-wire LF/HF coils, etched aluminum HF antennas and custom dual-antenna designs |
| B2B Support | Chip selection, antenna engineering, CAD layout, samples, lamination trials, RF testing, encoding, QC reports and export supply |
Request RFID Prelam Samples and Quote
What Is an RFID PVC Prelam Inlay Sheet?
An RFID prelam inlay is the internal functional sheet used to manufacture a contactless plastic card. The antenna, integrated circuit and electrical connections are embedded between plastic layers before the buyer adds printed core sheets and transparent overlays. The completed stack is laminated, cooled, punched and personalized into finished cards.
A Prelam Is Not a Finished Printable Card
The prelam normally carries no customer artwork. Printing is applied to separate front and back core sheets, helping protect the chip and antenna while allowing controlled color, overlay and security-feature production.
LF and HF Use Separate Antenna Systems
A dual-frequency card contains separate LF and HF circuits. The two chips do not become one protocol. Each frequency must be designed, tuned, read and—where supported—written through the appropriate reader interface.
The Finished Card Determines Real Performance
Printed layers, metalized graphics, magnetic stripes, adhesives, card thickness, nearby metal and reader geometry can change RF performance. Qualification should therefore include the fully laminated and punched card, not only the bare prelam.
![125kHz LF RFID PVC prelam inlay sheet with embedded chip and copper antenna coil]( "125kHz LF RFID PVC Prelam Inlay Sheet")
125kHz LF Chip and Coil Structure
![RFID PVC prelam inlay sheet with multi-card layout for smart card lamination]( "RFID PVC Prelam Inlay Sheet Layout")
Multi-Card Sheet for Industrial Lamination
Single-Frequency and Dual-Frequency Product Options
| Inlay Type | Construction | Typical B2B Use |
| 125kHz LF Prelam | One LF chip and one tuned low-frequency copper coil | Legacy proximity access, parking, membership and identification systems |
| 13.56MHz HF Prelam | One HF chip and one ISO/NFC-compatible antenna selected for the application | Secure access, transport, campus, hotel, NFC and multi-application cards |
| LF + HF Dual-Frequency Prelam | Separate LF and HF chips with separate coils inside one card body | Migration from legacy 125kHz readers to modern HF smart-card infrastructure |
| LF + UHF or HF + UHF | Multiple chips and frequency-specific antennas in one structure | Access plus longer-range vehicle, asset or personnel tracking |
| Contact + Contactless Hybrid | RFID prelam plus a milled contact-module cavity or dual-interface architecture | Secure identity, telecom, banking or regulated credential projects after qualification |
Dual-Frequency Cards Support Migration
Organizations can issue one credential that works with older LF readers and newer HF readers while infrastructure is upgraded. The access-control database must still map and manage the identifiers or applications from both technologies.
Hybrid Inlays Require Separate Engineering
Adding a second chip increases local thickness, antenna congestion, material flow and test complexity. A single-frequency design should not be converted to dual frequency without a new layout, lamination trial and RF qualification.
LF 125kHz Chip Selection
| LF Chip Option | Read / Write Positioning | Typical Use | B2B Buying Note |
| TK4100-Type | Common legacy read-only proximity configuration; exact supplier and encoding must be confirmed | Basic access-control and identification systems | Provide a reader sample and required output format; do not assume all “TK4100” products are identical |
| EM4200 | Factory-programmed low-frequency read-only identification IC | Access control, waste management and selected identification formats | Confirm code length, modulation, mask option and reader compatibility before production |
| ATA5577 / T5577-Type | Programmable LF read/write transponder with configurable modulation and coding | Configurable identification, migration, testing and compatible legacy formats | Define configuration block, data format, password, lock bits and programming verification |
| EM4305 / Other R/W LF | Read/write LF options available for application-specific formats | Access, industrial identification and programmable credentials | Confirm exact IC status, memory, protection and programmer support |
Read-Only and Read/Write LF Chips Are Different Products
EM4200-type credentials normally transmit a factory-programmed identifier, while ATA5577-type devices can be configured and written by a compatible programmer. The quotation should state whether the buyer needs a fixed number, customer encoding or a programmable blank.
ISO 11784/11785 Compatibility Is Configuration-Specific
These standards are associated with animal-identification data structures and air-interface formats. They should not be applied as a blanket claim to every TK4100, EM4200 or T5577 access card. Confirm the exact chip, configuration and reader system.
HF 13.56MHz Chip Selection
| HF Chip Family | Protocol Direction | Typical Application | Selection Note |
| MIFARE Classic / Compatible Legacy 1K | ISO/IEC 14443 Type A legacy ecosystem | Installed access, ticketing and older closed-loop systems | Use where existing infrastructure requires it; evaluate modern secure alternatives for new systems |
| MIFARE Ultralight | ISO/IEC 14443 Type A environment | Limited-use tickets, events and simple contactless programs | Confirm memory, originality, password and lifecycle requirements |
| NTAG 213 / 215 / 216 | NFC Forum Type 2 Tag and ISO/IEC 14443 Type A | NFC business cards, mobile links, authentication and digital engagement | Choose by NDEF memory, URL length, password and originality requirements |
| MIFARE DESFire EV3 | ISO/IEC 14443 Type A with secure higher-layer applications | Secure access, campus, transport, identity and multi-application cards | Requires application design, key management, personalization and reader/software integration |
| ICODE / ISO 15693 Family | ISO/IEC 15693 and NFC Forum Type 5 positioning | Library, asset, vicinity-card and longer-coupling-distance applications | Reader protocol and antenna size differ from ISO/IEC 14443 Type A systems |
“13.56MHz Compatible” Is Not a Complete Specification
A reader can operate at 13.56MHz and still support only selected standards or commands. Specify Type A, Type B, ISO 15693 or NFC Forum support plus the exact chip model and application software.
Secure Chips Require Secure Personalization
Supplying a DESFire-class chip does not automatically create a secure credential. Keys, applications, access rights, diversification, issuer procedures and backend authentication must be engineered separately.
![TK4100 type 125kHz RFID PVC prelam inlay sheet for access card manufacturing]( "TK4100 RFID PVC Inlay Sheet")
LF Proximity Inlay Option
![RFID PVC prelam sheet example for LF HF and dual-frequency card production]( "RFID Prelam Inlay Sheet Example")
Custom Chip and Antenna Integration
Dual-Frequency Antenna and Card Engineering
| Engineering Factor | Dual-Frequency Requirement |
| Antenna Separation | Position LF and HF coils to reduce physical overlap, pressure concentration and unintended coupling |
| Chip Position | Keep both chips clear of punching lines, slots, contact-module cavities and high-pressure zones |
| Local Thickness | Compensate for two ICs, coil crossovers and connection points without creating visible bumps |
| LF Tuning | Match the LF coil and chip capacitance to the reader frequency, coding and target read performance |
| HF Tuning | Tune the HF antenna with the final chip, card stack, printed layers and intended reader |
| System Mapping | Define how the LF identifier and HF UID/application relate to one cardholder record |
| End-User Verification | Test the same finished card on every required legacy and new reader model |
Reader Support Must Be Verified for Both Frequencies
A dual-frequency reader may support only selected LF formats and selected HF protocols. Supply the reader brand, model, firmware and expected output so the card can be tested against the actual system.
Read Range Must Be Specified by Test Method
LF and HF read distances differ and depend on reader power, antenna geometry, card orientation, coding, final card stack and environment. Use separate pass/fail distances and test fixtures for each interface.
Sheet Layout, Size and Thickness Planning
| Parameter | Original / Available Option | B2B Control Point |
| 2 × 5 | A4 reference 210 × 297mm | Confirm card pitch, edge margins, antenna orientation and registration holes |
| 3 × 7 | Approximately 295 × 460mm | Match printed core, lamination plate and punching tool |
| 3 × 8 | Approximately 295 × 485mm | Define artwork registration and card numbering direction |
| 4 × 8 / 5 × 5 / 4 × 10 | Higher-output industrial layouts | Control sheet flatness, antenna spacing and electrical test access |
| Custom Layout | Custom cards, key fobs, mini cards and proprietary tools | Provide CAD, finished outline, cutting clearance and chip/antenna coordinates |
| LF Thickness Reference | Approximately 0.50–0.60mm from the original page | Confirm average, local chip-zone gauge and finished-card calculation |
| Dual-Frequency Thickness | Project-specific and normally influenced by two chips and two antenna systems | Approve thickness map, card flatness and local pressure compensation |
Prelam Thickness Is Not Finished Card Thickness
A common CR80/ID-1 card is designed around a nominal thickness near 0.76mm, but the final result depends on printed cores, overlays, adhesive flow, chip zones and lamination compression. Measure the conditioned finished card.
Layout Must Match the Buyer’s Tooling
“3 × 8” does not define every sheet dimension, registration mark or card pitch. The final drawing should be signed before antenna production because punching and chip position errors can destroy electrical yield.
![PVC RFID prelam inlay sheet layout with card positions antenna zones and registration marks]( "PVC RFID Inlay Sheet Layout")
Custom Sheet Layout and Registration
![HF RFID PVC prelam inlay sheet for F08 and MIFARE type smart card production]( "F08 and M1 HF RFID PVC Inlay Sheet")
HF Chip and Antenna Layout Option
Finished Smart Card Layer Structure
| Layer | Function | Key Control |
| Front Overlay | Protects print and provides gloss, matte, frosted or security finish | Gauge, bonding, abrasion and personalization compatibility |
| Front Printed Core | Carries graphics, text, logos and security print | Registration, ink cure, shrinkage and metallic-print clear zones |
| RFID Prelam Inlay | Contains one or more chips, antennas and electrical connections | RF tuning, chip position, thickness, electrical yield and alignment |
| Back Printed Core | Balances the front and carries reverse-side artwork | Layer balance, stripe position and print coverage |
| Back Overlay | Protects the card and may include magnetic stripe or signature panel | Bonding, flatness, encoding and final surface |
Metallic Foil and Conductive Ink Can Change RF Performance
Large metallic areas near the HF antenna may reduce coupling or shift resonance. Include all metalized print, holographic foil and magnetic components in the final card RF test.
Balanced Layers Reduce Warpage
Similar front and back gauges, controlled material direction and balanced print coverage can reduce curl. Dual-frequency structures need additional attention because chip and antenna locations may be asymmetrical.
Lamination Process for LF, HF and Hybrid Inlays
Approve the stack drawing: Record every overlay, printed core, inlay, adhesive, stripe and security layer.
Condition the materials: Stabilize sheets in a clean production environment and protect them from dust and moisture.
Verify orientation: Match card pitch, chip positions, antenna zones, artwork and punching marks.
Develop the heat cycle: Establish temperature, pressure, dwell, release material and cooling for the exact construction.
Protect chip zones: Avoid hard particles, excessive local pressure and plate defects over either chip.
Cool under controlled pressure: Cooling affects flatness, chip stress, bonding and RF consistency.
Test the laminated sheet: Inspect thickness, position, appearance and both RF interfaces before punching.
Verify finished cards: Punch, personalize, encode and test LF and HF performance on the intended systems.
| Common Risk | Possible Cause | Corrective Direction |
| Chip Failure | Excessive heat, pressure, ESD or weak chip connection | Review chip limits, process pressure, ESD control and connection quality |
| Open Coil | Broken conductor, poor joint, cutting damage or excessive material movement | Inspect continuity, conductor path, joint strength and punch clearance |
| Weak LF or HF Range | Detuning, reader mismatch, card-stack change or metallic interference | Retune and test each interface with the completed card and target reader |
| Visible Chip Bump | Insufficient gauge compensation or excessive local thickness | Optimize cavities, layer gauges, cushioning and pressure distribution |
| Delamination | Contamination, incompatible materials, low heat or poor cooling | Review material compatibility, cleaning, heat cycle and peel strength |
| Card Warpage | Unbalanced stack, overheating, uneven pressure or rapid cooling | Balance layers and optimize heating, plate flatness and cooling |
Electrical, RF and Mechanical Quality Control
| Inspection Item | Recommended B2B Control |
| Chip Identity | Verify manufacturer, exact part number, frequency, protocol, memory and lot traceability |
| LF Functional Test | Read the defined ID or programmed blocks with the agreed LF reader and output format |
| HF Functional Test | Read UID and selected commands, memory or application according to the exact HF chip |
| Antenna Continuity | Detect open circuits, shorts, weak joints and conductor defects for both coils |
| RF Performance | Use separate LF and HF test fixtures, reader models, orientations and pass distances |
| Chip and Antenna Position | Check against CAD, card outline, punching clearance, slots and module cavities |
| Sheet Dimensions | Length, width, squareness, card pitch, registration holes and edge quality |
| Thickness and Flatness | Average thickness, local chip zones, bow, curl and point-to-point variation |
| Finished Card Test | LF/HF operation, dimensions, bending, torsion, heat, humidity, peel and reader compatibility |
| Traceability | Chip lots, antenna design, PVC lot, sheet number, test program, inspection result and packing record |
Define the Scope of “100% Inspection”
Full electrical reading at every card position can be specified, while destructive peel, bending and cross-section tests normally use sampling. The purchase specification should define commands, readers, fixtures, limits and reports.
Dual-Frequency Yield Must Cover Both Interfaces
A card that passes LF but fails HF—or passes HF but fails LF—is not a conforming dual-frequency card. Acceptance criteria should require both technologies to pass on the same finished card position.
Applications for LF, HF and Dual-Frequency Cards
| Application | Recommended Technology Direction | Critical Validation |
| Legacy Access Control | 125kHz read-only or programmable LF chip required by the installed reader | Reader format, ID output, card orientation and access database |
| Access-System Migration | LF + secure HF dual-frequency credential | Both reader populations, identity mapping, key management and rollout plan |
| Hotel Key Cards | Chip specified by the hotel-lock platform; dual technology when mixed locks exist | Encoder, lock firmware, card thickness, humidity and repeated use |
| Employee and Campus IDs | HF secure application or LF + HF during migration | Door access, attendance, payment, printing and lifecycle |
| NFC Membership and Marketing | NTAG or another NFC Forum compatible HF chip | Phone compatibility, NDEF data, URL security and antenna position |
| Transport and Secure Multi-Application | Secure HF chip and certified system architecture | Transaction performance, cryptography, key injection and scheme approval |
Encoding, UID and Security Management
| Data Item | Required Definition |
| LF Identifier | Fixed factory code, programmed format, facility code, card number and output order |
| HF UID / CSN | UID length, fixed or random behavior, database format and reader interpretation |
| HF Memory / Application | NDEF, sectors, pages, files, access rights, counters and lock state |
| Keys and Passwords | Ownership, generation, injection, diversification, transport and audit trail |
| Dual-ID Mapping | Relationship between LF number, HF UID/application and printed card number |
| Reconciliation | Duplicate, missing, rejected and destroyed card records across both interfaces |
UID or Serial Number Alone Is Not Strong Authentication
Public identifiers may be copied or emulated. Security-sensitive systems should use appropriate cryptographic authentication, backend controls and issuer procedures instead of relying only on a visible or readable number.
Key Injection Is a Separate Secure Process
A secure HF chip requires controlled application creation and key loading. Define the secure environment, data exchange, verification, rejected-card handling and audit requirements before production.
Prototype, OEM and Change-Control Process
Requirement review: Confirm readers, chips, protocols, card layout, card stack and test limits.
Engineering drawing: Approve sheet size, card pitch, chip positions, antenna paths and cutting clearances.
Prototype inlay: Produce a small engineering batch for electrical, RF, thickness and lamination trials.
Finished-card test: Print, laminate, punch, encode and test cards on all required systems.
Golden sample approval: Sign the approved card, data structure, reader test and visual standard.
Bulk production: Control chip lot, antenna process, dimensions, electrical testing and traceability.
Change control: Obtain approval before changing chip source, package, antenna, PVC, adhesive, layout or test equipment.
Stock Samples and Custom Prototypes Serve Different Purposes
A stock sample demonstrates general workmanship. A custom prototype verifies the exact chip, antennas, layout, card stack, readers and lamination equipment required by the buyer.
MOQ Depends on Chip and Antenna Customization
In-stock standard designs may support small sample orders. Custom chips, dual-frequency layouts, antenna tooling, secure encoding and nonstandard sheet dimensions normally require a production MOQ.
Team and RFID Prelam Production Support
Stable RFID prelam production requires controlled chip sourcing, antenna forming, chip-to-coil connection, plastic collation, lamination, electrical testing, dimensional inspection and lot traceability. Repeat orders should use the approved chip, antenna drawing, material stack and test method unless a documented change is accepted.
![Wallis RFID prelam inlay project and technical support team for B2B card programs]( "Wallis RFID Prelam Project Team")
RFID Project and Technical Support
![RFID PVC prelam inlay production workshop for LF HF and dual-frequency card sheets]( "RFID PVC Prelam Production Workshop")
LF, HF and Hybrid Inlay Workshop
Packaging, Storage and Export Supply
Store sheets flat in sealed, clean and dry packaging away from heat and direct sunlight.
Use rigid boards, interleaving and reinforced cartons to protect antennas and chip zones.
Avoid uneven pallet loads, bending, sharp impacts and excessive stack pressure.
Use appropriate ESD handling controls for exposed production processes and testing.
Condition sheets in the lamination room when warehouse and production conditions differ.
Label every pack with chip combination, antenna design, layout, thickness, quantity and batch.
Apply first-in, first-out inventory and retest material after prolonged storage or abnormal transport exposure.
![Professional export packaging for LF HF and dual-frequency RFID PVC prelam inlay sheets]( "RFID Prelam Inlay Export Packaging")
Protected Flat Packing for International B2B Orders
Why Choose Wallis for RFID PVC Prelam Inlays?
LF, HF and hybrid capability: Single-frequency and dual-frequency projects can be developed from the actual reader ecosystem.
Chip-specific engineering: Read-only, programmable, NFC and secure HF options are separated by protocol and application.
Custom antenna and layout: Sheet size, card pitch, chip location, coil geometry and punching clearances can be customized.
Finished-card qualification: Samples can be printed, laminated, punched, encoded and tested on target readers.
Documented quality control: Electrical, RF, dimensional, visual and traceability requirements can be written into the specification.
Factory-direct B2B supply: Suitable for card factories, access integrators, hotel-system suppliers, issuers, importers and distributors.
Information Needed for a Fast B2B Quotation
Application and required configuration: LF, HF or LF + HF dual frequency.
Reader brands, models, firmware, protocols and required output format.
Exact LF and HF chip manufacturer, part number, memory and security requirement.
Sheet layout, dimensions, card pitch, registration marks and quantity.
Card size, finished thickness, chip locations, slots, holes and punching drawing.
Prelam material, color, thickness and tolerance.
LF and HF read-range test requirements and target orientations.
Final card stack, overlays, printed cores, metallic ink, magnetic stripe and security features.
Lamination press, temperature, pressure, dwell, cooling and plate dimensions.
Encoding, UID/ID list, key injection, data mapping and reconciliation requirements.
Prototype quantity, annual forecast, MOQ target and delivery schedule.
Packing, inspection documents, destination port and required compliance documents.
Discuss Your LF and HF Inlay Project
Frequently Asked Questions
What is an RFID PVC prelam inlay sheet?
It is an intermediate card sheet containing an RFID chip and antenna inside PVC layers. Card manufacturers add printed cores and overlays before final lamination and punching.
Can one prelam contain both 125kHz and 13.56MHz?
Yes. A dual-frequency prelam contains separate LF and HF chips and antennas in one card body. Both interfaces require independent tuning and testing.
Why use a dual-frequency RFID card?
It allows one credential to work with legacy 125kHz readers and newer 13.56MHz smart-card readers during an infrastructure migration.
Are the LF and HF chips linked together?
Normally they are separate circuits. Their identifiers can be linked in the customer’s database, but they communicate independently with different readers.
Which 125kHz chips are available?
TK4100-type, EM4200, ATA5577/T5577-type and other LF options can be discussed. Confirm read-only or read/write behavior, encoding and reader format.
Is EM4200 read-only?
EM4200 is positioned as a factory-programmed low-frequency read-only identification IC. The required code option and reader compatibility must be specified.
Is T5577 programmable?
ATA5577/T5577-type devices are configurable read/write LF transponders. Programming format, password, lock bits and verification must be defined.
Are all 125kHz cards ISO 11784/11785 compatible?
No. Compatibility depends on the exact chip and configuration. These standards should not be applied as a blanket claim to every access-control LF chip.
Which 13.56MHz chips are available?
Options include legacy Type A chips, MIFARE Ultralight, NTAG, MIFARE DESFire and ISO 15693/ICODE families, subject to availability and application requirements.
Are all 13.56MHz chips compatible with the same reader?
No. Readers support specific standards, commands and applications. Confirm Type A, Type B, ISO 15693 or NFC Forum support and the exact IC.
Which HF chip is suitable for NFC business cards?
NTAG 213, 215 or 216 and other NFC Forum compatible chips are common options. Choose by NDEF memory, phone compatibility and security requirements.
Which HF chip is suitable for secure access?
A secure platform such as MIFARE DESFire may be appropriate, but the reader, keys, applications, backend and personalization process must be engineered together.
What layouts are available?
Common layouts include 2 × 5, 3 × 7, 3 × 8, 4 × 8, 5 × 5 and 4 × 10. Custom layouts can be made from the buyer’s CAD drawing.
What is the typical LF prelam thickness?
The original page references approximately 0.50–0.60mm for selected LF constructions. The exact gauge depends on chip, coil, PVC and final card design.
Is a dual-frequency prelam thicker?
It may require more thickness or local compensation because it contains two chips and two antenna systems. The complete thickness map should be approved.
Can the antenna design be customized?
Yes. Coil geometry can be developed around the chip, card size, reader, target range, chip position and cutting clearance.
What read range can the finished card achieve?
Range depends on frequency, chip, antenna, reader, card stack, orientation and environment. Define separate LF and HF test readers and pass distances.
Can metallic foil be printed on a dual-frequency card?
It can be considered after testing. Large metalized areas may affect the HF antenna and should be included in finished-card RF qualification.
Can PETG or polycarbonate be used instead of PVC?
Alternative structures can be developed, but bonding, heat, shrinkage, RF tuning, chip stress and final-card durability must be validated separately.
Are the prelam sheets printed?
They are normally blank functional sheets. Customer graphics are usually printed on separate core sheets before the complete card is laminated.
What lamination temperature should be used?
There is no universal setting. Heat, pressure, dwell and cooling must be developed for the exact PVC, chip packages, antennas, printed cores and overlays.
How is chip damage prevented during lamination?
Use controlled local thickness, clean plates, balanced pressure, compatible chip packages, approved heat cycles and electrical testing before and after lamination.
Can every card position be electrically tested?
Yes, full electrical testing can be specified. For dual-frequency products, both LF and HF interfaces should pass at every accepted position.
Can the chips be encoded before delivery?
LF programming, HF memory writing, NDEF data and application personalization can be discussed. Secure keys require a separate controlled process.
Can samples be tested before bulk production?
Yes. The best qualification uses the exact chips, antennas, card stack, lamination press, punching tool and target readers.
What determines the minimum order quantity?
MOQ depends on chip availability, single or dual frequency, antenna tooling, layout, material, encoding, test requirements and whether a standard design is available.
What information is required for an accurate quotation?
Provide the exact LF and HF chips, readers, protocols, layout, card drawing, thickness, card stack, test limits, encoding, quantity, packing and destination.
Request Custom LF, HF or Dual-Frequency Prelam Samples
Contact Wallis Plastic for customized 125kHz LF, 13.56MHz HF and LF + HF dual-frequency RFID PVC prelam inlay sheets. Our team supports chip selection, antenna and layout design, card-stack planning, lamination trials, LF/HF testing, encoding, quality specifications and factory-direct B2B supply.
Request Samples and Factory Quote
