|
karti kɔnɔfɛnw
Wallis ye baara kɛ
| Kulɛri: | |
|---|---|
| Fɛn min bɛ kɛ: | |
| A bonya : | |
| a kɛcogo: | |
| A hakɛ: . | |
Wallis karti lamination cushion pads ye presse consumables ye minnu bɛ se ka baara kokura, minnu bɛ kɛ izini plastiki karti laminateurs kɔnɔ walasa ka dɛmɛ don ka fɛn misɛnninw musaka bɔ u janya caman na ani ka degun tila ɲɔgɔn na lamination cassette kɔnɔ. Silikoni, fibreglasi-reinforced ani a ɲɔgɔnna jɔli minnu bɛ sɔrɔ, olu bɛ se ka kɛ ka kɛɲɛ ni PVC, PETG, PC, RFID inlay, ID card ani smart card dilanni ye.
B2B kariti dilannikɛlaw fɛ, pad sugandili ka kan ka kɛ ka da laminatɛri kan, nɛgɛdaga hakɛw, kariti minɛnw, stack jɔcogo, funteni kurulen, degun, cycle waati ani surface finish wajibiyalen. Press pad bɛnnen bɛ se ka segin-ka-bɔnye ni flakɛli dɛmɛ, nka a tɛ enki jalen ɲuman, jisuma kɔlɔsili, plati ladonni walima lamination furakɛcogo min dabɔra, o nɔnabila.
Nin nafa ninnu bɛ sisan fɛn dilannen-ɲɛw ɲɛfɔli hakɛ jira. Fɛn labanw jɔli, baarakɛcogo funteni min bɛ to senna, u gɛlɛya, u hakɛ muɲuni ani u baarakɛcogo ka kan ka dafa quotation kɔnɔ, fɛɛrɛko kunnafonisɛbɛn kɔnɔ ani misali dafalen kɔnɔ.
| Paramɛtiriw | ka ɲɛfɔli sɛbɛn / B2B dantigɛli |
|---|---|
| Ka kɛ | Karti lamination cushion pad / karti presse pad |
| Reference Construction (Jɛkulu min bɛ wele ko Construction). | Silikoni min bɛ se ka funteni kɛlɛ ni fibreglasi barikalan ye; kusi jɔli wɛrɛw minnu bɛ kɛ ni poroze lajɛ ye |
| Reference (sɛbɛnni) Thickness | 1,5–3,5mm ye; sugandi ka kɛɲɛ ni kasɛti cɛmancɛ ye, degun musaka ani funteni-taama laɲini |
| Reference Baarakɛcogo funteni | 120–180°C ka kɛɲɛ ni sisan fɛn dilannenw hakɛ ye; funteni min bɛ to senna ani min bɛ se ka caya, o dafa ka ɲɛsin kalasi sugandilen ma |
| Kɛnɛ | A bɛ kɛ nɔgɔ ye walima a bɛ kɛ fɛn ye min tɛ se ka kɛ; aw bɛ a lajɛ fan min ɲɛsinnen bɛ tasa ma ani ni bɔli furakɛli ka kan ka kɛ |
| Ɲɛ | Sugandili finman, nɛrɛmuguma walima poroze kɛrɛnkɛrɛnnen |
| Gɛlɛya / Kusɔn | A kɛra ka kɛɲɛ ni mɔgɔw sago ye; Shore hardness walima compression-recovery reference min dagalen don, o ɲɛfɔ yɔrɔ min na a bɛ se ka kɛ |
| Kundama | A4, A3, presse-plate hakɛ walima tigɛcogo ladamulen min sinsinnen bɛ kiliyanw ka ja kan |
| Aplikasi minnu bɛ kɛ | PVC, PETG, PC, ABS, RFID inlay, contactless, ID, tɔndenw ani karti lamininen wɛrɛw |
| Baara kɛcogo kura | A bɛ se ka baara kɛ kokura ni cogoyaw ye minnu dabɔra; fɛn falen waati bɛ bɔ funteni, degun, nɔgɔ, marali ani cycle jate la |
| Komanw wajibiyalen don | MOQ, packing ani lead time bɛ bɔ hakɛw, jɔli ani customization de la |
Karti lamini kusɛti ye fɛn ye min bɛ se ka funteni kɛlɛ, min bɛ se ka digi, min bɛ bila lamini kasɛti walima presse stack kɔnɔ ka kɛɲɛ ni masin dilanni ye. A ka c’a la, a bɛ baara kɛ ɲɔgɔn fɛ ni tasumamugulanw ye, nɛgɛdaga polisilenw walima nɛgɛmafɛnw, bɔli layɛrɛw ani karti-sɛbɛn gafe. A jɔyɔrɔ ye ka fɛn misɛnninw ɲɔgɔnna caman Sɔrɔ kulu la ani ka dɛmɛ Dòn ka degun ni funteni Lase cogo basigilen na.
A sigicogo tigitigi ka kan ka tugu laminatɛri ni kasɛti cikanw kɔ. A ka c’a la, sɛbɛnnikɛlan bɛ bila karti gafe ni nɛgɛ finiw kɔfɛ sanni a ka kɛ yɔrɔ ye min ma sɛgɛsɛgɛ ka ɲɛsin mɔgɔw ma minnu bɛ se ka ɲɔgɔn sɔrɔ tigitigi sɛbɛnw kan minnu sɛbɛnnen don.
Cushioning layer min bɛ kɔrɔsi, o bɛ se ka plate, stack ani sheet caman ɲɔgɔnna misɛnninw musaka bɔ. O bɛ dɛmɛ ka sigida tansiyɔnba ni tansiyɔn dɔgɔman yɔrɔw dɔgɔya minnu bɛ se ka kɛ sababu ye ka ɲɔgɔn siri cogo kelen na, dakunw tiɲɛni walima plati taamasiɲɛw.
Pad janya ni a jɔcogo bɛ nɔ bila funteni bɛ se karti kulu ma joona cogo min na ani kulu nɛnɛ cogo min na. So jɔli min ka fin walima min bɛ se ka fɛnw ta, o bɛ se ka cycles surunw dɛmɛ, ka sɔrɔ jɔli min ka bon, min ka nɔgɔn, o bɛ se ka musaka caman di. Balannako ɲuman ka kan ka sigi sen kan ni presse sɛgɛsɛgɛliw ye sanni ka kɛ ni a bonya dɔrɔn ye.
Kusi pad a yɛrɛ tɛ se ka garanti di kartiw ma minnu tɛ bugun walima minnu tɛ wuli. Ji, solvent marali, enki filimu janya, overlay chimie, fiɲɛ minɛlen, platen parallelism, funteni kelen, degun, nɛnɛ ani bɔli waati fana ka kan ka kɔlɔsi.
| Pad Category | Typical Selection Logic | Points ka kan ka dafa |
|---|---|---|
| Silicone + Fibre de verre Pad ye | Karti lamination générale yɔrɔ min na cushioning stable, handling saniya ani performance baarakɛcogo kura de ka kan | A bonya, a gɛlɛya, a funteni, a sanfɛla tack, a fibreglasi bɔli ani a degunni seginni |
| Wool / Felt + Silicone Pad ye | Taabolo minnu mago bɛ tampon nɔgɔlen na walima funteni kɛcogo wɛrɛ la | Ji kɔlɔsili, sɔgɔsɔgɔninjɛ bɔli, dugukolo sanfɛla ɲɛsincogo, a bonya bɔnɛni ani a saniyacogo |
| Pad Fast-Cycle min ka fin | Presse cycles surunw yɔrɔ minnu na funteni jiginni teliya nafa ka bon ka tɛmɛ musaka caman sɔrɔli kan | Kasɛti flakɛli, platen kelen-kelen, karti-stack caman ɲɔgɔnna ani peak pressure |
| Pad Multilayer min bɛ funteni caman sɔrɔ | Funteni min ka bon walima min bɛ segin-ka-bɔnyew ɲini ni jɔli kɛrɛnkɛrɛnnen dɔ sɔnna | Jatebɔ min bɛ kɛ ka taa a fɛ ni a kuncɛyɔrɔ ye, kɛnɛma-yɔrɔ dafalen, nɔgɔko kɔlɔsili ani bɔli kɛcogo |
Aw bɛ tasumamugu walima kasɛti hakɛw di, sɛbɛnnikɛlan yɔrɔ min bɛ se ka baara kɛ, a jɔyɔrɔ dingɛw, nkɔni janya ani yɔrɔ wajibiyalenw. Padi minnu bonya ka ca, olu bɛ se ka kurukuru walima ka doni tali bali, ka sɔrɔ papidi minnu bonya ka dɔgɔn, olu bɛ se ka degunw tigɛtigɛ dawolow kɛrɛfɛ.
Janya bɛ farikolo jɔcogo ɲɛfɔ, k’a sɔrɔ gɛlɛya ni degun kɛcogo de bɛ pad jaabi cogo de jira doni kɔrɔ. Padi min ka bon, o tɛ fisaya a yɛrɛma. Degun tɛmɛnen bɛ se ka funteni jiginni, stack janya ani karti laban janya Changer, ka sɔrɔ pad gɛlɛn kojugu bɛ se ka musaka dafabali di.
Aw bɛ funteni, tansiyɔn funteni, nɛnɛ ani bɔli cogoyaw fɔ, i n’a fɔ funteni, tansiyɔn, sigi waati ani sɛgɛsɛgɛliw baarakɛwaati kelen kɔnɔ. Baarakɛcogo funteni min bɛ to senna, o ka kan ka danfara don ni funteni hakɛ kuntaala surun ye.
Yɔrɔ nɔgɔ dɔgɔyali nafa ka bon barisa buguri, silikoni tolenw, fiɲɛ tiɲɛnenw walima fɛn minnu bɛ don a kɔnɔ, olu bɛ se ka fiɲɛw bila tabali walima karti sɛbɛnw kɔnɔ. Aw bɛ saniya furaw sɛgɛsɛgɛ ani ni pad sugandilen mago bɛ yɔrɔ kɛrɛnkɛrɛnnen na walima ni a bilayɔrɔ kɛrɛnkɛrɛnnen don.
| Sugandili Factor | Silicone-Fibreglass jɔli | Wool / Felt-Silicone jɔli |
|---|---|---|
| Karamɔgɔba | Pad élastomère barikama ni a yɔrɔ kɔrɔsilen ani a hakɛ dɛmɛni | Tampon min sinsinnen bɛ finimugu kan min ka nɔgɔn, o faralen ɲɔgɔn kan ni elastomɛri ye min bɛ se ka funteni kɛlɛ |
| Degun (Degun musaka) (Degun) musaka | A bɛ bɔ silikɔni dilanni na, a layini jate, a gɛlɛya ani a bonya | A bɛ se ka jaabi nɔgɔman di; aw bɛ degun banbali dafa siɲɛ caman kɔfɛ |
| Funteni-yɔrɔ-ko | A bɛ se ka sugandi walasa ka funteni jaabi balannen walima teliya la | A bɛ se ka insulate ka caya ka kɛɲɛ ni felt density ni thickness ye |
| Saniya | Aw bɛ a lajɛ ni barikalan bɛ kɛnɛ kan, ni a yɔrɔ tiɲɛna ani ni silikoni jiginni tɛ | Aw bɛ a lajɛ ni sɔgɔsɔgɔninjɛ tɛ, ni ji min bɛ minɛ ani ni a yɔrɔ nɔgɔ tɛ |
| Fɛɛrɛ ɲuman min bɛ se ka kɛ | Aw bɛ karti kulu kelen min dabɔra kandida fila bɛɛ kan, aw bɛ o boli ani ka funteni waati, a flakɛ, a sirili, a plati taamasiyɛnw ani a cycle sabatili suma ɲɔgɔn na | |
Pad min sugandira ka ɲɛ, o bɛ se ka presse dɛmɛ ka fanga kɛ cogo kelen na ka tɛmɛn sɛbɛnfura yɔrɔ kan min bɛ se ka baara kɛ, ka dɛmɛ don layini sirili ni a janya la min bɛ bɛn ɲɔgɔn ma.
Layɛrɛ min bɛ sariya labato, o bɛ se ka dɔ bɔ yɔrɔ gɛlɛnw ka ɲɔgɔn sɔrɔli la ani ka dɛmɛ don ka nɛgɛdaga polisilenw lakana ka bɔ doni tali la sigida la. O bɛ tali kɛ kɛrɛnkɛrɛnnenya la RFID prelam sɛbɛnw na minnu bɛ ni puwɛntiw, moduluw walima sigida janya caman ɲɔgɔnna ye, hali ni plati gɛlɛya ni stack dilancogo nafa ka bon hali bi.
Pad cogoya min bɛ kɔrɔsi, o bɛ dɛmɛ ka lamination recipe kɛ ka segin a kan. Sikili sɛbɛnw ka kan ka kɛ pad dɔnni ye, baara fɔlɔ don, cycle jate, ɲɛsincogo ani sɛgɛsɛgɛli cogoya.
Bugunw ni ji taamasiɲɛw fana bɛ se ka sɔrɔ jisuma fɛ, enki kɛnɛyabaliya fɛ, fɛn min bɛ wuli ka bɔ a nɔ na, funteni hakɛ jugumanba fɛ, fiɲɛbɔbaliya fɛ walima nɛnɛ bɔli joona fɛ. Gɛlɛyaw ɲɛnabɔli ka kan ka taabolo dafalen jateminɛ.
Stack labɛncogo bɛ danfara ka kɛɲɛ ni presse ni karti jɔcogo ye. Baara kɛ ni masin gafe ye ani baarakɛcogo sɛbɛn min dabɔra. Nin baarakɛcogo in ye B2B dantigɛli hukumu ye, a tɛ diɲɛ bɛɛ ka stack furakɛcogo ye.
| Taabolo | tiɲɛni wale | sɛbɛn |
|---|---|---|
| 1. Sumani kɛ | Aw bɛ pad janya lajɛ yɔrɔ caman na, plati flakɛli ani kasɛti yɔrɔ janya | Janya karti ani minɛnw ID |
| 2. Ka Stack jɔ | Load pad, steel plates, release layers ani karti gafe bila sira la min dagalen don | Stack ja ani layɛrɛ ɲɛminɛcogo |
| 3. Kɔrɔbɔli Press (Kɔrɔbɔli Press). | Aw bɛ baara kɛ ni karti laɲinifɛn ye, tintin, datugulan, RFID inlay ani a dilanni hakɛw | Funteni, tansiyɔn, sigiyɔrɔ ani nɛnɛ kuru |
| 4. Sɛgɛsɛgɛli kɛ | Aw bɛ bonding, flatness, gloss/matte transfer, bubbles, watermarks, dents ani edge condition lajɛ | Karta nafama ani fotow misali |
| 5. Ka sɔn | Aw bɛ pad grade datugu ani ka baara kɛ ni Sanu Sample ye | Sɛgɛsɛgɛli min dabɔra ani fɛn caman Changement-contrôle sɛbɛn |
Pad bɛ se ka jateminɛ kɛ plastiki karti caman na ni core sheets ni overlays ye minnu bɛ bɛn ɲɔgɔn ma. Polimɛri kelen-kelen bɛɛ ka funteni finɛtiri tɛ kelen ye, o la, pad kelen ni presse furakɛcogo man kan ka miiri ko a bɛ bɛn fɛn bɛɛ ma.
RFID sɛbɛnw bɛ se ka kɛ sigida janya caman ɲɔgɔnna ye puwɛntiw, antɛni jogindaw walima moduluw lamini na. Kusi sugandili ka kan ka tiɲɛ ɲɔgɔn fɛ ni nɛgɛ-plate gɛlɛya ye, stack janya ani RF sɛgɛsɛgɛli ka kɔn lamini ɲɛ ani a kɔfɛ.
Porogaramu minnu ka ɲɛgɛnw ni u hakɛ wajibiyalenw ka gɛlɛn, aw bɛ sɔn danw ɲɛfɔ u ka flakɛli, u bonya, u ɲɛkisɛw fanga, u ɲɛda fini ani u ka karti-farikolo dɛsɛw. Banki walima gɔfɛrɛnaman ka sariya o sariya labatoli bɛ bɔ karti porogaramu dafalen na, a tɛ bɔ cushion pad dɔrɔn de la.
| Observed Issue | Possible Pad-Related Cause | Taabolo sɛgɛsɛgɛli wɛrɛw |
|---|---|---|
| Bonding min tɛ kelen ye / Edge Lift | Pad janya caman ɲɔgɔnna, a sigili banbali, pad min bonya ka dɔgɔn walima a gɛlɛyacogo jugu | Platen parallelisme, pressure, overlay chimie, edge alignment ani nɛnɛ |
| Bugunw / Ji taamasiyɛnw | Padi nɔgɔlen walima nɔgɔ bɛ min na; jaabi sumalen min tɛ bɛn | Enki jalen, fɛnw nɔgɔ, fiɲɛ minɛlen, funteni hakɛ ani fiɲɛbɔ |
| Kartiw wulilenw | Padi deguncogo min tɛ kelen ye walima pad labɛncogo asymétrique | Fɛnw dɔgɔyali, layini balanbaliya, nɛnɛ tansiyɔn ani bɔli funteni |
| Tala Marka / Denw | Nɔgɔ minnu bɛ don a kɔnɔ, fiɲɛ minnu bɛ kɛnɛ kan walima pad yɔrɔ tiɲɛnen | Nɛgɛ-plati tiɲɛni, RFID modulu janya ani a minɛcogo saniya |
| Sumaya-sɔgɔli dɔɔni dɔɔni | Pad ka bon kojugu walima a bɛ insulating kojugu ka kɛɲɛ ni laɲini cycle ye | So funteni bɔli, thermocouple tiɲɛni, stack mass ani platen cogoya |
| Sɛnɛfɛnw bɛ Changé waati tɛmɛnen kɔfɛ | Compression set, hardening, cracks walima nɔgɔli segin-segin kɔfɛ | Recipe drift, raw-material batch caman cili ani minɛnw kalibreli |
Wallis bɛ se ka pad hakɛw lajɛ minnu bɛ kɛ ka kɛɲɛ ni mɔgɔw sago ye, a bonya, a gɛlɛya, a sanfɛla, a kulɛri, a dakun cogoya ani a pakew. Walasa ka i yɛrɛ tanga quotation ma min ma bɛn, i ka kunnafoni yɛrɛyɛrɛ di presse ani processus kan sanni i ka pad ɲini ka kɛɲɛ ni A3 walima A4 hakɛ dɔrɔn ye.
| RFQ Kunnafoni | Details ka Di |
|---|---|
| Laminatɛri (Laminateur) ye | Marka, modɛli, tasuma/nɛnɛ fɛɛrɛ ani kasɛti suguya |
| Plaque / Pad Taille (Taama) ye | Janya, bonya, nkɔni janya, dingɛw, dakunw ani dakunw bɔli ja |
| Kartiw ka minɛnw | PVC, PETG, ABS, PC, RFID prelam, overlay suguya ani stack bɛɛ lajɛlen janya |
| Aw ye Recette digi | Funteni ni nɛnɛ funteni, tansiyɔn, sigi waati ani sɛgɛsɛgɛliw baarakɛwaati kelen kɔnɔ |
| Sisan Pad | Fɛn minnu bɛ kɛ, u bonya, u gɛlɛya, u baara waati, fotow ani sisan nafamafɛnw |
| Sɔn-ni-sɔn Laɲini | Flatness, surface finish, peel strength, cycle time ani a falencogo makɔnɔnenw |
| Komanw ka kunnafoni | Misali hakɛ, a caman hakɛ, a foroko, a taamasiɲɛw ani a taayɔrɔ |
Aw bɛ a bonya, a janya lajɛ yɔrɔ caman na, a yɔrɔ cogoya, a dakun cogoya, a kulɛri, a ɲɛsincogo taamasiyɛn ani a barika bonya yelen. Yɔrɔ minnu kofɔlen don, aw bɛ gɛlɛya walima degun kɛcogo suma ni misali dabɔlen ye.
Aw bɛ cidenw ka karti sɛbɛnw boli ni laɲini presse furakɛcogo ye. Aw bɛ sɔn pad ma dɔrɔn ni aw ye sumaya jaabi, karti dafalen flakɛli, a sirili, a sanfɛla jiginni ani a nafamafɛnw suma ni poroze Sanuman misali ye.
Aw bɛ pad in falen walima ka a bila dankan na ni a janya bɛ ban kudayi, ni a degun tɛ kelen ye, ni a karilen don, ni a fiyɛw bɔra kɛnɛ kan, ni a yɔrɔ gɛlɛnw don, ni a donna a kɔnɔ, ni a dawolo tiɲɛna walima ni a bɛ se ka suman lamini sɔrɔta la. Baarakɛ waati ka kan ka tugu ɲɔgɔn kɔ ni sɛrɛkiliw ni cogoya lakikaw ye sanni ka tugu diɲɛ bɛɛ ka jateden latigɛlen dɔ fɛ.
Wallis bɛ karti dilanfɛnw dilan i n’a fɔ core sheets, overlays, RFID inlays, lamination steel plates ani press pads. O b’a to B2B sannikɛlaw bɛ se ka kusɔn pad lajɛ ɲɔgɔn fɛ ni karti kulu dafalen ye sanni u k’a jateminɛ i n’a fɔ fɛn dɔ min bɛ a dan na.
Walasa ka poroze ka setigiya sɔrɔ, aw bɛ pad sample ɲini, fɛɛrɛko ɲɛfɔli, tigɛ ja ani sɛgɛsɛgɛli bolodacogo. Sɛnɛfɛnw dilanni fɔlenw i n’a fɔ baarakɛwaati, nafamafɛnw dɔgɔyali ani cycle-time ɲɛtaa, olu ka kan ka dafa kiliyan ka masin kan ani karti jɔcogo min dagalen don.
O ye sɛbɛnnikɛlan ye min bɛ se ka baara kɛ kokura walima min bɛ se ka baara kɛ kokura tilancɛ la, min bɛ dɛmɛ ka degun tila ani ka funteni jiginni ɲɛnabɔ izini karti lamini kasɛti kɔnɔ. A bɛ baara kɛ ni nɛgɛdaga ye, ni bɔli layɛrɛw ani karti gafe ye ka kɛɲɛ ni masin kɛrɛnkɛrɛnnenw ka kulu dilanni ye.
Ayi, kusɛ ye degun-kɔrɔ-fɛn ye min bɛ bɛn sariya ma, k’a sɔrɔ nɛgɛdaga bɛ kɛnɛya, finimugu walima finimugu sugandilen wuli ka taa yɔrɔ wɛrɛ la ani ka yɔrɔ gɛlɛn ni fla di karti kulu lamini na.
A bilali bɛ bɔ laminatɛri ni kasɛti dilanni na. Aw bɛ masin gafe ni stack ja min dabɔra, aw bɛ tugu o kɔ. A ka c’a la, o pad bɛ bila karti gafe ni finimugu kɔkan, a tɛ kɛ i n’a fɔ fɛn min ma sɛgɛsɛgɛ ka ɲɛsin karti sɛbɛnnenw ma.
Pad dɔ bɛ se ka jateminɛ fɛn caman kan, nka presse dilacogo ni funteni jaabi tɛ kelen ye. Aw bɛ PVC, PETG, ABS walima PC karti jɔcogo kelen-kelen bɛɛ sɛmɛntiya u danma sani u ka dilan.
Sisan, a ɲɛfɔli hakɛ ye 1,5–3,5mm ye. Sugandili bɛ bɔ kasɛti bɔli la, stack caman ɲɔgɔnnabɔli, pad gɛlɛya, degun, funteni teliya ani musaka ɲininen. Padi min ka bon, o tɛ fisaya a yɛrɛma.
Ɲɛ minnu bɛ yen sisan olu ye 120–180°C ye. Funteni hakɛ min bɛ to senna ani min bɛ se ka caya, o ka kan ka dafa jɔli sugandilen na, ka a suma ni presse cycle yɛrɛ ye.
A bɛ se ka dɛmɛ don ka degun ni funteni sabatili ɲɛ, nka a tɛ se ka garanti di kartiw ma minnu nafa tɛ. Ji, tintiri kɛnɛyali, fiɲɛ minɛlen, funteni hakɛ, nɛnɛ ani fɛnw bɛnkan fana ka kan ka kɔlɔsi.
Duniya bɛɛ ka sɛrɛkili jate tɛ yen. Ɲɛnamaya bɛ bɔ funteni, degun, sigi waati, saniya, marali, pad jɔli ani nɔgɔli la. Track thickness, compression condition ani sɛnɛfɛnw bɔli.
Aw bɛ saniya fɛɛrɛ dɔrɔn de kɛ min dagalen don, min tɛ funu, ka a wuli walima ka a nɔgɔ. Aw bɛ pad in mara ka kɛ fla ye, ka saniya ani ka a ja, ka yɔrɔ jan fɛn nɔgɔlenw na, ka funteni ni tile yeelen tilennen bɔ. Aw kana a da.
Ɔwɔ, ka kɛɲɛ ni kɔrɔbɔli ye. RFID inlays bɛ se ka kɛ ni sigida janya caman ɲɔgɔnna ye puwɛntiw ni antɛni jogindaw lamini na, o la, aw bɛ pad tiɲɛ ni prelam yɛrɛ ye, nɛgɛdaga, presse furakɛcogo ani RF baarakɛcogo.
Ladamu janya, a bonya, a bonya, a gɛlɛya, a dakun cogoya ani a dingɛw bɛ se ka lajɛ. Aw bɛ ja hakɛlama ni masin modɛli di walasa sɛbɛnnikɛlan yɔrɔ min bɛ se ka baara kɛ ani a yɔrɔ janyalenw ka se ka lajɛ.
Laminatɛri modɛli, plati hakɛ, pad ja, karti minɛnw, stack bɛɛ lajɛlen janya, funteni, tansiyɔn, cycle waati, pad data sisan, nafamafɛnw kɔlɔsilenw, komandi hakɛ ani taayɔrɔ di.
